JP2015529396A - Ledヘッドランプ用マイクロチャネルヒートシンク - Google Patents

Ledヘッドランプ用マイクロチャネルヒートシンク Download PDF

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Publication number
JP2015529396A
JP2015529396A JP2015528654A JP2015528654A JP2015529396A JP 2015529396 A JP2015529396 A JP 2015529396A JP 2015528654 A JP2015528654 A JP 2015528654A JP 2015528654 A JP2015528654 A JP 2015528654A JP 2015529396 A JP2015529396 A JP 2015529396A
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JP
Japan
Prior art keywords
heat sink
leg
base plate
sink according
distal end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015528654A
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English (en)
Japanese (ja)
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JP2015529396A5 (enExample
Inventor
ムハンマド アギル ハミド
ムハンマド アギル ハミド
スティーブ バーマン
スティーブ バーマン
チャールズ エフ. シュバイツァー
チャールズ エフ. シュバイツァー
Original Assignee
フレックス‐エヌ‐ゲート アドバンスト プロダクト ディベロップメント エルエルシー
フレックス‐エヌ‐ゲート アドバンスト プロダクト ディベロップメント エルエルシー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by フレックス‐エヌ‐ゲート アドバンスト プロダクト ディベロップメント エルエルシー, フレックス‐エヌ‐ゲート アドバンスト プロダクト ディベロップメント エルエルシー filed Critical フレックス‐エヌ‐ゲート アドバンスト プロダクト ディベロップメント エルエルシー
Publication of JP2015529396A publication Critical patent/JP2015529396A/ja
Publication of JP2015529396A5 publication Critical patent/JP2015529396A5/ja
Pending legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/42Forced cooling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/56Cooling arrangements using liquid coolants
    • F21V29/59Cooling arrangements using liquid coolants with forced flow of the coolant
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/65Cooling arrangements characterised by the use of a forced flow of gas, e.g. air the gas flowing in a closed circuit
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8586Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2015528654A 2012-08-22 2013-08-22 Ledヘッドランプ用マイクロチャネルヒートシンク Pending JP2015529396A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261692196P 2012-08-22 2012-08-22
US61/692,196 2012-08-22
PCT/US2013/056184 WO2014031849A2 (en) 2012-08-22 2013-08-22 Micro-channel heat sink for led headlamp

Publications (2)

Publication Number Publication Date
JP2015529396A true JP2015529396A (ja) 2015-10-05
JP2015529396A5 JP2015529396A5 (enExample) 2016-10-13

Family

ID=50150491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015528654A Pending JP2015529396A (ja) 2012-08-22 2013-08-22 Ledヘッドランプ用マイクロチャネルヒートシンク

Country Status (5)

Country Link
US (1) US10094549B2 (enExample)
EP (1) EP2888528A4 (enExample)
JP (1) JP2015529396A (enExample)
CN (1) CN104755836A (enExample)
WO (1) WO2014031849A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209586A1 (ja) * 2023-04-05 2024-10-10 株式会社ニコン 光源ユニット、照明ユニット、露光装置、及び露光方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106342B4 (de) 2014-05-07 2023-07-27 HELLA GmbH & Co. KGaA Lichtmodul für einen Scheinwerfer eines Fahrzeugs
US10323813B2 (en) * 2016-10-04 2019-06-18 Michael E. Hontz Light modules for headlights
US10208916B2 (en) * 2016-12-19 2019-02-19 Flex-N-Gate Advanced Product Development Llc Channel between headlight chambers
DE102017114466A1 (de) 2017-06-29 2019-01-03 Automotive Lighting Reutlingen Gmbh Kühlkörper aus Aluminium zum Abführen von Wärme von Halbleiter-Lichtquellen und Kraftfahrzeugbeleuchtungseinrichtung mit einem solchen Kühlkörper
CN108200745B (zh) * 2018-01-22 2024-04-26 清华大学 热收集端及散热装置
US11255508B2 (en) 2020-06-15 2022-02-22 Grote Industries, Inc. Deicing system for an automotive lamp
MX2022016116A (es) 2020-06-15 2023-03-01 Grote Industries Inc Sistema de deshielo para lampara automotriz.
US20230228461A1 (en) * 2022-01-18 2023-07-20 Geothermal Technologies, Inc. Creating convective thermal recharge in geothermal energy systems

