JP6168689B2 - ワイヤソー及び切断加工方法 - Google Patents

ワイヤソー及び切断加工方法 Download PDF

Info

Publication number
JP6168689B2
JP6168689B2 JP2013146754A JP2013146754A JP6168689B2 JP 6168689 B2 JP6168689 B2 JP 6168689B2 JP 2013146754 A JP2013146754 A JP 2013146754A JP 2013146754 A JP2013146754 A JP 2013146754A JP 6168689 B2 JP6168689 B2 JP 6168689B2
Authority
JP
Japan
Prior art keywords
wire
workpiece
cutting
holding table
row
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013146754A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015016538A5 (zh
JP2015016538A (ja
Inventor
宮城 邦彦
邦彦 宮城
紀正 島井
紀正 島井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takatori Corp
Original Assignee
Takatori Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takatori Corp filed Critical Takatori Corp
Priority to JP2013146754A priority Critical patent/JP6168689B2/ja
Publication of JP2015016538A publication Critical patent/JP2015016538A/ja
Publication of JP2015016538A5 publication Critical patent/JP2015016538A5/ja
Application granted granted Critical
Publication of JP6168689B2 publication Critical patent/JP6168689B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2013146754A 2013-07-12 2013-07-12 ワイヤソー及び切断加工方法 Expired - Fee Related JP6168689B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013146754A JP6168689B2 (ja) 2013-07-12 2013-07-12 ワイヤソー及び切断加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013146754A JP6168689B2 (ja) 2013-07-12 2013-07-12 ワイヤソー及び切断加工方法

Publications (3)

Publication Number Publication Date
JP2015016538A JP2015016538A (ja) 2015-01-29
JP2015016538A5 JP2015016538A5 (zh) 2016-09-08
JP6168689B2 true JP6168689B2 (ja) 2017-07-26

Family

ID=52438059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013146754A Expired - Fee Related JP6168689B2 (ja) 2013-07-12 2013-07-12 ワイヤソー及び切断加工方法

Country Status (1)

Country Link
JP (1) JP6168689B2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105965707A (zh) * 2016-06-29 2016-09-28 周维宁 可实现2.5d加工的多线切割机及切割工艺
CN107009531A (zh) * 2017-06-06 2017-08-04 山东大学 一种提高线锯切割加工表面质量的工件加载装置
CN110076920B (zh) * 2019-05-31 2021-03-26 江苏吉星新材料有限公司 一种多线切片机线网角度的测量方法
CN112706034B (zh) * 2020-12-25 2022-10-28 重庆市鹏宇五金制品有限责任公司 一种缝纫机针生产用打磨装置
CN116092821B (zh) * 2023-03-07 2023-06-02 常州欧瑞电气股份有限公司 一种电力互感器自动化生产线及生产工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3539773B2 (ja) * 1994-09-19 2004-07-07 信越化学工業株式会社 ワイヤソーおよびワイヤソーによる切断方法
JPH1170457A (ja) * 1997-08-29 1999-03-16 Tokyo Seimitsu Co Ltd 固定砥粒ワイヤソー及びその被加工物切断方法
CH697024A5 (fr) * 2000-09-28 2008-03-31 Hct Shaping Systems Sa Dispositif de sciage par fil.
JP5759775B2 (ja) * 2011-04-15 2015-08-05 トーヨーエイテック株式会社 ワイヤソー装置及び切断加工方法

Also Published As

Publication number Publication date
JP2015016538A (ja) 2015-01-29

Similar Documents

Publication Publication Date Title
JP4803717B2 (ja) ワイヤソー
JP6168689B2 (ja) ワイヤソー及び切断加工方法
JP2007276097A (ja) ワイヤソー
JP2015155119A (ja) ワイヤソー及び切断加工方法
CN109624112B (zh) 金刚线切割方法
JP2010105061A (ja) ワイヤソー装置
JP2013058751A (ja) 加工物から1つ以上のウェハをスライスするためのマルチプルワイヤソーのためのワイヤスプール
CN102166793A (zh) 一种led专用多线切割机
KR101990664B1 (ko) 와이어 쏘우 장치 및 절단 가공 방법
JP2015033752A (ja) ワイヤソー
JP5759775B2 (ja) ワイヤソー装置及び切断加工方法
JP6589744B2 (ja) ワークの切断方法
JP6256870B2 (ja) ワイヤソー及びその制御方法
JP2009184023A (ja) ワイヤソーによるワーク切断方法及びワイヤソー切断装置
JP2015016538A5 (zh)
JP2018158428A (ja) ワイヤソー及び切断加工方法
KR101252702B1 (ko) 수평형 띠톱장치
JP2007230128A (ja) セラミックハニカム成形体の切断方法及び切断装置
JP2011110643A (ja) ワイヤソー
JP2011110643A5 (zh)
JP2007276048A (ja) ワイヤによるワークの切断方法
JP2014151384A (ja) ワイヤソー
JP2007111823A (ja) ワイヤ式切断装置
KR101897082B1 (ko) 잉곳 절단 장치 및 잉곳 절단 방법
CN206812252U (zh) 一种提高线锯切割加工表面质量的工件加载装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160620

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160713

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170217

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170328

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170531

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170626

R150 Certificate of patent or registration of utility model

Ref document number: 6168689

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees