JP2007288110A - Resin sealing die and resin sealing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing die and a resin sealing method in which uniform temperature distribution is attained along the longitudinal direction of a substrate when a chip attached to the substrate is resin sealed. <P>SOLUTION: In one die 111 for arranging a sheet of substrate 400, a plurality of heaters H (H1-H4) extending along the short side direction S of each substrate 400 are arranged along the long side direction L thereof. Since the temperature of each heater H (H1-H4) becomes substantially constant excepting the opposite ends thereof, temperature distribution on the die surface (substrate supply set surface 113) is made uniform along the long side direction L of the substrate 400 on the substrate surface. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a resin sealing mold and a resin sealing method that are used when a resin chip is manufactured by sealing a semiconductor chip or the like mounted on a substrate.

  A conventional method of resin-sealing a chip-shaped electronic component (hereinafter referred to as “chip”) such as a semiconductor chip mounted on a substrate will be described with reference to FIG. FIG. 3 is a partial cross-sectional view showing a process of resin sealing using a conventional resin sealing mold. In addition, in order to make it easy to understand, any drawing used in the following description is schematically omitted or exaggerated as appropriate.

  As shown in FIG. 3, a lower mold 1 and an upper mold 2 opposite to the lower mold 1 are provided as a resin-sealed mold (mold), and a substrate 3 is placed at a predetermined position of the lower mold 1. They are arranged on the left and right with the pot 9 in between (only the left substrate 3 is shown in FIG. 3). The rectangular substrate 3 is a circuit substrate made of a metal lead frame, a resin-based or ceramic-based printed circuit board, etc., and a plurality of chips 4 are mounted at predetermined positions, respectively. The electrodes (both not shown) of the substrate 3 and the chip 4 are electrically connected by a wire 5. Further, the upper mold 2 is provided with a cavity 6 to be filled with a fluid resin (not shown), and a runner 7 and a cull 8 which are resin flow paths sequentially communicating with the cavity 6. The lower mold 1 is provided with a pot 9 so as to face the cull 8, and a plunger 10 is fitted in the pot 9 so as to be movable up and down. In addition, a resin tablet 11 made of a thermosetting resin such as an epoxy resin is disposed on the plunger 10 in the pot 9. The resin tablet 11 is heated and pressed by the plunger 10 to melt and become a fluid resin. Then, the fluid resin is pressed by the plunger 10 and filled into the cavity 6 through the cull 8 and the runner 7 sequentially.

  The lower mold 1 is provided with a cylindrical hole 12, and a cylindrical heater 13 is fitted into the hole 12. The heater 13 is a heating unit that generates heat when supplied with current from a lead wire (not shown), and heats the fluid resin in the substrate 3 and the cavity 6 through the lower mold 1 by the heat. . And the heater 13 is arrange | positioned along the longitudinal direction L of the board | substrate 3 under the board | substrate 3 (for example, refer patent document 1).

  By the way, there are various types of arrangements of the chips 4 on the substrate 3. In recent years, in response to demands for cost reduction, a system in which one substrate 3 is partitioned in a lattice shape (matrix shape) and the chip 4 is mounted in each partitioned region 14 is widely used. In recent years, the number of regions 14 in the substrate 3 tends to increase in response to a request for multi-cavity. Furthermore, the length of the substrate 3, that is, the length of the substrate 3 in the longitudinal direction L shown in FIG. 3 is increased, and the entire substrate 3 tends to be enlarged.

  However, according to the conventional technology described above, there are the following problems. First, since the lengths of the substrates 3 arranged on the left and right sides of the pot 9 tend to increase, the resin sealing mold (the lower mold 1 and the upper mold 2) and the resin sealing apparatus are increased in size. Thus, there is a problem that the resin sealing device cannot be downsized. Secondly, since the heater 13 is provided along the longitudinal direction L of the substrate 3, there is a problem that the heater 13 has a temperature distribution such that the heater 13 has a low temperature at both ends thereof, particularly at the left end in FIG. Thirdly, since the runner 7 is formed along the longitudinal direction L of the substrate 3, there is a problem that the flow distance of the fluid resin filled in the cavity 6 through the cal 8 and the runner 7 is increased. is there. In particular, due to the second and third problems, in the left end portion of the cavity 6 shown in FIG. 3, the fluidity of the fluid resin made of the thermosetting resin is lowered, and the wire 5 is deformed or cut. The problem is likely to occur.