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
JP2005229095A (ja) * 2004-01-13 2005-08-25 Seiko Epson Corp 光源装置および投射型表示装置
JP2006100836A (ja) * 2004-09-29 2006-04-13 Osram Opto Semiconductors Gmbh 発光ダイオード装置および自動車用のヘッドライト
JP2006522463A (ja) * 2002-11-01 2006-09-28 クーリギー インコーポレイテッド 流体により冷却される超小型熱交換のための最適なスプレッダシステム、装置及び方法
JP2006287180A (ja) * 2005-03-08 2006-10-19 Seiko Epson Corp マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
JP2009064986A (ja) * 2007-09-06 2009-03-26 Panasonic Electric Works Co Ltd 光源装置
JP2011258411A (ja) * 2010-06-09 2011-12-22 Koito Mfg Co Ltd 車両用灯具
US20120012866A1 (en) * 2010-07-14 2012-01-19 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight module and light-emitting source package structure thereof

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105429A (en) 1990-07-06 1992-04-14 The United States Of America As Represented By The Department Of Energy Modular package for cooling a laser diode array
US5453641A (en) 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
US5848082A (en) 1995-08-11 1998-12-08 Sdl, Inc. Low stress heatsink and optical system
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
GB0114222D0 (en) * 2001-06-12 2001-08-01 Pulsar Light Of Cambridge Ltd Lighting unit with improved cooling
US6422307B1 (en) * 2001-07-18 2002-07-23 Delphi Technologies, Inc. Ultra high fin density heat sink for electronics cooling
WO2004038759A2 (en) * 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
DE10246990A1 (de) 2002-10-02 2004-04-22 Atotech Deutschland Gmbh Mikrostrukturkühler und dessen Verwendung
US6880956B2 (en) * 2003-07-31 2005-04-19 A L Lightech, Inc. Light source with heat transfer arrangement
KR20080099352A (ko) * 2003-12-11 2008-11-12 필립스 솔리드-스테이트 라이팅 솔루션스, 인크. 조명 소자를 위한 열 관리 방법 및 조명 고정구
US7309145B2 (en) * 2004-01-13 2007-12-18 Seiko Epson Corporation Light source apparatus and projection display apparatus
WO2005104323A2 (en) 2004-03-30 2005-11-03 Purdue Research Foundation Improved microchannel heat sink
WO2006017301A2 (en) 2004-07-13 2006-02-16 Thorrn Micro Technologies, Inc. Micro-channel heat sink
US7215547B2 (en) * 2004-08-16 2007-05-08 Delphi Technologies, Inc. Integrated cooling system for electronic devices
CN1671020A (zh) * 2004-08-27 2005-09-21 中国科学院长春光学精密机械与物理研究所 用于高功率垂直腔面发射激光器的组合型散热装置及制备
US7230334B2 (en) * 2004-11-12 2007-06-12 International Business Machines Corporation Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
WO2006079111A2 (en) 2005-01-24 2006-07-27 Thorrn Micro Technologies, Inc. Electro-hydrodynamic pump and cooling apparatus comprising an electro-hydrodynamic pump
CN100555070C (zh) * 2005-03-08 2009-10-28 精工爱普生株式会社 微通道结构体及其制造方法、光源装置和投影机
US20090294105A1 (en) * 2005-03-22 2009-12-03 Bharat Heavy Electricals Limited Selectively Grooved Cold Plate for Electronics Cooling
KR100671545B1 (ko) * 2005-07-01 2007-01-19 삼성전자주식회사 Led 어레이 모듈
JP2007127398A (ja) * 2005-10-05 2007-05-24 Seiko Epson Corp 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
US7300187B2 (en) * 2005-10-24 2007-11-27 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
US20110220332A1 (en) 2010-03-12 2011-09-15 Analogic Corporation Micro channel device temperature control
EP2111137A4 (en) * 2007-02-12 2013-03-06 Ge Lighting Solutions Llc LED LIGHTING SYSTEMS FOR DISPLAYS HAVING PRODUCTS
US7564129B2 (en) * 2007-03-30 2009-07-21 Nichicon Corporation Power semiconductor module, and power semiconductor device having the module mounted therein
TW200850136A (en) 2007-06-15 2008-12-16 Nat Univ Tsing Hua Microchannel heat sink
US7610948B2 (en) * 2007-07-25 2009-11-03 Tsung-Hsien Huang Cooler module
US8746330B2 (en) * 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
CN201117676Y (zh) * 2007-08-17 2008-09-17 广东昭信光电科技有限公司 集成微结构的大功率发光二极管封装结构
US20090059594A1 (en) * 2007-08-31 2009-03-05 Ming-Feng Lin Heat dissipating apparatus for automotive LED lamp
KR100989390B1 (ko) * 2008-02-15 2010-10-25 에스엘 주식회사 차량용 헤드 램프 구조
CN101319774A (zh) * 2008-06-24 2008-12-10 杨洪武 被动散热器及路灯散热装置
US8123382B2 (en) * 2008-10-10 2012-02-28 Cooper Technologies Company Modular extruded heat sink
US8847480B2 (en) * 2009-03-18 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Lighting device
WO2010141721A2 (en) * 2009-06-03 2010-12-09 Material Werks, Llc Lamp assembly and method for making
CN101986001B (zh) * 2009-07-28 2013-09-04 富准精密工业(深圳)有限公司 发光二极管灯具
JP2011048923A (ja) * 2009-08-25 2011-03-10 Stanley Electric Co Ltd 車両用灯具
CN102906497B (zh) 2010-01-27 2016-08-17 熔合Uv系统公司 微通道冷却的高热负荷发光装置
CN102812321B (zh) * 2010-04-09 2015-09-30 英格索尔-兰德公司 成型的微通道热交换器
DE202010004868U1 (de) * 2010-04-10 2010-07-29 Lightdesign Solutions Gmbh LED-Leuchtmittel
US8591078B2 (en) * 2010-06-03 2013-11-26 Phoseon Technology, Inc. Microchannel cooler for light emitting diode light fixtures
US8480269B2 (en) 2010-07-07 2013-07-09 Sunonwealth Electric Machine Industry Co., Ltd. Lamp and heat sink thereof
CN101943356B (zh) * 2010-07-14 2013-03-13 深圳市华星光电技术有限公司 背光模块及其发光源封装构造
US8203274B2 (en) 2010-08-13 2012-06-19 De Castro Erwin L LED and thermal management module for a vehicle headlamp
US8466486B2 (en) 2010-08-27 2013-06-18 Tsmc Solid State Lighting Ltd. Thermal management system for multiple heat source devices
EP2428725B1 (en) * 2010-09-10 2019-11-20 Koito Manufacturing Co., Ltd. Vehicle headlamp
JP5338012B2 (ja) * 2010-09-30 2013-11-13 ツォンシャン ウェイキアン テクノロジー カンパニー、リミテッド ハイパワー放熱モジュール
US9518711B2 (en) 2011-09-27 2016-12-13 Truck-Lite Co., Llc Modular headlamp assembly
US20120275152A1 (en) * 2011-04-29 2012-11-01 Phoseon Technology, Inc. Heat sink for light modules
CN102401293A (zh) * 2011-11-18 2012-04-04 林勇 一种微风道散热的led路灯

