JP2017147283A - Transfer method for fine structure and transfer device for fine structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable transfer of a fine structure to a transfer destination body with high precision.SOLUTION: An irregular pattern is formed on a fine structure mold 24, the irregular pattern is pre-filled with resin 22, and the fine structure mold 24 is pressed against a transfer destination body 21 to transfer the resin 22 of the fine structure mold 24 to the transfer destination body 21, whereby the fine structure can be transferred to the transfer destination body 21 with high precision.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a fine structure transfer method and a fine structure transfer apparatus for transferring a fine structure to a transfer target.

  In recent years, in optical parts used in products such as displays and lighting, light is formed by forming fine patterns on the surface of optical parts, etc. on the order of nanometers (nm) to microns (μm), which exhibit special optical properties. Therefore, it is desired to realize a device that has an unprecedented new function in which reflection and diffraction are controlled. In addition, in semiconductors such as system LSIs, miniaturization of wiring accompanying high integration is also desired. As a method for forming such a fine structure, a UV curable resin is applied to a transfer object, and the mold shape is transferred to the transfer object by irradiating the UV light with the mold pressed against the UV curable resin. The UV imprint method is attracting attention. For example, the method described in Patent Document 1 is known.

FIG. 11 is a schematic diagram of a process flow in Patent Document 1.
First, in step a in FIG. 11, the transfer material 12 is applied over the entire surface of the substrate 11, which is an object to be transferred, using a spin coating method or the like.

  Next, in step b of FIG. 11, the substrate 11 is placed on the flat stage 13, and the thin microstructured mold 14 is placed above the substrate 11 using the gripping tool 17, and then further cylindrically added from above. The pressure roller 151 is sequentially moved in the horizontal direction while pressing the microstructure mold 14. At the same time, UV transfer is performed by the UV irradiator 16 from the rear side in the traveling direction of the pressure roller 151 to cure the transfer material 12.

  Finally, in step c of FIG. 11, the pressure roller 151 is moved in the opposite direction and at the same time the gripping tool 17 is moved upward, whereby the microstructure mold 14 is released from the cured transfer material 12, and the substrate 11. The transfer material 12 is transferred in the form of a microstructure mold 14 onto it.

JP 2014-54735 A

  However, when the microstructure mold 14 is pressed against the transfer material 12 previously applied to the substrate 11, the transfer material 12 is not sufficiently filled into the fine irregularities of the microstructure mold 14, and bubbles are mixed. For example, a fine structure including the defect 140 as shown in FIG. 12 may be formed.

  In view of the above-described conventional problems, an object of the present invention is to transfer a fine structure to a transfer target with high accuracy.

  In order to achieve the above object, a fine structure transfer method according to an embodiment of the present invention is a fine structure transfer method for forming a fine structure on a transfer object, and a concavo-convex pattern corresponding to the fine structure is provided. The application step of applying a resin to the concave portion of the concave / convex pattern of the mold formed on the surface, and the surface on which the resin is applied and the formation surface on which the fine structure of the transferred body is formed face each other. A placement step of placing the transfer body, a pressurization step of relatively moving the mold and the transfer body so that the resin comes into contact with the transfer body and pressurizing each other, and on the transfer body The method includes a curing step for curing the resin, and a mold release step for relatively separating the mold and the transferred body to transfer only the resin to the transferred body.

  The fine structure transfer device according to an embodiment of the present invention is a fine structure transfer device that forms a fine structure on a transfer object, and has a concavo-convex pattern corresponding to the fine structure formed on a surface thereof. A mold in which a concave portion of a concavo-convex pattern is filled with a resin, a gripping tool that relatively moves the mold and the transferred object, a pressure tool that presses the mold against the transferred object, and the resin is cured. And a resin curing device.

  As described above, by forming a concavo-convex pattern on the microstructure mold, filling the concavo-convex pattern with resin in advance, pressurizing the microstructure mold onto the transfer object, and transferring the resin of the microstructure mold onto the transfer object, A fine structure can be transferred to a transfer target with high accuracy.

