JP2015187208A5 - - Google Patents

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JP2015187208A5
JP2015187208A5 JP2014064542A JP2014064542A JP2015187208A5 JP 2015187208 A5 JP2015187208 A5 JP 2015187208A5 JP 2014064542 A JP2014064542 A JP 2014064542A JP 2014064542 A JP2014064542 A JP 2014064542A JP 2015187208 A5 JP2015187208 A5 JP 2015187208A5
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compound
gallium
silanol
resin composition
thermosetting resin
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JP2014064542A
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JP2015187208A (en
JP6299328B2 (en
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Claims (15)

エポキシ化合物と、ガリウムトリアセチルアセトネートと酢酸ガリウムを除くガリウム化合物と、シラノール源化合物とを含有する熱硬化性樹脂組成物。 A thermosetting resin composition comprising an epoxy compound, a gallium compound excluding gallium triacetylacetonate and gallium acetate , and a silanol source compound. 上記エポキシ化合物が脂環式エポキシ化合物を含む、請求項１に記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to claim 1, wherein the epoxy compound includes an alicyclic epoxy compound. 上記シラノール源化合物がオルガノポリシロキサンを含む、請求項１または請求項２に記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to claim 1, wherein the silanol source compound contains an organopolysiloxane. 上記シラノール源化合物が、モノシラン化合物を含む、請求項１〜３のいずれかに記載の熱硬化性樹脂組成物。   The thermosetting resin composition according to any one of claims 1 to 3, wherein the silanol source compound contains a monosilane compound. 上記ガリウム化合物が、トリエトキシガリウムを含む、請求項１~４のいずれかに記載
の熱硬化性樹脂組成物。 The thermosetting resin composition according to any one of claims 1 to 4, wherein the gallium compound contains triethoxygallium . エポキシ化合物に、ガリウムトリアセチルアセトネートと酢酸ガリウムを除くガリウム化合物およびシラノール源化合物を混合するステップを有する、熱硬化性樹脂組成物の製造方法。 A method for producing a thermosetting resin composition, comprising the step of mixing a gallium compound excluding gallium triacetylacetonate and gallium acetate and a silanol source compound into an epoxy compound. 上記エポキシ化合物が脂環式エポキシ化合物を含む、請求項６に記載の製造方法。 The manufacturing method of Claim 6 with which the said epoxy compound contains an alicyclic epoxy compound. 上記シラノール源化合物がオルガノポリシロキサンを含む、請求項６または７に記載の製造方法。 The manufacturing method of Claim 6 or 7 in which the said silanol source compound contains organopolysiloxane. 上記シラノール源化合物が、モノシラン化合物を含む、請求項６〜８のいずれかに記載の製造方法。 The silanol source compound comprises a monosilane compound, The method according to any one of claims 6-8. 上記ガリウム化合物が、トリエトキシガリウムを含む、請求項６〜９のいずれかに記載の製造方法。 The manufacturing method in any one of Claims 6-9 in which the said gallium compound contains a triethoxygallium . エポキシ化合物を、ガリウムトリアセチルアセトネートと酢酸ガリウムを除くガリウム化合物およびシラノールの存在下で加熱するステップを含む、樹脂硬化物の製造方法。 A method for producing a cured resin product, comprising heating an epoxy compound in the presence of a gallium compound excluding gallium triacetylacetonate and gallium acetate and silanol. 上記エポキシ化合物が脂環式エポキシ化合物を含む、請求項１１に記載の製造方法。 The epoxy compound comprises an alicyclic epoxy compound, The method according to claim 1 1. 上記シラノールの供給源としてオルガノポリシロキサンを用いる、請求項１１または１２に記載の製造方法。 Using an organopolysiloxane as the source of the silanol method according to claim 1 1 or 1 2. 上記シラノールの供給源として、モノシラン化合物を用いる、請求項１１〜１３のいずれかに記載の製造方法。 As the source of the silanol, using monosilane compound, The method according to any one of claims 1 1 to 1 3. 上記ガリウム化合物として、トリエトキシガリウムを含む請求項１１〜１４のいずれかに記載の製造方法。 The manufacturing method in any one of Claims 11-14 containing a triethoxygallium as said gallium compound .
JP2014064542A 2014-03-26 2014-03-26 Thermosetting resin composition, method for producing the same, method for producing resin cured product, and method for generating self-polymerization of epoxy compound Active JP6299328B2 (en)

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JP2014064542A JP6299328B2 (en) 2014-03-26 2014-03-26 Thermosetting resin composition, method for producing the same, method for producing resin cured product, and method for generating self-polymerization of epoxy compound

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JP2014064542A JP6299328B2 (en) 2014-03-26 2014-03-26 Thermosetting resin composition, method for producing the same, method for producing resin cured product, and method for generating self-polymerization of epoxy compound

Publications (3)

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JP2015187208A JP2015187208A (en) 2015-10-29
JP2015187208A5 true JP2015187208A5 (en) 2017-03-09
JP6299328B2 JP6299328B2 (en) 2018-03-28

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WO2018025850A1 (en) * 2016-08-03 2018-02-08 三菱ケミカル株式会社 Resin composition

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JP5600869B2 (en) * 2008-11-05 2014-10-08 横浜ゴム株式会社 Heat-curable resin composition for encapsulating optical semiconductor and optical semiconductor encapsulant using the same
JP6452141B2 (en) * 2013-07-26 2019-01-16 国立大学法人九州工業大学 Latent curing catalyst, thermosetting resin composition, and resin-encapsulated semiconductor device

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