JP2015526833A - シリコン光源およびそれを応用したデバイス - Google Patents
シリコン光源およびそれを応用したデバイス Download PDFInfo
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- JP2015526833A JP2015526833A JP2015509508A JP2015509508A JP2015526833A JP 2015526833 A JP2015526833 A JP 2015526833A JP 2015509508 A JP2015509508 A JP 2015509508A JP 2015509508 A JP2015509508 A JP 2015509508A JP 2015526833 A JP2015526833 A JP 2015526833A
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- silicon
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
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- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
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- Physics & Mathematics (AREA)
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- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
図5(a)はシリコンLEDの実施例の構造を示す。この構造において、ウェーハ(4)と半透過性金属接点(1)との間に電気的バイアスを印加するキャリアを注入することによってエレクトロルミネッセンスが得られる。ここで、ウェーハ(4)は単一の結晶シリコンであり、ウェーハ(4)の裏側に配置された金属接点(5)はアルミニウム、銀(Ag)または金(Au)であることができる。半透過性金属接点には、金層(1)およびチタン層(2)を組み合わせた半透過性Au/Ti金属接点を用いることができる。接点の前に、ルチン表面洗浄手順を適用することができる。
重要なセンサの実施例は、図5(b)に示されるように、その構造に重水素化六フッ化アンモニウムシリコン(DASH)すなわち(ND4)2SiF6を含むLEDセンサである。図5(b)にシリコンウェーハ(4)上にて実現されるこのようなセンサの基本要素を示す。ここで、半透過性金属接点(1)および(2)はまた化学的および生物学的作用剤に対して透過性であり、多孔質DASH層(6)上に直接堆積される。前側の金属接点(1)および(2)はAu/Tiであり、作用剤に対する多孔質透過性構造を有することができる。Al/CrまたはAu/Cr、Al/Tiなどの金属は前側透過性金属接点として使用することができる。
重水処理方法は新たな機能を有する三端子デバイスの製造に首尾よく用いることができる。適用実施例が図7に示される、図7はシリコンウェーハ(4)の1320nmで光出力を有するFET構造を表す。p型ウェーハにn型チャネルを有するFET構造は、電気出力に加え、1320nmで光出力を有する二重ゲートトランジスタである。
活性領域が重水酸蒸気処理により形成される、1320nmで動作するVCSELおよびシリコンリッジ型レーザを製造可能であることが証明されている。以下において、新規のデバイス構造製造への応用に関する実施例が提供される。
本発明の別の実施例は、エミッタ領域、コレクタ領域およびベース領域に電気信号を印加するとベース領域から自然光信号を生成するヘテロバイポーラトランジスタからなる。
1.光通信モジュールにおいて:自由空間および光ファイバ用途;
2.チップ間およびマルチチップモジュールにおける相互接続;
3.赤外線撮像およびセンサシステム;
4.量子暗号法および量子コンピュータ用途;
5.レーダーおよび通信アンテナ;
6.衛星システム;
7.生体医学的用途、バイオチップ;
8.センサシステム(化学的および生物学的作用剤検出)。