Schematic diagram illustrating a fine pattern transfer method and transfer device according to an embodiment of the invention Schematic diagram illustrating an example of a resin coating method and a coating apparatus in an embodiment of the present invention The schematic diagram which illustrates the state of the resin apply | coated by the resin application | coating method in embodiment of this invention Schematic diagram illustrating an example of a resin coating method and a coating apparatus in an embodiment of the present invention Schematic diagram illustrating an example of a resin coating method and a coating apparatus in an embodiment of the present invention Schematic diagram illustrating an example of a resin coating method and a coating apparatus in an embodiment of the present invention Schematic diagram illustrating an example of a pressurizing method and pressurizing apparatus in an embodiment of the present invention Schematic diagram illustrating an example of a pressurizing method and pressurizing apparatus in an embodiment of the present invention The schematic diagram explaining the example of the coating method and coating device of the resin in the modification of this invention The schematic diagram explaining the example of the resin flow state at the time of pressurization in the modification of this invention Schematic diagram showing an overview of conventional roller-type UV imprint technology Schematic diagram for explaining the problems of the conventional imprint method

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic view illustrating the process flow of the imprint method according to the embodiment of the invention.

  Compared with the conventional process, the imprint method, which is a fine structure transfer method according to the present embodiment, does not apply resin to the substrate as in the prior art, but has an uneven pattern corresponding to the microstructure to be formed on the substrate. The first feature is that it is a method of applying a resin to a mold having the same. The first feature makes it possible to sufficiently fill the inside of the concave portion of the fine concavo-convex pattern formed in the mold. For this reason, mixing of bubbles into the applied resin can be prevented, and high-accuracy transfer can be realized.

  Further, in the present embodiment, when the mold is pressed against the transfer object, the second feature is that the center of the transfer object is first pressed, and then the pressure range is sequentially applied to the outer peripheral side of the transfer object. You can spread it. According to the second feature, even if bubbles are mixed in the resin at the time of pressurization, the mixed bubbles can be driven out by pressing from the center toward the outer end side. Therefore, according to this feature, it is possible to suppress the mixing of bubbles into the resin and realize more accurate transfer.

  Further, in addition to the second feature, as a third feature, the transfer surface of the transfer target may be held downward and the transfer surface may be pressurized from below. With this feature, it is possible to suppress the resin from flowing out of the mold, and to achieve further high accuracy.

Hereinafter, the transfer method according to the present embodiment will be described in detail.
Step a in FIG. 1 is a resin application step of applying a resin to a mold having a fine uneven pattern corresponding to a fine structure. First, for example, a light-transmitting film-like microstructure mold 24 having a fine concavo-convex pattern formed on the surface is prepared as a mold. Next, the outer end of the film-like microstructure mold 24 is held and fixed by the holding tool 27. Further, a UV curable resin 22 is prepared as a resin. Thereafter, the UV curable resin 22 is applied to the surface of the film-like microstructure mold 24 on which the concavo-convex pattern is formed, and the UV curable resin 22 is sufficiently filled in the concave portions of the concavo-convex pattern. Various application means may be considered, and a general spin coating method may be used, and other methods such as a screen printing method, a dispensing method, and a spray application method may be used. Although it depends on the coating means, when excess resist is deposited on the upper surface of the pattern, a method of scraping only the surface layer portion by squeezing or the like can also be adopted. By supplying the resin directly to the concavo-convex pattern of the microstructure mold 24 as in this step, the resin can be sufficiently filled into the concavo-convex pattern, and the risk of air bubbles being mixed can be reduced.

