CN104755836A - 用于led头灯的微通道热沉 - Google Patents

用于led头灯的微通道热沉 Download PDF

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Publication number
CN104755836A
CN104755836A CN201380052964.4A CN201380052964A CN104755836A CN 104755836 A CN104755836 A CN 104755836A CN 201380052964 A CN201380052964 A CN 201380052964A CN 104755836 A CN104755836 A CN 104755836A
Authority
CN
China
Prior art keywords
heat sink
substrate
pillar
microchannel
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380052964.4A
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English (en)
Chinese (zh)
Inventor
穆罕默德·阿齐尔·哈米德
史蒂夫·巴曼
查尔斯·F·施韦策
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flex N Gate Advanced Product Development LLC
Original Assignee
Flex N Gate Advanced Product Development LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flex N Gate Advanced Product Development LLC filed Critical Flex N Gate Advanced Product Development LLC
Publication of CN104755836A publication Critical patent/CN104755836A/zh
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/65—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air the gas flowing in a closed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
CN201380052964.4A 2012-08-22 2013-08-22 用于led头灯的微通道热沉 Pending CN104755836A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261692196P 2012-08-22 2012-08-22
US61/692,196 2012-08-22
PCT/US2013/056184 WO2014031849A2 (en) 2012-08-22 2013-08-22 Micro-channel heat sink for led headlamp

Publications (1)

Publication Number Publication Date
CN104755836A true CN104755836A (zh) 2015-07-01

Family

ID=50150491

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380052964.4A Pending CN104755836A (zh) 2012-08-22 2013-08-22 用于led头灯的微通道热沉

Country Status (5)

Country Link
US (1) US10094549B2 (enExample)
EP (1) EP2888528A4 (enExample)
JP (1) JP2015529396A (enExample)
CN (1) CN104755836A (enExample)
WO (1) WO2014031849A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106342B4 (de) 2014-05-07 2023-07-27 HELLA GmbH & Co. KGaA Lichtmodul für einen Scheinwerfer eines Fahrzeugs
US10323813B2 (en) * 2016-10-04 2019-06-18 Michael E. Hontz Light modules for headlights
US10208916B2 (en) * 2016-12-19 2019-02-19 Flex-N-Gate Advanced Product Development Llc Channel between headlight chambers
DE102017114466A1 (de) 2017-06-29 2019-01-03 Automotive Lighting Reutlingen Gmbh Kühlkörper aus Aluminium zum Abführen von Wärme von Halbleiter-Lichtquellen und Kraftfahrzeugbeleuchtungseinrichtung mit einem solchen Kühlkörper
CN108200745B (zh) * 2018-01-22 2024-04-26 清华大学 热收集端及散热装置
US11255508B2 (en) 2020-06-15 2022-02-22 Grote Industries, Inc. Deicing system for an automotive lamp
WO2021257296A1 (en) 2020-06-15 2021-12-23 Ruan Jiabiao Deicing system for. an automotive lamp
US20230228461A1 (en) * 2022-01-18 2023-07-20 Geothermal Technologies, Inc. Creating convective thermal recharge in geothermal energy systems
WO2024209586A1 (ja) * 2023-04-05 2024-10-10 株式会社ニコン 光源ユニット、照明ユニット、露光装置、及び露光方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1652017A (zh) * 2004-01-13 2005-08-10 精工爱普生株式会社 光源装置以及投影型显示装置
CN1671020A (zh) * 2004-08-27 2005-09-21 中国科学院长春光学精密机械与物理研究所 用于高功率垂直腔面发射激光器的组合型散热装置及制备
US20060076572A1 (en) * 2004-09-29 2006-04-13 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement and motor vehicle headlamp
CN1831638A (zh) * 2005-03-08 2006-09-13 精工爱普生株式会社 微通道结构体及其制造方法、光源装置和投影机
CN201117676Y (zh) * 2007-08-17 2008-09-17 广东昭信光电科技有限公司 集成微结构的大功率发光二极管封装结构
CN102401293A (zh) * 2011-11-18 2012-04-04 林勇 一种微风道散热的led路灯

