JP2015107528A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device which reduces the occurence of failures caused by scattered cutting water while inhibiting the degradation of a bellows structure.SOLUTION: A cutting device includes: intrusion prevention means (31) which prevents cutting water from intruding into the device and is formed by a bellows structure; and discharge means (33) which receives the cutting water flowing out from the intrusion prevention means and discharges the cutting water. The intrusion prevention means includes: a bellows part (311) which expands and contracts in conjunction with movement of a chuck table (3); and a support part (312) which supports the bellows part. A lower end of a side surface bellows part (311b) forming the bellows part is disposed separated from a lower surface of a case part (331), and the support part which is moved by expansion and contraction of the bellows part is guided on a guide part (334) formed in the case part.

Description

  The present invention relates to a cutting apparatus, and more particularly to a cutting apparatus that performs cutting while supplying cutting water to a workpiece.

  In a semiconductor device manufacturing process, division lines are formed in a lattice pattern on the surface of a wafer, and circuits such as ICs and LSIs are formed in regions partitioned by the division lines. After the back surface is ground to a predetermined thickness by a grinding apparatus, the wafer is carried into a processing apparatus such as a cutting apparatus or a laser processing apparatus, and is divided into individual devices along a division line. Devices divided in this way are widely used in electric devices such as mobile phones and personal computers.

  Conventionally, as a cutting device that divides a wafer, a chuck table that can move while holding the wafer by negative pressure, a cutting mechanism that has a cutting blade that cuts while supplying cutting water to the wafer held by the chuck table, and cutting A water case that receives water and guides it to the drain, and a bellows structure for preventing cutting water from entering the apparatus when the chuck table is moved. The thing which immerses a part (hanging part) is proposed (for example, refer patent document 1).

JP 2012-45689 A

  However, in the cutting device described in Patent Document 1, since a part of the bellows structure is immersed in the cutting water accumulated in the water case, a situation occurs in which the cutting water is scattered as the chuck table moves. Can do. Moreover, the situation where the cutting bellows structure deteriorates because the cutting waste contained in cutting water adheres to a part of bellows structure and the attached cutting waste dries can occur.

  This invention is made in view of such a situation, and it aims at providing the cutting device which can reduce generation | occurrence | production of the malfunction accompanying scattering of cutting water, suppressing deterioration of a bellows structure. To do.

  The cutting apparatus of the present invention includes a chuck table for holding a wafer, a cutting means for cutting a wafer held on the chuck table, a cutting water supply means for supplying cutting water used for cutting by the cutting means, and a cutting of the chuck table. A cutting apparatus comprising at least an intrusion preventing means having a bellows structure disposed in a moving direction and preventing cutting water from entering the apparatus, and a discharging means for receiving and discharging cutting water flowing out from the intrusion preventing means. The discharge means includes a case portion that receives cutting water and a guide portion that is formed in the case portion and extends in the movement direction of the chuck table, and the intrusion prevention means expands and contracts as the chuck table moves. And a support part connected to the bellows part and supporting the bellows part, the bellows part comprising an upper surface bellows part and the chuck tape of the upper face bellows part. A side bellows part that hangs down from both ends in a direction orthogonal to the movement direction of the bull, and the intrusion prevention means is disposed with the lower end of the side bellows part spaced apart from the lower surface of the case part, and the bellows part The support part which moves by the expansion and contraction of is guided on the guide part.

  According to the cutting device, the support portion constituting the intrusion preventing means is guided on the guide portion in the case portion, and the lower end of the side bellows portion is disposed in a state of being separated from the lower surface of the case portion. Since it is possible to prevent a part of the bellows structure from being immersed in the cutting water accumulated in the case part, it is possible to prevent a situation in which a part of the bellows structure scatters the cutting water as the chuck table moves. Deterioration of the bellows structure can be suppressed. As a result, it is possible to reduce the occurrence of problems associated with the scattering of cutting water while suppressing deterioration of the bellows structure.

  In the cutting apparatus of the present invention, it is preferable that the discharging means has an internal splash prevention plate extending in the moving direction of the chuck table at a position inside the side bellows portion. If splashes are generated from the cutting water as the chuck table moves, it is assumed that the splashes enter the apparatus from the inside of the side bellows portion. According to the above configuration, since the splash is shielded by the internal splash prevention plate, it is possible to prevent the splash from entering the apparatus.

