JP2015012280A - Imprint device, imprint method and article manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint device capable of smoothly performing imprint processing on a plurality of pattern formation regions.SOLUTION: The imprint device performs imprint processing for hardening an imprint material supplied onto a substrate while bringing the imprint material into contact with a pattern formed on a die. The substrate includes a first region in which the pattern is formed by the imprint material, and a second region which is disposed between the first region and a neighboring first region and in which the pattern is not formed. The imprint device performs the imprint processing on a plurality of first regions so as not to harden the imprint material in the other first region when hardening the imprint material in the first region subjected to the imprint processing, and hardens the imprint material in the second region surrounded by the plurality of first regions on which the imprint processing has been performed, thereafter.

Description

  The present invention relates to an imprint apparatus that forms a pattern on a resin on a substrate by an imprint process, an imprint method, and an article manufacturing method.

  As a technique for manufacturing a device such as a semiconductor device, there is known an imprint technique in which a resin is applied to a substrate and the resin is cured in a state where an original is pressed against the resin (Patent Document 1 and Patent Document 2). ). In the imprint apparatus, as a method of applying the resin to the substrate, there is a method of applying the resin to the entire surface of the substrate in advance with a dedicated application device before sending the resin to the imprint apparatus. An imprint process is performed for each shot region in which the resin is applied to the entire surface of the substrate by irradiating ultraviolet rays to cure the resin.

US Pat. No. 5,772,905 US Pat. No. 6,873,087

  A conventional imprint process will be described with reference to FIGS. When performing imprint processing, first, in step (A), the internal pressure of the hollow space portion 105d on the back surface side of the pattern portion 105b of the original plate 105 is increased, and the thin portion 105c bulges downward as indicated by a broken line and starts deformation. . At this time, the pattern portion 105b of the original 105 is also deformed so as to have a downward convex shape, and the operation of transferring the pattern of the original 105 to the resin 1a is started by contacting the resin 1a on the substrate 1 from near the center. . In step (B), the original plate 5 and the substrate 1 are aligned by aligning the original plate side mark and the substrate side mark by the alignment scope 11a in a state where the pattern portion 105b is completely imprinted on the resin 1a. . In the step (C) where the alignment is completed, the resin is irradiated with ultraviolet light through the original plate 105. The ultraviolet light irradiation region 6a in the original 105 is provided wider than the pattern portion 105b. By irradiating the resin 1a with ultraviolet light that has passed through the original plate 105, the resin 1a starts to cure by a photochemical reaction. At this time, as shown in FIG. 12C, the ultraviolet light around the angle of view of the pattern portion 105b leaks to the outside of the irradiation region 6a by being reflected by the substrate 1 and the original 105. Due to the influence of the ultraviolet light leaking to the outside of the irradiation region 6a, the cured portion 1b of the resin 1a spreads over the black portion region 6b shown in FIG. The resin changes from a fully cured state to a semi-cured state as it goes outward from the irradiation region 6a.

  The manner in which the imprint process shown in FIG. 12 is performed on two adjacent shot areas will be described with reference to FIG. As shown in FIG. 13A, a region AR3 where a pattern is not formed is arranged between two adjacent regions AR1 and AR2 which are regions where a pattern is formed. When the imprint process is performed on the area AR1, the ultraviolet light is irradiated so as to cover the area AR1 and the area AR3 located around the area AR1. That is, the ultraviolet light irradiation region 6a on the original plate 105 when the imprint process is performed on the region AR1 is a region shown in FIG. 13A and does not include the other pattern formation region AR2. However, as described above, the ultraviolet light leaks to the outside of the irradiation region 6a, so that the curing proceeds to the resin of the other pattern formation region AR2, and the region 6b of the cured portion 1b may extend to the other pattern formation region AR2. . Then, as shown in FIG. 13C, when imprint processing is performed on another pattern formation area AR2, the pattern portion 105b comes into contact with the cured portion 1b. As a result, normal alignment cannot be performed, or the pattern portion 105b cannot normally enter the resin 1a, and imprint processing cannot be performed normally.

  An object of the present invention is to provide an imprint apparatus that can smoothly perform imprint processing on a plurality of pattern formation regions.

