JP2015026519A - Conductive resin composition and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive conductive resin composition excellent in conductivity, adhesive property and workability.SOLUTION: The conductive resin composition contains (A) a silver coated silica particle, (B) an epoxy resin and (C) a curing agent as essential components. The (A) silver coated silica particle is contained at 35 to 90 mass% in the conductive resin composition. Also the (A) silver coated silica particle is a spherical particle having an aspect ratio of 1.0 to 1.2, a specific surface area by a gas absorption method of 0.3 to 5.0 m/g, an accumulated volume particle diameter by a laser diffraction scattering type particle size distribution measurement, Dof 1 to 10 μm, and a value of D/Drepresented by accumulated volume particle diameters Dand Dof 1.0 to 5.0 and a maximum particle diameter of 40 μm or less.

Description

  The present invention relates to a conductive resin composition used when a semiconductor element is bonded and fixed to a metal frame or the like, and a semiconductor device using the same.

  With the expansion of the advanced information society and the remarkable development of the electronics industry, the degree of integration of semiconductor elements used in transistors, ICs, LSIs, LEDs, etc. has increased, and higher heat dissipation and reliability have been demanded. . In addition, due to demands for convenience and portability of electronic products, further downsizing and higher performance are required, and in accordance with this, parts and semiconductor elements are required to be lighter, thinner, and lower in cost. Similarly, a conductive resin composition for die bonding that joins a semiconductor element and a metal frame is required to reduce weight and cost in addition to basic characteristics such as conductivity, adhesion, and workability. It has become like this.

  In general, the conductive resin composition exhibits conductivity by being highly filled with silver powder, but silver is expensive and has a specific gravity of 10.5 and is therefore likely to settle. Had a serious problem. In order to meet this demand, in recent years, conductive resin compositions containing light-weight and inexpensive silver-coated particles have been proposed.

  For example, a conductive paste containing metal-deposited crystallized glass powder that melts and reduces a metal component in glass and deposits a metal film has been proposed (see Patent Document 1). However, since the particle size is large and the silver coating is non-uniform, problems such as reduced workability, tip tilt, and insufficient conductivity are likely to occur.

  In addition, a conductive particle containing silver-coated silica particles whose surface is coated with silver, a conductive paste containing an organic binder resin and an organic solvent (see Patent Document 2), a binder and filler particles, and filler particles A conductive composition in which at least a part of the electrode is plated (see Patent Document 3) has been proposed. However, sufficient properties as an adhesive such as insufficient adhesive strength and voids are not always obtained.

Furthermore, a conductive composition containing flaky silver-coated particles having an aspect ratio (T (average thickness) / D ₅₀ ) of 0.3 to 1.0 has been proposed (see Patent Document 4). However, since the flaky particles are difficult to cover the corners with silver, the volume resistance becomes high. In addition, the flake shape is difficult to uniformly coat silver, and the specific gravity increases because the amount of coating increases. Thereby, the weight of the whole conductive resin composition increases, and the sedimentation of particles tends to occur. In addition, the flaky particles easily peel off the coated silver by an external factor such as a slight impact or stress, and problems such as a decrease in conductivity and insufficient adhesive strength are likely to occur. Moreover, since the crack at the time of a fracture | rupture extends | stretches, flaky particle | grains have low adhesive strength.

JP-A-51-53295 JP 2012-79457 A Special table 2010-539650 gazette International Publication No. 2012/118061

  The present invention has been made in response to such problems, and is an inexpensive conductive resin composition excellent in conductivity, adhesion, and workability, and reliability using such a conductive resin composition. It is an object to provide a high semiconductor device.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that a resin composition containing specific spherical silver-coated silica particles as an essential component can achieve the above-described object. It came to be completed.

The conductive resin composition of the present invention contains (A) silver-coated silica particles, (B) an epoxy resin, and (C) a curing agent as essential components. (A) 35-90 mass% of silver covering silica particles are contained in the conductive resin composition. Further, (A) the silver-coated silica particles have an aspect ratio of 1.0 to 1.2, a specific surface area of 0.3 to 5.0 m ² / g by gas adsorption method, and accumulation by a laser diffraction scattering type particle size distribution measurement method. volume particle diameter _{D 50} of 1 to 10 [mu] m, the value of _D 50 _{/ D 10} which is represented using the cumulative volume particle diameter _{D 10, D 50} of 1.0 to 5.0, and a maximum particle size of less 40μm spherical Particles.

  According to the present invention, an inexpensive conductive resin composition excellent in conductivity, adhesiveness, and workability can be provided. In addition, according to the present invention, a semiconductor device having excellent reliability can be provided by bonding a semiconductor element using the conductive resin composition having the above characteristics.

It is sectional drawing which shows an example of the semiconductor device of this invention.

  The conductive resin composition of the present invention contains (A) silver-coated silica particles, (B) an epoxy resin, and (C) a curing agent as essential components.

The silver-coated silica particles (A) are particles in which the surfaces of the silica particles are coated with silver, and are used for imparting conductivity to the conductive resin composition. (A) Silver-coated silica particles have an aspect ratio of 1.0 to 1.2, a specific surface area of 0.3 to 5.0 m ² / g by a gas adsorption method, and a cumulative volume particle by a laser diffraction scattering type particle size distribution measurement method. diameter _{D 50} of 1 to 10 [mu] m, the value of _D 50 _{/ D 10} which is represented using the cumulative volume particle diameter _{D 10, D 50} of 1.0 to 5.0, and the maximum particle size or less spherical particles 40μm is there. The silver-coated silica particles (A) may be used alone or in combination of two or more.

The core material of the silver-coated silica particles (A) is composed of silica particles.
The shape of the (A) component silver-coated silica particles is spherical. Spherical particles are preferable in terms of excellent filling properties and dispersibility when used as a conductive filler. As long as it is spherical, it may be hollow or porous, and may have a large number of protrusions on the particle surface or a large number of irregularities. The silver-coated silica particles (A) are particularly preferably silica particles in which the core silica particles are spherical.

