JP2015128195A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015128195A5 JP2015128195A5 JP2015080094A JP2015080094A JP2015128195A5 JP 2015128195 A5 JP2015128195 A5 JP 2015128195A5 JP 2015080094 A JP2015080094 A JP 2015080094A JP 2015080094 A JP2015080094 A JP 2015080094A JP 2015128195 A5 JP2015128195 A5 JP 2015128195A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit board
- printed circuit
- board according
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 35
- 239000011521 glass Substances 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 4
- 239000011247 coating layer Substances 0.000 claims 3
- 238000004140 cleaning Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0083160 | 2012-07-30 | ||
| KR20120083160 | 2012-07-30 | ||
| KR10-2012-0140480 | 2012-12-05 | ||
| KR20120140480 | 2012-12-05 | ||
| KR1020130061168A KR20140016150A (ko) | 2012-07-30 | 2013-05-29 | 인쇄회로기판 및 그 제조방법 |
| KR10-2013-0061168 | 2013-05-29 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013157429A Division JP2014027284A (ja) | 2012-07-30 | 2013-07-30 | 印刷回路基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015128195A JP2015128195A (ja) | 2015-07-09 |
| JP2015128195A5 true JP2015128195A5 (OSRAM) | 2016-02-12 |
| JP6342357B2 JP6342357B2 (ja) | 2018-06-13 |
Family
ID=50265370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015080094A Active JP6342357B2 (ja) | 2012-07-30 | 2015-04-09 | 印刷回路基板及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6342357B2 (OSRAM) |
| KR (1) | KR20140016150A (OSRAM) |
| TW (1) | TWI595811B (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102268385B1 (ko) * | 2014-08-14 | 2021-06-23 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
| KR101650938B1 (ko) * | 2014-09-25 | 2016-08-24 | 코닝정밀소재 주식회사 | 집적회로 패키지용 기판 |
| KR20170001310A (ko) | 2015-06-26 | 2017-01-04 | 삼성전기주식회사 | 글라스 코어 기판, 그의 제조 방법 및 그를 이용한 회로기판 |
| TWI685288B (zh) * | 2018-08-22 | 2020-02-11 | 健鼎科技股份有限公司 | 電路板及其製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4946165A (OSRAM) * | 1972-09-11 | 1974-05-02 | ||
| JP3756041B2 (ja) * | 1999-05-27 | 2006-03-15 | Hoya株式会社 | 多層プリント配線板の製造方法 |
| JP4134172B2 (ja) * | 2003-09-09 | 2008-08-13 | Hoya株式会社 | 両面配線ガラス基板の製造方法 |
| JP2005159330A (ja) * | 2003-11-05 | 2005-06-16 | Hitachi Chem Co Ltd | 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ |
| TWI236324B (en) * | 2004-04-08 | 2005-07-11 | Phoenix Prec Technology Corp | Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure |
| JP2006049804A (ja) * | 2004-07-07 | 2006-02-16 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
| JP4564342B2 (ja) * | 2004-11-24 | 2010-10-20 | 大日本印刷株式会社 | 多層配線基板およびその製造方法 |
| TW201121372A (en) * | 2009-09-02 | 2011-06-16 | Panasonic Corp | Printed wiring board, build-up multi-layer board, and production method therefor |
-
2013
- 2013-05-29 KR KR1020130061168A patent/KR20140016150A/ko not_active Ceased
- 2013-07-26 TW TW102126939A patent/TWI595811B/zh active
-
2015
- 2015-04-09 JP JP2015080094A patent/JP6342357B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013008880A5 (OSRAM) | ||
| JP2015076597A5 (OSRAM) | ||
| JP2014110390A5 (OSRAM) | ||
| JP2016192568A5 (OSRAM) | ||
| JP2015109449A5 (OSRAM) | ||
| JP2016225415A5 (OSRAM) | ||
| JP2013247353A5 (OSRAM) | ||
| JP2014022465A5 (OSRAM) | ||
| MY163173A (en) | Manufacturing method of multilayer printed wiring board | |
| JP2014156390A5 (OSRAM) | ||
| WO2014199231A3 (en) | Method for manufacturing a physical volumetric representation of a virtual three-dimensional object | |
| JP2013062314A5 (OSRAM) | ||
| JP2016063046A5 (OSRAM) | ||
| JP2007129124A5 (OSRAM) | ||
| JP2015128195A5 (OSRAM) | ||
| JP2016033967A5 (OSRAM) | ||
| JP2014003054A5 (OSRAM) | ||
| MY175520A (en) | Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board | |
| JP2009283739A5 (OSRAM) | ||
| JP2012094662A5 (ja) | 多層配線基板及びその製造方法 | |
| JP2014192386A5 (OSRAM) | ||
| JP2013236046A5 (OSRAM) | ||
| MY167064A (en) | Multilayer printed wiring board manufacturing method | |
| JP2014063801A5 (OSRAM) | ||
| JP2015035560A5 (OSRAM) |