  One aspect of the present invention is an imprint apparatus that performs an imprint process for curing the imprint material in a state where the imprint material supplied on the substrate is in contact with the pattern formed on the mold. The substrate includes a first region where a pattern is formed by the imprint process, and a second region which is disposed between a first region adjacent to the first region and no pattern is formed. The apparatus performs the imprint processing on the plurality of first regions so that the imprint material in the other first region is not cured when the imprint material in the first region targeted for the imprint processing is cured. And then curing the imprint material in the second region surrounded by the plurality of first regions where the imprint process has been performed.

  ADVANTAGE OF THE INVENTION According to this invention, the imprint apparatus which can perform an imprint process smoothly with respect to several pattern formation area can be provided.

The figure which shows an example of the imprint apparatus which concerns on this invention Illustration of coating device The figure explaining the sequence of the imprint process of Example 1. The figure explaining the original edition of the imprint device The figure explaining the sequence of the imprint process of Example 1. The figure explaining the ultraviolet light irradiation area | region and hardening part of Example 1. FIG. The figure explaining the sequence after the imprint process of Example 1 The figure explaining the sequence after the imprint process of Example 1 The figure explaining the ultraviolet irradiation region of Example 1 The figure explaining the sequence after the imprint process of Example 2 The figure explaining the ultraviolet light irradiation area | region of Example 2. FIG. The figure explaining the sequence of the imprint process of a prior art A diagram for explaining a conventional ultraviolet irradiation region and a cured portion

Hereinafter, an imprint apparatus that performs imprint processing for irradiating light and curing the resin while bringing the pattern formed on the original plate into contact with the resin supplied to the substrate will be described with reference to FIGS.
[Example 1]
The imprint apparatus according to the first embodiment will be described with reference to FIG. In Example 1, an example in which the present invention is applied to an ultraviolet light curable imprint apparatus that cures a resin by irradiating ultraviolet light will be described. However, the present invention can also be applied to an imprint apparatus that cures a resin by irradiation with light in other wavelength ranges.

  The imprint apparatus is configured to form a pattern in a plurality of regions of the substrate (wafer) 1 by repeating the imprint process in a region (first region) where a pattern is to be formed. The imprint process is a cycle in which a pattern is formed in one region of the substrate 1 by curing the resin while the original plate 5 is pressed against the uncured resin on the substrate 1. The original 5 is also called a mold or a mold. By transferring the pattern of the original 5 to the substrate 1, an element pattern corresponding to the pattern of the original 5 is formed on the substrate 1.

  The substrate 1 is held by a substrate chuck 2 provided on the substrate stage 3. The substrate stage 3 moves the substrate 1 held by the substrate chuck 2 in two directions (X direction and Y direction) orthogonal to each other. The base frame 4 supports and positions the substrate stage 3. An uneven pattern is formed on the surface of the original 5. When the original 5 is pressed against the ultraviolet curable resin (imprint material, resist) on the substrate 1, the pattern of the original 5 is transferred to the resin on the substrate 1. The original plate driving unit 5a drives the original plate 5 in the Z direction. The original plate driving unit 5a performs a stamping operation in which the original plate 5 is brought into contact with the uncured resin on the substrate 1 and pressed. The irradiation unit (first irradiation unit) 6 generates ultraviolet light and irradiates the uncured resin with ultraviolet light through the pattern surface of the original 5 to cure it. The irradiation unit 6 includes a light source such as a halogen lamp that generates i-line and g-line, and an optical system that collects and shapes the ultraviolet light generated by the light source. The imprint apparatus of Example 1 is an irradiation unit (second irradiation unit) that generates ultraviolet light and irradiates the uncured resin with ultraviolet light without passing through the pattern surface of the original 5 to cure it. Prepare. The function of the irradiation unit 13 will be described later. The control unit C controls the original plate driving unit 5a, the substrate stage 3, the irradiation unit 6, the alignment scope 11, and the like.

