JP2015105437A - Plating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating apparatus capable of effectively controlling the plating thickness distribution of a plated object.SOLUTION: A plating apparatus 1000 includes: a plurality of anodes 100 which are arranged in parallel with a plated object 10 and have electrical current supplied independently to each; and shields 200, which are interposed between the plurality of anodes to electrically shield the plurality of anodes from each other.

Description

  The present invention relates to a plating apparatus.

  In recent years, printed circuit boards have been used as core parts for mobile phones, semiconductors, information communications, etc., and related technologies have become increasingly important. In particular, the need for uniform plating on a printed circuit board is emphasized as well as the reliability improvement of semiconductor IC mobile communication components for miniaturization, high speed, high density, high performance, electromagnetic shielding and the like.

  Such uniform plating of the printed circuit board can improve the performance by thinning and uniforming the plating film of the fine circuit, and also reduces the noise of the electronic device by reducing the wiring profile. You can also. Further, the uniform plating thickness prevents excessive plating, and therefore can bring about an effect of reducing manufacturing costs.

  However, during plating, geometrical elements such as complex circuit configurations, electrolytic cell and electrode configurations, characteristics of solutions and additives, polarization and voltage related to the rate of electrochemical reactions, concentration distribution of reactive ions, etc. Due to various factors acting in a complex manner, it is difficult to obtain a uniform current distribution, which makes it difficult to effectively improve the plating thickness deviation.

  1. Korean Published Patent No. 10-1998-081740 (1998. 11.25. Published)

  The objective of this invention is providing the plating apparatus which can control effectively distribution of the plating thickness of a to-be-plated body.

  According to one aspect of the present invention, a plurality of anode portions that are arranged in parallel to the object to be plated and are independently supplied with current, and a plurality of anode portions so as to electrically shield the plurality of anode portions from each other. And a shielding part interposed between the two.

  Here, the shielding portion extends in the vertical direction from the end portion of the first shielding plate and the first shielding plate that divides the plurality of anode portions in the lateral direction, and guides the discharge of bubbles generated from the respective anode portions. A second shielding plate.

  The shielding part may further include a guide plate that projects from the first shielding plate toward the object to be plated and guides a current between each anode part and the object to be plated.

  The shielding part may further include an end shielding plate that shields current at positions corresponding to both ends of the object to be plated in the anode part.

  Each anode part can adjust the amount of current supplied.

  The anode part and the shielding part can be provided symmetrically on both sides with respect to the object to be plated.

  According to the embodiment of the present invention, it is possible to provide a plating apparatus that can effectively control the plating thickness distribution of the object to be plated.

1 is a view showing a plating apparatus according to an embodiment of the present invention. 3 is a diagram illustrating an example of a state in which current is independently supplied to each anode portion in the plating apparatus according to an embodiment of the present invention. It is drawing which shows the experimental result of the plating thickness of the to-be-plated body by the state of FIG.

  Embodiments of a plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components will be denoted by the same reference numerals, and redundant description thereof will be omitted. To do.

  In addition, terms such as “first”, “second” and the like used in the following are merely identification symbols for distinguishing the same or corresponding components, and the same or corresponding components are those “ It is not limited by terms such as “first” and “second”.

  In addition, the term “coupled” does not mean only in the case of physical direct contact between the components in the contact relationship between the components, but other configurations are interposed between the components, It is used as a concept including the case where components are in contact with other components.

  FIG. 1 is a view showing a plating apparatus according to an embodiment of the present invention. FIG. 2 is a view showing an example of a state in which current is independently supplied to each anode part in the plating apparatus according to an embodiment of the present invention. FIG. 3 is a drawing showing experimental results of the plating thickness of the object to be plated in the state of FIG.

  As shown in FIGS. 1 to 3, a plating apparatus 1000 according to an embodiment of the present invention includes an anode part 100 and a shielding part 200.

  The anode part 100 is arranged in parallel with the object to be plated 10 and is supplied with current independently, and a plurality of anode parts 100 are formed. That is, as shown in FIG. 1, the anode parts 100 can be separated from each other and arranged side by side on one side of the object to be plated 10.

  In this case, the object to be plated 10 is an object to be plated using the principle of electrolysis, and the object to be plated 10 is provided as a cathode in a plating tank 20 in which a plating solution is accommodated. When an electric current is supplied to 100, the surface of the object 10 to be plated, which is a cathode, is plated.