  In the cutting apparatus of the present invention, it is preferable that the discharging means has an external splash prevention plate extending in the moving direction of the chuck table at a position outside the side bellows portion. According to this configuration, by providing the external splash prevention plate outside the side bellows portion, the spray can be liquefied by attaching the spray of cutting water generated in the cutting process by the cutting means to the external splash prevention plate. It becomes possible to prevent the cutting water (spraying of the cutting water) from entering the inside of the bellows structure from the gap between the lower end of the portion and the lower surface of the case portion.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to reduce generation | occurrence | production of the malfunction accompanying scattering of cutting water, suppressing the deterioration of a bellows structure.

It is a perspective view which shows an example of the cutting device which concerns on this Embodiment. It is a disassembled perspective view of the component parts of the chuck table periphery which the cutting device which concerns on this Embodiment has. It is a cross-sectional schematic diagram of the intrusion prevention means and the discharge means which the grinding apparatus which concerns on this Embodiment has. It is a cross-sectional schematic diagram of the intrusion prevention means and the discharge means which the grinding apparatus which concerns on the modification of this Embodiment has.

  Hereinafter, an example of a cutting apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing an example of a cutting apparatus according to the present embodiment. FIG. 2 is an exploded perspective view of components around the chuck table included in the cutting apparatus according to the present embodiment. In FIG. 2, for convenience of explanation, a part of a case portion 331 of the discharge unit 33 described later is omitted.

  As shown in FIG. 1, the cutting apparatus 1 is configured to cut a disk-shaped wafer W held on a chuck table 3 on a housing 2 by a cutting means 4 provided above the chuck table 3. ing. Here, the wafer W to be cut will be described. The surface of the wafer W having a disk shape is divided into a plurality of regions by division lines arranged in a lattice shape, and IC, LSI are divided into the divided regions. Or various devices, such as LED, are formed. A dicing tape T is attached to the back surface of the wafer W, and the wafer W is mounted on the annular frame F via the dicing tape T.

  On the upper surface of the housing 2, a cover 30 that can move together with the chuck table 3 and a bellows portion 311 that constitutes an intrusion prevention means 31 described later are exposed. The cover 30 includes an upper plate portion 300 formed in a planar shape and two side plate portions 301 provided so as to hang from the end portion of the upper plate portion 300 (see FIG. 2). The intrusion preventing means 31 is disposed in the cutting movement direction (X-axis direction) of the chuck table 3 and plays a role of preventing cutting water from entering the apparatus. The configuration of the intrusion prevention means 31 will be described later.

  The chuck table 3 has a disk shape, is supported by the moving base 323, and is provided in the moving base 323 so as to be rotatable about the center of the chuck table 3 by a rotating means (not shown). It has been. On the surface of the chuck table 3, a holding surface 3a for sucking and holding the wafer W from the back side is formed by a porous ceramic material. The holding surface 3 a is connected to a suction source (not shown) through a flow path in the chuck table 3.

  Below the chuck table 3, a moving mechanism 32 for moving the chuck table 3 in the X-axis direction is provided as shown in FIG. The moving mechanism 32 includes a ball screw 320 having an axis in the X-axis direction, a guide rail 321 disposed in parallel with the ball screw 320, a motor 322 for rotating the ball screw 320, and a nut (not shown) that is screwed to the ball screw 320. And a moving base 323 slidably contacting the guide rail 321 at the bottom. As the ball screw 320 driven by the motor 322 rotates, the moving base 323 is guided by the guide rail 321 and cut and fed in the X-axis direction. The moving base 323 and the chuck table 3 are connected, and the chuck table 3 is also moved in the X-axis direction as the moving base 323 moves in the X-axis direction.

  The chuck table 3 is reciprocated between the transfer position at the center of the apparatus and the machining position facing the cutting means 4 by the moving mechanism 32. FIG. 1 shows a state in which the chuck table 3 stands by at the delivery position. In the housing 2, one corner portion adjacent to the delivery position is lowered by one step, and the placing table 6 is provided at a lowered position so as to be moved up and down. On the mounting table 6, a cassette 5 containing wafers W is mounted. By moving the mounting table 6 up and down while the cassette 5 is mounted, the drawing position and the pushing position of the wafer W are adjusted in the height direction.

