JP2015516675A5 - - Google Patents

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Publication number
JP2015516675A5
JP2015516675A5 JP2014561547A JP2014561547A JP2015516675A5 JP 2015516675 A5 JP2015516675 A5 JP 2015516675A5 JP 2014561547 A JP2014561547 A JP 2014561547A JP 2014561547 A JP2014561547 A JP 2014561547A JP 2015516675 A5 JP2015516675 A5 JP 2015516675A5
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JP
Japan
Prior art keywords
nozzle
liquid supply
liquid
wafer
nozzles
Prior art date
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Application number
JP2014561547A
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English (en)
Japanese (ja)
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JP2015516675A (ja
JP6121458B2 (ja
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Priority claimed from US13/418,034 external-priority patent/US20130233356A1/en
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Publication of JP2015516675A publication Critical patent/JP2015516675A/ja
Publication of JP2015516675A5 publication Critical patent/JP2015516675A5/ja
Application granted granted Critical
Publication of JP6121458B2 publication Critical patent/JP6121458B2/ja
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JP2014561547A 2012-03-12 2013-02-28 ウエハ形状物品の表面を処理するためのプロセスおよび装置 Active JP6121458B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/418,034 2012-03-12
US13/418,034 US20130233356A1 (en) 2012-03-12 2012-03-12 Process and apparatus for treating surfaces of wafer-shaped articles
PCT/IB2013/051603 WO2013136211A1 (en) 2012-03-12 2013-02-28 Process and apparatus for treating surfaces of wafer-shaped articles

Publications (3)

Publication Number Publication Date
JP2015516675A JP2015516675A (ja) 2015-06-11
JP2015516675A5 true JP2015516675A5 (enExample) 2016-04-14
JP6121458B2 JP6121458B2 (ja) 2017-04-26

Family

ID=49112963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014561547A Active JP6121458B2 (ja) 2012-03-12 2013-02-28 ウエハ形状物品の表面を処理するためのプロセスおよび装置

Country Status (5)

Country Link
US (1) US20130233356A1 (enExample)
JP (1) JP6121458B2 (enExample)
KR (1) KR102047149B1 (enExample)
TW (1) TWI595591B (enExample)
WO (1) WO2013136211A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6131162B2 (ja) 2012-11-08 2017-05-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US9873940B2 (en) 2013-12-31 2018-01-23 Lam Research Corporation Coating system and method for coating interior fluid wetted surfaces of a component of a semiconductor substrate processing apparatus
DE102014016364A1 (de) * 2014-11-05 2016-05-12 Eisenmann Se Reinigungsverfahren und Reinigungsvorrichtung für ein oder mehrere Teile eines Applikationssystems
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102518220B1 (ko) * 2016-11-09 2023-04-04 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
US10843236B2 (en) 2017-01-27 2020-11-24 Tel Manufacturing And Engineering Of America, Inc. Systems and methods for rotating and translating a substrate in a process chamber
JP7357625B2 (ja) 2018-02-19 2023-10-06 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド 制御可能なビームサイズの処理噴霧を有する小型電子機器処理システム
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber
DE102021121552A1 (de) * 2021-08-19 2023-02-23 Dürr Systems Ag Reinigungsgerät für eine Elektrodenanordnung eines Zerstäubers, zugehöriges Betriebsverfahren und entsprechende Elektrodenanordnung
JP2023140191A (ja) * 2022-03-22 2023-10-04 キオクシア株式会社 基板処理装置および基板処理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08261648A (ja) * 1995-03-28 1996-10-11 Hitachi Ltd 乾燥装置
JP3250090B2 (ja) * 1995-06-27 2002-01-28 東京エレクトロン株式会社 洗浄処理装置及び洗浄処理方法
JPH11165114A (ja) * 1997-12-05 1999-06-22 Dainippon Screen Mfg Co Ltd 枚葉式基板処理装置
CA2320278C (en) * 1998-02-12 2006-01-03 Acm Research, Inc. Plating apparatus and method
US6688784B1 (en) * 2000-10-25 2004-02-10 Advanced Micro Devices, Inc. Parallel plate development with multiple holes in top plate for control of developer flow and pressure
TWI252791B (en) * 2002-01-18 2006-04-11 Promos Technologies Inc Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
KR100457053B1 (ko) * 2002-07-30 2004-11-10 삼성전자주식회사 웨이퍼 세정 장치
US20040084318A1 (en) * 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
JP2007251078A (ja) * 2006-03-20 2007-09-27 Nuflare Technology Inc 気相成長装置
KR101000944B1 (ko) * 2008-10-09 2010-12-13 세메스 주식회사 처리액 공급 유닛과 이를 이용한 기판 처리 장치 및 방법
JP2010103131A (ja) * 2008-10-21 2010-05-06 Tokyo Electron Ltd 液処理装置及び液処理方法
US20100216373A1 (en) * 2009-02-25 2010-08-26 Araca, Inc. Method for cmp uniformity control
JP5391014B2 (ja) * 2009-09-28 2014-01-15 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

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