In other words, in order to solve the conventional technique, as shown in FIG. 3, the resin flow path (cal 8, runner 7, etc.) is shortened, and furthermore, the pot 9 portion is arranged closer to the cavity 6, A resin material plasticizing mechanism (injection cylinder), a plasticized resin material transfer mechanism (press piston), etc. are arranged outside the resin-sealed mold (for example, patent documents) 2). According to this configuration, the flow distance of the flowable resin, that is, the resin flow path is significantly shortened, and further, the resin-sealed structure is simplified by arranging the plasticizing mechanism etc. outside the resin-sealed mold. There is an advantage that it can be realized.
JP 2002-187175 A (FIG. 1 on page 5) JP 59-052842 A (FIG. 2 on page 5)

  However, in particular, since the substrate itself tends to increase in size, the thickness of each portion of such a substrate is not uniform, and therefore there is a variation in thickness in each portion, and the resin In the case of being disclosed in Patent Documents 1 and 2, there are two such large substrates on the mold surface of the sealing mold (both upper and lower molds), but a large number of large substrates are simultaneously fitted and set. Is customary. For this reason, even if the clamping pressure of each large substrate is simultaneously applied, the clamping state for each large substrate is not uniform. Therefore, for example, a part of the resin material may flow out between each large substrate and the mold surface to form a resin burr on the substrate surface and the mold surface. Conversely, when mold clamping pressure is applied to each substrate for the purpose of preventing this resin burr formation, if the mold clamping pressure is excessive, there is a problem that the semiconductor elements and wiring on each substrate are damaged. To do. Therefore, the variation in the thickness of the substrate is a factor that significantly deteriorates the quality of the molded product.

In addition, a large number of large substrates described above are simultaneously fitted and set on the mold surface, and the resin sealing molds (upper and lower molds) are clamped and sealed with a fluid resin. The resin-sealed mold (both upper and lower molds) itself to be set up needs to be made large. For this reason, it is difficult to control the entire enlarged resin sealing mold to a uniform temperature distribution with a heater.
That is, also in the above-mentioned resin-sealed mold (Patent Document 2), the heater 13 is provided along the longitudinal direction L of the substrate 3 shown in FIG. In general, the heater 13 itself is also increased in size to heat the enlarged resin-sealed mold, which causes an increase in cost and an installation space for incorporating the enlarged heater 13 into the resin-sealed mold. Since it may be necessary to ensure sufficient, maintenance of the heater 13 and temperature management need to be performed uniformly. Then, the heater 13 has a problem that the heater 13 has a temperature distribution that is low at both ends, particularly the left end of FIG. 3, so that a conventional resin sealing device, that is, a conventional mold (resin sealing) In the (stop-type) structure, it is very difficult to control a uniform temperature distribution, which can be said to be a very difficult operation.

  Furthermore, in the structure in which the plasticizing mechanism of the resin material and the transporting mechanism of the plasticized resin material are arranged outside the resin-sealed mold (Patent Document 2), the plasticizing mechanism is simply Since it is a structure arranged outside the resin-sealed mold, it is generally adopted as a resin-sealed mold structure, so-called a cull section, and a resin flow path section and a gate section connected to the cull section. These components have a structure disposed inside the resin-sealed mold. Accordingly, since the resin-encapsulated structure at this part is the same as the conventional one, the basic mold (resin-encapsulated) structure is not simplified, and is further cured at that part. There is a problem that the amount of resin (the amount of resin to be discarded) is large and uneconomical.

  That is, the present invention simplifies the structure of the mold (resin-sealed mold) and solves the conventional problems as described above by using this, and mainly the chip mounted on the substrate is sealed with the resin. Provided are a resin sealing mold and a resin sealing method in which a uniform temperature distribution is obtained along the longitudinal direction of a substrate when resin sealing is performed by a stationary mold.

In order to solve the above-mentioned problem, the resin-sealed mold according to claim 1 of the present invention is formed on a single substrate having two directions, ie, a longitudinal direction and a transverse direction perpendicular to the longitudinal direction. It is a resin-sealed mold used when resin-sealing the mounted chip-shaped electronic component,
Formed in at least one of the first mold to be in contact with the substrate during mold clamping, the second mold opposite to the first mold, and the first mold and the second mold And a cavity filled with a fluid resin, and at least three heaters provided in the first mold,
Each of the three or more heaters is provided so as to extend along the lateral direction and to be arranged along the longitudinal direction, and has the same specifications and a uniform heat generation distribution.

Moreover, in order to solve the above-mentioned subject, the resin sealing type | mold of Claim 2 which concerns on this invention is the resin sealing type | mold of Claim 1,
Of the three or more heaters arranged along the longitudinal direction, the end side heater including the heaters at both ends is controlled to generate more heat than the heaters other than the end side heater. Features.

Moreover, in order to solve the above-mentioned subject, the resin sealing type | mold of Claim 3 which concerns on this invention in the resin sealing type | mold of Claim 1 or 2 WHEREIN:
The first mold and the second mold are arranged to face each other in the vertical direction, and are formed in at least one of the first mold and the second mold and communicate with the cavity. A resin flow path through which the flowable resin flows, an injection mechanism for a resin material that is disposed opposite to the side surfaces of each of the first mold and the second mold, and is provided so as to freely advance and retract; A pot provided so as to face the side surface in the injection mechanism, and a plunger fitted in the pot so as to be movable forward and backward so as to face the side surface;
In the state where the first mold and the second mold are clamped and the injection mechanism is abutted against the side surface and the mold clamping is completed, the fluid resin in the pot is pressed by the plunger, The pressed fluid resin is filled in the cavity along the short direction through the resin flow path.