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
JP2006522463A (ja) * 2002-11-01 2006-09-28 クーリギー インコーポレイテッド 流体により冷却される超小型熱交換のための最適なスプレッダシステム、装置及び方法
JP2005229095A (ja) * 2004-01-13 2005-08-25 Seiko Epson Corp 光源装置および投射型表示装置
JP2006100836A (ja) * 2004-09-29 2006-04-13 Osram Opto Semiconductors Gmbh 発光ダイオード装置および自動車用のヘッドライト
JP2006287180A (ja) * 2005-03-08 2006-10-19 Seiko Epson Corp マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
JP2009064986A (ja) * 2007-09-06 2009-03-26 Panasonic Electric Works Co Ltd 光源装置
JP2011258411A (ja) * 2010-06-09 2011-12-22 Koito Mfg Co Ltd 車両用灯具
US20120012866A1 (en) * 2010-07-14 2012-01-19 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight module and light-emitting source package structure thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024209586A1 (ja) * 2023-04-05 2024-10-10 株式会社ニコン 光源ユニット、照明ユニット、露光装置、及び露光方法
WO2024209913A1 (ja) * 2023-04-05 2024-10-10 株式会社ニコン 光源ユニット、照明ユニット、露光装置、及び露光方法

Also Published As

Publication number Publication date
EP2888528A4 (en) 2016-05-25
WO2014031849A2 (en) 2014-02-27
US20150252997A1 (en) 2015-09-10
US10094549B2 (en) 2018-10-09
CN104755836A (zh) 2015-07-01
WO2014031849A3 (en) 2015-04-02
EP2888528A2 (en) 2015-07-01

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