JP2015098640A - Plating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating device capable of further minimizing deviation of the plating thickness of an object to be plated.SOLUTION: The plating device includes: a plating bath 100 accommodating an object to be plated; and a plurality of anodes 200, which are separated and installed in a plurality of rows and columns in the plating bath and to each of which electric current is supplied independently. Each of the anodes is formed entirely or partly in a circular shape.

Description

  The present invention relates to a plating apparatus.

  In recent years, printed circuit boards have been used as core parts for mobile phones, semiconductors, information communications, etc., and related technologies have become increasingly important. In particular, the need for uniform plating on a printed circuit board is emphasized as well as the reliability improvement of semiconductor IC mobile communication components for miniaturization, high speed, high density, high performance, electromagnetic shielding and the like.

  Such uniform plating of the printed circuit board can improve the performance by thinning and uniforming the plating film of the fine circuit, and also reduces the noise of the electronic equipment by reducing the wiring profile. be able to. Further, the uniform plating thickness prevents excessive plating, and therefore can bring about an effect of reducing manufacturing costs.

  However, during plating, geometrical elements such as complex circuit configurations, electrolytic cell and electrode configurations, characteristics of solutions and additives, polarization and voltage related to the rate of electrochemical reactions, concentration distribution of reactive ions, etc. Due to various factors acting in a complex manner, it is difficult to obtain a uniform current distribution, which makes it difficult to effectively improve the plating thickness deviation.

Korean Published Patent No. 10-1998-081740 (1998. 11.25. Published)

  An object of the present invention is to provide a plating apparatus capable of further minimizing the deviation of the plating thickness of the object to be plated.

  According to one aspect of the present invention, a plating tank that accommodates an object to be plated, and a plurality of anode portions that are provided in the plating tank and are divided into a plurality of horizontal and vertical portions and supplied with current independently. In addition, a plating apparatus is provided in which each anode part is formed in a circular shape in whole or in part.

  Here, among the plurality of anode parts, the anode part arranged at the outer part can be formed in a fan shape with a central angle of 180 °, and among the plurality of anode parts, the anode part arranged at the corner part is It can be formed in a fan shape with a central angle of 90 °.

  Each anode part can adjust the amount of current supplied.

  Each anode part can adjust at least one of the distance to the object to be plated and the angle to the object to be plated independently of each other.

  The anode part can be arranged symmetrically on both sides with respect to the object to be plated.

  According to the embodiment of the present invention, it is possible to provide a plating apparatus that can minimize the deviation of the plating thickness of the object to be plated.

1 is a view showing a plating apparatus according to an embodiment of the present invention. It is drawing which shows the experimental result of the plating thickness of the to-be-plated body by the plating apparatus of FIG. 4 is a view showing a plating apparatus according to another embodiment of the present invention. It is drawing which shows the experimental result of the plating thickness of the to-be-plated body by the plating apparatus of FIG.

  In the following, embodiments of the plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be denoted by the same reference numerals in the description with reference to the accompanying drawings. A duplicate description is omitted.

  In addition, terms such as “first”, “second” and the like used in the following are merely identification symbols for distinguishing the same or corresponding components, and the same or corresponding components are those “ It is not limited by terms such as “first” and “second”.

  In addition, the term “coupled” does not mean only in the case of physical direct contact between the components in the contact relationship between the components, but other configurations are interposed between the components, It is used as a concept including the case where components are in contact with other components.

  FIG. 1 is a view showing a plating apparatus according to an embodiment of the present invention. FIG. 2 is a drawing showing experimental results of the plating thickness of the object to be plated by the plating apparatus of FIG.

  As shown in FIGS. 1 and 2, a plating apparatus 1000 according to an embodiment of the present invention includes a plating tank 100 and an anode unit 200.

  The plating tank 100 is a container that accommodates the object 10 to be plated, and can accommodate a plating solution for plating the object 10 to be plated. Here, the object to be plated 10 is an object to be plated using the principle of electrolysis, and the object to be plated 10 is installed as a cathode in a plating tank 100 in which a plating solution is accommodated, which will be described later. When a current is supplied to the anode part 200, the surface of the object to be plated 10 serving as the cathode is plated.