Moreover, in order to solve the above-mentioned subject, the resin sealing type | mold of Claim 4 which concerns on this invention in the resin sealing type | mold of Claim 3 WHEREIN:
A plurality of mold sets each including the first mold and the second mold exist, and the plurality of mold sets are arranged so as to be stacked on each other.

Moreover, in order to solve the above-mentioned subject, the resin sealing method of Claim 5 which concerns on this invention is the one board | substrate which has two directions of the longitudinal direction and the transversal direction orthogonal to this longitudinal direction. A resin sealing method for resin-sealing chip-shaped electronic components mounted on the top,
Preparing a first mold to be in contact with the substrate at the time of mold clamping and a second mold opposite to the first mold; and at least three or more heaters provided in the first mold Using and heating at least the first mold, placing the substrate on one of the first mold and the second mold, the first mold and the second mold A mold clamping step, a step of filling a fluid resin in a cavity formed in at least one of the first mold and the second mold, and heating and curing the fluid resin. A step of forming a cured resin thereby, a step of opening the first mold and the second mold, a step of taking out a resin sealing body including the substrate, the electronic component, and the cured resin; With
Each of the three or more heaters is provided so as to extend along the lateral direction and to be arranged along the longitudinal direction, and has the same specifications and a uniform heat generation distribution.

Moreover, in order to solve the above-mentioned subject, the resin sealing method of Claim 6 which concerns on this invention is the resin sealing method of Claim 5,
At least in the heating step, among the three or more heaters arranged along the longitudinal direction, an end side heater including at least both ends generates more heat than a heater other than the end side heater. It is characterized by controlling as follows.

Moreover, in order to solve the above-mentioned subject, the resin sealing method of Claim 7 which concerns on this invention is the resin sealing method of Claim 5 or 6,
In the mold clamping step, an injection mechanism for a resin material, which is disposed so as to face the side surfaces of the first mold and the second mold and is provided so as to freely advance and retreat, further impinges on the side surfaces. Together
In the step of filling the fluid resin, the plunger fitted in the pot so as to be able to advance and retract is pressed against the fluid resin inside the pot provided to face the side surface in the injection mechanism. The pressed fluid resin is filled in the cavity along the short direction.

By adopting the resin sealing mold and the resin sealing method according to the present invention, it is not necessary to use a resin sealing apparatus having a conventional mold (resin sealing mold) with a complicated structure. Since operability or workability can be improved, practical application becomes easy.
Further, according to the present invention, it is possible to efficiently and reliably prevent the formation of resin burrs on the substrate surface without being affected by variations in the thickness of the substrate. Furthermore, by performing mold opening for separating the other mold while the resin-sealed substrate is fixed to one mold surface, the resin-sealed substrate can be released more efficiently. Thus, a resin-sealed molded product having high quality and high reliability can be molded.
Further, since the resin sealing device of the present invention can adopt a simple structure, the overall shape of the device can be reduced, and the mold maintenance work, in particular, the resin sealing device is provided. Maintenance and temperature management in the heater, that is, the entire resin-sealed mold can be easily performed with a uniform temperature distribution, and further, the generation of waste resin amount can be suppressed to contribute to resource saving.

The resin sealing mold and the resin sealing method according to the present invention will be described with reference to the drawings (FIGS. 1 and 2). FIG. 1 shows a process of performing resin sealing using a resin sealing molding portion equipped with a resin sealing mold in this embodiment. FIG. 2 shows an arrangement state of heaters in the resin-sealed mold corresponding to FIG.
1 and 2 are exaggerated for the sake of clarity.

  That is, the resin sealing molding portion 100 includes a resin sealing mold (mold 110) for resin sealing molding of chip-shaped electronic components (hereinafter referred to as “chips”) such as semiconductor chips, and the mold 110. A mold opening / closing mechanism (not shown) for mold opening and clamping, a press frame mechanism 130 for applying a required mold clamping pressure to the mold 110 in a state where the mold 110 is clamped, and the mold 110 A pot block 140 (resin material injection mechanism) for resin material supply arranged on the side and the pot block 140 with respect to the side surface position 110a of the mold that coincides with the mold mating surface (PL surface) of the mold 110 And a reciprocating drive mechanism 150 of the pot block 140 disposed so as to be freely separable. The injection mechanism for the resin material is a generic term including the pot block 140 and the reciprocating drive mechanism 150 described above.

  Further, although not shown, a release film is stretched between the mold surfaces of the mold 110 in order to further improve the mold release property between the mold surface and the package (resin sealing body 402). A film supply mechanism unit to be supplied and a vacuum evacuation mechanism unit for evacuating the mold 110 in a state of shutting off the outside air at the time of resin sealing molding of the mold 110 can be provided. However, in this embodiment, the film supply mechanism unit and the vacuum evacuation mechanism unit are not described. That is, release film molding and / or vacuuming (reduced pressure) molding can be performed in combination.

