JP2015093398A - Resin molding die and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin molding die that can improve the effectiveness of a vacuum attainment degree inside a cavity.SOLUTION: A resin molding die 10 comprises: a pair of dies where clamping of a workpiece and formation of a cavity 16 are carried out by closing an upper die 11 and a lower die 12 and a resin R filled into the cavity 16 is heated and cured; a chamber 70 that encloses the pair of dies; a cavity inner pressure control part 81 that has a function of discharging air in the cavity 16 and communicates with the cavity 16 to control the inner pressure of the cavity 16; and a chamber inner pressure control part 74 that has a function of discharging air in the chamber 70 and controls the inner pressure of the chamber 70.

Description

  The present invention relates to a technique effectively applied to a resin mold and a resin mold forming method using the same.

  Japanese Patent Application Laid-Open No. 2002-176067 (Patent Document 1) discloses a resin mold having a compressed air mechanism for sending compressed air into a cavity and an air suction mechanism (air vent part) for discharging residual air. Techniques related to molds are described.

  Japanese Patent Application Laid-Open No. 2010-36515 (Patent Document 2) describes a technique related to a resin mold having an air vent groove for discharging air in a cavity to the outside by evacuation.

  Japanese Patent Application Laid-Open No. 2005-53143 (Patent Document 3) discloses a technique relating to a resin mold for resin molding of a molded product after evacuating a resin mold region (region corresponding to a cavity) without providing an air vent. Is described.

JP 2002-176067 A JP 2010-36515 A JP 2005-53143 A

  In the resin mold dies described in Patent Documents 1 and 2, air (including gas that volatilizes from the molten resin) in the cavity is exhausted (exhaust) even after the workpiece (molded product) is clamped. The inside of the cavity can be depressurized. When the degree of vacuum reduction in the cavity is low (the degree of vacuum is high), for example, between the main surface of the flip-chip mounted electronic component (connection bump forming surface) and the mounting surface of the mounted substrate Even in such a narrow place, the resin can be filled easily.

  However, such resin mold dies are, for example, from a plurality of mold blocks (insert blocks) in order to facilitate replacement of molds used for various molded products or to improve maintainability. It is configured. For this reason, it is difficult to completely seal between the mold blocks, and a leak (air leakage) occurs from the gap, and there is a possibility that the pressure in the cavity cannot be sufficiently reduced.

  There is also a resin mold having a movable part such as an air vent pin, an ejector pin, or a shut-off pin. Even in such a resin mold, there is a risk of leaking from a gap for moving the movable part.

  Further, in the resin mold as described in Patent Document 3, the air in the cavity (particularly, gas that volatilizes from the molten resin) cannot be discharged after clamping the workpiece, and the desired cavity There is a possibility that the degree of achievement of reduced pressure cannot be obtained.

  The objective of this invention is providing the resin mold metal mold | die which can improve the effectiveness of the pressure reduction achievement in a cavity. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  The resin mold mold according to one embodiment of the present invention is a pair in which a workpiece is clamped and a cavity is formed by closing one and the other, and the resin filled in the cavity is heated and cured. The mold, a chamber containing the pair of molds, a function of discharging the air in the cavity, and a cavity internal pressure adjusting unit that communicates with the cavity and adjusts the internal pressure of the cavity; A chamber internal pressure adjusting unit which has a function of discharging air in the chamber and adjusts the internal pressure of the chamber.

  According to this, the leakage inside the cavity is reduced by minimizing the leak while the space outside the pair of molds is reduced by the chamber internal pressure adjusting unit, and further by reducing the inside of the cavity by the cavity internal pressure adjusting unit. As a result, a synergistic effect can be obtained, and the effectiveness of the degree of pressure reduction in the cavity can be increased as compared with the case where it is performed separately.

  In the resin mold according to the embodiment, it is more preferable to include a cavity seal portion that is provided between the one mold and the other mold and seals the inside of the cavity when the mold is closed. By the cavity seal portion, airtightness can be achieved in the vicinity (periphery) of the cavity, and the effectiveness of the degree of pressure reduction in the cavity can be further enhanced.

  Further, in the resin mold according to the one embodiment, the chamber includes a pair of bases having one and the other opposed to each other and having a space portion, and a base seal portion that hermetically seals the space surrounded by the pair of bases. The pair of bases has the one mold assembled to the one base, the other mold assembled to the other base, and the base seal portion has an opening edge of the one base More preferably, the chamber is provided between the opening portion and the opening edge of the other base, and the inside of the chamber is hermetically closed when the mold is closed. Thus, by using a pair of bases to which a pair of molds are assembled as a chamber as it is, there is no need to newly provide a chamber, and the configuration of the resin mold can be simplified.

  In the resin mold according to the embodiment, it is more preferable to include a film stretched on the parting surface of the one or the other mold. Even if a gap such as between mold blocks appears on the parting surface of one or the other mold, the gap is covered with a film, so that it is possible to prevent the occurrence of leakage when decompressing the inside of the cavity. it can.

  Further, in the resin mold according to the embodiment, an air vent communicating with the cavity is formed in the pair of molds, and the cavity internal pressure adjusting unit communicates with the cavity via the air vent. It is more preferable to provide a shut-off pin that can move forward and backward in the middle of the air vent. According to this, the air vent can be deepened to facilitate the discharge of air, and the effectiveness of the degree of pressure reduction in the cavity can be further increased (highly efficient deaeration in the cavity can be performed).

  In the resin mold according to the embodiment, it is more preferable that the cavity internal pressure adjusting unit has a function of feeding compressed air into the cavity. According to this, the effectiveness of the degree of pressure reduction in the cavity can be increased in a short time by discharging the air to the cavity in which the compressed air is fed and the pressure is increased.

  In the resin mold according to the one embodiment, it is more preferable to include another chamber that encloses the chamber. According to this, the effectiveness of the degree of pressure reduction in the cavity can be further enhanced.

  Further, in the resin mold forming method using the resin mold in the embodiment, the cavity internal pressure adjusting unit and the cavity are provided in a state where the work is clamped by supplying resin to pots provided in the pair of molds. The resin is pumped from the pot to the cavity through a runner gate communicating with the cull provided in the pair of molds while the chamber internal pressure adjusting unit is operated to reduce the inside of the cavity, and the cavity is filled. It is preferable to heat and cure the resin.

  Alternatively, in the resin mold forming method using the resin mold in the embodiment, after the resin is supplied to the cavity, the cavity internal pressure adjusting unit and the chamber internal pressure adjusting unit are operated with the workpiece clamped. It is preferable to heat and cure the resin filled in the cavity while reducing the pressure in the cavity.

  According to the resin mold molding method using these resin mold dies, by increasing the effectiveness of the degree of pressure reduction in the cavity, the resin filling property is improved, and voids are generated in the molded product (becomes a defective product). ) Can be prevented.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  According to the resin mold in one embodiment of the present invention, the effectiveness of the degree of pressure reduction in the cavity can be enhanced.

It is sectional drawing of the resin mold metal mold | die in Embodiment 1 of this invention. It is a figure for demonstrating the effect of the resin mold metal mold | die shown in FIG. It is sectional drawing of the resin mold metal mold | die in Embodiment 2 of this invention. It is sectional drawing of the resin mold metal mold | die in Embodiment 3 of this invention. It is sectional drawing of the resin mold metal mold | die in Embodiment 4 of this invention. It is sectional drawing of the resin mold metal mold | die in Embodiment 5 of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted.