  Next, as shown in steps b and c of FIG. 1, the substrate 21 which is an example of the transfer target and the microstructure mold 24 filled with the UV curable resin 22 are brought into contact with each other while being pressurized. For example, as shown in step b of FIG. 1, the surface opposite to the transfer surface of the substrate 21 is sucked and fixed by the stage 23. As shown in the example of FIG. 1, the substrate 21 may be disposed below the stage 23 with the transfer surface facing down, and the entire surface of the substrate 21 may be adsorbed and fixed by the stage 23 from above the substrate 21. When pressurizing the mold, the microstructure mold 24 held by the holding tool 27 is disposed so that the surface coated with the UV curable resin 22 and the transfer surface of the substrate 21 face each other, and then the substrate 21. The pressure roller 251 is lifted from a position corresponding to the central portion of the substrate 21 and is pressed from the lower surface of the substrate 21. Thereafter, the pressure roller 251 is moved in one direction on the plane in the direction toward the outer periphery of the substrate 21 with respect to the substrate 21, and the fine structure made of the UV curable resin 22 filled in the concavo-convex pattern is sequentially transferred to the substrate. . At this time, as shown in step b of FIG. 1, only one of the grippers 27 corresponding to the direction in which the pressure roller 251 has moved rises in synchronization with the amount of movement of the pressure roller 251. When the pressure roller 251 stops at the outer end of the substrate 21 as shown in c, it stops at the position where the surface of the microstructure mold 24 and the outer end of the substrate 21 come into contact. Here, the gripping tool 27 grips the microstructure mold 24 and relatively moves the microstructure mold 24 and the substrate 21. However, a gripping tool for holding the substrate 21 is further provided in the gripping tool. Then, the microstructure mold 24 and the substrate 21 may be moved relative to each other by moving the substrate 21. Next, the end of the microstructure mold 24 opposite to the end of the microstructure mold 24 first brought into contact with the stage 23 by raising the other portion of the gripper 27 in synchronization with the moving amount of the pressure roller. The pressure roller 251 is moved in the opposite direction in a state where the part is raised to the stage 23 side. The pressure roller 251 is stopped in a state where the fine structure mold 24 finally comes into contact with the entire surface of the substrate 21.

  When the width of the pressure roller 251 is longer than the width of the microstructure mold 24, the pressure roller 251 is moved in one direction perpendicular to the width of the pressure roller 251 and then moved in the opposite direction. As a result, the entire surface of the microstructure mold 24 can be adsorbed and fixed to the substrate 21. When the width of the pressure roller 251 is shorter than the width of the microstructure mold 24, the pressure roller 251 is moved back and forth in a direction perpendicular to the width of the pressure roller 251, which is the length direction of the microstructure mold 24. The pressure roller 251 may be moved in the width direction of the pressure roller 251 and the moving and pressing operation may be repeated to press the entire surface of the microstructure mold 24 onto the substrate 21. Further, as described above, the pressure roller 251 may be moved with respect to the substrate 21, but the substrate 21 may be moved with respect to the pressure roller 251, and the pressure roller 251 and the substrate 21 are relative to each other. And the pressure roller 251 may be pressed against the substrate 21. Further, the pressure roller 251 may be pressed from the back side with respect to the concave / convex pattern forming surface of the microstructure mold 24 or may be pressed from the back side with respect to the fine structure forming surface of the substrate 21. Further, the microstructure mold 24 is not necessarily in the form of a film, and is not limited to a film form as long as it has elasticity to the extent that it can be deformed when pressed, and has a certain thickness. Also good.

  Next, as shown in step d of FIG. 1, the UV curable resin 22 subjected to the pressure contact is irradiated with ultraviolet rays (hereinafter referred to as UV light) through a microstructure mold 24 from a UV light source 26 which is a resin curing device. Then, the UV curable resin 22 is cured. Note that the microstructure mold 24 is preferable because it has translucency, so that UV light can be irradiated through the microstructure mold 24, but it does not need to have translucency depending on the UV light irradiation method. Also, when using a resin that does not need to be irradiated with UV light in order to cure the resin, the microstructure mold 24 does not need to have translucency.

  Finally, as shown in the mold release step of step e in FIG. 1, by moving the raised gripper 27 downward, only the microstructure mold 24 is left while leaving the UV curable resin 22 transferred to the substrate 21. Release.

  Here, the means for applying the UV curable resin onto the microstructure mold will be described in detail with reference to FIGS. FIG. 2 is a schematic cross-sectional view illustrating a process of applying a UV curable resin by a spray method as an example of a coating method, and FIG. 3 is a schematic plan view illustrating a microstructure mold after the UV curable resin is applied.

  In the application of the UV curable resin by the spray method, the UV curable resin 22 is applied from above the microstructure mold 24 by the spray nozzle 31 in a state where the microstructure mold 24 is patterned using the shielding mask 32. As shown in FIG. 3, the patterning area 241 that is the application region of the UV curable resin 22 has the same shape and the same shape as the region where the fine structure of the substrate 21 is formed, as well as the outer shape and size of the substrate 21 to be transferred. Try to be the size. Therefore, the pattern formation region 242 that is a region where the fine shape of the microstructure mold 24 is formed is formed larger than the patterning area 241. Thus, the shielding mask 32 is disposed on the surface of the microstructure mold 24 on which the concave / convex pattern is formed, and the UV curable resin 22 is applied from the spray nozzle 31 onto the microstructure mold 24 from above the shielding mask 32. As a result, the UV curable resin 22 is applied to the surface of the microstructure mold 24 on which the concavo-convex pattern is formed from the opening of the shielding mask 32 corresponding to the patterning area 241, and the UV curable resin 22 is applied only to the concavo-convex pattern in the patterning area 241. Is filled.