As shown in FIG. 2, the target substrate 400 of this embodiment is a chip portion 401 mounted on one surface of a substrate 400 formed in an arbitrary shape that is rectangular in this case by a resin material. It is to be sealed. As shown in FIG. 2, the long side of the substrate 400 is the longitudinal direction L, and the short side of the substrate 400 is the short direction S.
At least one of the chip portions 401 is sealed and molded from the longitudinal direction L of the substrate 400, that is, from the right side of the resin sealing molding portion 100 shown in FIG. 1, with a resin material (fluid resin 300) heated and melted. A resin sealing body 402 (chip portion 401) formed on the surface is formed. After the resin sealing molding, a resin-sealed substrate (product) that forms a cured resin to be a cured resin sealing body 402 (chip portion 401) is molded. For example, a BGA (Ball Grid Array) substrate, a CSP (Chip Size Package) substrate, and the like are applicable.

This embodiment shows a case where a single resin sealing range (resin sealing body 402) for resin sealing a large number of chip portions 401 is formed on one surface of one substrate 400. However, a plurality of resin sealing ranges (two or more locations) may be formed.
There are various types of chip arrangements on the substrate 400. In recent years, FIG. 2 shows a system in which a single substrate 400 is partitioned into a grid (matrix) according to a request for cost reduction, and chips are mounted in each partitioned area (chip portion 401). ing. In recent years, the number of regions in the substrate 400 tends to increase in response to a request for multi-cavity. Further, the length of the substrate 400, that is, the length of the substrate 400 in the longitudinal direction L shown in FIG.
The substrate 400 can appropriately correspond to a circuit board made of a metal lead frame, resin-based or ceramic-based printed circuit board, etc. The shape of the substrate 400 is not limited to a rectangle, and the four corners of the rectangle are chamfered. In addition, a shape obtained by extending an oval shape, an oval shape, and the like can be appropriately handled.

The mold 110 includes at least one set of mold structural units. In the illustrated example, the mold 110 includes two sets of mold structural units composed of one mold 111 and two molds 112, that is, required. A plurality of sets are stacked in the vertical direction.
Further, as shown in FIGS. 1 and 2, a supply set surface 113 of the substrate 400 is provided on the mold surface of the first mold 111, that is, the mold matching surface (PL surface). The supply set surface 113 serves as a single substrate supply unit for supplying and setting a single substrate 400 on which a chip (not shown) is mounted. That is, only one substrate 400 is supplied and set on the supply set surface 113 of the substrate 400 in the set of mold structural units. Further, the supply set surface 113 of the substrate 400 is not provided with a step for positioning the substrate, which is provided as a concave shape on the conventional mold surface. Accordingly, the supply set surface 113 of the substrate 400 is formed in a planar shape. A cavity 114 for resin molding is provided on the mold surface of the second mold 112 disposed to face the supply set surface 113 of the first mold 111.

Reference numeral 115 in FIG. 1 denotes a resin flow path for transferring a molten resin material (flowable resin 300), one end of which is formed in communication with the cavity 114, and the other end is a mold. It is formed so as to communicate with the side surface position 110a of the mating surface (PL surface).
The cavity 114 of the second mold 112 is formed with a resin flow path 115 of the flowable resin 300. The position opposite to the resin flow path 115, that is, the resin sealing molding shown in FIG. By forming an air vent (not shown) communicating with the cavity 114 on the left side of the part 100, the cavity 114 is injected by the fluid resin 300 when the fluid resin 300 is injected into the cavity 114 described later. You may make it positively extrude | pushed out through the inner air vent. Furthermore, if the above-described vacuuming (reduced pressure) molding is performed in combination, the remaining air can be more efficiently and forcibly sucked and discharged.

Therefore, according to the mold 110, in the illustrated example, the two substrates 400 are arranged in the vertical direction of the drawing, which is completely different from the parallel arrangement of the two substrates 400 in the horizontal (horizontal) direction of the conventional arrangement configuration diagram. Therefore, the dimension in the depth direction (short direction S) can be significantly shortened.
Further, even if the substrate 400 is elongated in the longitudinal direction L, one substrate 400 is placed horizontally in the longitudinal direction L with respect to one mold 110 as shown in the figure, and flows along the short direction S. The functional resin 300 can be injected into the chip portion 401.
That is, according to the resin-sealed mold (mold 110) structure of the present embodiment, in the illustrated example, the flowable resin 300 is injected into the cavity 114 via the resin flow path 115. Since it is sufficient that the conductive resin 300 is substantially filled, the compression molding method and the potting method can be appropriately handled. Further, the cavity 114 of the mold 110 is formed only on the side of the second mold 112, but in addition to this or in place of this, it can be formed on the side of the first mold 111 to cope with it appropriately.