  In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
First, a resin mold 10 and a resin mold apparatus 100 including the resin mold 10 used in the resin mold forming method according to the present embodiment will be described with reference to FIG. FIG. 1 is a cross-sectional view of a resin mold 10 that is a main part of the resin mold apparatus 100. The resin mold 10 has a bilaterally symmetric configuration around the one-dot chain line in FIG. 1, and FIG. 1 shows the left configuration.

  In the case of mass production, the resin mold apparatus 100 includes at least one press section (resin mold mold mechanism) including a resin mold mold 10 between a supply section (not shown) and a storage section. Is done. In the supply unit, preparation and processing for supplying the workpiece W (here, a molded product) and the resin R (for example, tablet, granule, or liquid mold resin) to the press unit are performed. In the storage unit, preparation and processing for storing the workpiece W (in this case, a molded product) molded by resin molding are performed. A loader (not shown) for carrying in the press part and an unloader (not shown) for carrying out from the press part are used for transporting the workpiece W and the resin R between the supply part, the press part and the storage part. These are constituted by a known mechanism.

  The workpiece W is obtained by mounting a chip component 102 (for example, a semiconductor chip such as a CPU) on a substrate 101 (for example, a wiring substrate). The chip component 102 is flip-chip mounted on the substrate 101 via bumps 103 arranged in a matrix. For this reason, a narrow portion (a gap between the bump height or a narrow pitch bump) is formed between the substrate 101 and the chip component 102. As will be described later, according to the resin mold 10 of the present embodiment, an underfill (mold underfill) between the substrate 101 and the chip component 102 can be performed.

  The resin mold 10 includes an upper mold 11 (one mold) and a lower mold 12 (the other mold) that constitute a pair of molds that can be opened and closed (clamped), A plate-like intermediate mold 20 (intermediate mold) sandwiched between the lower mold 12 is provided. In the resin mold 10 in the present embodiment, the work W is clamped and hermetically closed (closed) in the mold by closing the mold with the upper mold 11 and the lower mold 12 with the intermediate mold 20 interposed therebetween. 16 is formed, and the resin filled in the cavity 16 is heated and cured at a predetermined molding temperature (mold temperature).

  Further, the resin mold 10 includes a chamber 70 that is closed so as to enclose the upper mold 11 and the lower mold 12 in accordance with mold closing. The chamber 70 will be described as being configured to be airtight (can be closed).

  Further, the resin mold 10 includes a cavity seal portion 80 provided between the upper mold 11 and the lower mold 12 and around the intermediate mold 20. For example, the cavity seal portion 80 made of an O-ring is crushed by the outer peripheral portion of the lower surface (parting surface) of the upper die 11 and the outer peripheral portion of the upper surface (parting surface) of the lower die 12 when the die is closed. As a result, the space between the upper mold 11 and the lower mold 12 including the inside of the cavity 16 is hermetically sealed. In order to depressurize the airtight cavity 16, the resin mold 10 is provided outside the chamber 70 in communication with the cavity 16 and has a function of discharging the air in the cavity 16 (for example, a vacuum pump). In addition, a cavity internal pressure adjusting unit 81 that adjusts the internal pressure of the cavity 16 is provided. In order to increase the pressure reduction efficiency in the cavity 16, the communication path to the cavity internal pressure adjusting unit 81 outside the chamber 70 is preferably thick and short.

  In this embodiment, the chamber 70 is provided with a pair of bases having a recessed space portion where one (upper mold base 71) and the other (lower mold base 72) face each other. The upper mold base 71 and the lower mold base 72 are recessed so that the outer shape is concave, and have a space. The upper mold 11 is assembled in the recess of the upper mold base 71, and the lower mold base 72. The lower mold 12 is assembled in the recess. Further, a support block or the like for this assembly is provided between the upper mold base 71 and the upper mold 11 or between the lower mold base 72 and the lower mold 12.

  The chamber 70 includes a base seal portion 73 provided between the upper mold base 71 and the lower mold base 72 and provided at the opening edge (outer peripheral portion). For example, the base seal portion 73 made of an O-ring is crushed by the opening edge portion of the upper die base 71 and the opening edge portion of the lower die base 72 when the die is closed. A space formed between the base 72 (this may be referred to as a chamber) is hermetically sealed. Thus, by using the pair of bases (the upper mold base 71 and the lower mold base 72) as they are as the chamber 70, it is not necessary to provide a new chamber, and the configuration of the resin mold 10 can be simplified. .

  In order to reduce the pressure in the hermetically sealed chamber 70, the resin mold 10 is provided outside the chamber 70 and has a function of discharging the air in the chamber 70 (for example, a vacuum pump). A chamber internal pressure adjusting unit 74 for adjusting is provided. The chamber internal pressure adjusting unit 74 is communicated with the inside of the chamber 70 through an air passage 75 formed in the upper mold base 71. In order to increase the pressure reduction efficiency in the chamber 70, the communication path to the chamber internal pressure adjusting unit 74 outside the chamber 70 is preferably thick and short.

  Such a resin mold mold 10 makes the space including the cavity 16 formed in the pair of molds (the upper mold 11 and the lower mold 12) airtight, and further, the pair of bases (the upper mold base 71 and the lower mold base). 72), a space (a space in which a pair of molds are enclosed) is hermetically sealed to form a double seal. In addition, the resin mold 10 forms a double vacuum by depressurizing each space to be a double seal. Below, the structure of the more specific resin mold metal mold | die 10 is demonstrated, and the effect by a double seal and a double vacuum is demonstrated.

  In the resin mold 10, when the upper mold 11 is a fixed mold and the lower mold 12 is a movable mold (driving mold), the upper mold base 71 (upper mold 11) is a fixed platen and lower mold base 72 (lower mold) (not shown). The mold 12) is fixedly assembled to a movable platen (not shown). In this case, the resin mold 10 is opened and closed by a known mechanism for moving the movable platen up and down via a drive transmission mechanism (a link mechanism such as a toggle link or a screw shaft) driven by a drive source (electric motor) (not shown). Is done.

  In a state where the intermediate mold 20 is clamped by the upper mold 11 and the lower mold 12 by closing the mold, the resin mold mold 10 includes a pot 13, a cull 14, a runner gate 15, a cavity 16, a through gate 17, a dummy cavity. 18 and a communication passage communicating (connected) in the order of the air vent 19 is formed. The resin R is pumped from the pot 13 through this communication path, and the resin R filled in the cavity 16 is heated and cured.

  Since the air vent 19 that communicates with the cavity 16 in terms of air discharge is provided, the dummy cavity 18 may not be provided. However, by providing the dummy cavity 18, the resin R can be pumped together with the air from the cavity 16 to the dummy cavity 18, thereby further preventing the air of the resin R filled in the cavity 16 from remaining.

  Specifically, the upper die 11 includes an upper die chase block 30, an upper die clamper block 31, an upper die cavity block 32, and springs 33 and 34.

  The upper die chase block 30 is formed with a concave portion 30a that is recessed from the surface on the lower die 12 side in the central portion. The upper mold clamper block 31 is assembled to the inner bottom surface of the recess 30a via a spring 33 (supported by being suspended) so as to be movable up and down.

  The upper die clamper block 31 is formed with a through hole 31a penetrating in the thickness direction. In the through hole 31a, an upper mold cavity block 32 is assembled via a spring 34 on its upper surface so as to be vertically movable (supported by being suspended). The upper mold cavity block 32 is movable relative to the upper mold clamper block 31 by the spring 34.

