JP2015035554A5 - - Google Patents
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- Publication number
- JP2015035554A5 JP2015035554A5 JP2013166808A JP2013166808A JP2015035554A5 JP 2015035554 A5 JP2015035554 A5 JP 2015035554A5 JP 2013166808 A JP2013166808 A JP 2013166808A JP 2013166808 A JP2013166808 A JP 2013166808A JP 2015035554 A5 JP2015035554 A5 JP 2015035554A5
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- exposed
- resin sealing
- sealing portion
- die pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013166808A JP2015035554A (ja) | 2013-08-09 | 2013-08-09 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013166808A JP2015035554A (ja) | 2013-08-09 | 2013-08-09 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015035554A JP2015035554A (ja) | 2015-02-19 |
JP2015035554A5 true JP2015035554A5 (fr) | 2016-09-23 |
Family
ID=52543869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013166808A Pending JP2015035554A (ja) | 2013-08-09 | 2013-08-09 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2015035554A (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6791794B2 (ja) * | 2017-03-29 | 2020-11-25 | 旭化成エレクトロニクス株式会社 | 半導体装置 |
CN111615747B (zh) * | 2017-12-27 | 2023-10-03 | 三菱电机株式会社 | 半导体装置 |
CN108831871A (zh) * | 2018-06-08 | 2018-11-16 | 郑州云海信息技术有限公司 | 一种提升qfn封装零件焊接质量的设计方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3461720B2 (ja) * | 1998-04-20 | 2003-10-27 | 松下電器産業株式会社 | 樹脂封止型半導体装置 |
JP2001177007A (ja) * | 1999-12-21 | 2001-06-29 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP3524545B2 (ja) * | 2002-01-23 | 2004-05-10 | 松下電器産業株式会社 | 回路部品内蔵モジュールの製造方法 |
US7709935B2 (en) * | 2003-08-26 | 2010-05-04 | Unisem (Mauritius) Holdings Limited | Reversible leadless package and methods of making and using same |
-
2013
- 2013-08-09 JP JP2013166808A patent/JP2015035554A/ja active Pending
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