Here, the heater H provided in the mold 110, which may be called a characteristic part of the present embodiment, will be described with reference to FIG.
The heater H is provided with at least three heaters provided in at least one mold 111, in this case, four heaters. These four heaters H (H1 to H4) are arranged as H (H1), H (H2), H (H3), H (H4) from the left side in FIG. Each of the four heaters H (H1 to H4) is provided so as to extend along the short direction S and to be aligned along the long direction L, and has the same specifications and uniform heat generation distribution. This is the biggest feature. The uniform heat generation distribution here means a heat generation distribution based on a theoretically calculated heat generation amount, that is, a theoretical heat generation distribution, and more specifically, applied to the heaters H (H1 to H4). Theoretical (in other words, calculated) heat generation distribution considering only the heat itself generated according to the energy generated, and the effect of temperature drop due to heat dissipation near both ends of the entire mold 110 (at least one mold 111) It does not mean the actual (in other words, actually measured) heat generation distribution.
Furthermore, among the three or more (in this case, four) heaters H (H1 to H4) arranged along the longitudinal direction L, the end side heater H including at least the heaters H at both ends, in this case, H (H1) H (H4) is a heater H other than the end H (H1 · H4) side, in this case, more than the two heaters H (H2 · H3) of H (H2) and H (H3) It is controlled to generate heat. The heat referred to here means the heat generated by the heater H (H1 to H4) main body without being affected by the configuration and atmosphere around the heater H.

  Therefore, according to the heaters H (H1 to H4) in this embodiment provided in the downsized resin-sealed mold (mold 110), each of the substrates 400 in one mold 111 in which one substrate 400 is disposed. A plurality of heaters H (H <b> 1 to H <b> 4) extending along the short direction S are arranged side by side along the longitudinal direction L of the substrate 400. As a result, the temperature of portions other than both ends of each heater H (H1 to H4) becomes substantially constant, so that the temperature distribution on the mold surface (substrate supply set surface 113) is made uniform along the longitudinal direction L of the substrate 400. The Further, a longer energization time may be set for the heaters H (H1 and H4) at both ends in the longitudinal direction L of the substrate 400 than for the heaters H (H2 and H3) closer to the center. As a result, the temperature drop due to heat dissipation near both ends in the longitudinal direction L of the substrate 400 is compensated, so that the mold surface (113) temperature distribution can be made more uniform along the longitudinal direction L of the substrate 400. That is, a uniform temperature distribution can be obtained along the longitudinal direction L of the substrate 400.

Although not shown in the drawing, the first mold 111 is formed at each position of a positioning pin standing at a predetermined position on the mold surface (substrate supply set surface 113) and the second mold 112 facing the positioning pin. It is a pin hole. The positioning pins and pin holes show an example in which the substrate 400 before resin sealing molding is supplied and set at a predetermined position on the substrate supply setting surface 113.
That is, when the substrate 400 is supplied and set on the substrate supply set surface 113, as shown in FIG. 2, the positioning hole 403 provided in the substrate 400 and the positioning pin are engaged with each other. For example, the substrate 400 can be efficiently and reliably supplied to a predetermined position on the substrate supply set surface 113. Further, when clamping is performed to close the two molds (111, 112) in this state, the positioning pins of the first mold 111 are in the state where the substrate 400 is locked at a predetermined position. Since it is inserted into each pin hole of the mold 112, the substrate 400 is reliably supplied and set on the substrate supply set surface 113 as shown in FIG.

The mold opening / closing mechanism described above is a mechanism for simultaneously opening or closing the two sets of mold structural units (molds 110) that are stacked (superposed) in the vertical direction, and is not shown. However, the case where a rack and pinion mechanism is employed is shown.
Although not shown in the figure, the die opening / closing mechanism has a pinion gear provided so as to rotate by driving the pressing means 132, which will be described later, and a forward and reverse rotation of the pinion gear that meshes with the pinion gear. Two rack gears are provided that move in opposite directions. It should be noted that the pinion gear may be rotated by a forward / reverse rotation drive motor (not shown) instead of or in addition to driving in the pressing means 132 described later.
One rack gear is fixed to a die mounting block having a lower end portion disposed at a lower position, and an upper end portion of the rack gear meshes with a pinion gear. Conversely, the other rack gear has its lower end engaged with the pinion gear, and its upper end fixed to a die mounting block disposed above.
In addition, a set of mold structural units composed of one mold 111 and two molds 112 are installed at respective positions on the upper surface and the lower surface of the mold opening / closing mechanism main body.

Therefore, according to such a configuration, by opening and closing the pinion gears in the forward and reverse directions, the mold opening (opening and closing the molds 1 and 111 in the two mold structural units stacked one above the other simultaneously is opened and closed ( (Not shown) and clamping (see FIG. 1) can be performed.
In this embodiment, the mold opening / closing mechanism rotates the pinion gear by driving the pressing means 132, which will be described later, and moves the rack gears meshed with the pinion gear in the up and down direction. This shows a case where two sets of mold structural units (mold 110) arranged in layers are simultaneously opened or clamped. However, the present invention is not limited to this mold opening / closing mechanism, and other configurations can be adopted. That is, any mechanism may be used as long as two sets of mold structural units (mold 110) stacked in the vertical direction are simultaneously opened or clamped. For example, as the drive source, an appropriate pneumatic drive mechanism such as an hydraulic / pneumatic mechanism, a crank mechanism, other machines, or electricity can be employed. Further, for example, the two molds 112 (or the rack gear) described above are moved up and down through such an appropriate drive source, and two sets of layers arranged in the up and down direction in conjunction with this are moved. A configuration in which the mold structural unit (mold 110) is simultaneously opened or clamped may be employed.