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105429A (en) 1990-07-06 1992-04-14 The United States Of America As Represented By The Department Of Energy Modular package for cooling a laser diode array
US5453641A (en) 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
US5848082A (en) 1995-08-11 1998-12-08 Sdl, Inc. Low stress heatsink and optical system
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
GB0114222D0 (en) * 2001-06-12 2001-08-01 Pulsar Light Of Cambridge Ltd Lighting unit with improved cooling
US6422307B1 (en) * 2001-07-18 2002-07-23 Delphi Technologies, Inc. Ultra high fin density heat sink for electronics cooling
WO2004038759A2 (en) 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
DE10246990A1 (de) * 2002-10-02 2004-04-22 Atotech Deutschland Gmbh Mikrostrukturkühler und dessen Verwendung
AU2003286821A1 (en) * 2002-11-01 2004-06-07 Cooligy, Inc. Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
US6880956B2 (en) * 2003-07-31 2005-04-19 A L Lightech, Inc. Light source with heat transfer arrangement
EP2572932B1 (en) * 2003-12-11 2015-04-22 Philips Solid-State Lighting Solutions, Inc. Thermal management for lighting devices
JP4654664B2 (ja) * 2004-01-13 2011-03-23 セイコーエプソン株式会社 光源装置および投射型表示装置
DE112004002811T5 (de) 2004-03-30 2008-03-13 Purdue Research Foundation, Lafayette Verbesserte Mikrokanal-Wärmesenke
WO2006017301A2 (en) 2004-07-13 2006-02-16 Thorrn Micro Technologies, Inc. Micro-channel heat sink
US7215547B2 (en) * 2004-08-16 2007-05-08 Delphi Technologies, Inc. Integrated cooling system for electronic devices
US7230334B2 (en) * 2004-11-12 2007-06-12 International Business Machines Corporation Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
KR20070108880A (ko) * 2005-01-24 2007-11-13 손 마이크로 테크놀로지스, 인코포레이티드 전기-수력학적 펌프 및 전기-수력학적 펌프를 포함한 냉각장치
JP4218677B2 (ja) * 2005-03-08 2009-02-04 セイコーエプソン株式会社 マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
US20090294105A1 (en) * 2005-03-22 2009-12-03 Bharat Heavy Electricals Limited Selectively Grooved Cold Plate for Electronics Cooling
KR100671545B1 (ko) * 2005-07-01 2007-01-19 삼성전자주식회사 Ｌｅｄ 어레이 모듈
JP2007127398A (ja) * 2005-10-05 2007-05-24 Seiko Epson Corp 熱交換器、熱交換器の製造方法、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
US7300187B2 (en) * 2005-10-24 2007-11-27 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
US20110220332A1 (en) 2010-03-12 2011-09-15 Analogic Corporation Micro channel device temperature control
WO2008100894A1 (en) * 2007-02-12 2008-08-21 Lumination Llc Led lighting systems for product display cases
US7564129B2 (en) * 2007-03-30 2009-07-21 Nichicon Corporation Power semiconductor module, and power semiconductor device having the module mounted therein
TW200850136A (en) 2007-06-15 2008-12-16 Nat Univ Tsing Hua Microchannel heat sink
US7610948B2 (en) * 2007-07-25 2009-11-03 Tsung-Hsien Huang Cooler module
US8746330B2 (en) * 2007-08-09 2014-06-10 Coolit Systems Inc. Fluid heat exchanger configured to provide a split flow