  1 is provided with a pair of guide rails 7 parallel to the Y-axis direction and a push-pull mechanism 8 for transporting the wafer W between the pair of guide rails 7 and the cassette 5. ing. The pair of guide rails 7 guide the conveyance of the wafer W by the push-pull mechanism 8 and position the wafer W in the X-axis direction. The push-pull mechanism 8 is configured to pull out the unprocessed wafer W from the cassette 5 to the pair of guide rails 7 and to push the processed wafer W into the cassette 5 from the pair of guide rails 7. The Y-axis direction of the wafer W is positioned by the push-pull mechanism 8.

  A first transfer arm 11 that transfers the wafer W between the guide rail 7 and the chuck table 3 is provided in the vicinity of the pair of guide rails 7. The wafer W is transferred by turning the L-shaped arm portion 16 of the first transfer arm 11 in a top view. Further, a spinner type cleaning mechanism 12 is provided on the right side of the chuck table 3 in the delivery position in FIG. In the cleaning mechanism 12, cleaning water is sprayed toward the rotating spinner table 17 to clean the wafer W, and then dry air is blown in place of the cleaning water to dry the wafer W.

  A support base 22 is provided on the housing 2. A second transfer arm 13 that transfers the wafer W between the chuck table 3 and the cleaning mechanism 12 is provided on the side surface 23 of the support base 22. The arm portion 18 of the second transfer arm 13 extends obliquely forward, and the wafer W is transferred by moving the arm portion 18 in the Y-axis direction.

  The support table 22 is provided with a cantilever support portion 24 so as to cross over the moving path of the chuck table 3. A ball screw type moving mechanism (not shown) that moves the cutting means 4 and the imaging means 14 in the Y-axis direction and the Z-axis direction is incorporated in the support base 22 and the cantilever support portion 24. By this moving mechanism, the cutting means 4 and the imaging means 14 are positioned above the chuck table 3.

  The cutting means 4 has a cutting blade 41 provided at the tip of a spindle (not shown). The cutting blade 41 is covered with a blade cover 42. The blade cover 42 is provided with an injection nozzle 43 as cutting water supply means for supplying cutting water toward a portion cut by the cutting blade 41. In the cutting means 4, the cutting blade 41 is rotated at a high speed, and the wafer W is cut while supplying (spraying) cutting water from the spray nozzle 43, so that a cutting groove corresponding to the blade thickness of the cutting blade 41 is formed on the wafer W. Formed.

  The image pickup means 14 is provided so as to be able to pick up an image of the surface area of the wafer W projected at a predetermined magnification by a microscope. For example, the imaging unit 14 includes an imaging element (not shown) such as a CCD. For example, this image sensor is configured by a plurality of pixels so that an electrical signal corresponding to the amount of light received by each pixel can be obtained. The image of the surface area of the wafer W picked up by the image pickup means 14 is used for adjusting the cutting position with respect to the wafer W.

  Here, the configuration of the intrusion prevention means 31 and the discharge means 33 included in the cutting apparatus 1 according to the present embodiment will be described with reference to FIGS. 2 and 3. FIG. 3 is a schematic cross-sectional view of the intrusion prevention means 31 and the discharge means 33 included in the cutting apparatus 1 according to the present embodiment. FIG. 3 shows a cross section along a plane orthogonal to the cutting movement direction (X-axis direction) of the chuck table 3. Further, in FIG. 2, for convenience of explanation, some components (external splash plate 337 described later) shown in FIG. 3 are omitted.

  As shown in FIG. 2, the discharge means 33 is disposed below the movement path of the chuck table 3. The discharge means 33 plays a role of receiving and discharging cutting water flowing out from the intrusion prevention means 31. The discharge means 33 includes a case part 331 that receives cutting water, a drain hole 333 and a guide part 334 formed in the case part 331, and a drain 335 connected to the drain hole 333. The cutting water is discharged from the drain 335 to the outside through the drain hole 333.

  The case portion 331 includes a bottom plate 331a, and an outer wall 331b and an inner wall 331c that stand from the bottom plate 331a. One end (an outer end) of a bellows portion 311 to be described later is fixed to a part of the outer side wall 331b. The space surrounded by the inner wall 331c constitutes an opening 331d for moving the chuck table 3. The opening 331 d is covered with the chuck table 3 and the intrusion prevention means 31.

