JP2015106636A - Wiring board and electronic device - Google Patents

Wiring board and electronic device Download PDF

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JP2015106636A
JP2015106636A JP2013247856A JP2013247856A JP2015106636A JP 2015106636 A JP2015106636 A JP 2015106636A JP 2013247856 A JP2013247856 A JP 2013247856A JP 2013247856 A JP2013247856 A JP 2013247856A JP 2015106636 A JP2015106636 A JP 2015106636A
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conductor
insulating substrate
wiring board
wall
notch
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JP6258679B2 (en
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三倉　勉
Tsutomu Mikura
勉 三倉
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Kyocera Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a wiring board and an electronic device which can be made compact, and in which the wall surface conductor is less likely to be peeled.SOLUTION: A wiring conductor is deposited on an insulating substrate 2 having a notch 4 at a rectangular corner, and a wall surface conductor 3 projecting from the back of the notch 4 and having a planar outer side face. In the plan view, an obtuse angle α is formed by the inner side face of the notch 4 and the outer side face of the wall surface conductor 3. When punching the parts becoming the notch 4 and wall surface conductor 3, the wall surface conductor 3 can be peeled from the insulating substrate 2.

Description

本発明は、例えば電子部品が搭載される配線基板およびそれを用いた電子装置に関するものである。   The present invention relates to, for example, a wiring board on which electronic components are mounted and an electronic device using the wiring board.

従来、例えば半導体素子，センサ素子，容量素子または圧電振動子等の電子部品を搭載するために用いられる配線基板として一般的なものは、直方体状等の絶縁基板の主面（通常は上面）に電子部品の搭載部が設けられており、絶縁基板の側面から下面にかけて配線導体（壁面導体）が設けられている。配線基板を含む電子装置をろう材によって実装基板に接合する場合、この壁面導体が外部電極部分となる。   Conventionally, for example, a general wiring board used for mounting electronic components such as a semiconductor element, a sensor element, a capacitive element or a piezoelectric vibrator is formed on the main surface (usually the upper surface) of an insulating substrate such as a rectangular parallelepiped. An electronic component mounting portion is provided, and a wiring conductor (wall surface conductor) is provided from the side surface to the lower surface of the insulating substrate. When the electronic device including the wiring board is joined to the mounting board by the brazing material, the wall conductor becomes the external electrode portion.

このような配線基板は、例えばグリーンシート積層法により製作され、セラミック粉末と有機バインダとを主成分とするセラミックグリーンシートを準備し、金属粉末を主成分とする導体ペーストを印刷するなどして配線導体パターンを形成した基部となるセラミックグリーンシートを積層することにより積層体を形成した後、この積層体を焼成することにより配線基板が製作される。壁面導体は、セラミックグリーンシートの配線基板の外縁となる箇所に貫通導体を形成し、積層体に分割用の溝を形成すると同時に貫通導体を分割することで形成することができる。   Such a wiring board is manufactured by, for example, a green sheet laminating method, and a ceramic green sheet mainly composed of ceramic powder and an organic binder is prepared, and a conductor paste mainly composed of metal powder is printed. After a laminated body is formed by laminating ceramic green sheets serving as a base portion on which a conductor pattern is formed, a wiring board is manufactured by firing this laminated body. The wall surface conductor can be formed by forming a through conductor at a location that becomes the outer edge of the wiring board of the ceramic green sheet, and by dividing the through conductor at the same time as forming a dividing groove in the laminate.

特開平７−38217号公報Japanese Patent Laid-Open No. 7-38217

しかしながら、積層体に分割用の溝を形成すると同時に貫通導体を分割する工程において、分割用の溝を形成する時の応力によって、積層体における配線基板の周縁部となる部分が垂れ下がるように変形することにより、壁面導体となる導体ペーストが絶縁基板となるグリーンシートから剥離する可能性があった。電子装置への小型化の要求に伴い、絶縁基板に設けられる壁面導体の径が小さくなると、特に壁面導体が配線基板の角部に設けられた場合には、さらにセラミックグリーンシートと壁面導体となる導体ペーストとの接合面積が小さくなるため、剥がれの可能性がより高くなっていた。   However, in the step of forming the dividing groove in the multilayer body and at the same time dividing the through conductor, the portion of the multilayer body that becomes the peripheral portion of the wiring body is deformed by the stress at the time of forming the dividing groove. As a result, there is a possibility that the conductor paste that becomes the wall conductor peels off from the green sheet that becomes the insulating substrate. With the demand for downsizing of electronic devices, when the diameter of the wall conductor provided on the insulating substrate is reduced, especially when the wall conductor is provided at the corner of the wiring board, it becomes a ceramic green sheet and wall conductor. Since the bonding area with the conductive paste is reduced, the possibility of peeling is higher.