The press frame mechanism 130 is a mechanism for applying a required mold clamping pressure to the mold 110 in a state where the mold 110 is clamped.
The press frame mechanism 130 is provided such that it can be reciprocated along the machine base frame 101 by an appropriate reciprocating drive mechanism (not shown). The press frame mechanism 130 is provided with pressing means 132 using an appropriate pressing mechanism such as electric, hydraulic or mechanical.
Therefore, according to such a configuration, the reciprocating drive mechanism performs the alignment adjustment that moves the pressing center position 133 of the pressing means 132 in the press frame mechanism 130 to a position that matches the center position 118 of the mold 110 described above. The pressing force by the pressing means 132 can be efficiently and reliably applied to the center position 118 of the clamped mold 110. Therefore, at the time of mold clamping, the mold clamping pressure of the pressing means 132 applied to each of the mold structural units (mold 110) arranged in layers is simultaneously and equally applied to each of the mold structural units. It is done.
The center position 118 of the mold 110 means the center position of the mold 110 itself. However, as described above, the gist of the present invention is to match the substrate end portion 400a with the side surface position 110a of the mold. Therefore, the center position of the mold 110 in this case means the center position of the substrate 400 where the mold clamping pressure can be efficiently applied to the substrate 400. Then, the center position of the substrate 400 and the pressing center position 133 of the pressing means 132 can be matched by moving the press frame mechanism 130 via the above-described reciprocating drive mechanism.
Further, in this embodiment, since the mold 110 is fixed to the machine frame 101, the case where the press frame mechanism 130 described above is provided so as to reciprocate along the machine frame 101 is shown. However, the relationship between the two is relative and adopts a configuration opposite to this example, that is, a configuration in which the press frame mechanism 130 side is fixed and the mold 110 side is reciprocated. Also good.
Further, the pressing means 132 side and the mold 110 side (in the illustrated example, the mold mounting block) need to be separated from each other in order to enable the relative movement described above. However, it may be configured such that both of them can be fixed after the adjustment of the center alignment is completed. In this case, since the adjustment of the center alignment has already been completed, the vertical movement by the pressing means 132 is effectively utilized to simultaneously form two sets of mold structural units (mold 110) arranged in layers. There is an advantage that it can be used as a vertical drive mechanism for opening or clamping.

Further, the pot block 140 is disposed on the side of the mold 110, and with respect to the side surface position 110a of the mold that matches the mold alignment surface (PL surface) of the mold 110 by the reciprocating drive mechanism 150. It is provided so as to be freely separable.
The pot block 140 is provided with a resin material supply pot 141 arranged corresponding to the number of the upper and lower two sets of mold structural units (mold 110) and the arrangement position thereof, and supplied to the pot 141. A plunger 142 for pressurizing the resin material and an appropriate reciprocating drive mechanism 143 for reciprocating the plunger 142 are provided.
The pot block 140 is provided with an appropriate heater (not shown) for heating and melting the resin material (resin tablet) supplied into the pot 141 in the mold 110 (at least one mold 111). In addition to the heater H (H1 to H4). A heater (not shown) provided in the pot 141 can be selected and dealt with appropriately.
Therefore, according to this configuration, the one reciprocating drive mechanism 150 can advance the entire pot block 140 so as to join the position matching the die mating surface of the die 110. Can be retracted to separate from Further, by retracting the plunger 142 by the other reciprocating drive mechanism 143, the inside of the opening front end of the pot 141 can be made a space for supplying a resin material (resin tablet), and from this position The resin material (resin tablet) supplied to the pot 141 can be pressurized by moving the plunger 142 forward.
In addition, the mold combining surface (PL surface) of the first mold 111 and the second mold 112 in the mold structural unit and the pot 141 in the pot block 140 are joined and communicated, and the heaters H (H1 to H4). The resin material (resin tablet) in the pot 141 is heated and melted and pressurized by the plunger 142 to obtain the flowable resin 300 in the pot 141. It is possible to directly inject and fill the cavity 114 through the resin flow path 115 described above.

Further, the substrate 400 before the resin sealing molding is placed at a predetermined position of the resin sealing molding portion 100, that is, between the one mold 111 and the two molds 112 in the two upper and lower mold structure units opened. 2 is provided so that it can be carried in from the front side in the longitudinal direction L shown in FIG. 2 and the substrate 400 can be supplied and set on the substrate supply set surface 113 of the one mold 111 described above. Further, the substrate 400 after resin sealing molding (resin-sealed substrate) is locked and taken out from the substrate supply set surface 113 opened after the resin sealing molding, and the two sets of the upper and lower substrates 400 are removed. It is provided so that it can be carried out from the front side in the longitudinal direction L shown in FIG. 2 and transferred to the next process side from each between the first mold 111 and the second mold 112 in the mold structural unit. Yes.
Therefore, according to this configuration, it is possible to supply and set the substrate 400 before resin sealing molding to a predetermined position of the resin sealing molding portion 100, and to set the substrate 400 after resin sealing molding to the resin sealing molding portion. 100 can be taken out.

