JP2015515551A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015515551A5 JP2015515551A5 JP2015509032A JP2015509032A JP2015515551A5 JP 2015515551 A5 JP2015515551 A5 JP 2015515551A5 JP 2015509032 A JP2015509032 A JP 2015509032A JP 2015509032 A JP2015509032 A JP 2015509032A JP 2015515551 A5 JP2015515551 A5 JP 2015515551A5
- Authority
- JP
- Japan
- Prior art keywords
- target
- lip
- facing surface
- inches
- kit shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 2
- 208000000659 Autoimmune lymphoproliferative syndrome Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229940082150 encore Drugs 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261637606P | 2012-04-24 | 2012-04-24 | |
| US61/637,606 | 2012-04-24 | ||
| US13/860,578 | 2013-04-11 | ||
| US13/860,578 US20130277203A1 (en) | 2012-04-24 | 2013-04-11 | Process kit shield and physical vapor deposition chamber having same |
| PCT/US2013/037101 WO2013162992A1 (en) | 2012-04-24 | 2013-04-18 | Process kit shield and physical vapor deposition chamber having same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015515551A JP2015515551A (ja) | 2015-05-28 |
| JP2015515551A5 true JP2015515551A5 (https=) | 2016-06-09 |
| JP6238963B2 JP6238963B2 (ja) | 2017-11-29 |
Family
ID=49379103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015509032A Active JP6238963B2 (ja) | 2012-04-24 | 2013-04-18 | プロセスキットシールドおよびプロセスキットシールドを有する物理的気相堆積チャンバ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20130277203A1 (https=) |
| JP (1) | JP6238963B2 (https=) |
| KR (2) | KR20200079576A (https=) |
| CN (1) | CN104246004B (https=) |
| TW (1) | TWI616552B (https=) |
| WO (1) | WO2013162992A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130136864A1 (en) * | 2011-11-28 | 2013-05-30 | United Technologies Corporation | Passive termperature control of hpc rotor coating |
| JP5860063B2 (ja) * | 2011-12-22 | 2016-02-16 | キヤノンアネルバ株式会社 | 基板処理装置 |
| CN105097401B (zh) * | 2014-05-13 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种反应腔室及半导体加工设备 |
| CN105779932B (zh) * | 2014-12-26 | 2018-08-24 | 北京北方华创微电子装备有限公司 | 用于处理腔室的工艺内衬和物理气相沉积设备 |
| US10546733B2 (en) | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
| US10100399B2 (en) * | 2015-03-31 | 2018-10-16 | Ulvac, Inc. | Cathode assembly |
| US10103012B2 (en) | 2015-09-11 | 2018-10-16 | Applied Materials, Inc. | One-piece process kit shield for reducing the impact of an electric field near the substrate |
| US9953812B2 (en) | 2015-10-06 | 2018-04-24 | Applied Materials, Inc. | Integrated process kit for a substrate processing chamber |
| SG11201804420UA (en) * | 2015-11-24 | 2018-06-28 | Applied Materials Inc | Pre-coated shield for use in vhf-rf pvd chambers |
| CN108292588B (zh) * | 2015-12-04 | 2022-02-18 | 应用材料公司 | 用以防止hdp-cvd腔室电弧放电的先进涂层方法及材料 |
| US11017984B2 (en) * | 2016-04-28 | 2021-05-25 | Applied Materials, Inc. | Ceramic coated quartz lid for processing chamber |
| US9773665B1 (en) * | 2016-12-06 | 2017-09-26 | Applied Materials, Inc. | Particle reduction in a physical vapor deposition chamber |
| US10998172B2 (en) * | 2017-09-22 | 2021-05-04 | Applied Materials, Inc. | Substrate processing chamber having improved process volume sealing |
| JP7001448B2 (ja) * | 2017-12-05 | 2022-01-19 | 東京エレクトロン株式会社 | Ｐｖｄ処理方法およびｐｖｄ処理装置 |
| CN111602235B (zh) * | 2018-01-29 | 2025-03-14 | 应用材料公司 | 用于在pvd处理中减少颗粒的处理配件几何形状 |
| US10818839B2 (en) | 2018-03-15 | 2020-10-27 | Samsung Electronics Co., Ltd. | Apparatus for and method of fabricating semiconductor devices |
| US11584985B2 (en) * | 2018-08-13 | 2023-02-21 | Honeywell International Inc. | Sputter trap having a thin high purity coating layer and method of making the same |
| CN113412341B (zh) * | 2019-02-11 | 2024-11-01 | 应用材料公司 | 在脉冲式pvd中通过等离子体改性从晶片移除颗粒的方法 |
| US11289312B2 (en) | 2019-06-12 | 2022-03-29 | Applied Materials, Inc. | Physical vapor deposition (PVD) chamber with in situ chamber cleaning capability |
| KR102755075B1 (ko) * | 2019-11-15 | 2025-01-14 | 캐논 톡키 가부시키가이샤 | 성막장치 |
| KR102755070B1 (ko) * | 2019-11-20 | 2025-01-14 | 캐논 톡키 가부시키가이샤 | 성막장치 |
| CN114107931B (zh) * | 2021-11-19 | 2023-10-13 | 北京北方华创微电子装备有限公司 | 半导体腔室 |
| US12195843B2 (en) * | 2023-01-19 | 2025-01-14 | Applied Materials, Inc. | Multicathode PVD system for high aspect ratio barrier seed deposition |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419029A (en) * | 1994-02-18 | 1995-05-30 | Applied Materials, Inc. | Temperature clamping method for anti-contamination and collimating devices for thin film processes |
| US20020090464A1 (en) * | 2000-11-28 | 2002-07-11 | Mingwei Jiang | Sputter chamber shield |
| US6613442B2 (en) * | 2000-12-29 | 2003-09-02 | Lam Research Corporation | Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof |
| KR100427842B1 (ko) * | 2001-09-21 | 2004-04-30 | 장건 | 진공증착박막코팅챔버용 실드 및 그 제조방법 |
| US7026009B2 (en) * | 2002-03-27 | 2006-04-11 | Applied Materials, Inc. | Evaluation of chamber components having textured coatings |
| US20050205415A1 (en) * | 2004-03-19 | 2005-09-22 | Belousov Igor V | Multi-component deposition |
| US7618769B2 (en) * | 2004-06-07 | 2009-11-17 | Applied Materials, Inc. | Textured chamber surface |
| JP4623055B2 (ja) * | 2007-05-23 | 2011-02-02 | 日本テキサス・インスツルメンツ株式会社 | メタル成膜装置におけるメタル膜剥離防止構造及び当該構造を用いる半導体装置の製造方法 |
| CN102007572B (zh) * | 2008-04-16 | 2013-01-16 | 应用材料公司 | 晶圆处理沉积屏蔽构件 |
| US20100055298A1 (en) * | 2008-08-28 | 2010-03-04 | Applied Materials, Inc. | Process kit shields and methods of use thereof |
| US9834840B2 (en) * | 2010-05-14 | 2017-12-05 | Applied Materials, Inc. | Process kit shield for improved particle reduction |
| KR20120021642A (ko) * | 2010-08-11 | 2012-03-09 | 주식회사 에스에프에이 | 스퍼터 장치 |
-
2013
- 2013-04-11 US US13/860,578 patent/US20130277203A1/en not_active Abandoned
- 2013-04-18 KR KR1020207018767A patent/KR20200079576A/ko not_active Ceased
- 2013-04-18 CN CN201380021330.2A patent/CN104246004B/zh active Active
- 2013-04-18 JP JP2015509032A patent/JP6238963B2/ja active Active
- 2013-04-18 KR KR1020147032961A patent/KR20150013594A/ko not_active Ceased
- 2013-04-18 WO PCT/US2013/037101 patent/WO2013162992A1/en not_active Ceased
- 2013-04-19 TW TW102114051A patent/TWI616552B/zh active
-
2016
- 2016-12-14 US US15/378,402 patent/US20170088942A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015515551A5 (https=) | ||
| TWI537410B (zh) | 可調整式處理間距、置中及改良的氣體傳導 | |
| JP5931055B2 (ja) | 基板を処理する装置及び当該装置に含まれるプロセスキットシールド | |
| JP6238963B2 (ja) | プロセスキットシールドおよびプロセスキットシールドを有する物理的気相堆積チャンバ | |
| JP5762281B2 (ja) | Ｒｆ物理気相蒸着用処理キット | |
| US8911601B2 (en) | Deposition ring and electrostatic chuck for physical vapor deposition chamber | |
| US20110036709A1 (en) | Process kit for rf physical vapor deposition | |
| TW200721301A (en) | Actively heated aluminum baffle component having improved particle performance and methods of use and manufacture thereof | |
| TWI675434B (zh) | 合併式蓋環 | |
| US9062379B2 (en) | Wafer processing deposition shielding components | |
| TW201411719A (zh) | 用於電漿處理室之邊緣環組件及其製造方法 | |
| US20160168687A1 (en) | Particle reduction in a deposition chamber using thermal expansion coefficient compatible coating | |
| US9633824B2 (en) | Target for PVD sputtering system | |
| TW201623646A (zh) | 用於在鈦鎢靶材中之結核控制的方法及設備 |