  Further, on the lower surface of the upper mold clamper block 31, a concave portion constituting the cull 14 and a concave portion constituting the dummy cavity 18 are formed. The wall surfaces (side surfaces) of these recesses are tapered so that the diameter of the workpiece W (molded product) is reduced from the opening toward the bottom.

  A release film 35 is stretched on the parting surface of the upper mold 11 including the lower surface of the upper mold clamper block 31 and the lower surface of the upper mold cavity block 32. Specifically, for example, the long release film 35 is provided so as to be drawn out from a feeding roll wound up in a roll shape, passed through the parting surface of the upper mold 11 and wound up onto a winding roll. It is done. The release film 35 is sucked and held on the parting surface of the upper mold 11 by a known suction mechanism using a gap between the upper mold clamper block 31 and the upper mold cavity block 32 or a suction path (not shown). Yes.

  Although the release film 35 may be omitted, the molded product (work W) can be easily taken out from the upper mold 11 via the release film 35. Further, since the gap between the upper mold clamper block 31 and the upper mold cavity block 32 is covered with the release film 35, it is possible to prevent the occurrence of leakage when the inside of the cavity 16 is decompressed. In addition, when the upper mold cavity block 32 can be moved up and down, the release film 35 is used to more reliably prevent resin leakage from the gap between the upper mold clamper block 31 and the upper mold cavity block 32. it can. Further, it is possible to protect the upper surface of the chip component 102 (the surface in contact with the release film 35) and to prevent flash flash.

  The release film 35 has heat resistance capable of withstanding the heating temperature of the resin mold 10 and is easily peeled off from the parting surface of the upper mold 11 and is a film material having flexibility and extensibility. is there. As the release film 35, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinyl chloride and the like are preferably used.

  Specifically, the lower die 12 includes a lower die chase block 40, a lower die clamper block 41, a work support block 42, plate thickness adjusting mechanisms (plate thickness adjusting blocks 43a and 43b), and a spring 44. It is prepared for.

  The lower die chase block 40 is formed with a concave portion 40a that is recessed from the surface on the upper die 12 side in this central portion and a through hole 40b that penetrates in the thickness direction in the concave portion 40a. On the inner bottom surface of the recess 40a, a lower mold clamper block 41 is fixed and assembled on the lower surface.

  The lower mold clamper block 41 is formed with through holes 41a and 41b penetrating in the thickness direction. The through hole 41b of the lower mold clamper block 41 communicates in series with the through hole 40b of the lower mold chase block 40, and a cylindrical shape to which resin R is supplied into the communicating through hole 40b and the through hole 41b. The pot 13 is fixed and assembled. A plunger 45 that can be moved up and down by a known transfer driving mechanism (not shown) is provided in the pot 13. Note that a plunger seal portion 46 (for example, an O-ring) for preventing resin leakage is provided between the pot 13 and the lower mold base 72 and around the plunger 45.

  One end of a spring 44 is fixedly assembled to the lower mold chase block 40 (the inner bottom surface of the recess 40a) exposed at the bottom of the through hole 41a of the lower mold clamper block 41. On the other end of the spring 44, a work support block 42 is fixed and assembled on the lower surface side. For this reason, the work support block 42 is floatingly supported so that it can move up and down within the through hole 41a of the lower clamper block 41. The upper surface of the workpiece support block 42 constitutes a mounting surface for the workpiece W.

  The spring 44 is set to have a smaller elastic force than the spring 34 provided in the upper mold 11. Specifically, the force applied by the spring 34 to the workpiece W and the workpiece support block 42 is larger than the force urged by the spring 44. As a result, even when the lower mold 12 is raised when the mold is closed, the spring 44 can be bent without bending the spring 34, and the height of the workpiece W (substrate 101) can be uniform regardless of the plate thickness. The workpiece W can be clamped. That is, the lower surface of the upper cavity block 32 can continue to apply a clamping force via the release film 35 to the upper surface of the chip component 102 (the surface opposite to the bump 103 formation surface).

  Between the work support block 42 supported by the spring 44 and the lower chase block 40, plate thickness adjusting blocks 43a and 43b whose interfaces are formed with tapered surfaces (inclined surfaces) are provided to overlap each other. . Specifically, the plate thickness adjusting blocks 43a and 43b are configured in a wedge so that the overall thickness is uniform in the cross-sectional depth direction by combining blocks having different thicknesses in the cross-sectional depth direction (perpendicular to the paper surface). ing. A plate thickness adjusting mechanism is provided so that one of the plate thickness adjusting blocks 43a and 43b superimposed on the upper and lower stages can be slid by a driving source such as an air cylinder or a motor.

  As a result, even if a force for pushing down the work support block 42 by the upper die cavity block 32 (spring 34) is applied by raising the lower die 12, the wedge structure of the plate thickness adjusting mechanism (plate thickness adjusting blocks 43a and 43b) is used. It can be supported and fixed at a predetermined height. That is, the upper mold cavity block 32 prevents the work support block 42 from being pushed down excessively. The plate thickness adjusting mechanism is not necessarily an essential mechanism for the present application.

  The intermediate mold 20 sandwiched between the upper mold 11 and the lower mold 12 is made of the same material as the upper mold 11 and the lower mold 12 (for example, various types such as stainless steel (steel material), titanium, nickel, copper, etc. It is preferable to use a metal material such as an alloy from the viewpoint of preventing a mismatch of thermal expansion coefficients. The intermediate mold 20 is formed so as to penetrate in the thickness direction, and includes a through hole (cull hole) constituting the cull 14, a through hole (cavity hole) constituting the cavity 16, and a through hole constituting the dummy cavity 18. And a hole (dummy cavity hole). In addition, the intermediate mold 20 includes a groove (runner gate groove) forming the runner gate 15 and a groove (through gate groove) forming the through gate 17 formed at a certain depth from the surface on the upper mold 11 side. And a groove (air vent groove) constituting the air vent 19.

  In order to open and close the air vent 19, the resin mold 10 includes a resin stopping mechanism portion that includes a shut-off pin 50. The shut-off pin 50 is provided in the upper molder block 31 so as to be able to move forward and backward (up and down) in the middle portion of the air vent 19. The shut-off pin 50 is provided, for example, in a state where the other end is urged in a direction in which one end is separated from the air vent 19 by a coil spring (not shown) of a resilient material provided in the upper chase block 30. ing. The shut-off pin 50 is configured to be able to control an advance / retreat operation to the air vent 19 by a movable pin actuator via a relay pin (not shown).

  The resin stopper mechanism having such a configuration moves the shut-off pin 50 downward, causes the shut-off pin 50 to enter the air vent 19, closes the air vent 19, and the resin that has been pressure-fed through the communication path. R can be dammed up. Further, the resin stopping mechanism moves the shut-off pin 50 upward (separated by the urging force of the coil spring) and retracts the shut-off pin 50 out of the air vent 19 to open the air vent 19.

  In the communication passage formed by the resin mold 10, air in the cavity 16 is discharged in particular by the cavity internal pressure adjusting portion 81 communicated on the downstream side opposite to the pot 13 side (upstream side). The space between the upper mold 11 and the lower mold 12 is hermetically sealed by the cavity seal portion 80, and the air path 82 and the lower mold base 72 formed in the lower mold 11 are connected from the air vent 19 to the cavity internal pressure adjusting portion 81. It communicates via the formed air path 83. At this time, a seal portion 84 made of, for example, an O-ring is provided between the lower die chase block 40 and the lower die clamper block 41 forming the air passage 82, and airtightness in the middle of the air passage 82 is ensured. Has been. Further, between the lower mold base 72 and the lower mold chase block 40, which connects the air path 82 and the air path 83, a seal portion 85 made of, for example, an O-ring is provided, and the air path 82 and the air path 83 are Airtightness between is ensured.

