JP2015156509A - 基板洗浄装置及び基板洗浄方法 - Google Patents

基板洗浄装置及び基板洗浄方法 Download PDF

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Publication number
JP2015156509A
JP2015156509A JP2015086009A JP2015086009A JP2015156509A JP 2015156509 A JP2015156509 A JP 2015156509A JP 2015086009 A JP2015086009 A JP 2015086009A JP 2015086009 A JP2015086009 A JP 2015086009A JP 2015156509 A JP2015156509 A JP 2015156509A
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Japan
Prior art keywords
substrate
drying
liquid
process chamber
housing
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Pending
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JP2015086009A
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English (en)
Japanese (ja)
Inventor
裕 桓 金
Yoo Hwan Kim
裕 桓 金
秉 万 姜
Byung Man Kang
秉 万 姜
世 勳 呉
Se Hoon Oh
世 勳 呉
娟 準 金
Yeon Joon Kim
娟 準 金
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Semes Co Ltd
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Semes Co Ltd
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Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of JP2015156509A publication Critical patent/JP2015156509A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
JP2015086009A 2012-04-30 2015-04-20 基板洗浄装置及び基板洗浄方法 Pending JP2015156509A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20120045851 2012-04-30
KR10-2012-0045851 2012-04-30
KR10-2012-0110149 2012-10-04
KR1020120110149A KR20130122503A (ko) 2012-04-30 2012-10-04 기판 세정 장치 및 기판 세정 방법

Related Parent Applications (1)

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JP2013095894A Division JP5819879B2 (ja) 2012-04-30 2013-04-30 基板洗浄装置及び基板洗浄方法

Publications (1)

Publication Number Publication Date
JP2015156509A true JP2015156509A (ja) 2015-08-27

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ID=49852290

Family Applications (1)

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JP2015086009A Pending JP2015156509A (ja) 2012-04-30 2015-04-20 基板洗浄装置及び基板洗浄方法

Country Status (2)

Country Link
JP (1) JP2015156509A (ko)
KR (3) KR20130122503A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10538434B2 (en) 2017-09-08 2020-01-21 Fuji Xerox Co., Ltd. Titanium oxide aerogel particle, photocatalyst forming composition, and photocatalyst
US10563018B2 (en) 2017-09-08 2020-02-18 Fuji Xerox Co., Ltd. Titanium oxide aerogel particle, photocatalyst-forming composition, and photocatalyst

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150018613A (ko) * 2015-01-23 2015-02-23 김규태 왕복형 oled 진공 증착기
KR102392488B1 (ko) * 2015-05-13 2022-04-29 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7010629B2 (ja) 2017-08-31 2022-01-26 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
JP6966899B2 (ja) 2017-08-31 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
KR102571741B1 (ko) * 2020-09-18 2023-08-25 세메스 주식회사 기판 처리 장치 및 이를 구비하는 기판 처리 시스템

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0881790A (ja) * 1994-07-06 1996-03-26 Applied Materials Inc プラズマ不活性カバー及びそれを使用するプラズマ洗浄方法及び装置
JPH11251281A (ja) * 1998-02-27 1999-09-17 Super Silicon Kenkyusho:Kk 半導体ウエハ製造方法及び装置
JP2000135475A (ja) * 1998-10-30 2000-05-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003100853A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003297901A (ja) * 2002-04-05 2003-10-17 Supurauto:Kk 基板処理システムおよびその処理方法
JP2004207484A (ja) * 2002-12-25 2004-07-22 Dainippon Screen Mfg Co Ltd 乾燥処理装置および基板処理装置
JP2005086068A (ja) * 2003-09-10 2005-03-31 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007227467A (ja) * 2006-02-21 2007-09-06 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2007531997A (ja) * 2004-03-31 2007-11-08 東京エレクトロン株式会社 基板処理方法
JP2009164214A (ja) * 2007-12-28 2009-07-23 Toshiba Corp 微細構造体の処理方法、微細構造体の処理システムおよび電子デバイスの製造方法
JP2010027786A (ja) * 2008-07-17 2010-02-04 Tokyo Electron Ltd 基板処理方法、基板処理装置および記憶媒体

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0881790A (ja) * 1994-07-06 1996-03-26 Applied Materials Inc プラズマ不活性カバー及びそれを使用するプラズマ洗浄方法及び装置
JPH11251281A (ja) * 1998-02-27 1999-09-17 Super Silicon Kenkyusho:Kk 半導体ウエハ製造方法及び装置
JP2000135475A (ja) * 1998-10-30 2000-05-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003100853A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003297901A (ja) * 2002-04-05 2003-10-17 Supurauto:Kk 基板処理システムおよびその処理方法
JP2004207484A (ja) * 2002-12-25 2004-07-22 Dainippon Screen Mfg Co Ltd 乾燥処理装置および基板処理装置
JP2005086068A (ja) * 2003-09-10 2005-03-31 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007531997A (ja) * 2004-03-31 2007-11-08 東京エレクトロン株式会社 基板処理方法
JP2007227467A (ja) * 2006-02-21 2007-09-06 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2009164214A (ja) * 2007-12-28 2009-07-23 Toshiba Corp 微細構造体の処理方法、微細構造体の処理システムおよび電子デバイスの製造方法
JP2010027786A (ja) * 2008-07-17 2010-02-04 Tokyo Electron Ltd 基板処理方法、基板処理装置および記憶媒体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10538434B2 (en) 2017-09-08 2020-01-21 Fuji Xerox Co., Ltd. Titanium oxide aerogel particle, photocatalyst forming composition, and photocatalyst
US10563018B2 (en) 2017-09-08 2020-02-18 Fuji Xerox Co., Ltd. Titanium oxide aerogel particle, photocatalyst-forming composition, and photocatalyst

Also Published As

Publication number Publication date
KR20130122503A (ko) 2013-11-07
KR20150039189A (ko) 2015-04-09
KR20150039190A (ko) 2015-04-09

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