  The drain hole 333 is disposed in the bottom plate 331a.

  The guide portion 334 is generally formed of a plate-like member, and is located at a position near the center in the height direction (Z-axis direction) of an inner wall 331c disposed inside a side bellows portion 311b of the bellows portion 311 described later. 3 extending in the moving direction (X-axis direction) 3 (see FIG. 3). The guide part 334 plays a role of guiding a support part 312 of the intrusion preventing means 31 described later.

  An internal splash prevention plate 336 is provided at a position inside a side bellows portion 311b described later. The internal splash prevention plate 336 is generally formed of a plate-like member, and is parallel to the upper side of the guide portion 334, and at the upper end portion of the inner side wall 331c disposed inside the side surface bellows portion 311b of the bellows portion 311 at the chuck table. 3 extending in the moving direction (X-axis direction) 3 (see FIG. 3). The internal splash prevention plate 336 is disposed to face the upper surface of the guide portion 334 with a predetermined distance. The internal splash prevention plate 336 serves to shield spraying of cutting water by the cutting blade 41 rotating at high speed.

  The intrusion prevention unit 31 includes a pair of bellows portions 311 and a support portion 312 connected to the bellows portions 311. One end (outer end) of each bellows portion 311 is fixed to the outer wall 331b, and the other end (inner end) is fixed to the cover 30. The bellows portion 311 is disposed so as to expand and contract as the chuck table 3 moves in the cutting movement direction (X-axis direction).

  The bellows portion 311 includes an upper surface bellows portion 311a and a side bellows portion 311b that is provided continuously to the upper surface bellows portion 311a and hangs downward from both ends in a direction orthogonal to the extending direction of the upper surface bellows portion 311a. Yes. That is, the side bellows part 311b extends in the vertical direction.

  As shown in FIG. 3, the support portion 312 is provided connected to the bellows portion 311. For example, a plurality of support portions 312 are provided so as to protrude inward from a part of the side bellows portion 311b. A rolling element 312a is rotatably supported at the tip of the support portion 312. The rolling element 312a is formed of a tire made of an elastic material. The support portion 312 supports the bellows portion 311 by placing the rolling element 312 a on the upper surface of the guide portion 334 of the discharge means 33. When the chuck table 3 moves along with the cutting process, the rolling element 312 a rolls on the guide portion 334, so that the support portion 312 moves along the guide portion 334.

  In the state supported by the support portion 312, the bellows portion 311 is disposed at a position where the lower end portion of the side bellows portion 311b is separated from the bottom plate 331a. A gap G is formed between the lower end portion of the side bellows portion 311b and the bottom plate 331a. For this reason, the lower end portion of the side bellows portion 311b is not immersed in the cutting water accumulated in the bottom plate 331a. In FIG. 3, for convenience of explanation, the uppermost water level of the cutting water in the bottom plate 331a is indicated by a one-dot chain line L.

  In the state where the bellows part 311 is supported by the support part 312, the external splash prevention plate 337 is placed on the bottom plate 331a of the case part 331 near the side bellows part 311b at a position outside the side bellows part 311b. It extends in the (X-axis direction). The external splash prevention plate 337 is formed by bending a plate-like member, and has a fixed portion 337a, an upright portion 337b, and an inclined surface portion 337c. The external splash prevention plate 337 is provided so as to extend in the moving direction (X-axis direction) of the chuck table 3. The external splash prevention plate 337 has the fixing portion 337a fixed to the bottom plate 331a, the standing portion 337b is disposed opposite to the outer surface of the side bellows portion 311b, and the upper end of the inclined surface portion 337c is brought close to the side bellows portion 311b side. Is arranged in.

  As described above, in the cutting device 1 according to the present embodiment, the lower end portion of the side surface bellows portion 311b that constitutes the bellows portion 311 is the upper surface of the cutting water accumulated on the bottom plate 331a (the one-dot chain line L) as shown in FIG. It is arranged above the reference). For this reason, the side bellows part 311b is not immersed in the cutting water. Thereby, since it can prevent that a part of bellows structure is immersed in cutting water, the situation where a part of bellows structure scatters cutting water with the movement of the chuck table 3 can be prevented, and the scattered cutting water is apparatus. The situation of entering inside can be reduced. In addition, as the bellows structure to which cutting water containing cutting waste adheres expands and contracts, deterioration of the bellows structure due to friction between the cutting waste and the bellows structure can be suppressed.