  As described above, the resin mold 10 (resin molding apparatus 100) in this embodiment includes a double seal mechanism (including the cavity seal portion 80 and the base seal portion 73) and a double vacuum mechanism (cavity internal pressure adjusting portion 81 and chamber). Including an internal pressure adjusting unit 74). Below, the effect by these mechanisms is demonstrated with reference to FIG.

  FIG. 2 is a diagram for explaining the function and effect of the resin mold 10, wherein the horizontal axis represents time (t), the vertical axis represents the internal pressure (P) of the cavity 16 in logarithm, and the mold is closed (clamped). This shows the degree of pressure reduction in the cavity 16 with respect to time. The parameter A shown in FIG. 2 is obtained when only the cavity internal pressure adjusting unit 81 is operated using the cavity seal unit 80 (at this time, the base seal unit 73 is not used and the chamber internal pressure adjusting unit 74 is not operated). It is. Parameter B is when only the chamber internal pressure adjusting unit 74 is operated using the base seal portion 73 (at this time, the cavity internal pressure adjusting unit 81 is not operated without using the cavity seal unit 80). . Parameter C is when the cavity internal pressure adjusting unit 81 and the chamber internal pressure adjusting unit 74 are operated together using the cavity seal unit 80 and the base seal unit 73.

  As shown in FIG. 2, the configuration of the parameter B can improve the effectiveness of the degree of pressure reduction in the cavity 16 compared to the configuration of the parameter A. In the configuration of the parameter A, the inside of the cavity 16 can be depressurized after clamping, but in a pair of molds (upper mold 11 and lower mold 12) composed of a plurality of mold blocks as in this embodiment, Leakage occurs from the gaps between the mold blocks. On the other hand, in the configuration of parameter B, the inside of the cavity 16 cannot be decompressed after clamping, but until then, a pair of molds (upper mold 11 and lower mold 12) in which the cavity 16 is formed. The inside of the chamber 70 containing the gas can be decompressed.

  And the structure of the parameter C can make the pressure in the cavity 16 about one digit lower than the structure of the parameters A and B. This is because leakage is minimized in a state where the space outside the pair of molds (upper mold 11 and lower mold 12) (that is, the space in the chamber 70) is reduced by the chamber internal pressure adjusting unit 74, and after the clamping. However, it can be considered that the pressure in the cavity 16 is reduced by the cavity internal pressure adjusting unit 80 to obtain a synergistic effect by the chamber internal pressure adjusting unit 74 and the cavity internal pressure adjusting unit 80 with respect to the degree of pressure reduction in the cavity 16. Thus, according to the configuration of the parameter C, the effectiveness of the degree of pressure reduction in the cavity 16 can be improved as compared with the configuration of the parameters A and B performed separately.

  In addition, as shown in FIG. 2, the time tc according to the configuration of the parameter C is compared with the time ta according to the configuration of the parameter A and the time tb according to the configuration of the parameter B, even in the time until the pressure reduction degree P1 is reached. However, it is getting shorter. Further, if the cavity internal pressure adjusting unit 81 has a function of feeding compressed air into the cavity 16 (for example, a compressor), the compressed air is first fed into the cavity 16 with the mold closed. By discharging air to the cavity 16 in a state where the pressure is increased, the effectiveness of the degree of pressure reduction in the cavity 16 can be increased in a shorter time.

  Although not shown in FIG. 2, when only the cavity internal pressure adjusting unit 81 is operated using the cavity seal unit 80 and the base seal unit 73, or the chamber internal pressure is used using the cavity seal unit 80 and the base seal unit 73. A combination such as when only the adjusting unit 74 is operated is also conceivable, but the result of the configuration of the parameter C being most effective is obtained.

  Further, it is conceivable that the chamber internal pressure adjusting unit 74 and the cavity internal pressure adjusting unit 80 are operated together by using the base seal unit 73 without using the cavity seal unit 80, but the configuration of the parameter C is effective. The result is obtained. Specifically, by using the cavity seal portion 80 as in the configuration of the parameter C, the effectiveness of the degree of pressure reduction can be improved as compared with the case where it is not used. That is, the cavity seal part 80 can be hermetically sealed in the vicinity (surrounding) of the cavity 16, and the effectiveness of the degree of pressure reduction in the cavity 16 can be further enhanced.

  When the mold is closed, the upper mold chase block 30 and the lower mold chase block 40 are aligned by a lock block (not shown), and the gap by the lock block is also surrounded by the cavity seal portion 80. Thus, it can be prevented from becoming a leak source. Further, even when the plate thickness adjusting portion is provided as in the present embodiment, the gap between the movable portions (for example, the plate thickness adjusting blocks 43a and 43b) is also surrounded by the cavity seal portion 80. It can be prevented from becoming a leak source.

  In addition, another chamber containing the airtight chamber 70 or a space between the pair of molds (the upper mold 11 and the lower mold 12) and the chamber 70 is provided with another chamber. You can also. That is, by using triple seal (more multi-seal) and triple vacuum (more multi-vacuum), the effectiveness of the degree of pressure reduction in the cavity 16 can be further enhanced. In addition, as another chamber, what is comprised from the same material as the upper mold | type 11 and the lower mold | type 12, for example can be used in a box shape.

  In this embodiment, the case where the shut-off pin 50 is provided is described. However, the shut-off pin 50 is not necessarily provided. However, the air vent 19 can be formed deeply by providing the shut-off pin 50. That is, the air can be easily discharged, and the effectiveness of the degree of pressure reduction in the cavity 16 can be further increased (the highly efficient degassing in the cavity 16 can be performed).

  Next, a transfer type resin mold forming method using the resin mold 10 will be described. In this embodiment, the side surface of the chip component 102 including a narrow portion between the substrate 101 and the lower surface of the chip component 102 is molded (sealed) with respect to the workpiece W (molded product), and the upper surface of the chip component 102 is formed. A resin molded part that is exposed is formed. Thereby, the workpiece W becomes a molded product. In addition, as resin, in order to perform resin filling (underfill) to a narrow part, low viscosity and high fluidity resin with a small filler diameter are used.

  First, in a state where the resin mold 10 is opened, the upper surface (surface on the upper die 11 side) of the work support block 42 is slightly larger than the upper surface (surface on the upper die 11 side) of the lower die clamper block 41 around it. In the lower position. In such a state, the chip component 102 flip-chip mounted on the substrate 101 is supplied (loaded into) the resin mold 10 as the workpiece W, and the workpiece W (substrate 101) is placed on the upper surface of the workpiece support block 42. To do. The work support block 42 is assembled so that the upper surface of the substrate 101 at this time is positioned slightly above the upper surface of the lower mold clamper block 41.

  Further, when the mold is opened, the shut-off pin 50 is retracted from the air vent 19 and the release film 35 is sucked and held by the parting surface of the upper mold 11. Further, in a state where the mold is opened, the head of the plunger 45 waits at a position (resin supply position) where the head portion of the plunger 45 is lowered (retracted) in the pot 13, and the low-viscosity resin R is supplied into the pot 13. Since the resin R in the pot 13 is heated by a heater in which the upper mold 11 and the lower mold 12 are built in in advance, the resin R is melted by the heat.