US20090059594A1 (en) * 2007-08-31 2009-03-05 Ming-Feng Lin Heat dissipating apparatus for automotive LED lamp
JP2009064986A (ja) * 2007-09-06 2009-03-26 Panasonic Electric Works Co Ltd 光源装置
KR100989390B1 (ko) * 2008-02-15 2010-10-25 에스엘 주식회사 차량용 헤드 램프 구조
CN101319774A (zh) * 2008-06-24 2008-12-10 杨洪武 被动散热器及路灯散热装置
US8123382B2 (en) 2008-10-10 2012-02-28 Cooper Technologies Company Modular extruded heat sink
US8847480B2 (en) * 2009-03-18 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Lighting device
CN102667326B (zh) * 2009-06-03 2016-08-10 沃克斯材料有限公司 灯组件及制造方法
CN101986001B (zh) 2009-07-28 2013-09-04 富准精密工业(深圳)有限公司 发光二极管灯具
JP2011048923A (ja) * 2009-08-25 2011-03-10 Stanley Electric Co Ltd 車両用灯具
WO2011094293A1 (en) * 2010-01-27 2011-08-04 Fusion Uv Systems, Inc. Micro-channel-cooled high heat load light emitting device
CN102812321B (zh) * 2010-04-09 2015-09-30 英格索尔-兰德公司 成型的微通道热交换器
DE202010004868U1 (de) * 2010-04-10 2010-07-29 Lightdesign Solutions Gmbh LED-Leuchtmittel
US8591078B2 (en) * 2010-06-03 2013-11-26 Phoseon Technology, Inc. Microchannel cooler for light emitting diode light fixtures
JP2011258411A (ja) * 2010-06-09 2011-12-22 Koito Mfg Co Ltd 車両用灯具
US8480269B2 (en) 2010-07-07 2013-07-09 Sunonwealth Electric Machine Industry Co., Ltd. Lamp and heat sink thereof
CN101943356B (zh) * 2010-07-14 2013-03-13 深圳市华星光电技术有限公司 背光模块及其发光源封装构造
US8288782B2 (en) * 2010-07-14 2012-10-16 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight module and light-emitting source package structure thereof
US8203274B2 (en) * 2010-08-13 2012-06-19 De Castro Erwin L LED and thermal management module for a vehicle headlamp
US8466486B2 (en) 2010-08-27 2013-06-18 Tsmc Solid State Lighting Ltd. Thermal management system for multiple heat source devices
US8534888B2 (en) 2010-09-10 2013-09-17 Koito Manufacturing Co., Ltd. Optical unit for a vehicular lamp
JP5290355B2 (ja) * 2010-09-30 2013-09-18 ツォンシャン ウェイキアン テクノロジー カンパニー、リミテッド ハイパワー放熱モジュール
US9518711B2 (en) 2011-09-27 2016-12-13 Truck-Lite Co., Llc Modular headlamp assembly
US20120275152A1 (en) * 2011-04-29 2012-11-01 Phoseon Technology, Inc. Heat sink for light modules

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1652017A (zh) * 2004-01-13 2005-08-10 精工爱普生株式会社 光源装置以及投影型显示装置
CN1671020A (zh) * 2004-08-27 2005-09-21 中国科学院长春光学精密机械与物理研究所 用于高功率垂直腔面发射激光器的组合型散热装置及制备
US20060076572A1 (en) * 2004-09-29 2006-04-13 Osram Opto Semiconductors Gmbh Light-emitting diode arrangement and motor vehicle headlamp
CN1831638A (zh) * 2005-03-08 2006-09-13 精工爱普生株式会社 微通道结构体及其制造方法、光源装置和投影机
CN201117676Y (zh) * 2007-08-17 2008-09-17 广东昭信光电科技有限公司 集成微结构的大功率发光二极管封装结构
CN102401293A (zh) * 2011-11-18 2012-04-04 林勇 一种微风道散热的led路灯

Also Published As

Publication number Publication date
US10094549B2 (en) 2018-10-09
EP2888528A4 (en) 2016-05-25
WO2014031849A3 (en) 2015-04-02
WO2014031849A2 (en) 2014-02-27
JP2015529396A (ja) 2015-10-05
US20150252997A1 (en) 2015-09-10
EP2888528A2 (en) 2015-07-01

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