  Further, the discharge means 33 is provided with an internal splash prevention plate 336 at a position above the guide portion 334. In the case where the guide portion 334 is provided inside the side bellows portion 311b, when splashes are generated from the cutting water due to wind pressure or the like accompanying the movement of the chuck table 3, the splash exceeds the guide portion 334 and enters the inside of the apparatus. An intrusion is expected. By providing the internal splash prevention plate 336 at a position above the guide portion 334, even if splash occurs from the cutting water as the chuck table 3 moves, the splash is shielded by the internal splash prevention plate 336. Therefore, it is possible to prevent the apparatus from entering the inside of the apparatus.

  Further, the discharge means 33 is provided with an external splash prevention plate 337 spaced from the side surface bellows portion 311b at a predetermined interval. By providing the external splash prevention plate 337 in the vicinity of the side bellows portion 311b, the spray of cutting water by the cutting blade 41 rotating at a high speed adheres to the external splash prevention plate 337 to liquefy the spray, and the bottom end of the side bellows portion 331b. It is possible to prevent the cutting water (spraying of the cutting water) from entering the inside of the bellows part 331 from a gap formed by arranging the case part 331 (more specifically, the bottom plate 331a) in a non-contact manner. It becomes possible.

  The present invention is not limited to the embodiment described above, and can be implemented with various modifications. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the case where the support portion 312 that constitutes the intrusion prevention unit 31 is provided on the side bellows portion 311b that constitutes the bellows portion 311 has been described. However, the position where the support portion 312 is provided is not limited to this, and can be changed as appropriate. For example, as shown in FIG. 4, the support portion 312 may be provided on a part of the lower surface of the upper surface bellows part 311 a (for example, a part of the lower surface outside the inner side wall 331 c of the case part 331). In this case, for example, it is conceivable that the internal splash prevention plate 336 is provided slightly inclined from the upper end portion of the inner side wall 331c to the support portion 312 side.

  As described above, according to the present invention, there is an effect that it is possible to reduce the occurrence of problems associated with the scattering of cutting water while suppressing deterioration of the bellows structure, and in particular, the cutting water enters the apparatus. This is useful for a cutting apparatus having an intrusion prevention means having a bellows structure for preventing the above.

DESCRIPTION OF SYMBOLS 1 Cutting apparatus 3 Chuck table 30 Cover 31 Intrusion prevention means 311 Bellows part 311a Upper surface bellows part 311b Side surface bellows part 312 Support part 32 Moving mechanism 33 Discharge means 331 Case part 333 Drain hole 334 Guide part 335 Drain 4 Cutting means 41 Cutting blade 42 Blade cover 43 Injection nozzle F Frame T Dicing tape W Wafer

Claims (3)

A chuck table for holding the wafer, a cutting means for cutting the wafer held on the chuck table, a cutting water supply means for supplying cutting water used for cutting by the cutting means, and a cutting movement direction of the chuck table. A cutting apparatus comprising at least an intrusion prevention means having a bellows structure for preventing the cutting water from entering the apparatus and a discharge means for receiving and discharging the cutting water flowing out from the intrusion prevention means. There,
The discharging means includes a case portion that receives the cutting water, and a guide portion that is formed in the case portion and extends in a moving direction of the chuck table,
The intrusion prevention means includes a bellows portion that expands and contracts as the chuck table moves, and a support portion that is connected to the bellows portion and supports the bellows portion.
The bellows portion is composed of an upper bellows portion and side bellows portions depending from both ends of the upper bellows portion in a direction perpendicular to the moving direction of the chuck table.
The intrusion prevention means is arranged such that the lower end of the side bellows portion is spaced from the lower surface of the case portion, and the support portion that moves by the expansion and contraction of the bellows portion is guided on the guide portion. A cutting device characterized by the above.   2. The cutting apparatus according to claim 1, wherein the discharging means has an internal splash prevention plate extending in the moving direction of the chuck table at a position inside the side bellows portion.   3. The cutting apparatus according to claim 1, wherein the discharging means has an external splash prevention plate extending in a moving direction of the chuck table at a position outside the side bellows portion.

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