JP2015187208A5 - - Google Patents

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Publication number
JP2015187208A5
JP2015187208A5 JP2014064542A JP2014064542A JP2015187208A5 JP 2015187208 A5 JP2015187208 A5 JP 2015187208A5 JP 2014064542 A JP2014064542 A JP 2014064542A JP 2014064542 A JP2014064542 A JP 2014064542A JP 2015187208 A5 JP2015187208 A5 JP 2015187208A5
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JP
Japan
Prior art keywords
compound
gallium
silanol
resin composition
thermosetting resin
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JP2014064542A
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English (en)
Japanese (ja)
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JP6299328B2 (ja
JP2015187208A (ja
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Priority to JP2014064542A priority Critical patent/JP6299328B2/ja
Priority claimed from JP2014064542A external-priority patent/JP6299328B2/ja
Publication of JP2015187208A publication Critical patent/JP2015187208A/ja
Publication of JP2015187208A5 publication Critical patent/JP2015187208A5/ja
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JP2014064542A 2014-03-26 2014-03-26 熱硬化性樹脂組成物、その製造方法、樹脂硬化物の製造方法、および、エポキシ化合物の自己重合を発生させる方法 Active JP6299328B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014064542A JP6299328B2 (ja) 2014-03-26 2014-03-26 熱硬化性樹脂組成物、その製造方法、樹脂硬化物の製造方法、および、エポキシ化合物の自己重合を発生させる方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014064542A JP6299328B2 (ja) 2014-03-26 2014-03-26 熱硬化性樹脂組成物、その製造方法、樹脂硬化物の製造方法、および、エポキシ化合物の自己重合を発生させる方法

Publications (3)

Publication Number Publication Date
JP2015187208A JP2015187208A (ja) 2015-10-29
JP2015187208A5 true JP2015187208A5 (enExample) 2017-03-09
JP6299328B2 JP6299328B2 (ja) 2018-03-28

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ID=54429605

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JP2014064542A Active JP6299328B2 (ja) 2014-03-26 2014-03-26 熱硬化性樹脂組成物、その製造方法、樹脂硬化物の製造方法、および、エポキシ化合物の自己重合を発生させる方法

Country Status (1)

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JP (1) JP6299328B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018025850A1 (ja) * 2016-08-03 2018-02-08 三菱ケミカル株式会社 樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5600869B2 (ja) * 2008-11-05 2014-10-08 横浜ゴム株式会社 加熱硬化性光半導体封止用樹脂組成物およびこれを用いる光半導体封止体
JP6452141B2 (ja) * 2013-07-26 2019-01-16 国立大学法人九州工業大学 潜在性硬化触媒、熱硬化性樹脂組成物及び樹脂封止型半導体装置

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