JP2015076613A5 - - Google Patents

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Publication number
JP2015076613A5
JP2015076613A5 JP2014205344A JP2014205344A JP2015076613A5 JP 2015076613 A5 JP2015076613 A5 JP 2015076613A5 JP 2014205344 A JP2014205344 A JP 2014205344A JP 2014205344 A JP2014205344 A JP 2014205344A JP 2015076613 A5 JP2015076613 A5 JP 2015076613A5
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JP
Japan
Prior art keywords
manufacturing
led chip
mounting tool
forming
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014205344A
Other languages
English (en)
Japanese (ja)
Other versions
JP6626612B2 (ja
JP2015076613A (ja
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Publication date
Priority claimed from TW102136175A external-priority patent/TWI601225B/zh
Application filed filed Critical
Publication of JP2015076613A publication Critical patent/JP2015076613A/ja
Publication of JP2015076613A5 publication Critical patent/JP2015076613A5/ja
Application granted granted Critical
Publication of JP6626612B2 publication Critical patent/JP6626612B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014205344A 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法 Active JP6626612B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102136175A TWI601225B (zh) 2013-10-07 2013-10-07 發光二極體組件及製造方法
TW102136175 2013-10-07

Publications (3)

Publication Number Publication Date
JP2015076613A JP2015076613A (ja) 2015-04-20
JP2015076613A5 true JP2015076613A5 (cg-RX-API-DMAC7.html) 2017-11-09
JP6626612B2 JP6626612B2 (ja) 2019-12-25

Family

ID=52777262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014205344A Active JP6626612B2 (ja) 2013-10-07 2014-10-06 発光ダイオードモジュール及びその製造方法

Country Status (4)

Country Link
US (1) US9534747B2 (cg-RX-API-DMAC7.html)
JP (1) JP6626612B2 (cg-RX-API-DMAC7.html)
CN (2) CN104518055B (cg-RX-API-DMAC7.html)
TW (1) TWI601225B (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106876286B (zh) * 2017-02-04 2019-08-20 武汉华威科智能技术有限公司 一种极薄柔性电子芯片封装方法及产品
TWI712188B (zh) 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63262259A (ja) * 1987-04-20 1988-10-28 Matsushita Electric Ind Co Ltd 光プリンタ用書き込みヘツド
JPH03233978A (ja) * 1990-02-08 1991-10-17 Matsushita Electric Ind Co Ltd 発光装置
JPH08330633A (ja) * 1995-05-29 1996-12-13 Kyocera Corp 半導体発光装置
JP3641122B2 (ja) * 1997-12-26 2005-04-20 ローム株式会社 半導体発光素子、半導体発光モジュール、およびこれらの製造方法
JP4715301B2 (ja) * 2005-05-20 2011-07-06 ソニー株式会社 素子転写装置、素子転写方法および表示装置の製造方法
CN200969348Y (zh) * 2006-10-17 2007-10-31 宏齐科技股份有限公司 发光二极管芯片的封装结构
JP2008159937A (ja) * 2006-12-25 2008-07-10 Kyocera Corp 発光素子用集合基板および発光装置集合基板
US7834365B2 (en) * 2007-09-12 2010-11-16 Harvatek Corporation LED chip package structure with high-efficiency light-emitting effect and method of packing the same
JP5518502B2 (ja) * 2009-01-27 2014-06-11 シチズン電子株式会社 発光ダイオードの製造方法
TWI411092B (en) * 2009-06-24 2013-10-01 Led package structure with external lateral cutting beveled edges and method for manufacturing the same
US7811843B1 (en) * 2010-01-13 2010-10-12 Hon Hai Precision Industry Co., Ltd. Method of manufacturing light-emitting diode
CN102339925B (zh) * 2010-07-22 2015-11-18 赛恩倍吉科技顾问（深圳）有限公司 发光元件封装方法
KR20120067153A (ko) * 2010-12-15 2012-06-25 삼성엘이디 주식회사 발광소자, 발광소자 패키지, 발광소자의 제조방법, 및 발광소자의 패키징 방법
US8227271B1 (en) * 2011-01-27 2012-07-24 Himax Technologies Limited Packaging method of wafer level chips
JP2013197236A (ja) * 2012-03-19 2013-09-30 Asahi Glass Co Ltd 発光装置および発光装置の製造方法
CN203339225U (zh) * 2013-06-06 2013-12-11 邱东扬 无封装芯片led发光照明结构

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