  On the other hand, the current supplied to the anode part 100 is not only transmitted linearly to the object to be plated 10 as a cathode, but also may be transmitted to the object to be plated 10 by detouring along the plating solution. The plating thickness in the object to be plated 10 is not necessarily exactly proportional to the amount of current supplied to the anode part 100 at the position corresponding to the object to be plated 10.

  In particular, at the end of the electrode plate, the electric force lines are not perpendicular to the electrode plate, but the edge of the object 10 to which a relatively large amount of detour current can reach due to an edge effect that curves outward and extends. In some cases, non-uniform plating may be performed, for example, a thick plating portion may be formed.

  Further, considering that the plating thickness of the specific portion is thick, even if different current amounts are supplied to the anode portions 100 in advance, current exchange between the anode portions 100 having different potential differences is performed. A communication phenomenon may occur. Thereby, even if different current amounts are supplied to the respective anode portions 100 in advance, the plating thickness required for the object to be plated 10 may not be appropriately controlled.

  Therefore, in the plating apparatus 1000 according to the present embodiment, a plurality of anode parts 100 are separated from each other so that current is supplied independently, and currents supplied to the respective anode parts 100 are transmitted to each other. The shielding part 200 for shielding can be provided.

  That is, the shielding unit 200 is interposed between the plurality of anode units 100 so as to electrically shield the plurality of anode units 100 from each other, and exchanges current between the anode units 100. It is possible to prevent the communication phenomenon that occurs.

  As described above, the plating apparatus 1000 according to the present embodiment includes the divided anode portions 100 and the shielding portions 200 that electrically shield the portions between the anode portions 100. The plating thickness distribution can be effectively controlled.

  Specifically, the process of controlling the plating thickness distribution of the object to be plated 10 will be described with reference to FIGS. 2 and 3 as follows.

  As shown in FIG. 2, it is possible to supply different currents to the anode portions 100 in advance in consideration of the fact that the plating of a specific portion of the object to be plated 10 is formed thick. FIG. 2 shows a case where the ratio of the current values supplied to the respective anode parts 100 is 2: 3: 1: 3: 2.

  Here, FIG. 3 shows the case where the shielding part 200 is not interposed between the anode parts 100 (comparative example) and the case where the shielding part 200 is interposed between the anode parts 100 (example). The experimental result which compared the plating thickness of the to-be-plated body 10 in FIG.

  As shown in FIG. 3, when the shielding part 200 is interposed between each anode part 100 (Example), it can confirm that the plating thickness of the center part of the to-be-plated body 10 becomes low. .

  That is, in the case of the comparative example, the plating thickness of the central part of the object to be plated 10 is hardly affected by the current value supplied to each anode part 100, whereas in the case of the example, It can be confirmed that the plating thickness of the central portion of the object to be plated 10 changes in proportion to a certain portion according to the current value supplied to each anode portion 100.

  Thus, when the shielding part 200 is interposed between the respective anode parts 100 (Example), the sensitivity of the plating thickness to the input current becomes high, thereby improving the control ability of the plating thickness. be able to.

  In the plating apparatus 1000 according to the present embodiment, the shielding unit 200 can include a first shielding plate 210 and a second shielding plate 220, and further includes a guide plate 230 and an end shielding plate 240. be able to.

  The first shielding plate 210 divides the plurality of anode portions 100 in the horizontal direction, and the second shielding plate 220 extends in the vertical direction from the end portion of the first shielding plate 210, and extends from each anode portion 100. It can guide the discharge of the generated bubbles.

  Specifically, as shown in FIG. 1, the anode parts 100 may be partitioned from each other in the lateral direction by a first shielding plate 210. However, even if the anode parts 100 are partitioned in the lateral direction as described above, the bypass currents can be transmitted to each other.

  Accordingly, the second shielding plate 220 is extended in the vertical direction from the end portion of the first shielding plate 210, and it is possible to prevent a current that bypasses in the vertical direction from being transmitted between the anode portions 100.

  On the other hand, at the time of plating, bubbles may be generated in each anode part 100 by an electrolysis reaction, but such bubbles are not blocked by the first shielding plate 210 and the second shielding plate 220 and are smoothly discharged. There is a need.

  Accordingly, as shown in FIG. 1, a passage for guiding the discharge of bubbles may be formed between the second shielding plates 220, and a discharge hole may be formed at the uppermost end.

