JP2015196904A - 錯体Ｃｏ２＋金属イオン還元剤を使用した、連続プラチナ層の無電解堆積 - Google Patents

錯体Ｃｏ２＋金属イオン還元剤を使用した、連続プラチナ層の無電解堆積 Download PDF

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Publication number
JP2015196904A
JP2015196904A JP2015074711A JP2015074711A JP2015196904A JP 2015196904 A JP2015196904 A JP 2015196904A JP 2015074711 A JP2015074711 A JP 2015074711A JP 2015074711 A JP2015074711 A JP 2015074711A JP 2015196904 A JP2015196904 A JP 2015196904A
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Japan
Prior art keywords
solution
concentrated stock
stock solution
platinum
free
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JP2015074711A
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English (en)
Japanese (ja)
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JP2015196904A5 (enExample
Inventor
ユージニジュス・ノークス
Norkus Eugenijus
アイナ・スタンケビシエーヌ
Stankeviciene Ina
アルドナ・ジャグミニエーヌ
Jagminiene Aldona
ロレッタ・タマサウスカイテ−タマシウナイテ
Tamasauskaite-Tamasiunaite Loreta
アニルッダ・ジョイ
Joi Aniruddha
イエッディ・ドルディ
Dordi Yezdi
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Lam Research Corp
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Lam Research Corp
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Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2015196904A publication Critical patent/JP2015196904A/ja
Publication of JP2015196904A5 publication Critical patent/JP2015196904A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/168—Control of temperature, e.g. temperature of bath, substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76849—Barrier, adhesion or liner layers formed in openings in a dielectric the layer being positioned on top of the main fill metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
JP2015074711A 2014-04-02 2015-04-01 錯体Ｃｏ２＋金属イオン還元剤を使用した、連続プラチナ層の無電解堆積 Pending JP2015196904A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/243,793 US9499913B2 (en) 2014-04-02 2014-04-02 Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
US14/243,793 2014-04-02

Publications (2)

Publication Number Publication Date
JP2015196904A true JP2015196904A (ja) 2015-11-09
JP2015196904A5 JP2015196904A5 (enExample) 2018-05-24

Family

ID=54209249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015074711A Pending JP2015196904A (ja) 2014-04-02 2015-04-01 錯体Ｃｏ２＋金属イオン還元剤を使用した、連続プラチナ層の無電解堆積

Country Status (4)

Country Link
US (1) US9499913B2 (enExample)
JP (1) JP2015196904A (enExample)
KR (1) KR20150114914A (enExample)
TW (1) TW201602409A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9469902B2 (en) * 2014-02-18 2016-10-18 Lam Research Corporation Electroless deposition of continuous platinum layer
LT6547B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos cheminio nusodinimo tirpalas ir platinos tolydžios dangos formavimo būdas

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591667A (ja) * 1982-05-20 1984-01-07 ゼネラル・エレクトリツク・カンパニイ シリコンに対する白金の無電解めつき法
JP2000355774A (ja) * 1999-04-06 2000-12-26 Daiwa Kasei Kenkyusho:Kk めっき方法とそれに用いるめっき液前駆体
JP2003268558A (ja) * 2002-03-18 2003-09-25 Daiwa Fine Chemicals Co Ltd (Laboratory) 無電解めっき浴及び該めっき浴を用いて得られた金属被覆物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698939A (en) * 1970-07-09 1972-10-17 Frank H Leaman Method and composition of platinum plating
US4279951A (en) * 1979-01-15 1981-07-21 Mine Safety Appliances Company Method for the electroless deposition of palladium
JPH04325688A (ja) 1991-04-26 1992-11-16 Murata Mfg Co Ltd 無電解めっき浴
JP3116637B2 (ja) 1993-03-12 2000-12-11 株式会社村田製作所 無電解めっき液
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
DE10048844A1 (de) * 2000-10-02 2002-04-11 Basf Ag Verfahren zur Herstellung von Platinmetall-Katalysatoren
US8298325B2 (en) * 2006-05-11 2012-10-30 Lam Research Corporation Electroless deposition from non-aqueous solutions
US8632628B2 (en) * 2010-10-29 2014-01-21 Lam Research Corporation Solutions and methods for metal deposition
US9469902B2 (en) * 2014-02-18 2016-10-18 Lam Research Corporation Electroless deposition of continuous platinum layer
US20150307995A1 (en) * 2014-04-29 2015-10-29 Lam Research Corporation ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591667A (ja) * 1982-05-20 1984-01-07 ゼネラル・エレクトリツク・カンパニイ シリコンに対する白金の無電解めつき法
JP2000355774A (ja) * 1999-04-06 2000-12-26 Daiwa Kasei Kenkyusho:Kk めっき方法とそれに用いるめっき液前駆体
JP2003268558A (ja) * 2002-03-18 2003-09-25 Daiwa Fine Chemicals Co Ltd (Laboratory) 無電解めっき浴及び該めっき浴を用いて得られた金属被覆物

Also Published As

Publication number Publication date
TW201602409A (zh) 2016-01-16
KR20150114914A (ko) 2015-10-13
US20150284857A1 (en) 2015-10-08
US9499913B2 (en) 2016-11-22

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