本発明の一つの態様による配線基板は、矩形状の角部に切り欠きを有する絶縁基板と、切り欠きの奥から絶縁基板内に突出し、外側面が平面状である壁面導体とを有しており、平面視で切り欠きの内側面と壁面導体の外側面とのなす角は鈍角である。   A wiring board according to one aspect of the present invention includes an insulating substrate having a cutout at a rectangular corner, and a wall conductor that protrudes from the back of the cutout into the insulating substrate and has a flat outer surface. The angle formed by the inner side surface of the notch and the outer side surface of the wall conductor in plan view is an obtuse angle.

本発明の他の態様によれば、電子装置は、上記構成の配線基板と、配線基板に搭載された電子部品とを備えている。   According to another aspect of the present invention, an electronic device includes the wiring board having the above-described configuration and an electronic component mounted on the wiring board.

本発明の一つの態様による配線基板において、矩形状の角部に切り欠きを有する絶縁基板と、切り欠きの奥から絶縁基板内に突出し、外側面が平面状である壁面導体とを有しており、平面視で切り欠きの内側面と壁面導体の外側面とのなす角は鈍角であることによって、絶縁基板の側面となる部分に壁面導体を作製する際に壁面導体が絶縁基板から剥離することを効果的に抑制することが可能となるものである。   A wiring board according to an aspect of the present invention includes an insulating substrate having a cutout at a rectangular corner, and a wall conductor that protrudes into the insulating substrate from the back of the cutout and has a flat outer surface. The angle between the inner surface of the notch and the outer surface of the wall conductor in plan view is an obtuse angle, so that the wall conductor peels off from the insulating substrate when the wall conductor is formed on the side surface of the insulating substrate. This can be effectively suppressed.

本発明の他の態様によれば、電子装置は、上記構成の配線基板を備えていることによって、より小型化と高密度化が可能となる電子装置を提供することができる。   According to another aspect of the present invention, the electronic device includes the wiring board having the above-described configuration, thereby providing an electronic device that can be further reduced in size and increased in density.

（ａ）は本発明の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）に示された電子装置の側面図である。(A) is a top view which shows the electronic device in embodiment of this invention, (b) is a side view of the electronic device shown by (a). （ａ）は図１（ａ）に示された電子装置のＡ部の拡大上面図であり、（ｂ）は図１（ａ）に示された電子装置のＡ部の拡大斜視図であり、（ｃ）は本発明の実施形態における電子装置の他の例を示す要部拡大上面図である。(A) is an enlarged top view of part A of the electronic device shown in FIG. 1 (a), (b) is an enlarged perspective view of part A of the electronic device shown in FIG. 1 (a), (C) is a principal part enlarged top view which shows the other example of the electronic device in embodiment of this invention. 本発明の実施形態における配線基板の製造方法において、切り欠きとなる部位および壁面導体３となる部位を示す上面図である。FIG. 5 is a top view showing a part that becomes a notch and a part that becomes a wall conductor 3 in the method for manufacturing a wiring board in the embodiment of the present invention.

以下、本発明の例示的な実施形態について図面を参照して説明する。   Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings.

図１、２を参照して本発明の実施形態における電子装置について説明する。本実施形態における電子装置は、配線基板１と、配線基板１に搭載された電子部品11とを含んでいる。   An electronic device according to an embodiment of the present invention will be described with reference to FIGS. The electronic device according to the present embodiment includes a wiring board 1 and an electronic component 11 mounted on the wiring board 1.

配線基板１は、絶縁基板２と壁面導体３とを有している。   The wiring substrate 1 has an insulating substrate 2 and a wall conductor 3.

絶縁基板２は、矩形状の角部に切り欠き４を有している。   The insulating substrate 2 has a cutout 4 at a rectangular corner.

