JP2015175851A - 発光スペクトル分析による欠陥の分離のためのシステムと方法 - Google Patents
発光スペクトル分析による欠陥の分離のためのシステムと方法 Download PDFInfo
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- JP2015175851A JP2015175851A JP2015051375A JP2015051375A JP2015175851A JP 2015175851 A JP2015175851 A JP 2015175851A JP 2015051375 A JP2015051375 A JP 2015051375A JP 2015051375 A JP2015051375 A JP 2015051375A JP 2015175851 A JP2015175851 A JP 2015175851A
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- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Microscoopes, Condenser (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461952861P | 2014-03-13 | 2014-03-13 | |
| US61/952,861 | 2014-03-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015175851A true JP2015175851A (ja) | 2015-10-05 |
| JP2015175851A5 JP2015175851A5 (enExample) | 2018-04-19 |
Family
ID=54068613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015051375A Pending JP2015175851A (ja) | 2014-03-13 | 2015-03-13 | 発光スペクトル分析による欠陥の分離のためのシステムと方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US10041997B2 (enExample) |
| JP (1) | JP2015175851A (enExample) |
| SG (1) | SG10201501966TA (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016216828A1 (de) | 2015-09-07 | 2017-03-09 | Yazaki Corporation | Verbindungsstück |
| US9903824B2 (en) | 2014-04-10 | 2018-02-27 | Fei Efa, Inc. | Spectral mapping of photo emission |
| US10041997B2 (en) | 2014-03-13 | 2018-08-07 | Fei Efa, Inc. | System and method for fault isolation by emission spectra analysis |
| WO2024241626A1 (ja) | 2023-05-19 | 2024-11-28 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10213635A (ja) * | 1997-01-21 | 1998-08-11 | Carl Zeiss Jena Gmbh | 放射分布検出用顕微鏡システム及びその操作方法 |
| US6051828A (en) * | 1997-07-02 | 2000-04-18 | Texas Instruments Incorporated | Light emission noise detection and characterization |
| JP2001203248A (ja) * | 2000-01-18 | 2001-07-27 | Hitachi Ltd | エミッション顕微鏡を用いた不良解析方法およびそのシステム並びに半導体装置の製造方法 |
| JP2001319955A (ja) * | 2000-05-10 | 2001-11-16 | Hitachi Ltd | 発光解析方法およびその装置 |
| JP2002014145A (ja) * | 2000-06-29 | 2002-01-18 | Hamamatsu Photonics Kk | 半導体デバイス検査装置及び半導体デバイス検査方法 |
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| US3601492A (en) * | 1967-11-20 | 1971-08-24 | Monsanto Co | Apparatus for measuring film thickness |
| JPH076923B2 (ja) * | 1990-11-09 | 1995-01-30 | 三菱電機株式会社 | 空間周波数フィルタ、その空間周波数フィルタの製造方法及びパターン欠陥検査装置 |
| US5220403A (en) | 1991-03-11 | 1993-06-15 | International Business Machines Corporation | Apparatus and a method for high numerical aperture microscopic examination of materials |
| US5208648A (en) | 1991-03-11 | 1993-05-04 | International Business Machines Corporation | Apparatus and a method for high numerical aperture microscopic examination of materials |
| JP3314440B2 (ja) * | 1993-02-26 | 2002-08-12 | 株式会社日立製作所 | 欠陥検査装置およびその方法 |
| KR960015001A (ko) * | 1994-10-07 | 1996-05-22 | 가나이 쓰토무 | 반도체 기판의 제조방법과 피검사체상의 패턴결함을 검사하기 위한 방법 및 장치 |
| WO1997046865A1 (en) * | 1996-06-04 | 1997-12-11 | Tencor Instruments | Optical scanning system for surface inspection |
| US5940545A (en) | 1996-07-18 | 1999-08-17 | International Business Machines Corporation | Noninvasive optical method for measuring internal switching and other dynamic parameters of CMOS circuits |
| US6512385B1 (en) * | 1999-07-26 | 2003-01-28 | Paul Pfaff | Method for testing a device under test including the interference of two beams |
| US6891627B1 (en) * | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
| JP2002303586A (ja) * | 2001-04-03 | 2002-10-18 | Hitachi Ltd | 欠陥検査方法及び欠陥検査装置 |
| US6621275B2 (en) | 2001-11-28 | 2003-09-16 | Optonics Inc. | Time resolved non-invasive diagnostics system |
| US6850321B1 (en) * | 2002-07-09 | 2005-02-01 | Kla-Tencor Technologies Corporation | Dual stage defect region identification and defect detection method and apparatus |
| US6943572B2 (en) | 2002-09-03 | 2005-09-13 | Credence Systems Corporation | Apparatus and method for detecting photon emissions from transistors |
| US6891363B2 (en) | 2002-09-03 | 2005-05-10 | Credence Systems Corporation | Apparatus and method for detecting photon emissions from transistors |