  FIG. 2 shows a coating device (dispenser) 7 for coating a resin on the substrate 1. The coating device 7 supplies the uncured resin stored in the tank 7c from the nozzle 7a onto the substrate 1 through the pipe 7b. In the example of FIG. 2, the resin is dropped on the central portion of the substrate 1 in a state where the substrate 1 supported on the turntable 7d is rotated, so that the resin is uniformly applied to the entire upper surface of the substrate 1 by centrifugal force. To be applied. The coating apparatus 7 may be provided in the imprint apparatus, or may be an apparatus different from the imprint apparatus. When the coating apparatus 7 is provided outside the imprint apparatus, after the resin is supplied onto the substrate 1 by the coating apparatus 7, the substrate 1 supplied with the resin is carried into the imprint apparatus. Returning to FIG. 1, the alignment scope 11 is a microscope that aligns the positions of the original side mark formed on the original plate 5 and the substrate side mark formed on the substrate 1, and measures how the two marks overlap with each other. Then, mutual alignment is performed. The surface plate 12 supports the irradiation unit 6, the original plate driving unit 5a, and the like.

  Next, the imprint process according to the first embodiment will be described with reference to FIGS. In step A (FIG. 3A), the control unit C mounts the substrate 1 on the substrate chuck 2 provided on the substrate stage 3. In step B (FIG. 3B), the control unit C lowers the original 5, and the original 5 and the substrate 1 are contacted by the alignment scope 11 while the original 5 and the substrate 1 are in contact and the resin is uncured. The relative position between the original 5 and the substrate 1 is adjusted by superimposing them. In step C (FIG. 3C), the control unit C further lowers the original 5 to the substrate 1 side by the original driving unit 5a, and presses the pattern portion 5b of the original 5 against the resin to transfer the pattern. In step D (FIG. 3D), the control unit C irradiates the resin with ultraviolet light from the irradiation unit 6 through the original plate 5. In this step D, the resin is cured. In step E (FIG. 3E), the control unit C peels off the original plate 5 from the substrate 1 by the original plate drive unit 5a and retracts it, thereby forming a patterned resin layer on the substrate 1 and ending the imprint process. .

  A detailed configuration of an imprint apparatus that forms the pattern of the original 5 on the substrate 1 by performing the above steps A to E will be described. FIG. 4 shows a top view and a side sectional view of the original 5. The original 5 includes a pattern portion 5b on which a pattern is formed, a thin portion 5c, and a hollow space portion 5d formed on the back side of the thin portion 5c. The internal pressure of the hollow space 5d is controlled by the pressure controller 5g. The original 5 is held by the original holding unit 5f.

  The imprint process will be described with reference to FIG. First, in step A (FIG. 5A), the control unit C increases the internal pressure of the hollow space 5d by the pressure control unit 5g, and causes the thin portion 5c to bulge downward and be deformed as indicated by a broken line. At this time, the pattern portion 5b is also deformed so as to be convex downward, and the operation of transferring the pattern of the original 5 to the resin 1a in contact with the resin 1a on the substrate 1 from near the center is started. In step B (FIG. 5B), the control unit C aligns the original side mark and the substrate side mark with the alignment scope 11a in a state where the pattern portion 5b is completely imprinted on the resin 1a, whereby the original 5 and the substrate are aligned. Align with 1. In the process C (FIG. 5C) in which the original 5 and the substrate 1 are aligned, the control unit C is irradiated with ultraviolet light from the irradiation unit 6 only on the pattern formation region targeted for imprint processing, thereby forming other patterns. Irradiate ultraviolet light so that the region is not irradiated. For example, the ultraviolet light irradiation region 6a in the original 5 is made to coincide with the region of the pattern portion 5b as shown in FIG. By irradiating the resin 1a with the ultraviolet light transmitted through the original plate 5, the resin 1a starts to be cured by a photochemical reaction. At this time, in Step C, the ultraviolet light around the angle of view of the pattern portion 5b is reflected by the substrate 1 and the original plate 5 and leaks outside the irradiation region 6a. As shown in FIG. 5D, the cured portion 1b of the resin 1a reaches the region 6b due to the influence of the ultraviolet light leaking outside the irradiation region 6a. The resin changes from a fully cured state to a semi-cured state as it goes outward from the irradiation region 6a. However, in the first embodiment, the ultraviolet light reflected by the substrate 1 and the original plate 5 reaches the resin in the adjacent pattern formation region by irradiating the ultraviolet light so that the ultraviolet light is incident only on the pattern portion 5b. I try not to leak. That is, the ultraviolet light reflected by the substrate 1 and the original plate 5 and leaking outside the pattern portion 5b remains in the region where the pattern is not formed (second region) between the adjacent pattern formation regions, and other adjacent It is configured not to reach the pattern formation region.