絶縁基板２は、上面に半導体素子等の電子部品11を搭載するための搭載部２ａを有し、例えば、酸化アルミニウム質焼結体，ムライト質焼結体，炭化珪素質焼結体，窒化アルミニウム質焼結体，窒化珪素質焼結体，ガラスセラミックス焼結体等の電気絶縁性セラミックスから成る略四角形の絶縁層を複数上下に積層して形成されている。   The insulating substrate 2 has a mounting portion 2a for mounting an electronic component 11 such as a semiconductor element on its upper surface. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, aluminum nitride It is formed by laminating a plurality of substantially rectangular insulating layers made of electrically insulating ceramics such as a sintered material, a silicon nitride material, and a glass ceramic material.

絶縁基板２は、例えば酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウムの粉末に酸化珪素・酸化マグネシウム・酸化カルシウム等の焼結助剤を添加し、さらに適当な有機バインダ・溶剤等を添加混合して泥漿物を作るとともに、この泥漿物をドクターブレード法またはカレンダーロール法を採用することによってグリーンシート（生シート）とし、しかる後、このグリーンシートに適当な打ち抜き加工を施して略四角形状に加工するとともにこれを複数枚積層し、焼成することによって製作される。   If the insulating substrate 2 is made of, for example, an aluminum oxide sintered body, a sintering aid such as silicon oxide, magnesium oxide, or calcium oxide is added to the aluminum oxide powder, and an appropriate organic binder, solvent, etc. Is added to the mixture to make a mud, and the mud is made into a green sheet (raw sheet) by adopting the doctor blade method or the calender roll method, and then the green sheet is subjected to an appropriate punching process. It is manufactured by processing into a square shape and laminating and firing a plurality of these.

この絶縁基板２の切り欠き４の奥から絶縁基板２内に突出しており、外側面が平面状である貫通導体等の壁面導体３が設けられており、また壁面導体３に電気的に接続され、電子部品11が搭載される上面から側面、下面にかけて、ビアホール導体、スルーホール導体等の貫通導体を含む配線導体が被着形成されている。壁面導体３および配線導体は、絶縁基板２が電気絶縁性セラミックスから成る場合には、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），金（Ａｕ），銀（Ａｇ）または銅（Ｃｕ）等のメタライズから成り、絶縁基板２用のセラミックグリーンシートに壁面導体３および配線導体用の導体ペーストをスクリーン印刷法等によって所定形状で印刷して、セラミックグリーンシートと同時に焼成することによって、絶縁基板２の所定位置に形成される。内部導体のうち、セラミックグリーンシートを厚み方向に貫通する貫通導体は、導体ペーストを印刷することによってセラミックグリーンシートに形成した貫通孔を充填しておけばよい。このような導体ペーストは、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），金（Ａｕ），銀（Ａｇ），銅（Ｃｕ）等の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基板２との接合強度
を高めるために、ガラス、セラミックスを含んでいても構わない。 A wall surface conductor 3 such as a through conductor that protrudes from the back of the notch 4 of the insulating substrate 2 into the insulating substrate 2 and has a flat outer surface is electrically connected to the wall surface conductor 3. Wiring conductors including through-hole conductors such as via-hole conductors and through-hole conductors are deposited from the top surface to the side and bottom surfaces on which the electronic component 11 is mounted. The wall conductor 3 and the wiring conductor are tungsten (W), molybdenum (Mo), manganese (Mn), gold (Au), silver (Ag), or copper (Cu) when the insulating substrate 2 is made of an electrically insulating ceramic. ), Etc., printed on the ceramic green sheet for the insulating substrate 2 in a predetermined shape by a screen printing method or the like, and then fired simultaneously with the ceramic green sheet. It is formed at a predetermined position on the substrate 2. Of the internal conductors, the through conductor that penetrates the ceramic green sheet in the thickness direction may be filled with a through hole formed in the ceramic green sheet by printing a conductor paste. Such a conductive paste is kneaded by adding an appropriate solvent and binder to a metal powder such as tungsten (W), molybdenum (Mo), manganese (Mn), gold (Au), silver (Ag), copper (Cu). By adjusting the viscosity, it is adjusted to an appropriate viscosity. In order to increase the bonding strength with the insulating substrate 2, glass or ceramics may be included.

本実施形態の配線基板１においては、平面視で切り欠き４の内側面と壁面導体３の外側面とのなす角αが鈍角である。   In the wiring board 1 of the present embodiment, the angle α formed by the inner surface of the notch 4 and the outer surface of the wall conductor 3 is an obtuse angle in plan view.

