JP2015105437A - メッキ装置 - Google Patents

メッキ装置 Download PDF

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Publication number
JP2015105437A
JP2015105437A JP2014060222A JP2014060222A JP2015105437A JP 2015105437 A JP2015105437 A JP 2015105437A JP 2014060222 A JP2014060222 A JP 2014060222A JP 2014060222 A JP2014060222 A JP 2014060222A JP 2015105437 A JP2015105437 A JP 2015105437A
Authority
JP
Japan
Prior art keywords
anode
plated
plating
shielding
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014060222A
Other languages
English (en)
Japanese (ja)
Inventor
キム チュル−キュ
Chulkyu Kim
キム チュル−キュ
ロー ユー−ジュン
You-Jung Roh
ロー ユー−ジュン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2015105437A publication Critical patent/JP2015105437A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2014060222A 2013-11-28 2014-03-24 メッキ装置 Pending JP2015105437A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130146483A KR20150062008A (ko) 2013-11-28 2013-11-28 도금 장치
KR10-2013-0146483 2013-11-28

Publications (1)

Publication Number Publication Date
JP2015105437A true JP2015105437A (ja) 2015-06-08

Family

ID=53045667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014060222A Pending JP2015105437A (ja) 2013-11-28 2014-03-24 メッキ装置

Country Status (3)

Country Link
JP (1) JP2015105437A (ko)
KR (1) KR20150062008A (ko)
DE (1) DE102014205800A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014129603A (ja) * 2012-12-31 2014-07-10 Samsung Electro-Mechanics Co Ltd プリント基板用メッキ装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19717489B4 (de) 1997-04-25 2008-04-10 Sms Demag Ag Anordnung zur elektrogalvanischen Metallbeschichtung eines Bandes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014129603A (ja) * 2012-12-31 2014-07-10 Samsung Electro-Mechanics Co Ltd プリント基板用メッキ装置

Also Published As

Publication number Publication date
KR20150062008A (ko) 2015-06-05
DE102014205800A1 (de) 2015-05-28

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