  The anode part 200 is divided into a plurality of horizontal and vertical parts in the plating tank 100 and is supplied with a current independently, and a plurality of anode parts are formed. That is, as shown in FIG. 1, the anode parts 200 can be separated from each other and arranged side by side in a plurality of horizontal and vertical directions on one side of the object to be plated 10.

  When plating the object to be plated 10, the current supplied to the anode unit 200 is not only transmitted linearly to the object to be plated 10 which is a cathode, but also bypassed along the plating solution and transmitted to the object to be plated 10. As a result, the plating thickness of the object to be plated 10 may not be exactly proportional to the amount of current supplied to the anode part 200 at the position corresponding to the object to be plated 10.

  In particular, at the edge of the electrode plate, the electric field lines are not perpendicular to the electrode plate, but the edge of the object 10 to which a relatively large amount of detour current reaches due to an edge effect that curves and extends outward. In some cases, non-uniform plating may be performed, for example, a thick plating portion may be formed.

  Therefore, in the plating apparatus 1000 according to the present embodiment, a plurality of anode parts 200 are separated from each other and are independently supplied with current, and each anode part 200 is formed in a circular shape in whole or in part. Can be configured.

  That is, the electric field of the entire anode part 200 is dispersed, and the end of each anode part 200 is subjected to curve processing, so that the edge effect described above is relatively relative to the entire object to be plated 10 in each dispersed electric field. Since it can be generated over the area, current concentration at the end of the object to be plated 10 can be prevented.

  Thereby, the plating apparatus 1000 according to the present embodiment further minimizes the deviation of the plating thickness of the object 10 to be plated, in particular, the deviation of the plating thickness between the end and the center of the object 10 to be plated. Can do.

  Specifically, the deviation of the plating thickness of the object to be plated 10 will be described with reference to FIG.

  2 shows a case in which each of the divided anode parts 200 is formed in a square shape (Comparative Example 1) and a case in which the anode part 200 is formed like the plating apparatus in FIG. 1 (Example 1). The experimental result which compared plating thickness is shown.

  As shown in FIG. 2, when the anode part 200 is formed as in the plating apparatus of FIG. 1 (Example 1), the plating thickness deviation between the end part and the center part of the object to be plated 10 is more I understand that it is small.

  As described above, when the anode part 200 is formed as in the plating apparatus of FIG. 1 (Example 1), current concentration at the end of the object to be plated 10 is relatively reduced. The plating thickness deviation can be further minimized.

  In the plating apparatus 1000 according to the present embodiment, each anode unit 200 can adjust the amount of current supplied. For example, when the shape of the object to be plated 10 or the plating thickness required for the object to be plated 10 is changed, each anode part 200 can adjust the plating thickness by changing the amount of current supplied. it can.

  In this case, since the amount of current supplied to each anode part 200 is not always constant according to the shape of the object to be plated 10 and the plating thickness required for the object to be plated 10, each anode part 200 It is possible to configure so that the amount of current supplied to each can be adjusted independently of each other.

  Thus, in the plating apparatus 1000 according to the present embodiment, each anode unit 200 can adjust the amount of current supplied, and the shape of the body to be plated 10 and the plating thickness required for the body to be plated 10. Can be dealt with more actively without changing the structure of the plating apparatus 1000.

  In the plating apparatus 1000 according to the present embodiment, each anode unit 200 can adjust at least one of the distance to the object to be plated 10 and the angle with respect to the object to be plated 10 independently of each other.

  For example, considering that the plating thickness of the end portion of the object to be plated 10 is formed relatively thick, the anode part 200 provided at a position corresponding to the end portion of the object to be plated 10 is the object to be plated. The plating thickness with respect to the end portion of the object to be plated 10 can be adjusted by a method such as being farther away from 10 or reducing the angle of contact with the object to be plated 10.

  As a result, the plating apparatus 1000 according to the present embodiment has not only the amount of current supplied to each anode part 200 but also the distance between each anode part 200 and the object to be plated 10 and each anode part 200. By appropriately combining the angles with the object to be plated 10, it is possible to cope with changes in various plating conditions.