このように、平面視で切り欠き４の内側面と壁面導体３の外側面とのなす角αが鈍角であることによって、切り欠き４および壁面導体３となる箇所を例えば打ち抜き金型により打ち抜くと、配線基板１の周縁部となる積層体の周縁部すなわち切り欠き４が垂れ下がるように変形し、周囲の変形した部分が壁面導体３となる導体ペーストを保持するように押さえ、壁面導体３が絶縁基板２から剥離することを抑制することが可能となる。   Thus, when the angle α formed by the inner side surface of the notch 4 and the outer side surface of the wall conductor 3 is an obtuse angle in plan view, the portion to be the notch 4 and the wall conductor 3 is punched by, for example, a punching die. Then, the peripheral portion of the laminate that is the peripheral portion of the wiring substrate 1, that is, the notch 4 is deformed so as to hang down, and the peripheral deformed portion is pressed so as to hold the conductor paste that becomes the wall conductor 3, and the wall conductor 3 is insulated It becomes possible to suppress peeling from the substrate 2.

なお、平面視で切り欠き４の内側面と壁面導体３の外側面とのなす角αは120度〜150度であると、配線基板１を含む電子装置をろう材によって実装基板に接合する際に、ろう材を切り欠き内に適度に保持しやすいとともに、上述の周囲の変形した部分が壁面導体３となる導体ペーストを押さえやすく、壁面導体３が絶縁基板２から剥離することを効果的に抑制することが可能となり、好ましい。平面視で切り欠き４の内側面と壁面導体３の外側面とのなす角αが90度以下であると、配線基板１を含む電子装置をろう材によって実装基板に接合する際に、ろう材が切り欠き内に入り込みにくくなり、ろう材が不足して充分な接合強度が得られにくいものとなる。平面視で切り欠き４の内側面と壁面導体３の外側面とのなす角αが180度以上であると、周囲の変形した部分が壁面導体３となる導体ペース
トを押さえることができず、壁面導体３が絶縁基板２から剥離しやすいものとなる。 When the angle α formed by the inner surface of the notch 4 and the outer surface of the wall conductor 3 is 120 ° to 150 ° in plan view, the electronic device including the wiring substrate 1 is joined to the mounting substrate by the brazing material. In addition, it is easy to hold the brazing material moderately in the notch, and the above-mentioned deformed portion around the above is easy to hold down the conductor paste that becomes the wall conductor 3, so that the wall conductor 3 is effectively peeled off from the insulating substrate 2. This is preferable because it can be suppressed. When the angle α formed by the inner surface of the notch 4 and the outer surface of the wall conductor 3 is 90 degrees or less in plan view, the brazing material is bonded to the mounting substrate with the brazing material when the electronic device including the wiring board 1 is joined. Becomes difficult to enter the notch, and the brazing material is insufficient, so that it is difficult to obtain sufficient bonding strength. If the angle α formed by the inner surface of the notch 4 and the outer surface of the wall conductor 3 is 180 degrees or more in plan view, the surrounding deformed portion cannot hold down the conductor paste that becomes the wall conductor 3. The conductor 3 is easily peeled off from the insulating substrate 2.

また、平面視で壁面導体３は切り欠き４より絶縁基板２の内側に位置している。配線基板１をこのような構成とすることによって、積層体の取り扱い時において、積層体に外力が加わっても、外力による応力が切り欠き４によって分散し、壁面導体３および壁面導体３の両側の絶縁層の部分は変形しにくいものとなって、セラミックグリーンシートと壁面導体３となる導体ペーストとの接合面積の減少を抑制することができ、壁面導体３が絶縁基板２から剥離することを抑制することが可能となる。同様に、積層体の焼成後に作製される絶縁基板２、配線基板１、電子装置において、取り扱い時に外力が加わっても、外力による応力が切り欠き４によって分散し、壁面導体３に欠け等のないものとなり、好ましい。   In addition, the wall conductor 3 is located inside the insulating substrate 2 from the notch 4 in plan view. When the wiring board 1 has such a configuration, even when an external force is applied to the multilayer body, the stress due to the external force is dispersed by the notches 4 when the multilayer body is handled, and the wall conductor 3 and the wall conductors 3 on both sides are distributed. The insulating layer portion is hard to be deformed, and the reduction of the bonding area between the ceramic green sheet and the conductor paste that becomes the wall conductor 3 can be suppressed, and the wall conductor 3 can be prevented from peeling from the insulating substrate 2. It becomes possible to do. Similarly, in the insulating substrate 2, the wiring substrate 1, and the electronic device that are manufactured after firing the laminated body, even if an external force is applied during handling, the stress due to the external force is dispersed by the notch 4 and the wall conductor 3 is not chipped. This is preferable.