  Spherical silica particles are produced, for example, by dropping silica melted in a melting furnace from the top and spheronizing in a cooling step. The surface of the silica particles may be subjected to a surface treatment. As a method for coating the surface of the silica particles with silver, there are a vapor deposition method, a sputtering method, an electroplating method, a displacement plating method, an electroless plating method, and the like. Moreover, when processing, the surface of a silica particle can be efficiently coat | covered by performing silver plating after activating with palladium and nickel-plating, for example. In particular, the coating treatment by the electroless plating method is preferable in that the surface of the silica particles can be uniformly and densely coated.

  The silver-coated silica particles (A) have an aspect ratio of 1.0 to 1.2. In the present invention, the aspect ratio is a value obtained by measuring (maximum major axis of particle / width perpendicular to the major axis). When the aspect ratio is within this range, when the semiconductor element is bonded to a supporting member such as a lead frame or a substrate, the silver-coated silica particles are highly filled, and the volume resistance can be reduced. Further, even when the blending amount is increased, the viscosity is hardly increased and workability is not adversely affected. When the aspect ratio is greater than 1.2, the filling rate of the silver-coated silica particles is lowered and the volume resistance is increased regardless of whether the particles are spherical particles or flaky particles, so that sufficient conductivity is obtained. Absent. Further, when the blending amount is increased, the viscosity tends to be high and workability is insufficient.

The silver-coated silica particles (A) have a specific surface area of 0.3 to 5.0 m ² / g as determined by gas adsorption. When the specific surface area is in this range, the conductive resin composition is excellent in workability, dispersibility, and volume resistance. When the specific surface area is less than 0.3 m ² / g, the viscosity and the thixotropy decrease. For example, when dispensing with a syringe having a needle diameter of 0.3 mm, dripping or stringing occurs, and satisfactory workability cannot be obtained. When the specific surface area is larger than 5.0 m ² / g, the viscosity and the thixotropy are increased, and the workability is insufficient. On the other hand, when the specific surface area is larger than 5.0 m ² / g, the silver coating amount increases and the specific gravity of the silver-coated silica particles increases, so that the particles easily settle. In addition, when the specific surface area is large, when the same amount of silver is coated on the silica particles, the coated area becomes large, and thus the thickness of the silver coating layer becomes thin. For this reason, sufficient conduction cannot be obtained, and the volume resistance increases.

The silver-coated silica particles (A) have a cumulative volume particle size D ₅₀ of 1 to 10 μm as measured by a laser diffraction / scattering particle size distribution measurement method. If D ₅₀ is in this range, the conductive resin composition which is excellent in workability. And D ₅₀ is 1μm smaller, because the viscosity of the conductive resin composition becomes high, workability is lowered. When D ₅₀ is larger than 10 μm, for example, when dispensing with a syringe having a needle diameter of 0.3 mm, nozzle clogging is likely to occur at the tip of the syringe, which may cause application failure.

The silver-coated silica particles (A) have a D ₅₀ / D ₁₀ value of 1.0 to 5.0 expressed using cumulative volume particle diameters D ₁₀ and D _{50 according} to a laser diffraction / scattering particle size distribution measurement method. It is. When the value of D ₅₀ / D ₁₀ is within this range, the conductivity and adhesiveness are excellent. When D ₅₀ / D ₁₀ is larger than 5.0, fine powder of 1.0 μm or less is increased and the silver coating area is increased. Therefore, when silica particles are coated with the same amount of silver, the silver coating layer of the entire particles The thickness of the becomes thinner. For this reason, sufficient electrical conductivity cannot be obtained. In addition, as the amount of fine powder increases, the amount of epoxy resin attached to the particles increases, so the amount of epoxy resin at the interface between the conductive resin composition and the support member and the interface between the conductive resin composition and the semiconductor element decreases. Therefore, sufficient adhesion cannot be obtained.

  When the silver-coated silica particles (A) have a maximum particle size in the range of 40 μm or less according to the laser diffraction / scattering particle size distribution measurement method, when the semiconductor element and the support member are joined, the conductive resin composition The film thickness is often 10 to 30 μm, but if silver-coated silica particles having a large particle diameter are present at this time, there is a possibility that a problem such as tilting of the semiconductor element may occur. Further, for example, when dispensing with a syringe having a needle diameter of 0.3 mm, nozzle clogging is likely to occur at the tip of the syringe, which may cause application failure.

  The silver-coated silica particles (A) preferably have a specific gravity of 2.4 to 3.6. When the specific gravity is within this range, the conductive resin composition is excellent in conductivity and dispersibility. When the specific gravity is less than 2.4, the silver coating amount is small and the silver coating layer becomes thin, so that the volume resistance increases and the conductivity decreases. When the specific gravity is larger than 3.6, the silver-coated silica particles are liable to settle. The specific gravity is more preferably 2.7 to 3.3.

  The surface of the silver-coated silica particles (A) is preferably coated with a silane coupling agent. When the silane coupling agent is coated, the adhesion and compatibility between the silver-coated silica particles and the epoxy resin increase, and the adhesive strength increases. When coating with a silane coupling agent, the surface of the silver-coated silica particles is treated with a fatty acid or a fatty acid salt, and then the outermost surface is coated with a silane coupling agent, which is most effective in adhesion, compatibility, and adhesion. . The silane coupling agent is not particularly limited and may be used alone or in combination of two or more. The silane coupling agent coating method includes a wet method and a dry method. For example, a dry method of directly adding to silver-coated silica particles, stirring and drying, a method of directly spraying and processing, a silane coupling to alcohol A method of blending an agent, adding silver-coated silica particles, stirring, and coating treatment may be mentioned.