  In the plating apparatus 1000 according to the present embodiment, the anode part 200 can be arranged symmetrically on both sides with respect to the object to be plated 10. That is, as shown in FIG. 1, a pair of anode parts 200 can be installed on both sides of the object to be plated 10.

  Thereby, when plating the to-be-plated body 10, it can plate on both sides of the to-be-plated body 10 simultaneously. Further, the pair of anode parts 200 can be provided symmetrically so that the plating thicknesses on both surfaces of the object to be plated 10 can be formed uniformly.

  FIG. 3 is a view showing a plating apparatus according to another embodiment of the present invention. FIG. 4 is a drawing showing experimental results of the plating thickness of the object to be plated by the plating apparatus of FIG.

  As shown in FIGS. 3 and 4, in the plating apparatus 2000 according to another embodiment of the present invention, among the plurality of anode parts 200, the anode part 200 disposed in the outer part has a fan shape with a central angle of 180 °. Among the plurality of anode parts 2000, the anode part 200 disposed at the corner part can be formed in a fan shape with a central angle of 90 °.

  That is, each anode part 200 is not formed in the same circular shape, but the shape of the anode part 200 disposed at a position corresponding to the end of the object to be plated 10 and the position corresponding to the corner part of the object to be plated 10. The shapes of the anode portions 200 arranged in the above may be different from each other.

  Thereby, since the plating apparatus 2000 according to the present embodiment can further reduce the edge effect at the end and corner of the object to be plated 10, the plating between the end and the center of the object to be plated 10 is performed. The thickness deviation can be reduced more effectively.

  Specifically, the deviation of the plating thickness of the object to be plated 10 will be described with reference to FIG.

  4 shows the case where the divided anode parts 200 are formed in a square shape (Comparative Example 2) and the case where the anode part 200 is formed as in the plating apparatus of FIG. 3 (Example 2). The experimental result which compared plating thickness is shown.

  As shown in FIG. 4, when the anode part 200 is formed as in the plating apparatus of FIG. 3 (Example 2), the plating thickness deviation between the end part and the center part of the object to be plated 10 is remarkable. I can see it gets smaller.

  Further, when the anode part 200 is formed as in the plating apparatus of FIG. 3 (Example 2), the plating thickness of the central part of the object to be plated 10 is increased as compared with the comparative example 2, so that the object to be plated is increased. It is also possible to control the plating thickness so as to be different from one another for each of the ten specific parts.

  As described above, when the anode part 200 is formed as in the plating apparatus of FIG. 3 (Example 2), current concentration at the end of the object to be plated 10 is significantly reduced. The plating thickness deviation can be reduced more effectively.

  On the other hand, the plating apparatus 2000 according to another embodiment of the present invention is the same as or similar to the configuration of the plating apparatus 1000 according to one embodiment of the present invention other than the above-described configuration, and thus detailed description of the overlapping configuration is provided. Is omitted.

  The embodiments of the present invention have been described above. However, those who have ordinary knowledge in the technical field can add or change components without departing from the spirit of the present invention described in the claims. The present invention can be variously modified and changed by deleting or adding, and it is also included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 To-be-plated body 100 Plating tank 200 Anode part 1000, 2000 Plating apparatus

Claims (5)

A plating tank for receiving the object to be plated;
A plurality of anode parts provided in the plating tank in a plurality of horizontal and vertical directions, each supplied with current independently,
Each of the anode portions is formed in a circular shape in whole or in part. Among the plurality of anode parts, the anode part arranged in the outer part is formed in a fan shape with a central angle of 180 °,
2. The plating apparatus according to claim 1, wherein among the plurality of anode portions, the anode portion disposed at a corner portion is formed in a fan shape having a central angle of 90 °.   The plating apparatus according to claim 1, wherein each of the anode portions is capable of adjusting an amount of current supplied.   4. Each of the anode parts can adjust at least one of a distance from the object to be plated and an angle with respect to the object to be plated independently of each other. The plating apparatus as described in the item.   5. The plating apparatus according to claim 1, wherein the anode part is disposed symmetrically on both sides with respect to the object to be plated. 6.

Images