SG10201501966TA - System and method for fault isolation by emission spectra analysis - Google Patents

System and method for fault isolation by emission spectra analysis

Info

Publication number
SG10201501966TA
SG10201501966TA SG10201501966TA SG10201501966TA SG10201501966TA SG 10201501966T A SG10201501966T A SG 10201501966TA SG 10201501966T A SG10201501966T A SG 10201501966TA SG 10201501966T A SG10201501966T A SG 10201501966TA SG 10201501966T A SG10201501966T A SG 10201501966TA
Authority
SG
Singapore
Prior art keywords
emission spectra
fault isolation
spectra analysis
analysis
fault
Prior art date
Application number
SG10201501966TA
Other languages
English (en)
Inventor
Deslandes Herve
Sabbineni Prasad
Freed Regina
Original Assignee
Dcg Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dcg Systems Inc filed Critical Dcg Systems Inc
Publication of SG10201501966TA publication Critical patent/SG10201501966TA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9505Wafer internal defects, e.g. microcracks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Microscoopes, Condenser (AREA)
SG10201501966TA 2014-03-13 2015-03-13 System and method for fault isolation by emission spectra analysis SG10201501966TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201461952861P 2014-03-13 2014-03-13

Publications (1)

Publication Number Publication Date
SG10201501966TA true SG10201501966TA (en) 2015-10-29

Family

ID=54068613

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501966TA SG10201501966TA (en) 2014-03-13 2015-03-13 System and method for fault isolation by emission spectra analysis

Country Status (3)

Country Link
US (2) US10041997B2 (enExample)
JP (1) JP2015175851A (enExample)
SG (1) SG10201501966TA (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10041997B2 (en) 2014-03-13 2018-08-07 Fei Efa, Inc. System and method for fault isolation by emission spectra analysis
US9903824B2 (en) 2014-04-10 2018-02-27 Fei Efa, Inc. Spectral mapping of photo emission
DE102016216828B4 (de) 2015-09-07 2021-06-10 Yazaki Corporation Verbindungsstück
CN121152968A (zh) 2023-05-19 2025-12-16 浜松光子学株式会社 检查装置及检查方法

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JP3314440B2 (ja) * 1993-02-26 2002-08-12 株式会社日立製作所 欠陥検査装置およびその方法
US5774222A (en) * 1994-10-07 1998-06-30 Hitachi, Ltd. Manufacturing method of semiconductor substrative and method and apparatus for inspecting defects of patterns on an object to be inspected
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US6512385B1 (en) * 1999-07-26 2003-01-28 Paul Pfaff Method for testing a device under test including the interference of two beams
JP3950608B2 (ja) * 2000-01-18 2007-08-01 株式会社ルネサステクノロジ エミッション顕微鏡を用いた不良解析方法およびそのシステム並びに半導体装置の製造方法
JP2001319955A (ja) * 2000-05-10 2001-11-16 Hitachi Ltd 発光解析方法およびその装置
JP2002014145A (ja) * 2000-06-29 2002-01-18 Hamamatsu Photonics Kk 半導体デバイス検査装置及び半導体デバイス検査方法
US6891627B1 (en) * 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
JP2002303586A (ja) * 2001-04-03 2002-10-18 Hitachi Ltd 欠陥検査方法及び欠陥検査装置
US6621275B2 (en) 2001-11-28 2003-09-16 Optonics Inc. Time resolved non-invasive diagnostics system
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JP4485904B2 (ja) * 2004-10-18 2010-06-23 株式会社日立ハイテクノロジーズ 検査装置及び検査方法
US7733100B2 (en) * 2005-08-26 2010-06-08 Dcg Systems, Inc. System and method for modulation mapping
JP4928862B2 (ja) * 2006-08-04 2012-05-09 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
US20090002656A1 (en) 2007-06-29 2009-01-01 Asml Netherlands B.V. Device and method for transmission image detection, lithographic apparatus and mask for use in a lithographic apparatus
US7852475B2 (en) * 2007-08-13 2010-12-14 Jds Uniphase Corporation Scanning spectrometer with multiple photodetectors
US20090147255A1 (en) 2007-12-07 2009-06-11 Erington Kent B Method for testing a semiconductor device and a semiconductor device testing system
JP5352111B2 (ja) * 2008-04-16 2013-11-27 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた欠陥検査装置
JP5007979B2 (ja) * 2008-05-22 2012-08-22 独立行政法人産業技術総合研究所 欠陥を検査する方法及び欠陥検査装置
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US10041997B2 (en) 2014-03-13 2018-08-07 Fei Efa, Inc. System and method for fault isolation by emission spectra analysis
US9903824B2 (en) 2014-04-10 2018-02-27 Fei Efa, Inc. Spectral mapping of photo emission

Also Published As

Publication number Publication date
US10620263B2 (en) 2020-04-14
US20180328985A1 (en) 2018-11-15
US20150260789A1 (en) 2015-09-17
US10041997B2 (en) 2018-08-07
JP2015175851A (ja) 2015-10-05

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