JP2015088683A - 熱接合シート、及びプロセッサ - Google Patents
熱接合シート、及びプロセッサ Download PDFInfo
- Publication number
- JP2015088683A JP2015088683A JP2013227997A JP2013227997A JP2015088683A JP 2015088683 A JP2015088683 A JP 2015088683A JP 2013227997 A JP2013227997 A JP 2013227997A JP 2013227997 A JP2013227997 A JP 2013227997A JP 2015088683 A JP2015088683 A JP 2015088683A
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- JP
- Japan
- Prior art keywords
- solder
- bonding sheet
- solder region
- thermal bonding
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
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Abstract
【解決手段】熱接合シート10は、融点の異なる4種類のはんだから構成されており、第1のはんだ領域11、第2のはんだ領域12、第3のはんだ領域13、及び第4のはんだ領域14を有する。各はんだ領域の融点は、第1のはんだ領域11<第2のはんだ領域12<第3のはんだ領域13<第4のはんだ領域14の関係を有する。
【選択図】図1A
Description
開示の熱接合シートは、面方向の中央部よりも融点が高い前記面方向の周辺部を有する。
回路面を有する半導体素子と、
前記半導体素子の前記回路面の反対側の面上に開示の前記熱接合シートから形成される接合層と、
前記接合層上にヒートスプレッダと、
を有する。
開示のプロセッサによれば、従来における前記諸問題を解決し、前記目的を達成することができ、発生したボイドを接合面から除去でき、ボイドが少なく放熱性に優れるプロセッサを提供できる。
開示の熱接合シートは、前記熱接合シートの前記面方向の中央部よりも融点が高い前記面方向の周辺部を有する。
前記熱接合シートは、半導体素子と、ヒートスプレッダとの接合に好適に使用される。
前記熱接合シートは、熱伝導性に優れるシートであり、熱伝導シートともいう。
前記熱接合シートは、前記熱接合シートの面方向の中央部から前記熱接合シートの面方向の周辺部に向かって融点が漸次高いことが好ましい。
前記熱接合シートの一例を図1A及び図1Bに示す。図1Aは、熱接合シート10の一例の概略上面図である。図1Bは、図1Aのa−a断面図である。
図1A及び図1Bにおける熱接合シート10は、融点の異なる4種類のはんだから構成されており、第1のはんだ領域11、第2のはんだ領域12、第3のはんだ領域13、及び第4のはんだ領域14を有する。各はんだ領域の融点は、第1のはんだ領域11<第2のはんだ領域12<第3のはんだ領域13<第4のはんだ領域14の関係を有する。即ち、図1A及び図1Bの熱接合シート10は、熱接合シート10の面方向の中央部から熱接合シート10の面方向の周辺部に向かって融点が段階的に高くなっている。
第1のはんだ領域11、第2のはんだ領域12、及び第3のはんだ領域13は、上面から見た際、大きさの異なる同心円である。
図2A及び図2Bにおける熱接合シート20は、融点の異なる4種類のはんだから構成されており、第1のはんだ領域21、第2のはんだ領域22、第3のはんだ領域23、及び第4のはんだ領域24を有する。各はんだ領域の融点は、第1のはんだ領域21<第2のはんだ領域22<第3のはんだ領域23<第4のはんだ領域24の関係を有する。即ち、図2A及び図2Bの熱接合シート20は、熱接合シート20の面方向の中央部から熱接合シート20の面方向の周辺部に向かって融点が段階的に高くなっている。
第1のはんだ領域21、第2のはんだ領域22、第3のはんだ領域23、及び第4のはんだ領域24は、上面から見た際、大きさの異なる正方形である。
図3A及び図3Bにおける熱接合シート30は、融点の異なる4種類のはんだから構成されており、第1のはんだ領域31、第2のはんだ領域32、第3のはんだ領域33、及び第4のはんだ領域34を有する。各はんだ領域の融点は、第1のはんだ領域31<第2のはんだ領域32<第3のはんだ領域33<第4のはんだ領域34の関係を有する。即ち、図3A及び図3Bの熱接合シート30は、熱接合シート30の面方向の中央部から熱接合シート30の面方向の周辺部に向かって融点が段階的に高くなっている。
第1のはんだ領域31、第2のはんだ領域32、第3のはんだ領域33、及び第4のはんだ領域34は、上面から見た際、大きさの異なる正六角形である。
図4A及び図4Bにおける熱接合シート40内には、融点の異なるはんだが、その境界を明確に持たずに存在している。即ち、図4A及び図4Bの熱接合シート40は、熱接合シート40の面方向の中央部から熱接合シート40の面方向の周辺部に向かって融点が漸次高くなっている。
なお、図4A及び図4Bでは、熱接合シート40における融点の漸次変化を、黒の階調(濃淡)で表現しており、白に近い(薄い)ほど相対的に融点が低く、黒に近い(濃い)ほど相対的に融点が高い。