Claims (21)
- 50%を超えるルミネッセンス量子効率を有し、200nm未満の半値全幅を有して、800〜1800nmの赤外線領域において1320nmで単一ピーク放射を有する、フォトルミネッセンス、エレクトロルミネッセンス、レーザ、トランジスタ、ダイオードおよびセンサ用途のシリコン光源。
- 重水D2O含有HF:HNO3化学的混合物の酸蒸気(acid vapor)によるシリコンウェーハ(4)表面の処理工程と、
前記処理による前記ウェーハ(4)へのナノ多孔質シリコン層(3)の形成工程と、
前記ナノ多孔質シリコン層(3)への重水素化六フッ化アンモニウムシリコン(ND4)2SiF6層(6)の形成工程と、
を含む、請求項1に記載の光源の製造方法。 - 好ましくはHF:HNO3:D2O混合物の化学的溶液である、請求項2に記載の重水(酸化ジュウテリウム、D2O)含有化学的混合物。
- a)単一のシリコンウェーハ(4)と、
b)請求項2に記載の前記重水(D2O)含有酸蒸気を使用して前記ウェーハ(4)上に形成されたナノ多孔質シリコン層(3)と、
c)半透過性金属接点(1)と、
d)前記ウェーハの裏側金属接点(5)と、
を含む、請求項1に記載のシリコン光源。 - 以下の構成部品、すなわち、
a)請求項2に記載の方法による前記ナノ多孔質シリコン層(3)上に形成された重水素化六フッ化アンモニウムシリコン(6)、すなわち(ND4)2SiF6と、
b)オーミックコンタクト品質および電気特性を向上させるための中間の半透過性金属接点(2)と、
の少なくともいずれかをさらに含む、請求項4に記載のシリコン光源。 - a)シリコンウェーハ(4)と、
b)請求項2に記載の方法により、前記ウェーハ(4)上に製造されるナノ多孔質シリコン層(3)と、
c)前記ナノ多孔質シリコン層(3)上に形成される選択的(optional)な重水素化六フッ化アンモニウムシリコン(DASH)層(6)と、
d)前記ナノ多孔質シリコン層(3)上、またはもし存在するとすれば前記DASH層(6)上の半透過性金属接点(1)と、
e)前記半透過性金属接点(1)と前記ナノ多孔質シリコン層(3)との間、またはもし存在するとすれば前記DASH層(6)上の、選択的(optional)な金属接点(2)と、
f)前記シリコンウェーハ(4)に対して形成される裏側金属接点(5)と、
を含む、室温において800〜1800nmのスペクトル範囲の間で1320nmで単一ピーク放射を有する、発光ダイオード(LED)。 - 多孔質、すなわち化学的および生物学的作用剤(agent)に対して透過性であるメッシュ状構造を有する、半透過性金属接点(1)および選択的(optional)な金属接点(2)を含み、室温において800〜1800nmの間で1320nmで単一ピーク放射を有し、かつ請求項6に記載のLEDデバイス構造を有する、化学的および生物学的作用剤を検出するセンサ。
- a)シリコンウェーハ(4)と、
b)請求項2に記載の前記ウェーハ(4)上に製造されるナノ多孔質シリコン層(3)と、
c)前記ナノ多孔質シリコン層(3)上に形成される半透過性金属接点(1)と、
d)前記ナノ多孔質シリコン層(3)と前記第1半透過性金属接点(1)との間の選択的(optional)な金属層(2)と、
e)前記シリコンウェーハ(4)の裏側に形成される第2ナノ多孔質シリコン層(33)と、
f)前記第2ナノ多孔質シリコン層(33)上に形成される裏側金属接点(5)と、
g)トランジスタチャネル内における電子伝導のために、トランジスタのシリコンウェーハ(4)上に形成されたソース(10)領域およびドレイン(11)領域と、
を含む、室温において800〜1800nmの間で1320nmの光出力を有する電界効果トランジスタ(FET)。 - a)シリコンオンインシュレータ(SOI)の第2ウェーハ(8)と、
b)SOIの酸化膜層(7)と、
c)SOIのシリコンウェーハ(4)と、
d)請求項2に記載のSOIの前記シリコンウェーハ(4)上に形成されるナノ多孔質シリコン層(3)と、
e)ナノ多孔質シリコン層(3)上に形成されたp型半導体層(13)と、
f)絶縁するための絶縁誘電体コーティング(14)と、
g)前記半導体層(13)上の半透過性金属接点(1)と、
h)前記半導体層(13)と前記半透過性金属接点(1)との間の選択的(optional)な金属層(2)と、