  Next, the intermediate mold 20 is disposed on the part W of the lower mold 12 so that the chip part 102 is accommodated in the cavity hole (also referred to as the cavity 16) of the intermediate mold 20 and covers the work W. To do.

  Next, the movable lower mold 12 is driven to approach the fixed upper mold 11 (the lower mold 12 is raised), and the workpiece W is moved together with the intermediate mold 20 between the upper mold 11 and the lower mold 12. Clamp and close the mold. As a result, a communication path that is communicated by the pot 13, the cull 14, the runner gate 15, the cavity 16, the through gate 17, the dummy cavity 18, and the air vent 19 is formed.

  Specifically, the cull 14 is a space formed including a recess formed in the center of the upper mold 11 (upper clamper block 31) facing the pot 13 and a cull hole of the intermediate mold 20. The cavity 16 is a space formed by surrounding both ends of the cavity hole of the intermediate mold 20 with the parting surface of the upper mold 11 and the upper surface of the substrate 101. The dummy cavity 18 is a space formed including a recess formed in the outer peripheral portion of the upper mold 11 (upper clamper block 31) and a dummy cavity hole of the intermediate mold 20. The runner gate 15 is a space formed including the parting surface of the upper mold 11 and the runner gate groove of the intermediate mold 20. The through gate 17 is a space formed including the parting surface of the upper mold 11 and the through gate groove of the intermediate mold 20. The air vent 19 is a space formed including the parting surface of the upper mold 11 and the air vent groove of the intermediate mold 20.

  Further, by closing the mold, the cavity seal portion 80 is clamped by the upper mold 11 and the lower mold 12 at the outer periphery of the upper mold 11 (upper mold chase block 30) and the lower mold 12 (lower mold chase block 40). Therefore, an airtight space is formed inside the mold including the cavity 16. Further, by closing the mold, the base seal portion 73 is clamped by the upper mold base 71 and the lower mold base 72 at the outer peripheral portions of the upper mold base 71 and the lower mold base 72, so that the upper mold base 71 and the lower mold base 72 are clamped. An airtight space is formed in the chamber 70 formed by 72.

  Here, after the cavity seal portion 80 comes into contact with the upper die 11 during mold closing, the cavity internal pressure adjusting portion 81 can be operated to form a reduced pressure environment inside the mold including the cavity 16. Further, after the base seal part 73 comes into contact with the upper mold base 71 in the middle of mold closing, the chamber internal pressure adjusting part 74 can be operated to form a reduced pressure environment in the chamber 70. If the cavity internal pressure adjusting unit 81 and the chamber internal pressure adjusting unit 74 are driven immediately before mold closing, air suction in the communication path can be performed simultaneously with mold closing to form a reduced pressure environment, thereby shortening the cycle time. can do.

  In the process of closing the mold, the thickness adjustment is performed by the thickness adjustment mechanism. Specifically, first, when the intermediate mold 20 is clamped between the upper mold 11 and the lower mold 12, the substrate 101 and the work support block 42 are pushed down. Next, the lower plate thickness adjustment block 43b is moved forward or backward by a predetermined amount, and the upper plate thickness adjustment block 43a is brought into close contact with the lower surface of the work support block 42 and fixed.

  Thus, the difference in plate thickness is absorbed so that the upper surface of the substrate 101 and the upper surface of the lower mold clamper block 41 are flush with each other, and the substrate 101 is clamped between the intermediate mold 20 and the lower mold clamper block 41. That is, even if there is a difference in the plate thickness of the substrate 101 of the workpiece W placed symmetrically about the pot 13, the upper surface of each substrate 101 is clamped at a uniform height. For this reason, flash flashing of the resin R on the upper surface of the substrate 101 can be prevented. This is particularly effective when the viscosity is low.

  Next, in a state where the workpiece W is clamped, the cavity internal pressure adjusting unit 81 and the chamber internal pressure adjusting unit 74 are operated together to reduce the pressure in the cavity 16, and the plunger 45 is raised to communicate with the cal 14 from the pot 13. The resin R is pumped to the cavity 16 through the gate 15 and filled into the cavity 16. At this time, since the effectiveness of the degree of pressure reduction in the cavity 16 is high, the resin filling property is improved, and the resin can be filled even in a narrow place such as between the substrate 101 and the chip component 102. .

  Next, the molten resin R is further pumped together with air by raising the plunger 45, overflowing the resin R from the cavity 16, and flowing the resin R into the dummy cavity 18 through the through gate 17.

  Further, before the flow of the resin R reaches the air vent 19 through the through gate 17 and the dummy cavity 18, the resin stop mechanism is driven to cause the shutoff pin 50 to enter the air vent 19. As a result, the air vent 19 is closed, and the resin R being pumped can be blocked by the shut-off pin 50. By adopting a configuration in which the resin R is dammed by the shut-off pin 50, the air vent 19 can be formed deeply to facilitate the discharge of air, and the effectiveness of the degree of pressure reduction in the cavity 16 can be further improved. Fillability can be improved. In addition, resin stains outside the resin mold 10 can be prevented. Further, by preventing resin contamination, the cleaning process can be simplified and the cycle time can be shortened.

  Next, in a state where the resin R is blocked by the shut-off pin 50, the plunger 45 is further raised to increase the pressure in the cavity 16 to a predetermined molding pressure, and then in the cavity 16 in a state where the pressure is maintained. Curing of the filled resin R is completed.

  Next, the movable mold lower mold 12 is driven away from the fixed mold upper mold 11 (the lower mold 12 is lowered), and the upper mold 11 and the lower mold 12 are separated and opened (ie, The upper mold base 71 and the lower mold base 72 are also separated). Thereby, the workpiece | work W can be taken out in the state which bite into the intermediate mold 20 with the cured resin R. Next, the workpiece W is formed by pushing the workpiece W downward from the intermediate mold 20 and taking it out. As described above, by using the resin mold 10, it is possible to increase the effectiveness of the degree of pressure reduction in the cavity 16, so that the resin filling property is improved, and voids are generated in the molded product (the defective product and Can be prevented. Therefore, it is possible to prevent the manufacturing yield from being lowered. Moreover, the reliability of a molded product can be improved by preventing generation | occurrence | production of a void.

(Embodiment 2)
In the first embodiment, the case where the workpiece W is clamped between the upper mold 11 and the lower mold 12 via the intermediate mold 20 and applied to the resin mold 10 that performs mold underfill has been described. Not limited to this, as shown in FIG. 3, the present invention is also applicable to a resin mold 10A that clamps a BGA type work W between an upper mold 11 and a lower mold 12 without using an intermediate mold. Can do. FIG. 3 is a cross-sectional view of a resin mold 10A that is a main part of the resin mold apparatus 100 according to the embodiment of the present invention.

  In the resin mold 10A according to the present embodiment, the workpiece W is clamped and the cavity 16 is formed by closing the upper mold 11 and the lower mold 12, and the resin R filled in the cavity 16 is heated. -It has a pair of molds to be cured. In the present embodiment, the cavity 16 is a space formed by being surrounded by the lower surface of the upper mold cavity block 32, the wall surface of the through hole 31 a formed in the upper mold clamp block 31, and the upper surface of the substrate 101. In addition, since the upper mold cavity block 32 is configured to move relative to the upper mold clamper block 31, the volume of the cavity 16 changes.