  Examples of silane coupling agents include 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimeth Sisilane, N-2- (aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl- Butylidene) propylamine, 3-mercaptopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, 3- Ureidopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldie Xysilane, phenyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, decyltrimethoxysilane, trifluoropropyltrimethoxysilane, hexamethyldisilazane, bis (triethoxysilylpropyl) tetrasulfide, 3-isocyanatopropyltri From the viewpoint of compatibility and reactivity with epoxy resin, preferably 3-glycidoxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxy Silane, methyltrimethoxysilane, bis (triethoxysilylpropyl) tetrasulfide.

  The silver-coated silica particles (A) are preferably those whose surfaces are coated with a fatty acid or a fatty acid salt. When the fatty acid or the fatty acid salt is coated, the dispersibility and compatibility of the silver-coated silica particles are improved and the particles are prevented from aggregating. The fatty acid or fatty acid salt is not particularly limited, and may be used alone or in combination of two or more. The coating method of fatty acid or fatty acid salt includes a method of adding at the time of plating, a method of reacting in a gas phase with a heating and stirring device, a method of directly adding and stirring, a method of blending with alcohol and wet processing, and a direct spraying process. The method of doing is mentioned. Examples of fatty acids or fatty acid salts include benzotriazole, stearic acid, oleic acid, propionic acid, caprylic acid, lauric acid, myristic acid, palmitic acid, palmitoleic acid, behenic acid, acrylic acid, linoleic acid, linolenic acid, arachidonic acid And salts thereof. From the viewpoint of compatibility with epoxy resins and reactivity, oleic acid, stearic acid, and palmitic acid are preferred.

  When the total of the conductive resin composition is 100% by mass, the silver-coated silica particles of the component (A) is preferably 35 to 90% by mass. When it is within this range, a conductive resin composition excellent in conductivity, adhesiveness, and workability is obtained. If it is less than 35% by mass, it will be difficult to obtain good conductivity, and if it exceeds 90% by mass, the adhesiveness will be lowered, the workability will be significantly reduced, and the cost will be increased. More preferably, it is 40-80 mass%.

  You may mix | blend conductive particles other than (A) component with the conductive resin composition of this invention. The conductive particles other than the component (A) are preferably 50% by mass or less in total in all the conductive particles (the silver-coated silica particles of the component (A) and the conductive particles other than the component (A)). More preferably, it is 30 mass% or less, More preferably, it is only using the silver coating silica particle of (A) component.

Examples of the conductive particles other than the component (A) include silver particles, copper particles, nickel particles, aluminum particles, silver-coated copper particles, and silver nanoparticles. From the viewpoint of conductivity and workability, silver particles and silver nanoparticles are preferable. As the silver particles, those having a flaky shape or an indefinite shape having a cumulative volume particle size D ₅₀ of 0.5 to 15 μm by a laser diffraction scattering type particle size distribution measuring method are more preferable. The silver _{nanoparticles,} more preferably those _{D 50} is 5 to 300 nm, the shape is not particularly limited.

  You may mix | blend nonelectroconductive particle with the conductive resin composition of this invention in the range which does not impair the predetermined effect of this invention. The total amount of the non-conductive particles is preferably 50% by mass or less, more preferably in the total particles (the silver-coated silica particles of the component (A), the conductive particles other than the component (A), and the non-conductive particles). Is 30% by mass or less, and more preferably, only the silver-coated silica particles of the component (A) are used.

Non-conductive particles include silica, fumed silica, alumina, boron nitride, titanium oxide, barium, talc, calcium carbonate, aluminum hydroxide, and the like. From the viewpoint of workability and adhesiveness, silica and fumed silica are preferred. As the silica, a spherical one having a cumulative volume particle diameter D50 of _0.5 to 15 μm by a laser diffraction / scattering particle size distribution measurement method is more preferable. As the fumed silica, those having a primary particle size D50 of ₅ to 300 nm are more preferable, and the shape is not particularly limited.

  The conductive resin composition of the present invention preferably has a specific gravity of 1.0 to 3.0. When in this range, a conductive resin composition having excellent conductivity and dispersibility is obtained. When the specific gravity is less than 1.0, it is difficult to obtain good electrical conductivity, and when it exceeds 3.0, dispersibility and workability are lowered, and the cost is increased. More preferably, it is 1.3-2.5.

  The conductive resin composition of the present invention preferably has a viscosity of 5 to 200 Pa · s measured using an E-type viscometer (3 ° cone) at 25 ° C. and 0.5 rpm. When in this range, the conductive resin composition is excellent in workability. When the viscosity is less than 5 Pa · s, dripping or the like occurs, and when the viscosity is more than 200 Pa · s, dispensing becomes difficult and workability is deteriorated. More preferably, it is 20-180 Pa.s.

  The conductive resin composition of the present invention contains (B) an epoxy resin. The epoxy resin as the component (B) is not particularly limited, and may be used alone or in combination. As the epoxy resin as the component (B), any epoxy resin can be used as long as it has two or more glycidyl groups in one molecule.

  For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, novolac type epoxy resin, ether or polyether type epoxy resin, ester or polyester epoxy resin, urethane type epoxy resin, polyfunctional type epoxy resin, fat Cyclic epoxy resin, aliphatic epoxy resin, hydrogenated epoxy resin, naphthalene type epoxy resin, fluorene type epoxy resin, ethylene oxide modified bisphenol A type epoxy resin, propylene oxide modified bisphenol A type epoxy resin, glycidyl modified polyptadiene resin, glycidyl Modified triazine resin, silicone modified epoxy resin, aminophenol type epoxy resin, flexible epoxy resin, methacrylic modified epoxy resin, acrylic modified epoxy resin Resins, special-modified epoxy resin, dicyclopentadiene type epoxy resin, side chain hydroxyl alkyl-modified epoxy resins, long-chain alkyl-modified epoxy resin, imide modified epoxy resin, such as CTBN modified epoxy resins include, but are not limited to.