Further, the pot block 140 and the plunger 142 are retracted to the required positions, and the resin material (resin tablet) is placed in the space provided at the opening front end of the pot 141 in the longitudinal direction L shown in FIG. It is provided so that it can be supplied from the back side.
Therefore, according to this configuration, the resin material (resin tablet) can be supplied to each of the pots 141 in the pot block 140 by retracting to a required position.

Here, the resin sealing method in this embodiment is performed as follows, for example.
First, in the mold open state of two sets of upper and lower mold structural units (molds 110), the substrate 400 before resin sealing molding is placed between each of the molds 111 and 112 in the longitudinal direction shown in FIG. The substrate 400 is carried in from the front side of L, and the substrate 400 is set on the substrate supply set surface 113 of the first mold 111. Further, the pot block 140 is entirely retracted from the position of the mold 110 by the reciprocating drive mechanism 150, and the plunger 142 is retracted by the reciprocating drive mechanism 143 to supply the resin material (resin tablet) into the front end of the opening of the pot 141. Configure the space.
Next, the two upper and lower sets of mold structural units (mold 110) are closed via the mold opening / closing mechanism.
Next, the reciprocating drive mechanism performs alignment adjustment for moving the pressing center position 133 of the pressing means 132 in the press frame mechanism 130 to a position coinciding with the center position 118 of the mold 110, and the mold 110 is clamped. By applying a pressing force by the pressing means 132 to the center position 118, the mold clamping pressure of the pressing means 132 is simultaneously and evenly applied to each of the mold structural units (molds 110) arranged in layers ( (See FIG. 1). Further, the resin material (resin tablet) described above is supplied into the space of the pot 141 from the back side in the longitudinal direction L shown in FIG.
Next, as shown in FIG. 1, the reciprocating drive mechanism 150 joins the pot block 140 to the side surface position 110 a of the die that matches the die mating surface (PL surface) of the die 110. At this time, the mold combining surfaces of the first mold 111 and the second mold 112 in the mold structural unit and the pot 141 in the pot block 140 are joined and communicated with each other, and are supplied into the pot 141. The obtained resin material (resin tablet) is heated and melted by obtaining a uniform temperature distribution with a heater including the heaters H (H1 to H4) described above.
In other words, the heaters H (H1 to H4) provided in the miniaturized resin-sealed mold (mold 110) are each in the short direction S of the substrate 400 in one mold 111 on which one substrate 400 is disposed. By providing a plurality of heaters H (H1 to H4) extending along the longitudinal direction L of the substrate 400, the temperature of the portions other than both ends of each heater H (H1 to H4) becomes substantially constant. The temperature distribution on the mold surface (substrate supply set surface 113) is made uniform along the longitudinal direction L of the substrate 400. Further, by setting a longer energization time for the heaters H (H1 and H4) at both ends in the longitudinal direction L of the substrate 400 than for the heaters H (H2 and H3) closer to the center, the longitudinal direction L of the substrate 400 is increased. Since the temperature drop due to heat dissipation near both ends is compensated, the temperature distribution on the mold surface (113) is made more uniform along the longitudinal direction L of the substrate 400. That is, a uniform temperature distribution can be obtained along the longitudinal direction L of the substrate 400.
Next, the plunger 142 is advanced to pressurize the resin material (fluid resin 300) in the pot 141, thereby directly injecting and filling it into the cavity 114 through the resin passage 115 for transfer. Thereby, the chip portion 401 (resin sealing body 402) on the substrate 400 fitted in the cavity 114 can be resin-sealed.
Next, after the required cure time has elapsed, the pot block 140 is moved away from the side surface position 110a of the mold 110 by the reciprocating drive mechanism 150 described above. Further, the mold closing pressure on the two upper and lower mold structure units (the mold 110) by the pressing means 132 of the press frame mechanism 130 is released, and the two upper and lower mold structures are connected via the mold opening / closing mechanism. Open the unit.
Next, the substrate 400 after resin sealing molding (resin-sealed substrate) is locked and taken out from the substrate supply set surface 113 that has been opened, and the substrate 400 is taken out to the outside in the longitudinal direction shown in FIG. Unload from the front side of L and transfer to the next process side.