  As described above, in the plating apparatus 1000 according to the present embodiment, the shielding unit 200 includes the first shielding plate 210 and the second shielding plate 220, thereby effectively transmitting current between the anode units 100. In addition to being able to block, the generated bubbles can be smoothly discharged.

  The guide plate 230 projects from the first shielding plate 210 in the direction of the object to be plated 10, and guides the current between each anode part 100 and the object to be plated 10. It is possible to block a part of the current transmitted to the object to be plated 10 from deviating from the linear path.

  As described above, the shielding unit 200 in the plating apparatus 1000 according to the present embodiment further includes the guide plate 230, and the current supplied to each anode unit 100 bypasses the object to be plated 10 to an unintended portion. Can be prevented from being transmitted.

  In this case, the protruding lengths of the guide plates 230 can be variously configured as required, such as the protruding lengths of the guide plates 230 being different from each other.

  The end shielding plate 240 shields current at positions corresponding to both ends of the object to be plated 10 in the anode part 100, and the plating thicknesses at both ends of the object to be plated 10 are relative to each other as described above. Can be prevented from being formed thick.

  That is, since a relatively large amount of detour current can reach both ends of the object to be plated 10, the current that is linearly transmitted to both ends of the object to be plated 10 using the end shielding plate 240 is partially offset. By doing so, the plating on the object to be plated 10 can be made uniform as a whole.

  In the plating apparatus 1000 according to the present embodiment, each anode unit 100 can adjust the amount of current supplied. For example, when the shape of the object to be plated 10 or the plating thickness required for the object to be plated 10 is changed, each anode unit 100 can adjust the plating thickness by changing the amount of current supplied. it can.

  In this case, the amount of current supplied to each anode part 100 is not always constant according to the shape of the body 10 to be plated and the plating thickness required for the body 10 to be plated. It is possible to configure so that the amount of current supplied to each can be adjusted independently of each other.

  Thus, in the plating apparatus 1000 according to the present embodiment, each anode unit 100 can adjust the amount of current supplied, and the shape of the body to be plated 10 and the plating thickness required for the body to be plated 10. Even when the thickness is changed, it is possible to actively cope with the change without changing the structure of the plating apparatus 1000.

  In the plating apparatus 1000 according to the present embodiment, the anode part 100 and the shielding part 200 can be provided symmetrically on both sides with respect to the object to be plated 10. That is, as shown in FIG. 1, a pair of anode part 100 and shielding part 200 can be provided on both sides of the object to be plated 10.

  Thereby, at the time of plating of the to-be-plated body 10, the plating to both surfaces of the to-be-plated body 10 can be performed simultaneously. Moreover, the pair of anode part 100 and the shielding part 200 are provided symmetrically, and the plating thickness of both surfaces of the object to be plated 10 can be formed uniformly.

  The embodiments of the present invention have been described above. However, those who have ordinary knowledge in the technical field can add, change, and modify the components without departing from the spirit of the present invention described in the claims. Various modifications and changes can be made to the present invention by deletion or addition, and it can be said that these are also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 To-be-plated body 20 Plating tank 100 Anode part 200 Shielding part 210 1st shielding board 220 2nd shielding board 230 Guide board 240 End part shielding board 1000 Plating apparatus

Claims (6)

A plurality of anode parts that are arranged in parallel to the object to be plated and are supplied with current independently;
A shielding part interposed between the anode parts so as to electrically shield the anode parts from each other;
Including plating equipment. The shielding part is
A first shielding plate that divides a plurality of the anode portions in a lateral direction;
2. The plating according to claim 1, further comprising: a second shielding plate that extends in a longitudinal direction from an end portion of the first shielding plate and guides discharge of bubbles generated from the anode portions. apparatus. The shielding part is
3. The plating according to claim 2, further comprising a guide plate that protrudes from the first shielding plate toward the object to be plated and guides a current between each of the anode portion and the object to be plated. apparatus. The shielding part is
The plating apparatus according to claim 3, further comprising an end shielding plate that shields current at positions corresponding to both ends of the object to be plated in the anode portion.   5. The plating apparatus according to claim 1, wherein each of the anode portions is capable of adjusting an amount of current to be supplied.   The plating apparatus according to claim 5, wherein the anode part and the shielding part are provided symmetrically on both sides with respect to the object to be plated.

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