| US7525659B2 (en) * | 2003-01-15 | 2009-04-28 | Negevtech Ltd. | System for detection of water defects |
| US7012537B2 (en) | 2004-02-10 | 2006-03-14 | Credence Systems Corporation | Apparatus and method for determining voltage using optical observation |
| JP4485904B2 (ja) * | 2004-10-18 | 2010-06-23 | 株式会社日立ハイテクノロジーズ | 検査装置及び検査方法 |
| US7733100B2 (en) * | 2005-08-26 | 2010-06-08 | Dcg Systems, Inc. | System and method for modulation mapping |
| JP4928862B2 (ja) * | 2006-08-04 | 2012-05-09 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びその装置 |
| US20090002656A1 (en) | 2007-06-29 | 2009-01-01 | Asml Netherlands B.V. | Device and method for transmission image detection, lithographic apparatus and mask for use in a lithographic apparatus |
| US7852475B2 (en) * | 2007-08-13 | 2010-12-14 | Jds Uniphase Corporation | Scanning spectrometer with multiple photodetectors |
| US20090147255A1 (en) | 2007-12-07 | 2009-06-11 | Erington Kent B | Method for testing a semiconductor device and a semiconductor device testing system |
| JP5352111B2 (ja) * | 2008-04-16 | 2013-11-27 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及びこれを用いた欠陥検査装置 |
| JP5007979B2 (ja) * | 2008-05-22 | 2012-08-22 | 独立行政法人産業技術総合研究所 | 欠陥を検査する方法及び欠陥検査装置 |
| US8988653B2 (en) | 2009-08-20 | 2015-03-24 | Asml Netherlands B.V. | Lithographic apparatus, distortion determining method, and patterning device |
| US20110242312A1 (en) * | 2010-03-30 | 2011-10-06 | Lasertec Corporation | Inspection system and inspection method |
| US20120326060A1 (en) * | 2011-06-22 | 2012-12-27 | Boaz Kenane | Testing method for led wafer |
| US8867580B2 (en) * | 2012-05-15 | 2014-10-21 | Finisar Corporation | Wavelength tunable laser |
| JP2015175851A (ja) | 2014-03-13 | 2015-10-05 | ディーシージー システムズ、 インコーポライテッドＤｃｇ Ｓｙｓｔｅｍｓ Ｉｎｃ． | 発光スペクトル分析による欠陥の分離のためのシステムと方法 |
| US9903824B2 (en) | 2014-04-10 | 2018-02-27 | Fei Efa, Inc. | Spectral mapping of photo emission |
-
2015
- 2015-03-13 JP JP2015051375A patent/JP2015175851A/ja active Pending
- 2015-03-13 US US14/657,605 patent/US10041997B2/en active Active
- 2015-03-13 SG SG10201501966TA patent/SG10201501966TA/en unknown
-
2018
- 2018-07-03 US US16/027,159 patent/US10620263B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10213635A (ja) * | 1997-01-21 | 1998-08-11 | Carl Zeiss Jena Gmbh | 放射分布検出用顕微鏡システム及びその操作方法 |
| US6051828A (en) * | 1997-07-02 | 2000-04-18 | Texas Instruments Incorporated | Light emission noise detection and characterization |
| JP2001203248A (ja) * | 2000-01-18 | 2001-07-27 | Hitachi Ltd | エミッション顕微鏡を用いた不良解析方法およびそのシステム並びに半導体装置の製造方法 |
| JP2001319955A (ja) * | 2000-05-10 | 2001-11-16 | Hitachi Ltd | 発光解析方法およびその装置 |
| JP2002014145A (ja) * | 2000-06-29 | 2002-01-18 | Hamamatsu Photonics Kk | 半導体デバイス検査装置及び半導体デバイス検査方法 |
Non-Patent Citations (1)
| Title |
|---|
| THIERRY PARRASSIN, SYLVAIN DUDIT, MICHEL VALLET, ANTOINE REVERDY, HERVE DESLANDES: ""Introduction of spectral mapping through transmission grating, derivative technique of photon emis", ISTFA 2014: CONFERENCE PROCEEDINGS FROM THE 40TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANA, JPN6019002978, November 2014 (2014-11-01), pages 115 - 124 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10041997B2 (en) | 2014-03-13 | 2018-08-07 | Fei Efa, Inc. | System and method for fault isolation by emission spectra analysis |
| US10620263B2 (en) | 2014-03-13 | 2020-04-14 | Fei Efa, Inc. | System and method for fault isolation by emission spectra analysis |
| US9903824B2 (en) | 2014-04-10 | 2018-02-27 | Fei Efa, Inc. | Spectral mapping of photo emission |
| DE102016216828A1 (de) | 2015-09-07 | 2017-03-09 | Yazaki Corporation | Verbindungsstück |
| DE102016216828B4 (de) * | 2015-09-07 | 2021-06-10 | Yazaki Corporation | Verbindungsstück |
| WO2024241626A1 (ja) | 2023-05-19 | 2024-11-28 | 浜松ホトニクス株式会社 | 検査装置及び検査方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150260789A1 (en) | 2015-09-17 |
| US20180328985A1 (en) | 2018-11-15 |
| US10041997B2 (en) | 2018-08-07 |
| US10620263B2 (en) | 2020-04-14 |
| SG10201501966TA (en) | 2015-10-29 |
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