  The epoxy resin is preferably liquid at normal temperature, but even if it is solid at normal temperature, it can be diluted with another liquid epoxy resin, a reactive diluent, a solvent or the like and used in liquid form. Liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, 1,6-hexanediol diglycidyl ether, 4,4′-isopropylidenedicyclohexanol diglycidyl ether, 1,4-cyclohexanedi Methanol diglycidyl ether, 1,4-butanediol diglycidyl ether, and a flexible epoxy resin are more preferable.

  Examples of the flexible epoxy resin include flexible group-modified epoxy resins YL7175-500, YL7175-1000, YL7410 (above, trade name, manufactured by Mitsubishi Chemical Corporation), and bisphenol A-modified epoxy resins EP-4003S, EP-4000S (above. ADEKA, trade name), TSR-960, TSR-601, 1650-75MPX, EXA-4850-150, EXA-4850-1000, EXA-4816, EXA-4822 (above, DIC, trade name) , BPO-20E, BEO-60E (trade name, manufactured by Shin Nippon Chemical Co., Ltd.) and the like, and YL7175-500 and YL7175-1000 are more preferable.

  Moreover, in this invention, you may mix | blend resin components other than (B) component in order to improve stress relaxation property, adhesiveness, etc. further. Examples of the resin that can be used in combination include acrylic resins other than the component (B), polyester resins, polybutadiene resins, phenol resins, polyimide resins, silicone resins, polyurethane resins, xylene resins, and the like. These resins may be used alone or in combination of two or more. Thus, when using other resins other than an epoxy resin together, another resin can be mixed to 50 mass parts with respect to 100 mass parts of epoxy resins.

  The conductive resin composition of the present invention contains (C) a curing agent. The curing agent for component (C) is not particularly limited, and may be used alone or in combination. As the curing agent for component (C), any curing agent can be used as long as it cures the epoxy resin. For example, dicyandiamide, a phenol resin, an amine compound, a latent amine compound, a cationic compound, an acid anhydride, a special epoxy curing agent, and the like can be given. From the viewpoints of curability and adhesiveness, dicyandiamide and a phenol resin are more preferable.

  The blending amount of the component (C) is not particularly limited as long as it effectively cures the epoxy resin. (C) The compounding quantity of a component has the following preferable range according to the kind of hardening | curing agent, for example. In the case of dicyandiamide, 0.1-10 mass parts is preferable with respect to a total of 100 mass parts of the epoxy resin which is (B) component. Moreover, in the case of a phenol resin, 5-100 mass parts is preferable with respect to a total of 100 mass parts of the epoxy resin which is (B) component.

  You may mix | blend a hardening accelerator with the conductive resin composition of this invention. The curing accelerator is not particularly limited as long as it is conventionally used as an epoxy resin curing accelerator, and may be used alone or in combination. Examples of the curing accelerator include imidazole-based curing accelerators, amine-based curing accelerators, triphenylphosphine-based curing accelerators, diazabicyclo-based curing accelerators, urea-based curing accelerators, borate salt-based curing accelerators, and polyamide-based curing agents. Examples include accelerators. From the viewpoints of curability and adhesiveness, an imidazole curing accelerator and an amine curing accelerator are preferable, and an imidazole curing accelerator is more preferable.

  Specific examples of the imidazole curing accelerator include, for example, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-n-propylimidazole, 2-undecyl-1H-imidazole, 2-heptadecyl-1H- Imidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-1H-imidazole, 4-methyl-2-phenyl-1H-imidazole, 2-phenyl-4-methylimidazole, 1-benzyl 2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl -2-Echi -4-methylimidazolium trimellitate, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methyl Imidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 [2'-Ethyl-4-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine isocyanuric Acid adduct, 2-phenyl-imidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydride Ximethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl-4,5-di (2-cyanoethoxy) methylimidazole, 1-dodecyl-2-methyl-3- Examples thereof include benzyl imidazolium chloride, 1-benzyl-2-phenylimidazole hydrochloride, 1-benzyl-2-phenylimidazolium trimellitate and the like.

  Specific examples of the amine curing accelerator include, for example, ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenediamine, dimethylaminopropylamine, diethylamino. Propylamine, trimethylhexamethylenediamine, pentanediamine, bis (2-dimethylaminoethyl) ether, pentamethyldiethylenetriamine, alkyl-t-monoamine, 1,4-diazabicyclo (2,2,2) octane (triethylenediamine), N N, N ', N'-tetramethylhexamethylenediamine, N, N, N', N'-tetramethylpropylenediamine, N, N, N ', N'-tetramethylethylenedi Aliphatic amines such as amine, N, N-dimethylcyclohexylamine, dimethylaminoethoxyethoxyethanol, dimethylaminohexanol; piperidine, piperazine, menthanediamine, isophoronediamine, methylmorpholine, ethylmorpholine, N, N ′, N ″ -Tris (diaminopropyl) hexahydro-s-triazine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxyspiro (5,5) undecane adduct, N-aminoethylpiverazine Alicyclic such as trimethylaminoethylpiverazine, bis (4-aminocyclohexyl) methane, N, N′-dimethylpiverazine, 1,8-diazabicyclo (4.5.0) undecene-7, and Heterocyclic amines; o-phenylenediamine, m-phenylenedi Aromatic amines such as amine, p-phenylenediamine, diaminodiphenylmethane, m-xylenediamine, pyridine, picoline; modified polyamines such as epoxy compound-added polyamine, Michael added polyamine, Mannich added polyamine, thiourea added polyamine, ketone-capped polyamine Dicyandiamide; guanidine; organic acid hydrazide; diaminomaleonitrile; amine imide; boron trifluoride-piperidine complex; boron trifluoride-monoethylamine complex, etc. From the viewpoint of curability, imidazole-based curing accelerator 2 -Phenyl-4-methylimidazole (2P4MHZ), 2-phenyl-4,5-dihydroxymethylimidazole (2PHZ), 2-phenyl-4-methyl-5-hydroxymethylimidazole (2P4MH) Z) is more preferred.

