JP2015522954A5 - - Google Patents

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Publication number
JP2015522954A5
JP2015522954A5 JP2015522216A JP2015522216A JP2015522954A5 JP 2015522954 A5 JP2015522954 A5 JP 2015522954A5 JP 2015522216 A JP2015522216 A JP 2015522216A JP 2015522216 A JP2015522216 A JP 2015522216A JP 2015522954 A5 JP2015522954 A5 JP 2015522954A5
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JP2015522216A
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JP6348491B2 (ja
JP2015522954A (ja
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Priority claimed from PCT/IB2013/055752 external-priority patent/WO2014013406A1/en
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JP2015522216A 2012-07-20 2013-07-12 セラミック緑色蛍光体と保護された赤色蛍光体層とを有するｌｅｄ Active JP6348491B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261673810P 2012-07-20 2012-07-20
US61/673,810 2012-07-20
PCT/IB2013/055752 WO2014013406A1 (en) 2012-07-20 2013-07-12 Led with ceramic green phosphor and protected red phosphor layer

Publications (3)

Publication Number Publication Date
JP2015522954A JP2015522954A (ja) 2015-08-06
JP2015522954A5 true JP2015522954A5 (enExample) 2017-10-12
JP6348491B2 JP6348491B2 (ja) 2018-06-27

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JP2015522216A Active JP6348491B2 (ja) 2012-07-20 2013-07-12 セラミック緑色蛍光体と保護された赤色蛍光体層とを有するｌｅｄ

Country Status (6)

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US (3) US9379293B2 (enExample)
EP (1) EP2875532B1 (enExample)
JP (1) JP6348491B2 (enExample)
KR (2) KR102131747B1 (enExample)
CN (1) CN104471730B (enExample)
WO (1) WO2014013406A1 (enExample)

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DE102014100771A1 (de) * 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines keramischen Konversionselements und Licht emittierendes Bauelement
DE102014107472A1 (de) * 2014-05-27 2015-12-03 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Beleuchtungsvorrichtung
CN106575693B (zh) 2014-06-19 2020-07-31 亮锐控股有限公司 具有小源尺寸的波长转换发光设备
US20160023242A1 (en) * 2014-07-28 2016-01-28 Osram Sylvania Inc. Method of making wavelength converters for solid state lighting applications
JP6940784B2 (ja) * 2014-09-26 2021-09-29 日亜化学工業株式会社 発光装置の製造方法
DE102014117448A1 (de) * 2014-11-27 2016-06-02 Osram Gmbh Optoelektronischer Halbleiterchip, Verfahren zur Herstellung eines optoelektronischen Halbleiterchips, Konversionselement und Leuchtstoff für ein Konversionselement
DE102015102842A1 (de) 2015-02-27 2016-09-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Leuchtstoffkompositkeramik sowie Verfahren zu deren Herstellung
FR3033939B1 (fr) * 2015-03-20 2018-04-27 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif optoelectronique a diode electroluminescente
EP3709374B1 (en) * 2015-05-29 2022-08-03 Nichia Corporation Light emitting device
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JP6217705B2 (ja) 2015-07-28 2017-10-25 日亜化学工業株式会社 発光装置及びその製造方法
CN106486585A (zh) * 2015-08-25 2017-03-08 比亚迪股份有限公司 Led荧光膜、led组件、制备方法以及电子器件
US9859477B2 (en) 2016-01-15 2018-01-02 Corning Incorporated Method of forming light emitting diode with high-silica substrate
JP2017174908A (ja) * 2016-03-22 2017-09-28 豊田合成株式会社 発光装置の製造方法
KR102674066B1 (ko) 2016-11-11 2024-06-13 삼성전자주식회사 발광 소자 패키지
DE102016224090B4 (de) * 2016-12-05 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement, Modul mit mindestens zwei optoelektronischen Bauelementen und Verfahren zum Herstellen eines optoelektronischen Bauelements
DE102017101729A1 (de) * 2017-01-30 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
CN110556464A (zh) * 2018-06-01 2019-12-10 深圳市绎立锐光科技开发有限公司 发光二极管封装结构及封装方法
JP6760350B2 (ja) * 2018-10-25 2020-09-23 日亜化学工業株式会社 発光装置
CN111640844B (zh) * 2020-06-17 2021-11-30 鸿利智汇集团股份有限公司 一种复合荧光膜及led封装工艺
US12199230B2 (en) 2021-05-06 2025-01-14 Samsung Electronics Co., Ltd. Light emitting device package
US20230178690A1 (en) * 2021-12-06 2023-06-08 Lumileds Llc Monolithic LED Array And Method Of Manufacturing Thereof
CN119968946A (zh) * 2022-09-29 2025-05-09 艾迈斯-欧司朗国际有限责任公司 转换元件、用于制造转换元件的方法以及发光部件

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WO2011028033A2 (ko) * 2009-09-02 2011-03-10 엘지이노텍주식회사 형광체, 형광체 제조방법 및 백색 발광 소자
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TW201208143A (en) * 2010-08-06 2012-02-16 Semileds Optoelectronics Co White LED device and manufacturing method thereof
JP5622494B2 (ja) * 2010-09-09 2014-11-12 スタンレー電気株式会社 発光装置およびその製造方法
JP5566263B2 (ja) * 2010-11-08 2014-08-06 株式会社小糸製作所 発光モジュール
DE102010053362B4 (de) 2010-12-03 2021-09-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterchips, strahlungsemittierender Halbleiterchip und strahlungsemittierendes Bauelement

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