JP2015016538A5 - - Google Patents
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- JP2015016538A5 JP2015016538A5 JP2013146754A JP2013146754A JP2015016538A5 JP 2015016538 A5 JP2015016538 A5 JP 2015016538A5 JP 2013146754 A JP2013146754 A JP 2013146754A JP 2013146754 A JP2013146754 A JP 2013146754A JP 2015016538 A5 JP2015016538 A5 JP 2015016538A5
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- 238000004804 winding Methods 0.000 claims description 2
- 238000005296 abrasive Methods 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013146754A JP6168689B2 (ja) | 2013-07-12 | 2013-07-12 | ワイヤソー及び切断加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013146754A JP6168689B2 (ja) | 2013-07-12 | 2013-07-12 | ワイヤソー及び切断加工方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015016538A JP2015016538A (ja) | 2015-01-29 |
JP2015016538A5 true JP2015016538A5 (zh) | 2016-09-08 |
JP6168689B2 JP6168689B2 (ja) | 2017-07-26 |
Family
ID=52438059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013146754A Expired - Fee Related JP6168689B2 (ja) | 2013-07-12 | 2013-07-12 | ワイヤソー及び切断加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6168689B2 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105965707A (zh) * | 2016-06-29 | 2016-09-28 | 周维宁 | 可实现2.5d加工的多线切割机及切割工艺 |
CN107009531A (zh) * | 2017-06-06 | 2017-08-04 | 山东大学 | 一种提高线锯切割加工表面质量的工件加载装置 |
CN110076920B (zh) * | 2019-05-31 | 2021-03-26 | 江苏吉星新材料有限公司 | 一种多线切片机线网角度的测量方法 |
CN112706034B (zh) * | 2020-12-25 | 2022-10-28 | 重庆市鹏宇五金制品有限责任公司 | 一种缝纫机针生产用打磨装置 |
CN116092821B (zh) * | 2023-03-07 | 2023-06-02 | 常州欧瑞电气股份有限公司 | 一种电力互感器自动化生产线及生产工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3539773B2 (ja) * | 1994-09-19 | 2004-07-07 | 信越化学工業株式会社 | ワイヤソーおよびワイヤソーによる切断方法 |
JPH1170457A (ja) * | 1997-08-29 | 1999-03-16 | Tokyo Seimitsu Co Ltd | 固定砥粒ワイヤソー及びその被加工物切断方法 |
CH697024A5 (fr) * | 2000-09-28 | 2008-03-31 | Hct Shaping Systems Sa | Dispositif de sciage par fil. |
JP5759775B2 (ja) * | 2011-04-15 | 2015-08-05 | トーヨーエイテック株式会社 | ワイヤソー装置及び切断加工方法 |
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2013
- 2013-07-12 JP JP2013146754A patent/JP6168689B2/ja not_active Expired - Fee Related
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