  The resin mold 10A is provided outside the chamber 70 so as to enclose a pair of molds (the upper mold 11 and the lower mold 12) by closing the mold, and the air in the chamber 70 is discharged. And a chamber internal pressure adjusting unit 74 having a function of discharging (for example, a vacuum pump). In the present embodiment, the chamber 70 includes a pair of bases (an upper mold base 71 and a lower mold base 72) having opposed concave spaces, and a base seal that hermetically seals the space surrounded by the pair of bases. Part 73.

  The resin mold 10 </ b> A includes a cavity internal pressure adjusting unit 81 that communicates with the cavity 16 and is provided outside the chamber 70 and has a function of discharging the air in the cavity 16 (for example, a vacuum pump). In this embodiment, in a pair of molds (upper mold 11 and lower mold 12), a communication path communicating in the order of pot 13, cull 14, runner gate 15, cavity 16 and air vent 19 and cavity internal pressure adjusting portion 81 are provided. And are connected. The air vent 19 is a space formed by an air vent groove carved on the lower surface of the upper clamper block 31 and the upper surface of the substrate 101 or the upper surface of the lower clamper block 41. An air vent pin 51 capable of moving back and forth (up and down) is provided in the middle of the air vent 19.

  Even in such a resin mold 10A, the same effects as those of the first embodiment can be obtained, and the effectiveness of the degree of pressure reduction in the cavity 16 can be enhanced.

  Also, transfer type resin molding can be performed using the resin molding die 10A. Specifically, first, the resin R is supplied to the pot 13 and the upper mold cavity block 32 is moved relative to the upper mold clamper block 31 to clamp the work W. Next, while the workpiece W is clamped, the cavity internal pressure adjusting unit 81 and the chamber internal pressure adjusting unit 74 are operated to reduce the pressure in the cavity 16, and the resin R is supplied from the pot 13 to the cavity 16 through the runner gate 15 communicating with the cull 14. The resin R filled in the cavity 16 is heated and cured. In this embodiment, since the effectiveness of the degree of pressure reduction in the cavity 16 can be improved, the resin filling property can be improved and the occurrence of voids in the molded product can be prevented.

(Embodiment 3)
In the second embodiment, the case where the upper mold cavity block 32 is moved relative to the upper mold clamper block 31 to change the capacity of the cavity 16 has been described. Not limited to this, as shown in FIG. 4, the present invention is also applied to a resin mold 10 </ b> B in which the volume of the cavity 16 is fixed and a BGA type work W is clamped between the upper mold 11 and the lower mold 12. can do. FIG. 4 is a cross-sectional view of a resin mold 10B that is a main part of the resin mold apparatus 100 according to the embodiment of the present invention.

  In the resin mold 10B according to the present embodiment, the work W is clamped and the cavity 16 is formed by closing the upper mold 11 and the lower mold 12, and the resin R filled in the cavity 16 is heated. -It has a pair of molds to be cured. In the present embodiment, the cavity 16 is a space formed by being surrounded by a recess recessed from the lower surface of the upper mold clamper block 31 and the upper surface of the substrate 101. The upper mold clamper block 31 is fixedly assembled to the upper mold chase block 30, and an ejector pin 52 that can move forward and backward to the cavity 16 is provided.

  The resin mold 10B is provided outside the chamber 70 so as to enclose a pair of molds (the upper mold 11 and the lower mold 12) by closing the mold, and the air in the chamber 70 is discharged. And a chamber internal pressure adjusting unit 74 having a function of discharging (for example, a vacuum pump). In the present embodiment, the chamber 70 includes a pair of bases (an upper mold base 71 and a lower mold base 72) having opposed concave spaces, and a base seal that hermetically seals the space surrounded by the pair of bases. Part 73.

  The resin mold 10 </ b> A includes a cavity internal pressure adjusting unit 81 that communicates with the cavity 16 and is provided outside the chamber 70 and has a function of discharging the air in the cavity 16 (for example, a vacuum pump). In this embodiment, in a pair of molds (upper mold 11 and lower mold 12), a communication path communicating in the order of pot 13, cull 14, runner gate 15, cavity 16 and air vent 19 and cavity internal pressure adjusting portion 81 are provided. And are connected. In the present embodiment, no air vent pin is provided in the middle of the air vent 19.

  Also in such a resin mold 10B, the same effect as that of the second embodiment can be obtained, and the effectiveness of the degree of pressure reduction in the cavity 16 can be enhanced. In the present embodiment, since there are few movable parts in the upper mold 11 and it is considered that there is little leakage from the gaps between the mold blocks, a release film stretched on the parting surface of the upper mold 11 is used. Not.

  Further, transfer resin molding can be performed using the resin molding die 10B. Specifically, first, the resin R is supplied to the pot 13 to clamp the workpiece W. Next, while the workpiece W is clamped, the cavity internal pressure adjusting unit 81 and the chamber internal pressure adjusting unit 74 are operated to reduce the pressure in the cavity 16, and the resin R is supplied from the pot 13 to the cavity 16 through the runner gate 15 communicating with the cull 14. The resin R filled in the cavity 16 is heated and cured. In this embodiment, since the effectiveness of the degree of pressure reduction in the cavity 16 can be improved, the resin filling property can be improved and the occurrence of voids in the molded product can be prevented.

(Embodiment 4)
In the first embodiment, the case where the transfer resin mold 10 is applied has been described. Not limited to this, as shown in FIG. 5, the present invention can also be applied to a TCM (Transfer Compression Mold) type resin mold 10C obtained by multiplying a transfer method and a compression method. FIG. 5 is a cross-sectional view of a resin mold 10 </ b> C that is a main part of the resin mold apparatus 100 according to the embodiment of the present invention.

  In the resin mold 10C according to the present embodiment, the work W is clamped and the cavity 16 is formed by closing the upper mold 11 and the lower mold 12, and the resin R filled in the cavity 16 is heated. -It has a pair of molds to be cured.

  The upper mold 11 is housed in an upper mold clamp block 31 having a through hole 31a (housing hole) formed in the mold opening / closing direction and an enlarged diameter hole 31b following the through hole 31a, and in the through hole 31a of the upper mold clamper block 31. The upper mold cavity block 32 is provided. The lower mold 12 includes a lower chase block 40 and a work support block 42 inserted and fixed thereto. In the present embodiment, the cavity 16 includes a lower surface of the upper mold cavity block 32, a stepped wall surface that forms part of the inner wall surface of the through hole 31a between the lower surface of the upper mold cavity block 32 and the expanded diameter hole 31b, and an expanded diameter. It is a space formed by being surrounded by the inner wall surface of the hole 31 b (so far, a cavity recess is formed in the upper mold 11) and the upper surface of the substrate 101.

  The upper mold clamper block 31 is suspended and supported on the upper mold base 71 side via a spring 33 so that a required clearance 76 is formed between the upper mold clamper block 30 and the upper mold chase block 30. The spring 33 is disposed in a through hole 30b provided in the upper die chase block 30 and abuts the lower surface of the upper die base 71 and the upper surface of the upper die clamper block 31 to attach the upper die clamper block 31 downward. It is fast.

  The resin mold 10C is provided outside the chamber 70 so as to enclose a pair of molds (the upper mold 11 and the lower mold 12) by closing the mold, and the air in the chamber 70 is discharged. And a chamber internal pressure adjusting unit 74 having a function of discharging (for example, a vacuum pump). In the present embodiment, the chamber 70 includes a pair of bases (an upper mold base 71 and a lower mold base 72) having opposed concave spaces, and a base seal that hermetically seals the space surrounded by the pair of bases. Part 73.