i)シリコンウェーハ(4)に対する裏側金属接点(5)と、
を含む、請求項1に記載の、室温において800〜1800nmの間で1320nmのレーザ光を発する、シリコンリッジ型レーザ。 - p型半導体層(13)は、請求項2に記載の前記ナノ多孔質シリコン層(3)上に形成される重水素化六フッ化アンモニウムシリコン層(DASH)(6)によって置き換えられる、請求項9に記載のシリコンリッジ型レーザ。
- 前記p型半導体層(13)は、Si、SiCまたはGaNからなる群から選択することができる、請求項9に記載のシリコンリッジ型レーザ。
- 前記絶縁誘電体コーティング(14)はポリイミドまたは二酸化ケイ素からなる群から選択することができる、請求項9または請求項10に記載のシリコンリッジ型レーザ。
- a)キャリアシリコンウェーハ(20)と、
b)最大1320nmで光を反射し、前記キャリアシリコンウェーハ(20)上に形成される、底部ブラッグ反射器(19)と、
c)前記底部ブラッグ反射器(19)上に形成されるシリコンウェーハ層(4)と、
d)請求項2に記載の前記シリコンウェーハ層(4)上に製造されるナノ多孔質シリコン層(3)と、
e)前記ナノ多孔質シリコン層(3)上に形成される上部ブラッグ反射器(18)と、
f)前記上部ブラッグ反射器(18)上に形成される半透過性金属接点(1)と、
g)前記上部ブラッグ反射器(18)と前記半透過性金属接点(1)との間の選択的(optional)な金属接点(2)と、
h)キャリアシリコンウェーハ(20)に対する裏側金属接点(5)と、
i)絶縁誘電体コーティング(22)と、
を含む、請求項1に記載の、室温において800〜1800nmの間で1320nmのレーザ光を発する、垂直共振器型面発光レーザ(VCSEL)。 - 前記底部ブラッグ反射器(19)および前記上部ブラッグ反射器(18)は、SiおよびSiGe周期的多層または選択的(optional)にSi/SiCもしくはSi/SiN周期的多層を堆積させることによって形成される、請求項13に記載の垂直共振器型面発光レーザ。
- 前記絶縁誘電体コーティング(22)は窒化ケイ素Si3N4またはポリイミドからなる群から選択することができる、請求項13に記載の垂直共振器型面発光レーザ。
- a)その上でHBTが成長する第2シリコンウェーハ(20)と、
b)前記第2シリコンウェーハ(20)上でエピタキシャルに成長する底部コレクタ層(44)と、
c)前記底部コレクタ層(44)上でベース層として成長する単結晶シリコン層(4)と、
d)請求項2に記載の方法によって前記ベース層(4)上に形成されるナノ多孔質シリコン層(3)と、
e)前記ナノ多孔質シリコン層(3)上で成長するエミッタ層(26)と、
f)前記エミッタ層(26)上に形成される半透過性金属接点(1)と、
g)前記エミッタ(26)と前記半透過性金属接点(1)との間の選択的(optional)な金属接点(2)と、
h)前記ベース層(4)上のベース金属接点(29)と、
i)前記コレクタ(44)上に形成される裏側金属接点(5)と、
を含む、トランジスタの電気部品であって、室温において1320nmで光信号出力を有する、ヘテロバイポーラトランジスタHBT。 - シリコンウェーハ(4)は、<100>または<111>結晶方位およびn型またはp型の導電性を有する単一のシリコンウェーハである、請求項1〜請求項16のいずれか1項に記載のシリコン光源。
- 前記ナノ多孔質シリコン層(3)の酸化膜は二酸化ケイ素SiOx(xはほぼ2である)である、請求項1〜請求項17のいずれか1項に記載のシリコン光源。
- 前記透過性金属接点(1および2)は、アルミニウム、金、クロム、チタンからなる金属の群から選択することができる、請求項1〜請求項18のいずれか1項に記載のシリコン光源。
- 前記裏側金属接点(5)は、アルミニウムまたは銀からなる群から選択することができる、請求項1〜請求項19のいずれか1項に記載のシリコン光源。
- 前記選択的(optional)な金属接点(2)は、チタン(Ti)またはクロム(Cr)からなる群から選択することができる、請求項1〜請求項20のいずれか1項に記載のシリコン光源。
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