  As other coating means, as shown in the sectional view of FIG. 4, the screen printing method is used to make the opening area of the screen plate 33 the same shape as the patterning area 241 shown in FIG. Similar application can be realized by applying pressure and dropping through the plate 33.

  Further, as shown in the cross-sectional view of FIG. 5, the dispensing nozzle 35 is moved using the dispensing method so that the UV curable resin 22 is dropped from the dispensing nozzle 35 so that coating can be realized in the patterning area 241 shown in FIG. 3. Thus, the same application can be realized. If the film thickness of the UV curable resin 22 after application is thick, the extra UV curable resin 22 is removed by the squeegee 36 by adding a squeezing method as shown in FIG. It is possible to reduce the thickness of the UV curable resin 22 to the limit while ensuring the filling.

  As described above, the concave / convex pattern is formed on the microstructure mold 24, and the concave / convex pattern of the microstructure mold 24 corresponding to the microstructure to be formed on the transferred body is pre-filled with resin, and then the microstructure mold 24 is transferred to the transferred body. Since the resin of the microstructure mold 24 is transferred to the transfer body by applying pressure to the transfer object, a fine structure can be separately formed by filling the uneven pattern with the resin and transferring it to the transfer object. Compared with the case where the mold is pressed against the resin applied to the surface of the transfer object to form a fine structure on the transfer object, the resin is sufficiently filled inside the unevenness of the uneven pattern. It is easy to fill the resin with the resin, and it is possible to suppress the mixing of bubbles into the applied resin, and to transfer the fine structure to the transfer object with high accuracy. Kill.

  Next, the pressurizing means shown in FIG. 1 will be described in detail with reference to FIGS. FIG. 7 is a cross-sectional view and a plan view showing a state of transfer when the pressure roller 251 moves from the center to one outer end during pressure application in FIG. In the plan view, for the sake of simplicity, the substrate 21 is shown with only a broken outline, and the stage 23 is omitted. Among the pattern formation regions 242 in which the uneven pattern is formed on the microstructure mold 24, there are regions 2411 and 2422 to which the UV curable resin 22 is applied in the application step, and the pressure roller that is initially in contact with the central portion 2511 251 moves to the position of the outer end 2512 of the substrate 21 while applying pressure. At that time, the gripping tool 271 on the side close to the direction in which the pressure roller 251 moves among the gripping tools at both ends gripping the microstructure mold 24 rises in synchronization with the movement of the pressure roller 251. Therefore, the substrate 21 and the UV curable resin 22 can maintain a contact state in the region 2411. Next, the pressure roller 251 is moved in the reverse direction, and the pressure operation is performed from the outer end 2512 to the outer end 2513 at the right end of the sheet, thereby completing the entire surface transfer including the region 2412.

  The pressurizing means is not limited to the above, and for example, it can be performed by a method as shown in FIG. Here, as the pressing means, a pressing tool made of an elastic body such as a rubber tool 37 having a thick center and a thinning toward the outer end is used. As shown in step a of FIG. 8, first, the rubber tool 37 disposed on the base 38 is installed on the lower surface of the microstructure mold 24. Next, as shown in step b of FIG. 8, the rubber tool 37 is raised to push up the fine structure mold 24, and only the central portion of the fine structure mold 24 is first placed on the substrate 21 at the thickest center of the rubber tool 37. In the same manner, the holding tool 27 of the microstructure mold 24 is also synchronized and raised. Finally, as shown in step c of FIG. 8, the rubber tool 37 is raised and pressurized until the outer end portion of the microstructure mold 24 comes into contact with the substrate 21, and then released.