  Although the compounding quantity of a hardening accelerator is not restrict | limited in particular, 0.1-10 mass parts is preferable with respect to a total of 100 mass parts of the epoxy resin which is (B) component, More preferably, it is 0.1. -5.0 parts by mass.

  Moreover, the reactive resin composition with the reactivity with respect to the ring-opening polymerization of an epoxy resin can be mix | blended with the conductive resin composition of this invention in order to improve workability | operativity. Specific examples thereof include, for example, n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, p-sec-butylphenyl glycidyl ether, glycidyl methacrylate, Examples include t-butylphenyl glycidyl ether, diglycidyl ether, (poly) ethylene glycol glycidyl ether, butanediol glycidyl ether, trimethylolpropane triglycidyl ether, 1,6-hexanediol diglycidyl ether, and the like. These may be used singly or in combination of two or more. Of these, phenyl glycidyl ether and t-butylphenyl glycidyl ether are more preferred. The amount of the reactive diluent used is preferably in the range in which the viscosity of the conductive adhesive composition of the present invention (value measured at 3 ° cone using an E-type viscometer) is in the range of 5 to 200 Pa · s. .

  In addition, a diluent can be blended with the conductive resin composition of the present invention for the purpose of improving workability. As a diluent, in addition to solvents, a (meth) acrylate compound can be used.

  Examples of the solvent include diethylene glycol diethyl ether, n-butyl glycidyl ether, t-butylphenyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, dioxane, hexane, methyl Cellosolve, cyclohexane, butyl cellosolve, butyl cellosolve acetate, butyl carbitol, butyl carbitol acetate, diethylene glycol dimethyl ether, diacetone alcohol, N-methylpyrrolidone, dimethylformamide, dimethylacetamide, γ-butyrolactone, and 1,3-dimethyl-2-imidazo Lysinone and the like can be mentioned.

  Examples of the (meth) acrylate compound include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl. (Meth) acrylate, 4-hydroxybutyl (meth) acrylate, 1,2-cyclohexanediol mono (meth) acrylate, 1,3-cyclohexanediol mono (meth) acrylate, 1,4-cyclohexanediol mono (meth) acrylate, 1,2-cyclohexanedimethanol mono (meth) acrylate, 1,3-cyclohexanedimethanol mono (meth) acrylate, 1,4-cyclohexanedimethanol mono (meth) acrylate, 1,2-cyclohex Diethanol mono (meth) acrylate, 1,3-cyclohexanediethanol mono (meth) acrylate, 1,4-cyclohexanediethanol mono (meth) acrylate, glycerin mono (meth) acrylate, glycerin di (meth) acrylate, trimethylolpropane mono (Meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol mono (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, neopentyl glycol mono (meth) acrylate, etc. (Meth) acrylate having hydroxyl group, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate , Tertiary butyl (meth) acrylate, isodecyl (meth) acrylate, lactyl (meth) acrylate, tridecyl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, isoamyl (meth) acrylate, isostearyl (meth) Acrylate, behenyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, other alkyl (meth) acrylates, cyclohexyl (meth) acrylate, tertiary butylcyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate , Benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, glycidyl (meth) acrylate, trimethylolpropane tri (meth) Acrylate), zinc mono (meth) acrylate, zinc di (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, neopentyl glycol (meth) acrylate, trifluoroethyl (meth) acrylate, 2,2 , 3,3-tetrafluoropropyl (meth) acrylate, 2,2,3,3,4,4-hexafluorobutyl (meth) acrylate, perfluorooctyl (meth) acrylate, perfluorooctylethyl (meth) acrylate, Ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) Acrylate, 1,3-butanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, tetramethylene glycol di (meth) acrylate, methoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, ethoxy Diethylene glycol (meth) acrylate, methoxy polyalkylene glycol mono (meth) acrylate, octoxy polyalkylene glycol mono (meth) acrylate, lauroxy polyalkylene glycol mono (meth) acrylate, stearoxy polyalkylene glycol mono (meth) acrylate, ants Roxy polyalkylene glycol mono (meth) acrylate, nonylphenoxy polyalkylene glycol mono (meth) acrylate, N, N'-methylenebis (Meth) acrylamide, N, N′-ethylenebis (meth) acrylamide, 1,2-di (meth) acrylamide ethylene glycol, di (meth) acryloyloxymethyltricyclodecane, N- (meth) acryloyloxyethylmaleimide N- (meth) acryloyloxyethyl hexahydrophthalimide, N- (meth) acryloyloxyethyl phthalimide, n-vinyl-2-pyrrolidone and the like.

  These diluents may be used individually by 1 type, and 2 or more types may be mixed and used for them. These diluents are preferably added in an amount of 1 to 20 parts by mass with respect to 100 parts by mass of the conductive resin composition, and the viscosity at 25 ° C. is preferably in the range of 5 to 200 Pa · s.

  In the conductive resin composition of the present invention, in addition to the above components, a viscosity modifier, an acid anhydride, and a coupling agent that are generally blended in this type of composition as long as the effects of the present invention are not impaired. Adhesion aids such as, curing acceleration aids such as organic peroxides, antifoaming agents, colorants, flame retardants, thixotropic agents, and other additives can be blended as necessary.

  Examples of the viscosity modifier include cellosolve acetate, ethyl cellosolve, butyl cellosolve, butyl cellosolve acetate, butyl carbitol acetate, propylene glycol phenyl ether, diethylene glycol dimethyl ether, diacetone alcohol and the like. These may be used individually by 1 type, and may mix and use 2 or more types.

