JP2015518242A - 回転式機械用の絶縁材料 - Google Patents
回転式機械用の絶縁材料 Download PDFInfo
- Publication number
- JP2015518242A JP2015518242A JP2015503814A JP2015503814A JP2015518242A JP 2015518242 A JP2015518242 A JP 2015518242A JP 2015503814 A JP2015503814 A JP 2015503814A JP 2015503814 A JP2015503814 A JP 2015503814A JP 2015518242 A JP2015518242 A JP 2015518242A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- filler
- insulating material
- nanoparticles
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/12—Impregnating, heating or drying of windings, stators, rotors or machines
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/30—Windings characterised by the insulating material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Abstract
Description
・真空圧含浸技術(VPI法)
・レジンリッチ技術。
・直径が小さいナノ粒子の濃度を、低く保つことができる。このことは経済的に、また化学的な見地からも都合がよい。と言うのも、粘度、反応性、及び貯蔵安定性といった特性を、より制御できるからである。
・同時に、比較的小さいナノ粒子の好ましい特性、例えば比表面積の大きさを利用できる。
Claims (7)
- 樹脂と、当該樹脂中に埋め込まれたナノ粒子状充填材との調製物を含有する絶縁材料において、前記充填材が、少なくとも双峰性の粒径分布で存在することを特徴とする、前記絶縁材料。
- 前記調製物が、樹脂、例えばエポキシ樹脂をベースとし、前記樹脂が、熱により、及び/又は紫外光により重合可能であることを特徴とする、請求項1に記載の絶縁材料。
- 前記樹脂に分散されたナノ粒子状充填材が、透過型電子顕微鏡で同定して、1.5dmax超の分布曲線の半値幅で存在することを特徴とする、請求項1又は2に記載の絶縁材料。
- 前記充填材のD50平均直径が、1〜500nmであることを特徴とする、請求項1から3までのいずれか1項に記載の絶縁材料。
- 前記充填材が、金属酸化物及び/又は半金属酸化物をベースとすることを特徴とする、請求項1から4までのいずれか1項に記載の絶縁材料。
- 前記充填材が、前記調製物の1〜80質量%の量で存在することを特徴とする、請求項1から5までのいずれか1項に記載の絶縁材料。
- 回転式電気機械、好適には発電機において巻取りコイルを含浸するための、請求項1から6までのいずれか1項に記載の絶縁材料の使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012205650.5 | 2012-04-05 | ||
DE102012205650A DE102012205650A1 (de) | 2012-04-05 | 2012-04-05 | Isolierstoff für rotierende Maschinen |
PCT/EP2013/056017 WO2013149850A1 (de) | 2012-04-05 | 2013-03-22 | Isolierstoff für rotierende maschinen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015518242A true JP2015518242A (ja) | 2015-06-25 |
JP5940210B2 JP5940210B2 (ja) | 2016-06-29 |
Family
ID=48045463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015503814A Expired - Fee Related JP5940210B2 (ja) | 2012-04-05 | 2013-03-22 | 回転式機械用の絶縁材料 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9771464B2 (ja) |
EP (1) | EP2807654A1 (ja) |
JP (1) | JP5940210B2 (ja) |
KR (1) | KR20150003791A (ja) |
CN (1) | CN104185876B (ja) |
DE (1) | DE102012205650A1 (ja) |
WO (1) | WO2013149850A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201607716PA (en) * | 2014-03-24 | 2016-11-29 | Lintec Corp | Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product |
EP3565089A1 (de) * | 2018-05-04 | 2019-11-06 | Siemens Aktiengesellschaft | Elektrisches isolationssystem eines elektromotors und herstellungsverfahren dazu |
EP3565090A1 (de) * | 2018-05-04 | 2019-11-06 | Siemens Aktiengesellschaft | Elektrisches isolationssystem eines elektromotors und herstellungsverfahren dazu |
US11916448B2 (en) | 2021-02-01 | 2024-02-27 | The Timken Company | Small-fraction nanoparticle resin for electric machine insulation systems |
TWI830505B (zh) * | 2022-11-21 | 2024-01-21 | 遠東科技大學 | 內凹曲面上具有陶瓷絕緣層的絕緣套件及其抗電壓擊穿之用途 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002118991A (ja) * | 2000-10-02 | 2002-04-19 | Fuji Electric Co Ltd | 回転電機のコアワニスおよびこのワニスを塗布した積層コア |
JP2005126700A (ja) * | 2003-09-30 | 2005-05-19 | Tdk Corp | 複合誘電体基板 |
JP2005206664A (ja) * | 2004-01-21 | 2005-08-04 | Nitto Denko Corp | 半導体封止用樹脂組成物 |
JP2005206665A (ja) * | 2004-01-21 | 2005-08-04 | Nitto Denko Corp | シート状半導体封止用樹脂組成物 |
JP2006014490A (ja) * | 2004-06-25 | 2006-01-12 | Toshiba Corp | 回転電機 |
JP2006351409A (ja) * | 2005-06-17 | 2006-12-28 | Nippon Steel Corp | 抜熱性の優れる絶縁被膜剤とその処理方法 |