第1のはんだ領域51を構成する第1のはんだにより形成された四角柱状のはんだの周囲に、シート状の第2のはんだ(第2のはんだ領域52を構成するはんだ)を巻きつけ、更にその上からシート状の第3のはんだ(第3のはんだ領域53を構成するはんだ)を巻き付ける方法。この方法においては、各シートを巻き付ける際に、各はんだ領域が溶融して接合するように、熱プレスを行うことが好ましい。
第1のはんだ領域51を構成する第1のはんだにより形成された四角柱状のはんだを、溶融した第2のはんだ(第2のはんだ領域52を構成するはんだ)に浸漬して、第1のはんだ領域51の周囲に第2のはんだ領域52を形成する。続けて、第2のはんだ領域52が形成された四角注状のはんだを、溶融した第3のはんだ(第3のはんだ領域53を構成するはんだ)に浸漬して、第3のはんだ領域53を形成する。
なお、溶融したはんだに浸漬する際には、浸漬する四角柱状のはんだを十分に冷却することが好ましい。そうすることにより、浸漬する四角柱状のはんだの溶融を少なくして、浸漬を行うことができる。
この方法によれば、主に、y−z平面における中央部から周辺部に向かって融点が段階的に高くなる熱接合ブロックが形成可能である。
一方、溶融したはんだの温度、及び浸漬する四角柱状のはんだの冷却度合いを適宜調整することで、各はんだ領域間の界面を不明確にし、y−z平面における中央部から周辺部に向かって融点が漸次高くなる熱接合ブロックを形成することも可能である。
融点が十分に高い四角柱状の芯材を、溶融した第2のはんだ(第2のはんだ領域52を構成するはんだ)に浸漬して、前記四角柱状の芯材の周囲に第2のはんだ領域52を形成する。続けて、第2のはんだ領域52が形成された前記四角柱状の芯材を、溶融した第3のはんだ(第3のはんだ領域53を構成するはんだ)に浸漬して、第3のはんだ領域53を形成する。その後、第3のはんだ領域53が形成された熱接合ブロックから芯材を取り除き、その中央部に溶融した第1のはんだ(第1のはんだ領域51を構成するはんだ)を流し込み、冷却する。
第3のはんだ(第3のはんだ領域53を構成するはんだ)かならる中空の四角柱状のはんだの内面に、溶融した第2のはんだ(第2のはんだ領域52を構成するはんだ)を塗布し、冷却して、第3のはんだ領域53の内面に第2のはんだ領域52を形成する。続いて、第2のはんだ領域52の内面に溶融した第1のはんだ(第1のはんだ領域51を構成するはんだ)を流し込み、冷却する。
開示のプロセッサは、半導体素子と、熱接合層と、ヒートスプレッダとを少なくとも有し、更に必要に応じて、その他の部材を有する。
前記半導体素子としては、回路面を有すれば、特に制限はなく、目的に応じて適宜選択することができ、例えば、集積回路、大規模集積回路などが挙げられる。
前記熱接合層は、開示の熱接合シートから形成される。
前記熱接合層は、前記半導体素子の前記回路面の反対側の面上に形成されている。
前記ヒートスプレッダとしては、特に制限はなく、目的に応じて適宜選択することができ、例えば、熱伝導性能の良好な材料により形成される。前記ヒートスプレッダは、Cu、Al、あるいはこれをベースにした複合材料により形成することができるが、無酸素銅が好ましい。
前記ヒートスプレッダは、前記接合層上に配置されている。
図6は、プロセッサの一例の概略断面図である。
図6のプロセッサは、パッケージ基板1と、前記半導体素子としての半導体チップ2と、接合層3と、ヒートスプレッダ4と、アンダーフィル樹脂5と、スティフナ6とを有する。
パッケージ基板1への接合部の熱疲労による断線を防止するために、電極2aのパッケージ基板1への接合部には絶縁性を有するアンダーフィル樹脂5が充填される。アンダーフィル樹脂5には、エポキシ樹脂を主成分とする熱膨張率20ppm/℃〜80ppm/℃程度の合成樹脂が使用される。
(付記1) 面方向の中央部よりも融点が高い前記面方向の周辺部を有することを特徴とする熱接合シート。
(付記2) 面方向の中央部から面方向の周辺部に向かって融点が段階的に高い付記1に記載の熱接合シート。
(付記3) 面方向の中央部から面方向の周辺部に向かって融点が漸次高い付記1に記載の熱接合シート。
(付記4) 材質が、はんだを含む付記1から3のいずれかに記載の熱接合シート。
(付記5) 回路面を有する半導体素子と、
前記半導体素子の前記回路面の反対側の面上に付記1から4のいずれかに記載の熱接合シートからなる接合層と、
前記接合層上にヒートスプレッダと、
を有することを特徴とするプロセッサ。
1a 接続用バンプ
2 半導体チップ
2a 電極
3 接合層
4 ヒートスプレッダ
5 アンダーフィル樹脂
6 スティフナ
10、20、30、40 熱接合シート
11、21、31、51 第1のはんだ領域
12、22、32、52 第2のはんだ領域
13、23、33、53 第3のはんだ領域
14、24、34 第4のはんだ領域
50 熱接合ブロック
Claims (5)
- 面方向の中央部よりも融点が高い前記面方向の周辺部を有することを特徴とする熱接合シート。
- 面方向の中央部から面方向の周辺部に向かって融点が段階的に高い請求項1に記載の熱接合シート。
- 面方向の中央部から面方向の周辺部に向かって融点が漸次高い請求項1に記載の熱接合シート。
- 材質が、はんだを含む請求項1から3のいずれかに記載の熱接合シート。
- 回路面を有する半導体素子と、
前記半導体素子の前記回路面の反対側の面上に請求項1から4のいずれかに記載の熱接合シートからなる接合層と、
前記接合層上にヒートスプレッダと、
を有することを特徴とするプロセッサ。
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US14/524,047 US20150123259A1 (en) | 2013-11-01 | 2014-10-27 | Thermal interface sheet and processor |