  Examples of the coupling agent include silane coupling agents, titanate coupling agents, aluminum coupling agents, zirconate coupling agents, and zircoaluminate coupling agents as already described. Among these coupling agents, a silane coupling agent is preferable, and 3-glycidoxypropyltrimethoxysilane is particularly preferable. A coupling agent may be used individually by 1 type, and 2 or more types may be mixed and used for it.

  This conductive resin composition includes the above-described (A) silver-coated silica particles, (B) an epoxy resin, (C) a curing agent, and a curing accelerator, a reactive diluent, a solvent, and the like blended as necessary. These components are uniformly mixed using a high-speed mixer or the like, then kneaded with a disperse, kneader, three-roll, etc., and then defoamed to prepare easily.

  The conductive resin composition of the present invention has excellent workability with little stringiness and dripping. Also, a combination of a semiconductor element and a silver-plated copper frame, a copper frame, or a PPF frame has excellent conductivity and adhesive strength. That is, the conductive resin composition of the present invention gives an inexpensive cured product excellent in conductivity, has high adhesive strength, good workability, and has a long pot life, and voids in the cured product. Does not occur.

As more specific characteristics, the viscosity at 25 ° C. of the conductive resin composition is 5 to 200 Pa · s, the volume resistivity of the cured product is 1 × 10 ⁻¹ Ω · cm or less, and the adhesive strength is 25 ° C. It is preferable to satisfy all the ranges of 20N or more and 260 ° C and 6N or more, and the resin composition of the present invention can achieve this. The test conditions for these characteristics are based on the characteristics test conditions in the examples.

  The semiconductor device of the present invention is characterized in that a semiconductor element is bonded and fixed on a support member with the conductive resin composition of the present invention. For example, the conductive resin composition of the present invention is After the semiconductor element is mounted on the lead frame and the conductive resin composition is heated and cured, the lead portion of the lead frame and the electrode on the semiconductor element are connected by ultrasonic wire bonding at room temperature, and then Can be manufactured by sealing with a sealing resin.

  Here, examples of the bonding wire include wires made of copper, gold, aluminum, gold alloy, aluminum-silicon, and the like, but aluminum wires are preferable from the viewpoint of cost and bonding properties. The conditions such as the output of ultrasonic waves and the load at the time of bonding are not particularly limited, and may be appropriately selected within the range of ordinary methods.

FIG. 1 shows an example of a semiconductor device of the present invention.
An adhesive layer 3 that is a cured product of the conductive resin composition of the present invention is interposed between a lead frame 1 such as a copper frame and the semiconductor element 2. Further, the electrode 4 on the semiconductor element 2 and the lead portion 5 of the lead frame 1 are connected by a bonding wire 6, and these are further sealed by a sealing resin 7. In addition, as thickness of the adhesive bond layer 3, about 10-30 micrometers is preferable.

  The semiconductor device of the present invention provides an inexpensive cured product with excellent conductivity, and has a high adhesive strength and a semiconductor element bonded and fixed by a conductive resin composition having excellent workability. It has reliability. The conductive resin composition of the present invention can be widely used as an adhesive for bonding a semiconductor element onto a semiconductor element support member, and is particularly useful when applied to an adhesive for a semiconductor element.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.

<Example of production of spherical silver-coated silica particles-1>
10 g of spherical silica particles (product name: US-5, manufactured by Tatsumori Co., Ltd.) having a cumulative volume particle size D ₅₀ of 3.5 μm are alkali degreased, acid neutralized and etched, washed with water, added to the palladium dichloride solution, The mixture was stirred to obtain palladium-adhered substrate particles.

  The obtained base particles were stirred in 300 ml of deionized water for 3 minutes, and 1 g of a metallic nickel particle slurry (trade name: 2020SUS, manufactured by Mitsui Kinzoku Co., Ltd.) was added to obtain nickel particle-attached base particles.

  The obtained base particles were diluted with 1000 ml of distilled water, and 4 ml of a plating stabilizer was added and stirred. Thereafter, 150 ml of a mixed solution of 400 g / l of nickel sulfate, 100 g / l of sodium hypophosphite, 100 g / l of sodium citrate, and 6 ml of a plating stabilizer is gradually added to the substrate particle mixed solution while stirring. A nickel coating was formed on the particles. The liquid after plating was filtered, and the filtrate was washed with water and dried to obtain nickel-coated substrate particles.

The resulting nickel-coated substrate particles were mixed with 5 g of silver nitrate, 1200 ml of distilled water, and 10 g of benzimidazole, and further mixed with 30 g of succinimide and 4 g of citric acid, and adjusted by adding 10 g of glyoxylic acid. It put into the silver plating solution. After heating and stirring at 80 ° C. to perform electroless plating, the coating was washed with water, and the silver-coated particles substituted with alcohol were dried to obtain silver-coated silica particles-1. The obtained silver-coated silica particles-1 had an aspect ratio of 1.01, a specific surface area of 1.5 m ² / g, D ₅₀ = 3.8 μm, D ₅₀ / D ₁₀ = 1.8, a maximum particle size of 19 μm, and a specific gravity of 2. The silver coating amount was 27.3 mass%.

<Production example of spherical silver-coated silica particles-2>
Cumulative volume particle diameter D ₅₀ 8.3μm spherical silica particles (Tatsumori Ltd., trade name: US-10) and after the electroless plating in the same manner as spherical silver coated silica particles -1, in the plating solution Stearic acid of 0.2% by mass with respect to the amount of silver was added and stirred. Then, it wash | cleaned with water, the silver coating particle substituted by alcohol was dried, and the silver covering silica particle-2 was obtained. The obtained silver-coated silica particles-2 had an aspect ratio of 1.04, a specific surface area of 0.5 m ² / g, D ₅₀ = 8.5 μm, D ₅₀ / D ₁₀ = 1.6, a maximum particle size of 32 μm, and a specific gravity of 3. 1 and the silver coating amount was 29.2% by mass.