JP2007027101A (ja) * | 2005-06-15 | 2007-02-01 | Toray Ind Inc | ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 |
US20070191513A1 (en) * | 2003-09-29 | 2007-08-16 | Irene Jenrich | Hardenable reaction resin system |
JP2007217623A (ja) * | 2006-02-20 | 2007-08-30 | Toray Ind Inc | ペースト組成物および誘電体組成物、ならびに誘電体組成物を用いたキャパシタ |
JP2008075069A (ja) * | 2006-08-23 | 2008-04-03 | Toshiba Corp | 注型樹脂組成物およびそれを用いた絶縁材料、絶縁構造体 |
US20080306203A1 (en) * | 2001-02-28 | 2008-12-11 | Hanse Chemie Ag | Silicon Dioxide Dispersion |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR0211819A (pt) * | 2001-08-15 | 2004-07-27 | 3M Innovative Properties Co | Composição, produto dentário, bandeja de impressão dentária, coroa dentária pré-formada, bandeja de impressão dentária pré-formada, métodos de preparação de uma composição, de um produto dentário, e de uma bandeja dentária, e, composto |
US20030187117A1 (en) * | 2002-03-29 | 2003-10-02 | Starkovich John A. | Materials and method for improving dimensional stability of precision electronic optical photonic and spacecraft components and structures |
EP1457509B1 (de) * | 2003-03-11 | 2006-06-28 | hanse chemie AG | Polymere Epoxidharz-Zusammensetzung |
DE10345139A1 (de) | 2003-09-29 | 2005-04-21 | Bosch Gmbh Robert | Härtbares Reaktionsharzsystem |
US7803457B2 (en) * | 2003-12-29 | 2010-09-28 | General Electric Company | Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom |
EP1557880A1 (en) | 2004-01-21 | 2005-07-27 | Nitto Denko Corporation | Resin composition for encapsulating semiconductor |
WO2006008120A1 (de) * | 2004-07-16 | 2006-01-26 | Alberdingk Boley Gmbh | Wässrige bindemitteldispersion mit nanopartikeln, verfahren zu deren herstellung und deren verwendung |
US7829188B2 (en) * | 2006-04-03 | 2010-11-09 | E.I. Du Pont De Nemours And Company | Filled epoxy compositions |
CN101506301A (zh) * | 2006-08-23 | 2009-08-12 | 株式会社东芝 | 浇铸型树脂组合物及采用它的绝缘材料、绝缘结构体 |
EP2137740A1 (en) * | 2007-04-20 | 2009-12-30 | ABB Research LTD | An impregnation medium |
US20090170998A1 (en) * | 2007-12-28 | 2009-07-02 | Deval Gupta | Silicon carbide containing thermoplastic compositions, method of preparing, and articles comprising the same |
DE102008030904A1 (de) * | 2008-06-30 | 2009-12-31 | Siemens Aktiengesellschaft | Verbundmaterial mit Nano-Pulver und Verwendung des Verbundmaterials |
DE102009053253A1 (de) | 2009-11-09 | 2011-05-12 | Siemens Aktiengesellschaft | Tränkharz für Verbundisolatoren |
WO2011100289A1 (en) * | 2010-02-11 | 2011-08-18 | 3M Innovative Properties Company | Resin system comprising dispersed multimodal surface -modified nanoparticles |
DE102010019721A1 (de) * | 2010-05-07 | 2011-11-10 | Siemens Aktiengesellschaft | Elektrisches Isoliermaterial, Isolationspapier und Isolationsband für eine Hochspannungsrotationsmaschine |
KR101874135B1 (ko) * | 2010-09-17 | 2018-07-03 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노입자형 인발성형 가공 보조제 |
DE102011083409A1 (de) | 2011-09-26 | 2013-03-28 | Siemens Aktiengesellschaft | Isoliersysteme mit verbesserter Teilentladungsbeständigkeit, Verfahren zur Herstellung dazu |
-
2012
- 2012-04-05 DE DE102012205650A patent/DE102012205650A1/de not_active Ceased
-
2013
- 2013-03-22 WO PCT/EP2013/056017 patent/WO2013149850A1/de active Application Filing
- 2013-03-22 CN CN201380017741.4A patent/CN104185876B/zh not_active Expired - Fee Related
- 2013-03-22 JP JP2015503814A patent/JP5940210B2/ja not_active Expired - Fee Related
- 2013-03-22 US US14/390,820 patent/US9771464B2/en not_active Expired - Fee Related
- 2013-03-22 EP EP13713811.1A patent/EP2807654A1/de not_active Withdrawn
- 2013-03-22 KR KR1020147031054A patent/KR20150003791A/ko not_active Application Discontinuation