US15/285,206 US9704775B2 (en) | 2013-11-01 | 2016-10-04 | Method for manufacturing thermal interface sheet |
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JP2020092154A (ja) * | 2018-12-05 | 2020-06-11 | 三菱電機株式会社 | 半導体装置 |
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US7183641B2 (en) * | 2005-03-30 | 2007-02-27 | Intel Corporation | Integrated heat spreader with intermetallic layer and method for making |
KR100719905B1 (ko) * | 2005-12-29 | 2007-05-18 | 삼성전자주식회사 | Sn-Bi계 솔더 합금 및 이를 이용한 반도체 소자 |
US7359416B2 (en) * | 2006-03-15 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Optical semiconductor device |
JP4589269B2 (ja) | 2006-06-16 | 2010-12-01 | ソニー株式会社 | 半導体装置およびその製造方法 |
TWI400363B (zh) | 2007-08-28 | 2013-07-01 | 羅門哈斯電子材料有限公司 | 電化學沈積之銦複合材料 |
US20100328895A1 (en) | 2007-09-11 | 2010-12-30 | Dorab Bhagwagar | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use |
JP5383795B2 (ja) * | 2009-04-22 | 2014-01-08 | パナソニック株式会社 | 半導体装置 |
US9103009B2 (en) * | 2012-07-04 | 2015-08-11 | Apple Inc. | Method of using core shell pre-alloy structure to make alloys in a controlled manner |
US9041192B2 (en) * | 2012-08-29 | 2015-05-26 | Broadcom Corporation | Hybrid thermal interface material for IC packages with integrated heat spreader |
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2013
- 2013-11-01 JP JP2013227997A patent/JP2015088683A/ja active Pending
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2014
- 2014-10-27 US US14/524,047 patent/US20150123259A1/en not_active Abandoned
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2016
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JP2001293594A (ja) * | 1994-09-29 | 2001-10-23 | Fujitsu Ltd | はんだ合金及びはんだ粉末及びはんだペースト及びプリント配線板及び電子部品及びはんだ付け方法及びはんだ付け装置 |
JP2002076606A (ja) * | 2000-06-12 | 2002-03-15 | Hitachi Ltd | 電子機器および半導体装置 |
US20070013054A1 (en) * | 2005-07-12 | 2007-01-18 | Ruchert Brian D | Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020092154A (ja) * | 2018-12-05 | 2020-06-11 | 三菱電機株式会社 | 半導体装置 |
CN111312671A (zh) * | 2018-12-05 | 2020-06-19 | 三菱电机株式会社 | 半导体装置 |
JP7080161B2 (ja) | 2018-12-05 | 2022-06-03 | 三菱電機株式会社 | 半導体装置 |
CN111312671B (zh) * | 2018-12-05 | 2024-01-05 | 三菱电机株式会社 | 半导体装置 |
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US20150123259A1 (en) | 2015-05-07 |
US9704775B2 (en) | 2017-07-11 |
US20170047269A1 (en) | 2017-02-16 |
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