JP2015525809A5 - - Google Patents
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- Publication number
- JP2015525809A5 JP2015525809A5 JP2015520252A JP2015520252A JP2015525809A5 JP 2015525809 A5 JP2015525809 A5 JP 2015525809A5 JP 2015520252 A JP2015520252 A JP 2015520252A JP 2015520252 A JP2015520252 A JP 2015520252A JP 2015525809 A5 JP2015525809 A5 JP 2015525809A5
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- epoxy
- epoxy curing
- item
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004593 Epoxy Substances 0.000 claims description 22
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000004049 embossing Methods 0.000 claims description 2
- 229920000768 polyamine Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261667637P | 2012-07-03 | 2012-07-03 | |
| US61/667,637 | 2012-07-03 | ||
| PCT/US2013/045623 WO2014007963A1 (en) | 2012-07-03 | 2013-06-13 | Method of making structured hybrid adhesive articles |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015525809A JP2015525809A (ja) | 2015-09-07 |
| JP2015525809A5 true JP2015525809A5 (cg-RX-API-DMAC7.html) | 2016-08-04 |
| JP6130502B2 JP6130502B2 (ja) | 2017-05-17 |
Family
ID=48692684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015520252A Active JP6130502B2 (ja) | 2012-07-03 | 2013-06-13 | 構造化ハイブリッド接着剤物品の製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US20150165670A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2870190B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6130502B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20150036272A (cg-RX-API-DMAC7.html) |
| CN (1) | CN104619742B (cg-RX-API-DMAC7.html) |
| BR (1) | BR112015000114A2 (cg-RX-API-DMAC7.html) |
| CA (1) | CA2877863A1 (cg-RX-API-DMAC7.html) |
| PL (1) | PL2870190T3 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2014007963A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9669426B2 (en) * | 2013-05-14 | 2017-06-06 | Boe Hyundai Lcd Inc. | Heat conductive adhesive film, method for manufacturing the same and OLED panel |
| JP6388727B2 (ja) * | 2015-02-27 | 2018-09-12 | スリーエム イノベイティブ プロパティズ カンパニー | 強化硬化剤を含む２液型接着剤 |
| CN112955486A (zh) | 2018-09-20 | 2021-06-11 | Ppg工业俄亥俄公司 | 含硫醇的组合物 |
| CN114269974A (zh) | 2019-08-19 | 2022-04-01 | 3M创新有限公司 | 包含可交联和交联粘合剂组合物的皮芯长丝及其打印方法 |
| EP4114894A1 (en) | 2020-03-06 | 2023-01-11 | 3M Innovative Properties Company | Adjustable hybrid psa/structural adhesive bonds by patterned surface-initiated cure |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1460571A (en) | 1973-11-16 | 1977-01-06 | Ciba Geigy Ag | Adhesive compositions |
| JPH0288684A (ja) * | 1988-09-27 | 1990-03-28 | Nitto Denko Corp | 接着方法及びそれに使用する液状接着剤 |
| ATE138084T1 (de) | 1988-11-23 | 1996-06-15 | Ciba Geigy Ag | Polyoxyalkylendithiole und polyamine enthaltende härtbare epoxidharz-stoffgemische |
| EP0475321B1 (en) | 1990-09-11 | 1996-06-05 | Hitachi Chemical Co., Ltd. | Epoxy resin film and method of producing it |
| DE4126877C1 (en) | 1991-08-14 | 1992-11-26 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De | Plastic microstructure prodn. for high temp. resistance - by forming poly:methyl methacrylate] mould unit, filling with plastic resin and dissolving in solvent, for high accuracy moulds |
| CA2086770A1 (en) * | 1992-01-10 | 1993-07-11 | Jyi-Faa Hwang | Epoxy interpenetrating polymer networks having internetwork bonds |