  The resin mold 10 </ b> C is provided outside the chamber 70 in communication with the cavity 16, and includes a cavity internal pressure adjusting unit 81 having a function (for example, a vacuum pump) for discharging the air in the cavity 16. In this embodiment, in a pair of molds (upper mold 11 and lower mold 12), a communication path communicating in the order of pot 13, cull 14, runner gate 15, cavity 16 and air vent 19 and cavity internal pressure adjusting portion 81 are provided. And are connected. The air vent 19 is a space formed by an air vent groove formed on the lower surface of the upper mold clamper block 31 and the upper surface of the substrate 101.

  Also in such a resin mold die 10C, it is possible to obtain the same effect as that of the first embodiment, and it is possible to improve the effectiveness of the degree of pressure reduction in the cavity 16.

  Moreover, TCM system resin molding can be performed using the resin mold 10C. Specifically, first, the workpiece W is supplied to the upper surface of the workpiece support block 42 in a state where the mold is opened. Further, the release film 35 is stretched (adsorbed and held) on the parting surface of the upper mold 11 including the inner surface of the cavity recess. Further, the resin R is supplied to the pot 13. Next, the workpiece W is clamped by closing the upper die 11 and the lower die 12 (first die closing).

  In the first mold closing stage, the clamping surfaces in which the parting surfaces of the lower mold 12 and the upper mold 11 are in contact with each other via the release film 35 and the spring 33 is slightly compressed so that the resin R does not leak out from the cavity 16. The mold is closed with force.

  Next, in a state where the workpiece W is clamped, the cavity internal pressure adjusting unit 81 and the chamber internal pressure adjusting unit 74 are operated together to reduce the pressure in the cavity 16, and the plunger 45 is raised to communicate with the cal 14 from the pot 13. The resin R is pumped to the cavity 16 through the gate 15 and filled into the cavity 16. In the first mold clamping stage, there is a sufficient gap between the upper surface of the chip part 102 and the lower surface of the upper mold cavity block 32, and the molten resin R is satisfactorily filled to every corner in the cavity 16. .

  Next, the upper mold 11 and the lower mold 12 further approach to perform the second mold closing. In the second mold closing stage, both ends of the upper mold chase block 30 against the urging force of the spring 33 until the opening edge of the upper mold chase block 30 abuts against the opening edge of the lower mold chase block 40 via the cavity seal portion 80. The mold is closed so that the mold comes closer. As a result, the upper mold clamper block 31 approaches the lower mold 12 and the space in the cavity 16 is narrowed, so that the molten resin R in the cavity 16 is pushed back into the pot 32. By holding the pressure in this state, the resin R is cured. In this embodiment, since the effectiveness of the degree of pressure reduction in the cavity 16 can be improved, the resin filling property can be improved and the occurrence of voids in the molded product can be prevented.

(Embodiment 5)
In the first embodiment, the case where the transfer resin mold 10 is applied has been described. Not only this but as shown in FIG. 6, it is applicable also to the resin mold 10D of a compression system. FIG. 6 is a cross-sectional view of a resin mold 10D, which is a main part of the resin mold apparatus 100 in the embodiment of the present invention. The resin mold 10D has a bilaterally symmetric configuration around a one-dot chain line in FIG. 6, and FIG. 6 shows a state where the right side is opened and a left side is closed.

  In the resin mold 10D in the present embodiment, the work W is clamped and the cavity 16 is formed by closing the upper mold 11 and the lower mold 12, and the resin R filled in the cavity 16 is heated. -It has a pair of molds to be cured. In the resin mold 10D, when the upper mold 11 is a movable mold and the lower mold 12 is a fixed mold, the upper mold base 71 (upper mold 11) is a movable platen not shown, and the lower mold base 72 (lower mold 12) is A fixed platen (not shown) is fixed and assembled.

  A work W (substrate 101) is sucked and held on the lower surface of the upper chase block 30. The upper die chase block 30 is formed with an air passage 90 opened on the lower surface, and a negative pressure suction force is applied to the lower surface side of the upper chase block 30 by a suction function unit 91 (for example, a vacuum pump) communicating with the upper air chase block 30. The workpiece W is attracted and held on the lower surface side of the upper chase block 30 by this negative pressure suction force.

  The lower die 12 includes a first lower die chase block 40A, a second lower die chase block 40B, a lower die cavity block 32A, and a lower die clamper block 41. The first lower die chase block 40A and the lower die cavity The block 32A is integrated with a bolt 92, and these are integrated with the second lower chase block 40B. The lower mold clamper block 41 is bulleted by the second lower mold chase block 40B by a spring 93 so as to move up and down while surrounding the lower mold cavity block 32A in the through hole 41a.

  Specifically, the spring 93 is elastically mounted between the head 94a of the bolt 94 fixed to the lower surface of the lower die clamper block 41 and the second lower die chase block 40B, and the head 32a is the first lower die chase. The upper movement of the lower mold clamper block 41 is restricted by contacting the lower surface of the block 40A, and the lower mold clamper block 41 is lowered by the lower surface of the lower mold clamper block 41 contacting the upper surface of the first lower mold chase block 40A. Is regulated.

  When the upper mold 11 and the lower mold 12 are closed while pressing the lower mold clamper block 41 against the urging force of the spring 93, the cavity 16 is closed on the upper surface of the lower mold cavity block 32A and the lower mold clamper block 41. This is a space formed by being surrounded by the wall surface of the through hole 41 a and the lower surface of the substrate 101. Then, the resin R supplied into the cavity 16 is compressed by the upper mold 11 and the lower mold 12 and held on the lower surface of the upper mold chase block 30, and the workpiece W set in the cavity 16 is resin-molded. ing.

  On the upper surface of the lower mold clamper block 41, an air vent groove that forms an air vent 19 that allows the air in the cavity 16 to escape outside the chamber 70 is formed. A through-hole 41c that penetrates the lower clamper block 41 up and down is formed in a portion where the air vent 19 is located. An air vent pin 51 is provided in the through hole 41c such that one end thereof is directed to the air vent 19 so as to be movable up and down. When the air vent pin 51 moves upward and the upper end of the air vent pin 51 comes into contact with the workpiece W via the release film 35, the air vent 19 is closed (closed), and when the air vent pin 51 is lowered, the air vent 19 is opened. .

  A flange 51a is provided at the lower end of the air vent pin 51, and a closing spring 95 is elastically mounted between the lower surface of the flange 51a and the second lower chase block 40B, and the upper surface of the flange 51a and the first lower chase block 40A. In between, a return spring 96 having a spring force weaker than that of the closing spring 95 is elastically mounted. The return spring 96 is provided for the purpose of returning the air vent pin 51 to the initial position when the mold is opened. The air vent pin 51 is stationary at a position where the force from the closing spring 95 and the force from the return spring 96 are balanced, and the air vent pin 51 is always at a position where the air vent 19 is opened.

  In the present embodiment, the resin R is compression-molded with the release film 35 disposed on the upper surface of the lower clamper block 41 in and around the cavity 16. Between the release film 35 and the bottom surface of the cavity 16, air is sucked by the suction function unit 97, and thus compression molding is performed in a state where the release film 35 is in close contact with the bottom surface of the cavity 16.

  The resin mold 10D is provided outside the chamber 70 so as to enclose a pair of molds (the upper mold 11 and the lower mold 12) by closing the mold, and the air in the chamber 70 is discharged. And a chamber internal pressure adjusting unit 74 having a function of discharging (for example, a vacuum pump).

