JP2015047692A - 基材を化学機械研磨する方法 - Google Patents

基材を化学機械研磨する方法 Download PDF

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Publication number
JP2015047692A
JP2015047692A JP2014174665A JP2014174665A JP2015047692A JP 2015047692 A JP2015047692 A JP 2015047692A JP 2014174665 A JP2014174665 A JP 2014174665A JP 2014174665 A JP2014174665 A JP 2014174665A JP 2015047692 A JP2015047692 A JP 2015047692A
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JP
Japan
Prior art keywords
layer
polishing
substrate
chemical mechanical
hard layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014174665A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015047692A5 (enExample
Inventor
ミッシェル・ケイ・ジェンセン
K Jensen Michelle
バイニャン・チャン
Bainian Qian
フェンジィ・イエ
Fengji Yeh
マーティー・ディグルート
Degroot Marty
モハマッド・ティー・イスラム
T Islam Mohammad
マシュー・リチャード・ヴァンハネヘム
Richard Van Hanehem Matthew
ダレル・ストリング
Darrell String
ジェームズ・ムルナン
Murnane James
ジェフリー・ジェームズ・ヘンドロン
James Hendron Jeffrey
ジョン・ジー・ノーランド
G Nowland John
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2015047692A publication Critical patent/JP2015047692A/ja
Publication of JP2015047692A5 publication Critical patent/JP2015047692A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2014174665A 2013-08-30 2014-08-29 基材を化学機械研磨する方法 Pending JP2015047692A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/014,498 US9102034B2 (en) 2013-08-30 2013-08-30 Method of chemical mechanical polishing a substrate
US14/014,498 2013-08-30

Publications (2)

Publication Number Publication Date
JP2015047692A true JP2015047692A (ja) 2015-03-16
JP2015047692A5 JP2015047692A5 (enExample) 2017-09-28

Family

ID=52470535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014174665A Pending JP2015047692A (ja) 2013-08-30 2014-08-29 基材を化学機械研磨する方法

Country Status (7)

Country Link
US (1) US9102034B2 (enExample)
JP (1) JP2015047692A (enExample)
KR (1) KR20150026902A (enExample)
CN (1) CN104416453B (enExample)
DE (1) DE102014012378A1 (enExample)
FR (1) FR3009989B1 (enExample)
TW (1) TWI630066B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018533489A (ja) * 2015-11-03 2018-11-15 キャボット マイクロエレクトロニクス コーポレイション 基礎層及びこれに取付けられた窓を有する研磨パッド
WO2019074098A1 (ja) * 2017-10-12 2019-04-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP2020205443A (ja) * 2016-08-26 2020-12-24 株式会社東京精密 ウェハの表面処理装置
CN112720248A (zh) * 2020-12-16 2021-04-30 浙江工业大学 一种具有剪切膨胀特性的高效抛光盘及其制备方法

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US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
KR101853021B1 (ko) * 2017-01-12 2018-04-30 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
US10391606B2 (en) 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US11179822B2 (en) * 2017-08-31 2021-11-23 Hubei Dinghui Microelectronics Materials Co., Ltd Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material
KR102058877B1 (ko) * 2018-04-20 2019-12-24 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
WO2021011260A1 (en) * 2019-07-12 2021-01-21 Cabot Microelectronics Corporation Polishing pad employing polyamine and cyclohexanedimethanol curatives
KR102387060B1 (ko) * 2020-06-16 2022-04-14 임용성 연마제품 펀칭장치
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
US20230390889A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp pad having polishing layer of low specific gravity

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JP2005539398A (ja) * 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド
JP2007520617A (ja) * 2004-02-03 2007-07-26 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド ポリウレタン研磨パッド
US7455571B1 (en) * 2007-06-20 2008-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Window polishing pad
US20130084702A1 (en) * 2011-09-29 2013-04-04 Jia Xie Acrylate polyurethane chemical mechanical polishing layer

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JP2005539398A (ja) * 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド
JP2007520617A (ja) * 2004-02-03 2007-07-26 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド ポリウレタン研磨パッド
US7455571B1 (en) * 2007-06-20 2008-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Window polishing pad
US20130084702A1 (en) * 2011-09-29 2013-04-04 Jia Xie Acrylate polyurethane chemical mechanical polishing layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018533489A (ja) * 2015-11-03 2018-11-15 キャボット マイクロエレクトロニクス コーポレイション 基礎層及びこれに取付けられた窓を有する研磨パッド
JP7000320B2 (ja) 2015-11-03 2022-01-19 シーエムシー マテリアルズ，インコーポレイティド 基礎層及びこれに取付けられた窓を有する研磨パッド
JP2020205443A (ja) * 2016-08-26 2020-12-24 株式会社東京精密 ウェハの表面処理装置
WO2019074098A1 (ja) * 2017-10-12 2019-04-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP2019072777A (ja) * 2017-10-12 2019-05-16 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN112720248A (zh) * 2020-12-16 2021-04-30 浙江工业大学 一种具有剪切膨胀特性的高效抛光盘及其制备方法

Also Published As

Publication number Publication date
KR20150026902A (ko) 2015-03-11
DE102014012378A1 (de) 2015-03-05
FR3009989A1 (fr) 2015-03-06
TW201524676A (zh) 2015-07-01
US9102034B2 (en) 2015-08-11
FR3009989B1 (fr) 2019-05-24
US20150065014A1 (en) 2015-03-05
TWI630066B (zh) 2018-07-21
CN104416453B (zh) 2017-07-28
CN104416453A (zh) 2015-03-18

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