TWI595591B - 用以處理晶圓狀物件之表面的程序及設備 - Google Patents

用以處理晶圓狀物件之表面的程序及設備 Download PDF

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Publication number
TWI595591B
TWI595591B TW102108288A TW102108288A TWI595591B TW I595591 B TWI595591 B TW I595591B TW 102108288 A TW102108288 A TW 102108288A TW 102108288 A TW102108288 A TW 102108288A TW I595591 B TWI595591 B TW I595591B
Authority
TW
Taiwan
Prior art keywords
nozzle
wafer
liquid
processing
nozzles
Prior art date
Application number
TW102108288A
Other languages
English (en)
Chinese (zh)
Other versions
TW201401420A (zh
Inventor
瑞尼 歐伯威格
麥可 布魯格
法蘭茲 古寧格
Original Assignee
蘭姆研究股份公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究股份公司 filed Critical 蘭姆研究股份公司
Publication of TW201401420A publication Critical patent/TW201401420A/zh
Application granted granted Critical
Publication of TWI595591B publication Critical patent/TWI595591B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
TW102108288A 2012-03-12 2013-03-08 用以處理晶圓狀物件之表面的程序及設備 TWI595591B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/418,034 US20130233356A1 (en) 2012-03-12 2012-03-12 Process and apparatus for treating surfaces of wafer-shaped articles

Publications (2)

Publication Number Publication Date
TW201401420A TW201401420A (zh) 2014-01-01
TWI595591B true TWI595591B (zh) 2017-08-11

Family

ID=49112963

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102108288A TWI595591B (zh) 2012-03-12 2013-03-08 用以處理晶圓狀物件之表面的程序及設備

Country Status (5)

Country Link
US (1) US20130233356A1 (enExample)
JP (1) JP6121458B2 (enExample)
KR (1) KR102047149B1 (enExample)
TW (1) TWI595591B (enExample)
WO (1) WO2013136211A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6131162B2 (ja) * 2012-11-08 2017-05-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US9873940B2 (en) 2013-12-31 2018-01-23 Lam Research Corporation Coating system and method for coating interior fluid wetted surfaces of a component of a semiconductor substrate processing apparatus
DE102014016364A1 (de) * 2014-11-05 2016-05-12 Eisenmann Se Reinigungsverfahren und Reinigungsvorrichtung für ein oder mehrere Teile eines Applikationssystems
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7297664B2 (ja) * 2016-11-09 2023-06-26 ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ，インコーポレイテッド プロセスチャンバ中でマイクロエレクトロニクス基板を処理するための磁気的な浮上および回転するチャック
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
US10843236B2 (en) 2017-01-27 2020-11-24 Tel Manufacturing And Engineering Of America, Inc. Systems and methods for rotating and translating a substrate in a process chamber
CN111937128A (zh) 2018-02-19 2020-11-13 东京毅力科创美国制造与工程公司 具有可控射束大小的处理喷雾的微电子处理系统
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber
DE102021121552A1 (de) * 2021-08-19 2023-02-23 Dürr Systems Ag Reinigungsgerät für eine Elektrodenanordnung eines Zerstäubers, zugehöriges Betriebsverfahren und entsprechende Elektrodenanordnung
JP2023140191A (ja) * 2022-03-22 2023-10-04 キオクシア株式会社 基板処理装置および基板処理方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5868865A (en) * 1995-06-27 1999-02-09 Tokyo Electron Limited Apparatus and method for washing treatment
US20010040100A1 (en) * 1998-02-12 2001-11-15 Hui Wang Plating apparatus and method
US20040020520A1 (en) * 2002-07-30 2004-02-05 Dong-Hyun Kim Apparatus for cleaning a wafer
US6688784B1 (en) * 2000-10-25 2004-02-10 Advanced Micro Devices, Inc. Parallel plate development with multiple holes in top plate for control of developer flow and pressure
US20040115567A1 (en) * 2002-12-16 2004-06-17 Mandal Robert P. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
TW201014658A (en) * 2008-10-09 2010-04-16 Semes Co Ltd Treating liquid supplying unit and substrate treating apparatus and method using the same
TW201017724A (en) * 2008-10-21 2010-05-01 Tokyo Electron Ltd Liquid treatment apparatus and liquid treatment method
US20100243462A1 (en) * 2002-11-05 2010-09-30 Uri Cohen Methods for Activating Openings for Jets Electroplating

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08261648A (ja) * 1995-03-28 1996-10-11 Hitachi Ltd 乾燥装置
JPH11165114A (ja) * 1997-12-05 1999-06-22 Dainippon Screen Mfg Co Ltd 枚葉式基板処理装置
TWI252791B (en) * 2002-01-18 2006-04-11 Promos Technologies Inc Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
JP2007251078A (ja) * 2006-03-20 2007-09-27 Nuflare Technology Inc 気相成長装置
US20100216373A1 (en) * 2009-02-25 2010-08-26 Araca, Inc. Method for cmp uniformity control
JP5391014B2 (ja) * 2009-09-28 2014-01-15 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5868865A (en) * 1995-06-27 1999-02-09 Tokyo Electron Limited Apparatus and method for washing treatment
US20010040100A1 (en) * 1998-02-12 2001-11-15 Hui Wang Plating apparatus and method
US6688784B1 (en) * 2000-10-25 2004-02-10 Advanced Micro Devices, Inc. Parallel plate development with multiple holes in top plate for control of developer flow and pressure
US20040020520A1 (en) * 2002-07-30 2004-02-05 Dong-Hyun Kim Apparatus for cleaning a wafer
US20100243462A1 (en) * 2002-11-05 2010-09-30 Uri Cohen Methods for Activating Openings for Jets Electroplating
US20040115567A1 (en) * 2002-12-16 2004-06-17 Mandal Robert P. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms
TW201014658A (en) * 2008-10-09 2010-04-16 Semes Co Ltd Treating liquid supplying unit and substrate treating apparatus and method using the same
TW201017724A (en) * 2008-10-21 2010-05-01 Tokyo Electron Ltd Liquid treatment apparatus and liquid treatment method

Also Published As

Publication number Publication date
KR20140135978A (ko) 2014-11-27
JP6121458B2 (ja) 2017-04-26
US20130233356A1 (en) 2013-09-12
JP2015516675A (ja) 2015-06-11
TW201401420A (zh) 2014-01-01
WO2013136211A1 (en) 2013-09-19
KR102047149B1 (ko) 2019-12-02

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