  The chamber 70 in the present embodiment includes a pair of opposing bases (a plate-like upper mold base 71 and a lower mold base 72), a tubular member 77A fixedly assembled to the lower surface of the upper mold base 71, and a tubular shape. A cylindrical member 77B assembled to the lower surface of the upper mold base 71 via a spring 78 so as to slide on the outer peripheral surface of the member 77A, an outer peripheral surface of the cylindrical member 77A, and an inner peripheral surface of the cylindrical member 77B And a seal portion 79 provided therebetween.

  Moreover, the chamber 70 in this embodiment is provided with the base seal part 73 which is provided in the lower end surface of the cylindrical member 77B, and seals the space enclosed by these. The base seal portion 73 is crushed by the lower end surface of the cylindrical member 77B and the upper surface of the lower die base 72 when the workpiece W is clamped by closing the upper die 11 and the lower die 12. It is. Thereby, the space formed between the upper mold base 71 and the lower mold base 72 can be hermetically sealed.

  The resin mold 10 </ b> D is provided outside the chamber 70 in communication with the cavity 16, and includes a cavity internal pressure adjusting unit 81 having a function of discharging air in the cavity 16 (for example, a vacuum pump). In the present embodiment, in a pair of molds (upper mold 11 and lower mold 12), a communication path that communicates in the order of the cavity 16 and the air vent 19 and a cavity internal pressure adjusting unit 81 are connected. The air vent 19 is a space formed by an air vent groove carved on the upper surface of the lower mold clamper block 31 </ b> A and the lower surface of the substrate 101.

  In such a resin mold 10D, the same effect as that of the first embodiment can be obtained, and the effectiveness of the degree of pressure reduction in the cavity 16 can be enhanced.

  In addition, compression molding resin molding can be performed using the resin molding die 10D. Specifically, first, in a state where the upper mold 11 and the lower mold 12 are opened, the work W is adsorbed to the upper mold 11 and a release film 35 is stretched on the parting surface of the lower mold 12 to form a resin. Supply R. Further, the cavity internal pressure adjusting unit 81 and the chamber internal pressure adjusting unit 74 are operated so that the inside of the cavity 16 can be decompressed.

  Next, the upper mold 11 is moved downward to bring the upper mold 11 and the upper mold 12 close to each other, whereby the upper surface of the lower mold clamper block 41 is placed on the lower surface of the substrate 101 (the lower surface of the upper chase block 30). To close the mold and clamp the workpiece W. At this stage, the air vent 19 is hardly closed by the air vent pin 51.

  Next, when the upper mold 11 and the lower mold 12 are further closed against the urging force of the spring 93, the lower mold clamper block 41 is relatively close to the other end of the air vent pin 51. (The air vent pin 51 moves upward), and one end of the air vent pin 51 passes through the parting surface of the lower mold clamper block 41 and approaches the upper mold 11 side.

  As a result, the air vent pin 51 comes into a loose contact with the release film 35. The air vent pin 51 is pushed by the second lower chase block 40B through the closing spring 95 and is received by the return spring 96 and the closing spring 95 from above and below, so that it is elastically applied to the release film 35. There is no such thing as touching and breaking through the release film 35. Even at this stage, the air vent pin 51 is in a state of loosely contacting the work W via the release film 35, so that the air in the cavity 16 is outside the space between the air vent 19 or the release film 35 and the work W. Can be discharged.

  Next, in the final stage where the upper mold 11 and the lower mold 12 are more strongly closed against the urging force of the spring 93, the lower mold clamper block 41 moves closer to the air vent pin 51. The air vent pin 51 is brought into strong contact with the workpiece W via the release film 35 by the action of the closing spring 95.

  As a result, one end of the air vent pin 51 protrudes from the air vent 19 side with a strong pressing force, so that the air vent 19 is completely closed (closed), and the lower mold clamper block 41 also fixes the release film 35 to the lower surface of the work W. Therefore, the cavity 16 is completely sealed, and the compression molding pressure is in the cavity 16 and the resin R is thermoset in a compressed state, thereby completing the compression molding. In this embodiment, since the effectiveness of the degree of pressure reduction in the cavity 16 can be improved, the resin filling property can be improved and the occurrence of voids in the molded product can be prevented.

  Although the present invention has been specifically described based on the embodiment, for example, in the fifth embodiment, the lower cavity mechanism is described as an example, but the upper cavity mechanism may be used. Thus, it goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  In the above-described embodiment, a case has been described in which the chamber is configured from a pair of bases outside the pair of molds (upper mold and lower mold), and the space formed by the pair of bases is decompressed. It is not always necessary to configure the chamber from a pair of bases. For example, a chamber including a pair of molds and the entire pair of bases to which the chamber is assembled can be configured.

10 Resin mold 11 Upper mold 12 Lower mold 16 Cavity 70 Chamber 74 Chamber internal pressure adjustment part 81 Cavity internal pressure adjustment part R Resin W Workpiece

Claims (9)

By closing one and the other, the workpiece is clamped and a cavity is formed, and a pair of molds in which the resin filled in the cavity is heated and cured,
A chamber containing the pair of molds;
A cavity internal pressure adjusting unit that has a function of discharging air in the cavity and communicates with the cavity to adjust an internal pressure of the cavity;
A chamber internal pressure adjusting unit which has a function of discharging air in the chamber and adjusts the internal pressure of the chamber;
The resin mold metal mold | die characterized by including. The resin mold according to claim 1,
A resin mold mold comprising a cavity seal portion that seals the inside of the cavity when the mold is closed between the one mold and the other mold. In the resin mold die according to claim 1 or 2,
The chamber includes a pair of bases having a space part facing one and the other, and a base seal part that hermetically seals the space surrounded by the pair of bases,
In the pair of bases, the one mold is assembled to the one base, and the other mold is assembled to the other base.
The base seal portion is provided between an opening edge portion of the one base and an opening edge portion of the other base, and the inside of the chamber is hermetically sealed when the mold is closed. . The resin mold according to claim 1, 2, or 3,
A resin mold mold comprising a film stretched on a parting surface of the one mold or the other mold. In the resin mold as described in any one of Claims 1-4,
An air vent communicating with the cavity is formed in the pair of molds,
The cavity internal pressure adjusting unit communicates with the cavity via the air vent,
A resin mold having a shut-off pin capable of moving back and forth in the middle of the air vent. In the resin mold as described in any one of Claims 1-5,
The cavity internal pressure adjusting unit has a function of feeding compressed air into the cavity. In the resin mold as described in any one of Claims 1-6,
A resin mold having a separate chamber containing the chamber. In the resin mold forming method using the resin mold die according to any one of claims 1 to 7,
In a state where resin is supplied to the pots provided in the pair of molds and the workpiece is clamped, the cavity internal pressure adjusting unit and the chamber internal pressure adjusting unit are operated to depressurize the inside of the cavity. A resin mold forming method, wherein the resin is pumped to the cavity through a runner gate communicating with a cull provided in the pair of molds, and the resin filled in the cavity is heated and cured. In the resin mold forming method using the resin mold die according to any one of claims 1 to 7,
After the resin is supplied to the cavity, the resin filled in the cavity is heated while the cavity internal pressure adjusting unit and the chamber internal pressure adjusting unit are operated to reduce the pressure in the state where the workpiece is clamped. A resin molding method characterized by curing.

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