また、図２（ｃ）に示すように、壁面導体３は、絶縁基板２内に突出した部分の幅Ｗ１が、外側面の幅Ｗ２より大きい。配線基板１をこのような構成とすることによって、壁面導体３が絶縁基板２内に入り込むような状態となり、絶縁基板２に保持されるものとなって、壁面導体３が絶縁基板２から剥がれにくいものとすることが可能となり、好ましい。   Further, as shown in FIG. 2C, the wall conductor 3 has a width W1 of a portion protruding into the insulating substrate 2 larger than a width W2 of the outer surface. By configuring the wiring board 1 as described above, the wall conductor 3 enters the insulating substrate 2 and is held by the insulating substrate 2, so that the wall conductor 3 is not easily separated from the insulating substrate 2. This is preferable.

なお、電子部品11は、配線基板１の上面に搭載されている。電子部品11の搭載方法は、ワイヤボンディングまたはフリップチップ接続であり、図１においてはワイヤボンディングによる接続構造が示されている。   The electronic component 11 is mounted on the upper surface of the wiring board 1. The electronic component 11 is mounted by wire bonding or flip-chip connection. FIG. 1 shows a connection structure by wire bonding.

次に、本実施形態の配線基板１の製造方法について説明する。   Next, the manufacturing method of the wiring board 1 of this embodiment is demonstrated.

絶縁基板２は、例えば酸化アルミニウム（Ａｌ２Ｏ３）質焼結体からなり、その上面に電子部品11が搭載される搭載部２ａを有している。この絶縁基板２は、主成分が酸化アルミニウム（Ａｌ２Ｏ３）である酸化アルミニウム質焼結体から成る場合、Ａｌ２Ｏ３の粉末に焼結助材としてシリカ（ＳｉＯ２），マグネシア（ＭｇＯ），カルシア（ＣａＯ）等の粉末を添加し、さらに適当なバインダ、溶剤および可塑剤を添加し、次にこれらの混合物を混錬してスラリー状となす。その後、従来周知のドクターブレード法等の成形方法によって多数個取り用のセラミックグリーンシートを得る。 The insulating substrate 2 is made of, for example, an aluminum oxide (Al 2 O 3 ) -based sintered body, and has a mounting portion 2a on which an electronic component 11 is mounted. When the insulating substrate 2 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al 2 O 3 ), silica (SiO 2 ), magnesia (MgO) is used as a sintering aid for the Al 2 O 3 powder. ), Calcia (CaO), etc. are added, and an appropriate binder, solvent and plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for obtaining a large number of pieces is obtained by a conventionally known molding method such as a doctor blade method.

このセラミックグリーンシートを用いて、以下の（１）〜（５）の工程により配線基板１が作製される。   Using this ceramic green sheet, the wiring substrate 1 is manufactured by the following steps (1) to (5).

（１）絶縁基板２の側面となる部位に形成される壁面導体３、壁面導体３に接続され、絶縁基板２の内部、上面、側面、下面となる部位に内部導体や貫通導体を含む配線導体をそれぞれ形成するための導体ペーストの印刷塗布および充填工程。   (1) A wiring conductor connected to the wall surface conductor 3 and the wall surface conductor 3 formed on a portion serving as a side surface of the insulating substrate 2 and including an internal conductor and a through conductor in the inside, top surface, side surface, and bottom surface of the insulating substrate 2 Printing and filling process of conductor paste for forming each of the above.

（２）導体ペーストが露出するようにして形成するための切り欠き４となる部位の打ち抜き金型を用いた打ち抜き加工工程。   (2) A punching process using a punching die at a portion to be the notch 4 for forming the conductor paste so as to be exposed.

（３）各絶縁層となるセラミックグリーンシートを積層してセラミックグリーンシート積層体を作製する工程。   (3) The process of producing the ceramic green sheet laminated body by laminating | stacking the ceramic green sheet used as each insulating layer.