  The relationship between the pattern portion 5b and the cured region of the resin will be described using FIG. FIG. 6A shows the relationship between two adjacent pattern formation regions AR1 and AR2, a region AR3 where no pattern is formed, and an ultraviolet light irradiation region 6b in the resin 1a on the substrate 1. FIG. Each of the two pattern formation areas AR1 and AR2 is the same size as the pattern portion 5b of the original 5 and coincides with the ultraviolet light irradiation area 6a on the original 5. The ultraviolet light irradiation area 6a on the original 5 may be larger than one pattern formation area if the irradiation area 6b in the corresponding resin 1a does not reach the adjacent pattern formation area. Further, the ultraviolet irradiation region 6a on the original 5 may be smaller than one pattern formation region as long as the irradiation region 6b in the corresponding resin 1a extends to the adjacent pattern formation region. In the example shown in FIG. 6A, the ultraviolet light irradiation area 6 a on the original 5 is the same size as one pattern formation area, the pattern portion 5 b of the original 5. The ultraviolet light irradiation region 6b in the resin 1a includes all of one pattern formation region and a part of the region AR2 where no pattern is formed, and does not reach the adjacent pattern formation region. The size (shape) of the ultraviolet light irradiation region 6a can be determined, for example, by driving a light shielding member provided in the imprint apparatus. Further, the ultraviolet light generated by the light source may be condensed and shaped in an arbitrary irradiation region 6a by an optical system included in the irradiation unit 6.

  The present invention is characterized in that the ultraviolet light irradiation region 6b of the resin 1a on the substrate 1 does not reach the adjacent pattern formation region. By providing this feature, the present invention suppresses the leakage of ultraviolet light to the adjacent pattern formation region. For this reason, as shown in FIG. 6B, the cured portion 1b of the resin does not overlap with the substrate side mark or the original plate side mark during alignment of the adjacent pattern formation region. Further, as shown in FIG. 6C, the cured portion 1b of the resin does not come into contact with the pattern portion 5b of the original 5 when performing the imprint process on the adjacent pattern formation region. Therefore, it is possible to smoothly perform the imprint process for the adjacent pattern formation region.

  Next, with reference to FIG. 7 and FIG. 8, the ultraviolet light irradiation performed for completely curing the uncured region and the partially cured region of the resin between the adjacent pattern forming regions will be described. After the imprint process is completed for all of the pattern formation regions, the irradiation unit 13 is used to perform ultraviolet light irradiation for completely curing the uncured region and the partially cured region of the resin on the substrate 1.

  In the first step A (FIGS. 7A and 8A), the control unit C drives the substrate stage 3 to start irradiating the substrate 1 with the irradiation unit 13, as shown in FIGS. 7A and 8A. Move to position. Next, in step B (FIGS. 7B and 8B), the control unit C applies an irradiation unit to the entire region where the resin on the substrate 1 exists, as shown in FIGS. 7B and 8B. The irradiation of the ultraviolet light 13a is started by 13, and the substrate stage 3 is driven in the state where the ultraviolet light 13a is irradiated. Therefore, the region irradiated with ultraviolet light by the irradiation unit 13 is the entire surface on the substrate 1. FIG. 9 shows a region (FIG. 9A) irradiated with ultraviolet light during imprint processing by the irradiation unit 6 and a region (FIG. 9B) irradiated with ultraviolet light after the imprint processing by the irradiation unit 13. When the irradiation of the ultraviolet light 13a is completed on the entire surface of the substrate 1, the resin on the substrate 1 is completely cured (step C (FIGS. 7C and 8C)).

[Example 2]
In Example 1, the second ultraviolet light irradiation after the imprint process was applied to the entire surface of the substrate 1. In Example 2, the region where the second ultraviolet light irradiation after the imprint process is performed is limited to an uncured region of resin on the substrate 1, a partially cured region, that is, a region where no pattern is formed. The irradiation part 13 in Example 2 irradiates ultraviolet light only to the area | region where the pattern which exists between adjacent pattern formation areas is not formed. FIG. 11 shows a region (FIG. 11A) irradiated with ultraviolet light at the time of imprint processing by the irradiation unit 6 and a region (FIG. 11B) irradiated with ultraviolet light after the imprint processing by the irradiation unit 13.