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002118991A (ja) * | 2000-10-02 | 2002-04-19 | Fuji Electric Co Ltd | 回転電機のコアワニスおよびこのワニスを塗布した積層コア |
US20080306203A1 (en) * | 2001-02-28 | 2008-12-11 | Hanse Chemie Ag | Silicon Dioxide Dispersion |
US20070191513A1 (en) * | 2003-09-29 | 2007-08-16 | Irene Jenrich | Hardenable reaction resin system |
JP2005126700A (ja) * | 2003-09-30 | 2005-05-19 | Tdk Corp | 複合誘電体基板 |
JP2005206664A (ja) * | 2004-01-21 | 2005-08-04 | Nitto Denko Corp | 半導体封止用樹脂組成物 |
JP2005206665A (ja) * | 2004-01-21 | 2005-08-04 | Nitto Denko Corp | シート状半導体封止用樹脂組成物 |
JP2006014490A (ja) * | 2004-06-25 | 2006-01-12 | Toshiba Corp | 回転電機 |
JP2007027101A (ja) * | 2005-06-15 | 2007-02-01 | Toray Ind Inc | ペースト組成物、誘電体組成物、誘電体シート、およびこれらを用いたキャパシタ内蔵回路基板 |
JP2006351409A (ja) * | 2005-06-17 | 2006-12-28 | Nippon Steel Corp | 抜熱性の優れる絶縁被膜剤とその処理方法 |
JP2007217623A (ja) * | 2006-02-20 | 2007-08-30 | Toray Ind Inc | ペースト組成物および誘電体組成物、ならびに誘電体組成物を用いたキャパシタ |
JP2008075069A (ja) * | 2006-08-23 | 2008-04-03 | Toshiba Corp | 注型樹脂組成物およびそれを用いた絶縁材料、絶縁構造体 |
Non-Patent Citations (1)
Title |
---|
JIS工業用語大辞典, vol. 第5版, JPN6015038491, 2001, pages 1434 - 1654, ISSN: 0003300107 * |
Also Published As
Publication number | Publication date |
---|---|
CN104185876B (zh) | 2017-10-03 |
US20150093499A1 (en) | 2015-04-02 |
WO2013149850A1 (de) | 2013-10-10 |
CN104185876A (zh) | 2014-12-03 |
EP2807654A1 (de) | 2014-12-03 |
DE102012205650A1 (de) | 2013-10-10 |
JP5940210B2 (ja) | 2016-06-29 |
US9771464B2 (en) | 2017-09-26 |
KR20150003791A (ko) | 2015-01-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5940210B2 (ja) | 回転式機械用の絶縁材料 | |
CN103814415B (zh) | 具有改进的抗局部放电性的绝缘体系及其制备方法 | |
JP4922018B2 (ja) | 回転電機のコイル絶縁物 | |
US9589699B2 (en) | Insulation systems having improved partial discharge resistance, and method for producing same | |
JP6058169B2 (ja) | 絶縁テープ及びその製造方法、固定子コイル及びその製造方法、並びに回転電機 | |
JP5813225B2 (ja) | 電気絶縁系用のテープを製造する方法 | |
US20130131218A1 (en) | Insulation for rotating electrical machines | |
WO2016104141A1 (ja) | 絶縁テープ及びその製造方法、並びに固定子コイル及びその製造方法、並びに発電機 | |
US20170301429A1 (en) | Insulation System | |
US20150069877A1 (en) | Resin Composition for Electric Insulation and Its Hardened Products, as well as Coils, Stators, Rotary Machines, and High Voltage Equipment Using the Products | |
JP2010158113A (ja) | 電気絶縁部材、回転電機用固定子コイルおよび回転電機 | |
EP2402958A1 (de) | Elektroisolationssystem für eine elektrische Hochspannungsrotationsmaschine | |
WO2018003950A1 (ja) | 回転電機用コイル、回転電機用コイルの製造方法、マイカテープ、マイカテープの製造方法、マイカテープの硬化物及び絶縁物 | |
JP6403444B2 (ja) | マイカテープ及び固定子コイル | |
JP2019122099A (ja) | 回転電機用コイル、回転電機用コイルの製造方法、マイカテープ、マイカテープの硬化物及び絶縁物 | |
WO2018003951A1 (ja) | 回転電機用コイル、回転電機用コイルの製造方法、マイカテープ、マイカテープの硬化物及び絶縁物 | |
JP5159812B2 (ja) | 回転電機 | |
CN109074944A (zh) | 具有电气绕组的紧凑型干式变压器和用于制造电气绕组的方法 | |
JP7292525B2 (ja) | 回転機コイルと回転電機、および回転機コイルの製造方法 | |
US11916448B2 (en) | Small-fraction nanoparticle resin for electric machine insulation systems | |
JP7203285B1 (ja) | 回転機コイル、その製造方法および回転機 | |
JPWO2018002974A1 (ja) | コロナ放電防止構造製造方法、コロナ放電防止構造および回転電機 | |
JP2006074861A (ja) | 回転電機の電機子巻線および回転電機 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20151026 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151102 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160201 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160225 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160418 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160517 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5940210 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |