JP2015207895A5 - - Google Patents

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Publication number
JP2015207895A5
JP2015207895A5 JP2014087149A JP2014087149A JP2015207895A5 JP 2015207895 A5 JP2015207895 A5 JP 2015207895A5 JP 2014087149 A JP2014087149 A JP 2014087149A JP 2014087149 A JP2014087149 A JP 2014087149A JP 2015207895 A5 JP2015207895 A5 JP 2015207895A5
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JP
Japan
Prior art keywords
substrate
forming
resist
plating layer
dry etching
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JP2014087149A
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English (en)
Japanese (ja)
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JP2015207895A (ja
JP6435629B2 (ja
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Priority claimed from JP2014087149A external-priority patent/JP6435629B2/ja
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Publication of JP2015207895A5 publication Critical patent/JP2015207895A5/ja
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Publication of JP6435629B2 publication Critical patent/JP6435629B2/ja
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JP2014087149A 2014-04-21 2014-04-21 基板のドライエッチング方法 Active JP6435629B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014087149A JP6435629B2 (ja) 2014-04-21 2014-04-21 基板のドライエッチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014087149A JP6435629B2 (ja) 2014-04-21 2014-04-21 基板のドライエッチング方法

Publications (3)

Publication Number Publication Date
JP2015207895A JP2015207895A (ja) 2015-11-19
JP2015207895A5 true JP2015207895A5 (enExample) 2017-04-27
JP6435629B2 JP6435629B2 (ja) 2018-12-12

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Family Applications (1)

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JP2014087149A Active JP6435629B2 (ja) 2014-04-21 2014-04-21 基板のドライエッチング方法

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JP (1) JP6435629B2 (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243217A (ja) * 1992-02-28 1993-09-21 Nec Corp 半導体装置の製造方法
JP3421259B2 (ja) * 1997-12-25 2003-06-30 ティーディーケイ株式会社 エッチングマスク、その作製方法およびエッチング方法、並びに磁気ヘッドおよびその製造方法
JP4516538B2 (ja) * 2006-03-01 2010-08-04 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
JP5386962B2 (ja) * 2008-12-12 2014-01-15 三菱電機株式会社 エッチング方法およびエッチング方法を用いた半導体装置の製造方法

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