JP2015103660A - 軟磁性フィルム - Google Patents
軟磁性フィルム Download PDFInfo
- Publication number
- JP2015103660A JP2015103660A JP2013243068A JP2013243068A JP2015103660A JP 2015103660 A JP2015103660 A JP 2015103660A JP 2013243068 A JP2013243068 A JP 2013243068A JP 2013243068 A JP2013243068 A JP 2013243068A JP 2015103660 A JP2015103660 A JP 2015103660A
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- JP
- Japan
- Prior art keywords
- soft magnetic
- resin
- magnetic film
- mass
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
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Abstract
【解決手段】軟磁性フィルムは、扁平状の軟磁性粒子を含有する軟磁性フィルムであって、昇温速度10℃/分、周波数1Hzの動的粘弾性測定における200℃での引張貯蔵弾性率E´200と、23℃での引張貯蔵弾性率E´23との比率E´200/E´23が0.25以上である。
【選択図】なし
Description
軟磁性樹脂組成物に対し軟磁性粒子が50体積%となるように、軟磁性粒子500質量部、アクリル酸エステル系ポリマー59質量部、ビスフェノールA型エポキシ樹脂(「エピコート1004」)8質量部、ビスフェノールA型エポキシ樹脂(「エピコートYL980」)4質量部、フェノールアラルキル樹脂5質量部、2−フェニル−4,5−ジヒドロキシメチルイミダゾール(「2PHZ−PW」熱硬化触媒)0.81質量部(樹脂成分100質量部に対して1.0質量部)、および、ポリエーテルリン酸エステル(分散剤)2.5質量部(軟磁性粒子100質量部に対して0.5質量部)を混合することにより、軟磁性樹脂組成物を得た。
表1に記載の材料および配合割合で、軟磁性樹脂組成物を得た。この軟磁性樹脂組成物を用いた以外は、実施例1と同様にして、実施例2および3の硬化状態の軟磁性フィルムを製造した。
(軟磁性フィルム)
軟磁性樹脂組成物に対し軟磁性粒子が40体積%となるように、軟磁性粒子500質量部およびエチレン酢酸ビニル共重合体106質量部を混合することにより、軟磁性樹脂組成物を得た。
表1に記載の材料および配合割合で、軟磁性樹脂組成物を得た。この軟磁性樹脂組成物を用いた以外は、実施例1と同様にして、比較例2の軟磁性フィルムを製造した。
各実施例および各比較例の軟磁性フィルムについて、下記の条件に基づいて、動的粘弾性測定を実施し、23℃における引張貯蔵弾性率E´23と200℃における引張貯蔵弾性率E´200とをそれぞれ求めた。
モード:引張モード
昇温速度:10℃/分
周波数:1Hz
サンプル厚み:90μm
チャック間距離:20mm
ひずみ:0.1%
測定温度範囲:0℃〜210℃
これらの結果および比率(E´200/E´23)を表1に示す。
各実施例および各比較例の軟磁性熱フィルムの比透磁率を、インピーダンスアナライザー(Agilent社製、「4294A」)を用いて、1ターン法(周波数1MHz)によって測定した。結果を表1に示す。
各実施例および各比較例の軟磁性フィルムを回路基板に積層し、この軟磁性フィルム積層回路基板をIRリフロー炉内部を260℃10秒間の条件にて通過させることにより、リフロー工程を実施した。
・Fe−Si−Al合金:商品名「SP−7」、軟磁性粒子、扁平状、平均粒子径65μm、メイト社製
・アクリル酸エステル系ポリマー:商品名「パラクロンW−197CM」、アクリル酸エチル−メタクリル酸メチルを主成分とするアクリル酸エステル系ポリマー、根上工業社製
・ビスフェノールA型エポキシ樹脂:商品名「エピコート1004」、エポキシ当量875〜975g/eq、JER社製
・ビスフェノールA型エポキシ樹脂:商品名「エピコートYL980」、エポキシ当量180〜190g/eq、JER社製
・4官能アミノグリシジル型エポキシ樹脂:商品名「テトラッド−C」、エポキシ当量105g/eq、、三菱瓦斯化学工業社製
・フェノールアラルキル樹脂:商品名「ミレックスXLC−4L」、水酸基当量170g/eq、三井化学社製
・2−フェニル−4,5−ジヒドロキシメチルイミダゾール:熱硬化触媒、商品名「キュアゾール2PHZ−PW」、四国化成社製
・ポリエーテルリン酸エステル:分散剤、商品名「HIPLAAD ED152」、楠本化成社製、酸価20
・エチレン酢酸ビニル共重合体:商品名「EV170」、三井デュポンポリケミカル社製
Claims (6)
- 扁平状の軟磁性粒子を含有する軟磁性フィルムであって、
昇温速度10℃/分、周波数1Hzの動的粘弾性測定における200℃での引張貯蔵弾性率E´200と、23℃での引張貯蔵弾性率E´23との比率E´200/E´23が0.25以上であることを特徴とする、軟磁性フィルム。 - 200℃における引張貯蔵弾性率E´200が、8.0×108Pa以上であることを特徴とする、請求項1に記載の軟磁性フィルム。
- エポキシ樹脂、フェノール樹脂およびアクリル樹脂を含有する軟磁性樹脂組成物から形成されることを特徴とする、請求項1または2に記載の軟磁性フィルム。
- 前記軟磁性樹脂組成物において、前記軟磁性粒子を除く軟磁性粒子除外成分100質量部に対して、前記エポキシ樹脂および前記フェノール樹脂の合計含有量が20質量部以上99質量部以下であることを特徴とする、請求項3に記載の軟磁性フィルム。
- 前記軟磁性樹脂組成物における軟磁性粒子の含有割合が、30体積%以上70体積%であることを特徴とする、請求項3または4に記載の軟磁性フィルム。
- 硬化状態であることを特徴とする、請求項1〜5のいずれか一項に記載の軟磁性フィルム。
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