（４）このセラミックグリーンシート積層体を約１５００〜１８００℃の温度で焼成して、各切り欠き４、壁面導体３および配線導体を有する絶縁基板２が複数配列された多数個取り基板を得る工程。   (4) A step of firing the ceramic green sheet laminate at a temperature of about 1500 to 1800 ° C. to obtain a multi-piece substrate in which a plurality of insulating substrates 2 each having notches 4, wall conductors 3 and wiring conductors are arranged. .

（５）焼成して得られた多数個取り基板に配線基板１の外縁となる箇所に沿って分割溝を形成しておき、この分割溝に沿って破断させて分割する方法、またはスライシング法等により配線基板１の外縁となる箇所に沿って切断する方法等を用いることができる。なお、分割溝は、焼成後にスライシング装置により多数個取り基板の厚みより小さく切り込むことによって形成することができるが、多数個取り基板用のセラミックグリーンシート積層体にカッター刃を押し当てたり、スライシング装置によりセラミックグリーンシート積層体の厚みより小さく切り込んだりすることによって形成してもよい。   (5) A method in which a dividing groove is formed along a portion serving as the outer edge of the wiring substrate 1 on the multi-piece substrate obtained by firing, and a method of dividing by dividing along the dividing groove, a slicing method, or the like Thus, it is possible to use a method of cutting along a portion that becomes the outer edge of the wiring board 1. The dividing groove can be formed by cutting the multi-cavity substrate smaller than the thickness of the multi-piece substrate after firing, but the cutter blade can be pressed against the ceramic green sheet laminate for the multi-piece substrate, or the slicing device May be formed by cutting smaller than the thickness of the ceramic green sheet laminate.

上述の（１）の工程において、壁面導体３は、絶縁基板２用のセラミックグリーンシートに導体ペーストをスクリーン印刷法等によって所定形状で印刷して、絶縁基板２用のセラミックグリーンシートと同時に焼成することによって、複数の絶縁基板２のそれぞれの所定位置に形成される。このような導体ペーストは、タングステン，モリブデン，マンガン，銀または銅等の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、導体ペーストは、絶縁基板２との接合強度を高めるために、ガラス、セラミックスを含んでいても構わない。また、壁面導体３は、導体ペーストをセラミックグリーンシートに印刷することによって形成される貫通導体または金属層であっても構わない。   In the above-described step (1), the wall surface conductor 3 is printed simultaneously with the ceramic green sheet for the insulating substrate 2 by printing the conductor paste on the ceramic green sheet for the insulating substrate 2 in a predetermined shape by screen printing or the like. Thus, the plurality of insulating substrates 2 are formed at predetermined positions. Such a conductive paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and a binder to a metal powder such as tungsten, molybdenum, manganese, silver or copper and kneading them. The conductor paste may contain glass or ceramics in order to increase the bonding strength with the insulating substrate 2. The wall surface conductor 3 may be a through conductor or a metal layer formed by printing a conductor paste on a ceramic green sheet.

また、壁面導体３は、セラミックグリーンシートを厚み方向に形成される導体が貫通導体の場合は、壁面導体３用の導体ペーストをスクリーン印刷法等によって印刷することによってセラミックグリーンシートに形成した貫通孔を充填し、上述の打ち抜き加工時に、図３に示すように、破線部分を打ち抜き、貫通導体が露出するように切り欠き４を形成して、セラミックグリーンシートと同時に焼成することによって形成される。   Further, when the conductor formed on the ceramic green sheet in the thickness direction is a through conductor, the wall conductor 3 is a through hole formed in the ceramic green sheet by printing a conductor paste for the wall conductor 3 by a screen printing method or the like. In the above-described punching process, as shown in FIG. 3, the broken line portion is punched, the notch 4 is formed so that the through conductor is exposed, and it is fired simultaneously with the ceramic green sheet.