As described above, since the resin-sealed molded part 100 shown in this embodiment is equipped with the resin-sealed mold (mold 110) having a simple structure, its operability or workability is improved. Therefore, practical application becomes easy.
In addition, resin burr formation on the surface of the substrate 400 can be efficiently and reliably prevented without being affected by variations in the thickness of the substrate 400, so that resin sealing of electronic components having high quality and high reliability can be achieved. A stop-molded product (resin-sealed substrate) can be molded. Furthermore, the mold release action of the resin-sealed substrate can be performed more efficiently by performing mold opening that separates the other mold while the resin-sealed substrate is fixed to one mold surface.
In addition, since a simple structure can be adopted for the resin sealing device, the overall shape of the device can be reduced, and the mold maintenance work, in particular, the resin sealing die (mold 110) is provided. Maintenance and temperature control in the heaters H (H1 to H4) obtained, that is, the entire resin-sealed mold can be easily performed in a uniform temperature distribution, and further, the generation of waste resin amount is suppressed to save resources. Can contribute.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

FIG. 1 shows a process of performing resin sealing using a resin sealing molding portion equipped with a resin sealing mold in this embodiment. FIG. 2 shows an arrangement state of heaters in the resin-sealed mold corresponding to FIG. FIG. 3 shows a step of performing resin sealing using a conventional resin sealing mold.

Explanation of symbols

1 Lower mold 2 Upper mold 3 Substrate 4 Chip (electronic component)
5 wire 6 cavity 7 runner 8 cal 9 pot 10 plunger 11 resin tablet (resin material)
12 holes 13 heater 14 area
100 Resin sealing molding part
101 stand frame
110 type
Side position of 110a type
111 Type 1
112 Two types
113 Board supply set surface
114 cavity
115 Resin passage
118 center position
130 Press frame mechanism
132 Pressing means
133 Pressing center position
140 pot block
141 pots
142 Plunger
143 Reciprocating drive mechanism
150 Reciprocating drive mechanism
300 Flowable resin
400 substrates
400a board edge
401 Chip part (area)
402 Resin encapsulant
403 Positioning hole H (H1 to H4) Heater L Longitudinal direction S Short direction

Claims (7)

A resin-sealed mold used for resin-sealing a chip-shaped electronic component mounted on a single substrate having two directions of a longitudinal direction and a short direction perpendicular to the longitudinal direction. ,
A first mold to be in contact with the substrate at the time of mold clamping;
A second mold opposite to the first mold;
A cavity formed in at least one of the first mold and the second mold and filled with a flowable resin;
And at least three heaters provided in the first mold,
Each of the three or more heaters is provided so as to extend along the lateral direction and to be arranged along the longitudinal direction, and has the same specifications and a uniform heat generation distribution. Sealing type. In the resin-sealed mold according to claim 1,
Of the three or more heaters arranged along the longitudinal direction, the end side heater including the heaters at both ends is controlled to generate more heat than the heaters other than the end side heater. A resin-sealed mold. In the resin-sealed mold according to claim 1 or 2,
The first mold and the second mold are arranged to face each other in the vertical direction,
A resin flow path formed in at least one of the first mold and the second mold and communicating with the cavity through which the flowable resin flows;
An injection mechanism for a resin material that is disposed opposite to the side surfaces of each of the first mold and the second mold and is provided so as to freely advance and retract;
A pot provided to face the side surface in the injection mechanism;
With a plunger fitted in the pot so as to be able to advance and retract so as to face the side surface,
In the state where the first mold and the second mold are clamped and the injection mechanism is abutted against the side surface and the mold clamping is completed, the fluid resin in the pot is pressed by the plunger, The resin-sealed mold, wherein the pressed fluid resin is filled in the cavity along the short direction through the resin flow path. In the resin-sealed mold according to claim 3,
While there are a plurality of mold sets composed of the first mold and the second mold,
A resin-sealed mold, wherein the plurality of mold sets are arranged so as to be laminated with each other. A resin sealing method for resin-sealing a chip-shaped electronic component mounted on a single substrate having two directions of a longitudinal direction and a short direction perpendicular to the longitudinal direction,
Preparing a first mold to be in contact with the substrate at the time of mold clamping and a second mold opposed to the first mold;
Heating at least the first mold using at least three heaters provided in the first mold; and
Disposing the substrate in either the first mold or the second mold;
Clamping the first mold and the second mold;
Filling a cavity formed in at least one of the first mold and the second mold with a flowable resin;
Forming the cured resin by heating and curing the flowable resin;
Opening the first mold and the second mold; and
And a step of taking out a resin sealing body including the substrate, the electronic component, and the cured resin,
The resin characterized in that each of the three or more heaters is provided so as to extend along the lateral direction and to be arranged along the longitudinal direction, and have the same specifications and a uniform heat generation distribution. Sealing method. In the resin sealing method of Claim 5,
At least in the heating step, among the three or more heaters arranged along the longitudinal direction, an end side heater including at least both ends generates more heat than a heater other than the end side heater. The resin sealing method characterized by controlling as follows. In the resin sealing method according to claim 5 or 6,
In the mold clamping step, an injection mechanism for a resin material, which is disposed so as to face the side surfaces of the first mold and the second mold and is provided so as to freely advance and retreat, further impinges on the side surfaces. Together
In the step of filling the fluid resin, the plunger fitted in the pot so as to be able to advance and retract is pressed against the fluid resin inside the pot provided to face the side surface in the injection mechanism. And filling the cavity with the pressed flowable resin along the lateral direction.

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