| US5942330A (en) * | 1994-05-19 | 1999-08-24 | Bostik, Incorporated | Adhesive compositions and methods and articles of manufacture comprising same |
| CA2196024A1 (en) | 1996-02-28 | 1997-08-28 | Craig N. Ernsberger | Multilayer electronic assembly utilizing a sinterable composition and related method of forming |
| AU740553B2 (en) | 1998-01-16 | 2001-11-08 | Loctite (R&D) Limited | Curable epoxy-based compositions |
| JP2002118144A (ja) | 2000-10-06 | 2002-04-19 | Sony Chem Corp | 接着剤及び電気装置 |
| US7125510B2 (en) | 2002-05-15 | 2006-10-24 | Zhili Huang | Microstructure fabrication and microsystem integration |
| JP4326190B2 (ja) | 2002-07-10 | 2009-09-02 | スリーエム イノベイティブ プロパティズ カンパニー | 可とう性成形型及びその製造方法 |
| ITTO20030530A1 (it) | 2003-07-09 | 2005-01-10 | Infm Istituto Naz Per La Fisi Ca Della Mater | Reticolo olografico di diffrazione, procedimento per la |
| JP2007046003A (ja) * | 2005-08-12 | 2007-02-22 | Three M Innovative Properties Co | 被着体の貼付方法 |
| EP1806375B1 (en) * | 2006-01-05 | 2009-04-01 | Cognis IP Management GmbH | Process for obtaining aqueous compositions comprising curing epoxy agents |
| JP4827861B2 (ja) * | 2008-01-18 | 2011-11-30 | 中国電力株式会社 | 流入量予測システム、流入量予測方法及びプログラム |
| WO2009142898A1 (en) | 2008-05-22 | 2009-11-26 | Dow Global Technologies Inc. | Adducts of epoxy resins and process for preparing the same |
| WO2010011705A1 (en) * | 2008-07-23 | 2010-01-28 | 3M Innovative Properties Company | Two-part epoxy-based structural adhesives |
| EP2393864A1 (en) * | 2009-02-06 | 2011-12-14 | 3M Innovative Properties Company | Room temperature curing epoxy adhesive |
| EP2223966B1 (en) | 2009-02-25 | 2017-08-16 | 3M Innovative Properties Company | Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
| US20100227981A1 (en) | 2009-03-04 | 2010-09-09 | Air Products And Chemicals, Inc. | Epoxide-based composition |
| PT2650210T (pt) | 2009-04-17 | 2018-05-10 | 3M Innovative Properties Co | Lâmina de proteção contra raios com discriminador modelado |
| EP2419333B1 (en) | 2009-04-17 | 2016-02-10 | 3M Innovative Properties Company | Lightning protection sheet with patterned conductor |
| CN101665674B (zh) * | 2009-09-30 | 2012-05-30 | 烟台德邦科技有限公司 | 一种单组分螺纹锁固环氧预涂胶及其制备方法 |
| EP2512978B1 (en) | 2009-12-14 | 2015-08-19 | Sicpa Holding Sa | Cast polymer layer with high aspect ratio |
| KR20130143015A (ko) * | 2010-08-20 | 2013-12-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 저온 경화성 에폭시 테이프 및 그의 제조 방법 |
| KR101952462B1 (ko) | 2010-12-29 | 2019-02-26 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 구조용 혼성 접착제 |
| WO2013025303A2 (en) * | 2011-08-18 | 2013-02-21 | Dow Global Technologies Llc | Curable resin compositions |
-
2013
- 2013-06-13 CA CA2877863A patent/CA2877863A1/en not_active Abandoned
- 2013-06-13 PL PL13731234T patent/PL2870190T3/pl unknown
- 2013-06-13 US US14/408,188 patent/US20150165670A1/en not_active Abandoned
- 2013-06-13 KR KR1020157002512A patent/KR20150036272A/ko not_active Ceased
- 2013-06-13 CN CN201380034619.8A patent/CN104619742B/zh not_active Expired - Fee Related
- 2013-06-13 EP EP13731234.4A patent/EP2870190B1/en active Active
- 2013-06-13 BR BR112015000114A patent/BR112015000114A2/pt not_active Application Discontinuation
- 2013-06-13 WO PCT/US2013/045623 patent/WO2014007963A1/en not_active Ceased
- 2013-06-13 JP JP2015520252A patent/JP6130502B2/ja active Active
-
2019
- 2019-02-01 US US16/265,211 patent/US10625463B2/en active Active
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