また、配線導体は、壁面導体３と同様のメタライズから成り、絶縁基板２用のセラミックグリーンシートに配線導体用の導体ペーストをスクリーン印刷法等によって所定形状で印刷して、セラミックグリーンシートと同時に焼成することによって、絶縁基板２の所定位置に形成される。配線導体のうち、セラミックグリーンシートを厚み方向に貫通する貫通導体は、導体ペーストを印刷することによってセラミックグリーンシートに形成した貫通孔を充填しておけばよい。このような導体ペーストは、壁面導体３に用いた金属ペーストと同様の方法により作製される。   The wiring conductor is made of the same metallization as that of the wall conductor 3, and a conductive paste for the wiring conductor is printed on the ceramic green sheet for the insulating substrate 2 in a predetermined shape by a screen printing method or the like, and fired simultaneously with the ceramic green sheet. As a result, the insulating substrate 2 is formed at a predetermined position. Of the wiring conductors, the through conductors that penetrate the ceramic green sheet in the thickness direction may be filled with the through holes formed in the ceramic green sheet by printing the conductor paste. Such a conductor paste is produced by the same method as the metal paste used for the wall conductor 3.

また、絶縁基板２の表面に露出した貫通導体から成る壁面導体３、配線導体を保護して酸化防止をするために、壁面導体３、配線導体の露出した表面に、厚さ0.5〜10μｍのＮ
ｉめっき層を被着させるか、またはこのＮｉめっき層および厚さ0.5〜３μｍの金（Ａｕ
）めっき層を順次被着させるのがよい。 In addition, in order to protect the wall conductor 3 and the wiring conductor made of the through conductor exposed on the surface of the insulating substrate 2 and prevent oxidation, the wall conductor 3 and the exposed surface of the wiring conductor are coated with N of 0.5 to 10 μm in thickness.
i plating layer is applied, or this Ni plating layer and 0.5 to 3 μm thick gold (Au
) Plating layers should be deposited sequentially.

また、絶縁基板２の上面を同じサイズの方形状とすると、電子部品11の搭載部２ａをより大きいものとすることが可能となり、また取り扱い時に外力が加わっても、外力による応力が絶縁基板２の上面側で分散し、壁面導体３に欠け等のないものとなり、好ましい。   Further, if the upper surface of the insulating substrate 2 is the same size, the mounting portion 2a of the electronic component 11 can be made larger. Even if an external force is applied during handling, the stress due to the external force is applied to the insulating substrate 2. The wall surface conductor 3 is free from chipping and the like, which is preferable.

このようにして形成された配線基板１に、電子部品11が搭載部２ａ上に搭載された電子装置を外部回路基板（図示せず）に搭載することで、電子部品11が配線導体、壁面導体３を介して外部回路基板に電気的に接続される。電子部品11は例えば、半導体素子，センサ素子，容量素子または圧電振動子等である。なお、電子部品11の各電極は、ボンディングワイヤ12等の接続端子等により配線基板１の配線導体に電気的に接続されている。   By mounting the electronic device on which the electronic component 11 is mounted on the mounting portion 2a on the wiring board 1 formed in this way on an external circuit board (not shown), the electronic component 11 becomes a wiring conductor and a wall conductor. 3 is electrically connected to an external circuit board. The electronic component 11 is, for example, a semiconductor element, a sensor element, a capacitive element, a piezoelectric vibrator, or the like. Each electrode of the electronic component 11 is electrically connected to the wiring conductor of the wiring board 1 by connection terminals such as bonding wires 12.

本実施形態の配線基板１は、矩形状の角部に切り欠き４を有する絶縁基板２と、切り欠き４の奥から絶縁基板２内に突出しており、外側面が平面状である壁面導体３とを有しており、平面視で切り欠き４の内側面と壁面導体３の外側面とのなす角αは鈍角である。これにより、絶縁基板２の側面となる部分に壁面導体３を作製する際に壁面導体３が絶縁基板２から剥離することを効果的に抑制することが可能となるものである。   The wiring board 1 of the present embodiment includes an insulating substrate 2 having a notch 4 at a corner of a rectangular shape, and a wall conductor 3 that protrudes from the back of the notch 4 into the insulating substrate 2 and has a flat outer surface. The angle α formed by the inner surface of the notch 4 and the outer surface of the wall conductor 3 is an obtuse angle in plan view. Thereby, it is possible to effectively suppress the separation of the wall surface conductor 3 from the insulating substrate 2 when the wall surface conductor 3 is produced on the side surface of the insulating substrate 2.

本発明の他の態様によれば、電子装置は、より小型化と高密度化が可能となる。   According to another aspect of the present invention, the electronic device can be further reduced in size and density.