  When the imprint process is completed, the control unit C first drives the substrate stage 3 to move the substrate 1 to the irradiation start position of the irradiation unit 13 as shown in FIG. 10A. Next, as shown in FIG. 10B, the control unit C drives the substrate stage 3 in a state where the ultraviolet light 13a is irradiated on a portion extending in the Y-axis direction in a region where no pattern is formed. Next, as shown in FIG. 10C, the control unit C drives the substrate stage 3 in a state where the ultraviolet light 13a is irradiated to a portion extending in the X-axis direction in a region where no pattern is formed. Then, as shown in FIG. 10D, the irradiation of the ultraviolet light 13a with respect to the entire region where the pattern on the substrate 1 is not formed is completed.

  In Example 2, after the imprint process for all the pattern formation regions on the substrate was completed, the irradiation unit 13 irradiated the ultraviolet light 13a. However, after the imprint process is performed on the plurality of pattern forming regions, the irradiation unit 13 may irradiate the ultraviolet light 13a to the region where the pattern surrounded by the plurality of pattern forming regions is not formed. Good.

  In any of the above-described examples, the imprint method of the photocuring method in which the resin is cured by irradiating light has been described. However, the present invention is not limited to the photocuring method. An imprint method may be used. However, since the spread of the cured portion 1b of the resin is greatly expanded as compared with the heating region due to heat conduction, a region narrower than that during photocuring is heated. The imprint apparatus includes a heat shield member that limits the heating region, and the heating region is determined by driving the heat shield member.

[Product Manufacturing Method]
In a method for manufacturing a device (semiconductor integrated circuit device, liquid crystal display device, MEMS, etc.) as an article, a pattern is transferred (formed) to a substrate (wafer, glass plate, film-like substrate, etc.) using the above-described imprint apparatus. Includes steps. Further, the manufacturing method may include a step of etching the substrate to which the pattern has been transferred. When manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method includes other processing steps for processing the substrate to which the pattern has been transferred, instead of the etching step. May be included.

Claims (9)

An imprint apparatus that performs an imprint process for curing the imprint material in a state where the imprint material supplied on the substrate is in contact with the pattern formed on the mold,
The substrate includes a first region where a pattern is formed by the imprint process and a second region where a pattern is not formed and is disposed between a first region adjacent to the first region,
The imprint apparatus performs the imprint process in a plurality of first areas so that imprint materials in other first areas are not cured when the imprint material in the first area to be subjected to the imprint process is cured. Then, the imprint material in the second region surrounded by the plurality of first regions where the imprint process has been performed is cured.   The imprint apparatus according to claim 1, wherein the imprint process is performed on all the first regions on the substrate, and then the imprint material in the second region is cured.   The imprint apparatus according to claim 1, wherein the imprint material is cured by irradiating light.   The imprint apparatus according to claim 3, wherein the imprint material in the second region is cured by irradiating the second region with light without passing through the pattern surface.   A first irradiation unit that irradiates light to the first region via the pattern surface, and a second irradiation unit that irradiates light to the second region without passing the pattern surface. The imprint apparatus according to claim 3 or 4.   The imprint apparatus according to claim 5, wherein the second irradiation unit irradiates only the second region with no light passing through the pattern surface.   The imprint apparatus according to claim 5, wherein the second irradiation unit irradiates light to the first region and the second region without passing through the pattern surface. An imprint method for performing an imprint process for curing the imprint material in a state where the imprint material supplied on the substrate and the pattern formed on the mold are in contact with each other,
The substrate includes a first region in which a pattern is formed and a second region in which a pattern is not formed and is disposed between the first region adjacent to the first region,
The imprint method is:
Performing the imprint process on a plurality of first regions so that the imprint material in the other first region is not cured when the imprint material in the first region to be subjected to the imprint process is cured. ,
Curing the imprint material in the second region surrounded by the plurality of first regions where the imprint process has been performed;
The imprint method characterized by including. Forming a pattern on a substrate using the imprint apparatus according to claim 1;
Processing the substrate on which the pattern is formed in the step;
The manufacturing method of the articles | goods containing this.

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