<Example of production of spherical silver-coated silica particles-3>
100 g of spherical silver-coated silica particles-1 are blended in a solution in which 1.0% by mass of a silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-403) and methanol are mixed and stirred. Then, filtration and drying were performed to obtain silver-coated silica particles-3 treated with a silane coupling agent. The obtained silver-coated silica particles-3 had an aspect ratio of 1.01, a specific surface area of 1.5 m ² / g, D ₅₀ = 3.8 μm, D ₅₀ / D ₁₀ = 1.8, a maximum particle size of 24 μm, and a specific gravity of 2. The silver coating amount was 27.4% by mass.

<Example of production of spherical silver-coated silica particles-4>
In the plating solution, spherical silica particles having a cumulative volume particle diameter D ₅₀ of 3.5 μm (trade name: US-5, manufactured by Tatsumori Co., Ltd.) are electrolessly plated in the same manner as the spherical silver-coated silica particles-1. The oleic acid of 0.2 mass% with respect to the amount of silver was added to and stirred. Then, it washed with water and the silver coating particle substituted with alcohol was dried, and the silver covering silica particle was obtained. 100 g of the particles were mixed in a solution obtained by mixing 1.0% by mass of a silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM-403) and methanol, stirred, filtered and dried. And silver-coated silica particles-4 treated with a silane coupling agent were obtained. Silver-coated silica particle-4 has an aspect ratio of 1.01, a specific surface area of 1.5 m ² / g, D ₅₀ = 3.8 μm, D ₅₀ / D ₁₀ = 1.8, a maximum particle size of 22 μm, and a specific gravity of 2.8. The silver coating amount was 27.3% by mass.

<Example of production of spherical silver-coated silica particles-5>
Cumulative volume particle diameter D ₅₀ 1.0μm spherical silica particles (Admatechs Co., Ltd., trade name: SO-E3,) the after electroless plating in the same manner as spherical silver coated silica particles -1, washed with water, The silver-coated particles substituted with alcohol were dried to obtain silver-coated silica particles-5. Silver-coated silica particles-5 have an aspect ratio of 1.03, a specific surface area of 6.0 m ² / g, D ₅₀ = 1.9 μm, D ₅₀ / D ₁₀ = 2.5, a maximum particle size of 18 μm, and a specific gravity of 2.6. The silver coating amount was 20.0% by mass.

<Example of production of spherical silver-coated silica particles-6>
After the cumulative volume particle diameter D ₅₀ was carried out in a manner similar to electroless plating spherical silica particles and spherical silver coated silica particles -1 8.0 .mu.m, washed with water, dried silver coating particles substituted with alcohol, the silver-coated silica Particle-6 was obtained. Silver-coated silica particles-6 have an aspect ratio of 1.29, a specific surface area of 2.2 m ² / g, D ₅₀ = 8.5 μm, D ₅₀ / D ₁₀ = 1.5, a maximum particle size of 72 μm, and a specific gravity of 4.9. The silver coating amount was 30.0% by mass.

<Example of production of spherical silver-coated silica particles-7>
After the cumulative volume particle diameter D ₅₀ was carried out in a manner similar to electroless plating spherical silica particles and spherical silver coated silica particles -1 7.0 .mu.m, stearic acid 0.2% by weight relative to amount of silver in the plating solution Was added and stirred. Then, it wash | cleaned with water and the silver coating particle substituted by alcohol was dried, and the silver covering silica particle-7 was obtained. Silver-coated silica particles-7 have an aspect ratio of 1.01, a specific surface area of 1.1 m ² / g, D ₅₀ = 7.6 μm, D ₅₀ / D ₁₀ = 1.8, a maximum particle size of 46 μm, and a specific gravity of 2.8. The silver coating amount was 29.0% by mass.

<Example of production of spherical silver-coated silica particles-8>
After the cumulative volume particle diameter D ₅₀ was carried out in a manner similar to electroless plating spherical silica particles and spherical silver coated silica particles -1 4.0 .mu.m, oleic acid 0.2% by weight relative to amount of silver in the plating solution Was added and stirred. Then, it wash | cleaned with water, the silver coating particle substituted by alcohol was dried, and the silver covering silica particle-8 was obtained. Silver-coated silica particle-8 has an aspect ratio of 1.03, a specific surface area of 4.5 m ² / g, D ₅₀ = 4.3 μm, D ₅₀ / D ₁₀ = 6.1, a maximum particle size of 22 μm, and a specific gravity of 3.0. The silver coating amount was 30.5% by mass.

The aspect ratio was measured with a scanning electron microscope SSX-550 (manufactured by Shimadzu Corporation). The specific surface area was measured with a flow-type specific surface area measuring apparatus Flow Soap II 2300 (manufactured by Shimadzu Corporation). D ₅₀ , D ₁₀ and the maximum particle size were measured with a laser diffraction / scattering particle size distribution analyzer LA-920 (manufactured by Horiba, Ltd.). The silver coating amount was calculated from the weight of silver-coated silica particles and the weight of silver-removed silica particles in which silver was dissolved with nitric acid. Table 1 summarizes the characteristics of the spherical silver-coated silica particles-1 to 8.

<Examples 1-8, Comparative Examples 1-6>
Each component was sufficiently mixed at the blending ratios shown in Tables 2 and 3, and kneaded with three rolls to prepare a conductive resin composition. After defoaming this conductive resin composition with a vacuum pump, various performances were evaluated. Details of each component used are as follows.

・ Bisphenol A type epoxy resin (epoxy equivalent 185)
・ Flexible epoxy resin (Mitsubishi Chemical Co., Ltd., trade name: YL7175-500,
Epoxy equivalent 487)
・ Phenol curing agent: Bisphenol F (Honshu Chemical Co., Ltd.)
・ Phenol curing agent: Polyparavinylphenol
(Product name: Maruka Linker M, manufactured by Maruzen Chemical Co., Ltd.)
・ Curing agent: Diciadiamide (DICY)
Curing accelerator: 2-phenyl-4-methyl-5-hydroxymethylimidazole
(Product name: 2P4MHZ, manufactured by Shikoku Kasei Co., Ltd.)
Adhesion aid: 3-glycidoxypropyltrimethoxysilane
(Product name: KBM-403, manufactured by Shin-Etsu Silicone)
Diluent: t-butylphenyl glycidyl ether
(Nippon Kayaku Co., Ltd., trade name: TGE-H)
・ Thixotropic agent: fumed silica (manufactured by Nippon Aerosil Co., Ltd., trade name: Aerosil 200)
・ Filler (flaky silver-coated glass):
Flaky silver-coated glass (Ecka, trade name: Ag / flaky glass 5/30, aspect ratio 1.25, D ₅₀ = 6.0 μm, D ₅₀ / D ₁₀ = 1.7, maximum particle size 28 μm, specific gravity 4 .6, Silver coverage 30% by mass)
・ Filler (flaky silver powder):
Flaky silver powder (made by Fukuda Metal Foil Industry Co., Ltd., trade name: AgC-221A, average particle size 6.6 μm, specific gravity 10.5)
・ Filler (silica powder):
Fused silica (manufactured by Tatsumori Co., Ltd., trade name: US-5, average particle size 3.5 μm, specific gravity 2.2)

<Evaluation method>
(1) Viscosity Using an E-type viscometer (3 ° cone) manufactured by Toki Sangyo Co., Ltd., the viscosity was measured at 25 ° C. and 0.5 rpm.
(2) Thixotropic Use an E-type viscometer (3 ° cone) manufactured by Toki Sangyo Co., Ltd., and measure the viscosity at 25 ° C. and 2.5 rpm. The viscosity ratio was calculated as thixotropy (0.5 rpm viscosity / 2.5 rpm viscosity).
(3) Sedimentation Fill the syringe with 10g of the conductive resin composition, place the syringe vertically in a 25 ° C incubator, take out the conductive resin composition on the upper and lower syringes 24 hours later, and measure the ash content did. If the sedimentation property is calculated from the following formula and is greater than 1.5%, it can be determined that sedimentation is likely to occur.
Sedimentability [%] = (Syringe lower ash-syringe upper ash) / syringe upper ash × 100
(4) Adhesive strength A conductive resin composition was applied to a silver-plated copper frame to a thickness of 20 μm, and a 2 mm × 2 mm silicon chip was mounted thereon and cured at 150 ° C. for 1 hour. After curing, the die shear strength during heating at 25 ° C. and 260 ° C. was measured using a die shear strength measuring device.
(5) Volume resistivity The conductive resin composition was printed on a glass plate so that the film thickness after curing was 40 μm and the width was 5 mm, cured at 150 ° C. for 1 hour, and then measured with a digital multimeter. .
(6) Workability 10 g of the conductive resin composition was filled in the syringe, and a shot master manufactured by Musashi Engineering Co., Ltd. was used. A dispensing test was performed on the silicon wafer substrate under the conditions of 0.8 kgf) and a gap of 100 μm. Using an optical microscope, the number of discharge failures without discharge due to angular collapse due to stringing after 100 shots and syringe clogging or liquid dripping was measured. When workability is calculated from the following formula and is greater than 10%, it can be determined that workability is poor.
Workability [%] = Number of ejection defects / 100 × 100

(7) Comprehensive evaluation Comprehensive evaluation was performed based on each above evaluation. Judgment criteria are as follows.
“X”: Viscosity less than 5 Pa · s or more than 200 Pa · s, thixotropy less than 2.0 or more than 6.0, specific gravity less than 1.0 or more than 3.0, sedimentation property more than 1.5%, adhesive strength (25 ° C.) Less than 20N, adhesive strength (260 ° C.) less than 6N, volume resistivity of 1 × 10 ⁻¹ Ω · cm, workability of more than 10%, whichever applies.
“◯”: Viscosity 5 to 200 Pa · s, thixotropy 2.0 to 6.0, specific gravity 1.0 to 3.0, sedimentation 1.5% or less, adhesive strength (25 ° C.) 20 N or higher, adhesive strength ( 260 ° C.) 6N or more, volume resistivity 1 × 10 ⁻¹ Ω · cm or less, workability 10% or less.
“◎”: Satisfies the criteria of “◯” and further satisfies all of adhesive strength (25 ° C.) of 120 N or higher and adhesive strength (260 ° C.) of 22 N or higher.

Claims (6)

A conductive resin composition comprising (A) silver-coated silica particles, (B) an epoxy resin, and (C) a curing agent as essential components,
The (A) silver-coated silica particles are contained in the conductive resin composition in an amount of 35 to 90% by mass, have an aspect ratio of 1.0 to 1.2, and a specific surface area of 0.3 to 5 by a gas adsorption method. 0.0 m ² / g, cumulative volume particle size D ₅₀ by laser diffraction scattering type particle size distribution measurement method is 1 to ₁₀ μm, and the value of D ₅₀ / D ₁₀ represented using cumulative volume particle size D ₁₀ , D ₅₀ is 1. A conductive resin composition, characterized by 0.0 to 5.0 and spherical particles having a maximum particle size of 40 μm or less.   2. The conductive resin composition according to claim 1, wherein the (A) silver-coated silica particles have a specific gravity of 2.4 to 3.6.   The conductive resin composition according to claim 1 or 2, wherein the surface of the (A) silver-coated silica particles is coated with a silane coupling agent.   The conductive resin composition according to any one of claims 1 to 3, wherein the surface of the (A) silver-coated silica particles is coated with a fatty acid or a fatty acid salt.   5. The conductive resin composition according to claim 1, having a specific gravity of 1.0 to 3.0 and a viscosity at 25 ° C. of 5 to 200 Pa · s.   6. A semiconductor device, wherein a semiconductor element is bonded and fixed by the conductive resin composition according to claim 1.

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