１・・・・・配線基板
２・・・・・絶縁基板
２ａ・・・・搭載部
３・・・・・壁面導体
４・・・・・切り欠き
11・・・・・電子部品
12・・・・・ボンディングワイヤ DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Insulation board 2a ... Mounting part 3 ... Wall conductor 4 ... Notch
11 ・ ・ ・ ・ ・ Electronic parts
12 ... bonding wire

Claims (3)

矩形状の角部に切り欠きを有する絶縁基板と、
前記切り欠きの奥から前記絶縁基板内に突出し、外側面が平面状である壁面導体とを有しており、
平面視で前記切り欠きの内側面と前記壁面導体の外側面とのなす角は鈍角であることを特徴とする配線基板。 An insulating substrate having a notch in a rectangular corner;
A wall conductor that protrudes from the back of the cutout into the insulating substrate and has a flat outer surface;
The wiring board according to claim 1, wherein an angle formed by the inner side surface of the notch and the outer side surface of the wall conductor in plan view is an obtuse angle. 前記壁面導体は前記絶縁基板内に突出した部分の幅が、前記外側面の幅より大きいことを特徴とする請求項１に記載の配線基板。   2. The wiring board according to claim 1, wherein a width of a portion of the wall conductor projecting into the insulating substrate is larger than a width of the outer surface. 請求項１に記載された配線基板と、
該配線基板に搭載された電子部品とを備えていることを特徴とする電子装置。 A wiring board according to claim 1;
An electronic device comprising: an electronic component mounted on the wiring board.
JP2013247856A 2013-11-29 2013-11-29 Wiring board and electronic device Expired - Fee Related JP6258679B2 (en)

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JPH0582960A (en) * 1991-09-20 1993-04-02 Ibiden Co Ltd Forming method of sectional through-hole in printed wiring board
JPH0837251A (en) * 1994-07-21 1996-02-06 Murata Mfg Co Ltd Laminated electronic part and manufacture thereof
JPH09130145A (en) * 1995-10-31 1997-05-16 Kinseki Ltd Piezoelectric oscillator
JPH11274740A (en) * 1998-01-23 1999-10-08 Nissha Printing Co Ltd Multilayer printed wiring board with external terminal on side face and manufacture thereof
JP2001160666A (en) * 1999-11-30 2001-06-12 Murata Mfg Co Ltd Module board and manufacturing method
JP2001217521A (en) * 2000-01-31 2001-08-10 Murata Mfg Co Ltd Module substrate
JP2001284826A (en) * 2000-03-28 2001-10-12 Kyocera Corp Multilayered board and divided multilayered board
JP2004112751A (en) * 2002-07-26 2004-04-08 Toyo Commun Equip Co Ltd Surface mounted electronic device, insulating substrate base material, insulating substrates, and manufacturing method thereof
JP2008153441A (en) * 2006-12-18 2008-07-03 Koa Corp Wiring substrate, and manufacturing method thereof
JP2009200404A (en) * 2008-02-25 2009-09-03 Alps Electric Co Ltd Method of manufacturing ceramic wiring board

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582960A (en) * 1991-09-20 1993-04-02 Ibiden Co Ltd Forming method of sectional through-hole in printed wiring board
JPH0837251A (en) * 1994-07-21 1996-02-06 Murata Mfg Co Ltd Laminated electronic part and manufacture thereof
JPH09130145A (en) * 1995-10-31 1997-05-16 Kinseki Ltd Piezoelectric oscillator
JPH11274740A (en) * 1998-01-23 1999-10-08 Nissha Printing Co Ltd Multilayer printed wiring board with external terminal on side face and manufacture thereof
JP2001160666A (en) * 1999-11-30 2001-06-12 Murata Mfg Co Ltd Module board and manufacturing method
JP2001217521A (en) * 2000-01-31 2001-08-10 Murata Mfg Co Ltd Module substrate
JP2001284826A (en) * 2000-03-28 2001-10-12 Kyocera Corp Multilayered board and divided multilayered board
JP2004112751A (en) * 2002-07-26 2004-04-08 Toyo Commun Equip Co Ltd Surface mounted electronic device, insulating substrate base material, insulating substrates, and manufacturing method thereof
JP2008153441A (en) * 2006-12-18 2008-07-03 Koa Corp Wiring substrate, and manufacturing method thereof
JP2009200404A (en) * 2008-02-25 2009-09-03 Alps Electric Co Ltd Method of manufacturing ceramic wiring board

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