  In addition to using a pressing tool made of an elastic body protruding from the center, such as the rubber tool 37, the microstructure mold 24 is configured to be deformable, and the pattern forming region is first formed by the gripper 27 or an arbitrary pressing tool. The microstructure mold 24 corresponding to the central portion of the mold is deformed so as to protrude in the direction of the substrate 21, and the microstructure mold 24 is pressed against the substrate 21. The structure mold 24 may be relatively moved in the direction of the substrate 21 so that the microstructure mold 24 is pressed against the substrate 21 even at a portion corresponding to the outer peripheral portion of the pattern formation region. In addition, a driving device (not shown) is provided, and the pressing tool such as the rubber tool 37 is moved in all directions such as a horizontal direction and a vertical direction by the driving device.

  The reason why the above-mentioned means can realize the transfer of the transfer material to the outside of the transfer medium, the improvement of the outer shape accuracy and the thinning, and the transfer without bubbles will be described with reference to FIGS. First, the bubble-less transfer can be realized by applying the UV curable resin 22 from the upper surface of the microstructure mold 24 as shown in step a of FIG. In the present method in which the UV curable resin 22 is applied to the unevenness of the microstructure mold 24 in advance, the upper surface is opened at the time of filling, so that bubbles easily escape upward, and the resin can be sufficiently filled by suppressing the generation of bubbles. it can. Next, regarding the protrusion, as shown in step a of FIG. 1 and FIG. 6, the excess UV curable resin 22 is removed by pressurization after step b of FIG. 1 by thinning the resin in advance. It is possible to reduce the amount to the limit, and it is possible to suppress the resin flow from the outer end of the concavo-convex pattern. Furthermore, as shown in steps b and c of FIG. 1, during the pressurization, by moving the pressurizing position gradually outward from the center, the protruding resin is set as one direction, and the protruding resin is concentrated. Instead, it is possible to uniformly disperse the entire surface of the substrate 21. Finally, the gripping tool 27 that grips the microstructure mold 24 is raised in synchronization with the movement of the pressure roller 251, so that excessive tension and minute vibrations are not applied to the microstructure mold 24 by the pressure roller 251. Thus, it is possible to realize full-surface transfer without bubbles with stable pressurization.

  Further, in the present embodiment, in the resin coating process shown in step a of FIG. 1, a part of the pre-applied region is irradiated with UV in advance by a separate UV irradiator, thereby further improving the outer shape accuracy. can do. The specific contents will be described below with reference to FIG.

  FIG. 9 is a sectional view and a plan view of a mechanism for curing at least a part of the UV curable resin 22 applied by the method described with reference to FIGS. 2 to 6 by irradiating UV light from the UV irradiator 41 in advance. It is. The UV irradiator 41 is disposed on the upper side of the microstructure mold 24 and irradiates UV light toward the lower UV curable resin 22. At that time, the central portion is separately shielded by the shielding mask 42, and only the UV curable resin 22 applied to the outer peripheral portion of the region where the UV curable resin 22 is applied, which is a patterning area 241 corresponding to the periphery of the central portion. Is cured. The UV light irradiated by the UV irradiator 41 is collimated so that the angle between the light beams is within 5 degrees, and is irradiated so that the light does not leak into the shielding mask 42. The state of the patterning area 241 is shown in the plan view of FIG. The outer peripheral portion of the UV curable resin 22 applied to the area opened as the patterning area 241 is cured in a frame shape to form a precured resin 441.

  Thus, by forming the pre-cured resin 441 using the shielding mask 42 and the UV irradiator 41, the outer shape of the fine structure can be made highly accurate. The reason will be described with reference to a cross-sectional view during pressurization shown in FIG. Here, as an example, a state of transfer at the end portion of the substrate 21 when pressure is applied using the pressure roller 251 shown in FIG. 7 is shown. FIG. 10 includes a schematic cross-sectional view of the whole and a view in which only the end portion of the substrate 21 is enlarged. As shown in the enlarged view of FIG. 10, as the pressure roller 251 approaches the outer end of the substrate 21, the excess portion of the UV curable resin 22 is pushed away toward the outer end, that is, rightward in the drawing. However, when heading toward the outer end, the precured resin 441 that has been cured in advance serves as a dam, and by blocking the flowing UV cured resin 22, it is possible to suppress the protrusion to the outside. In this manner, the outer end of the region where the UV curable resin 22 is applied in the application step shown in FIG. 9 is cured in advance, so that the outer shape of the microstructure can be formed with high accuracy while suppressing the protrusion.

  The resin used is not limited to the UV curable resin 22 and may be a thermoplastic resin. When a thermoplastic resin is employed, a thermal imprint method is realized by heating a mold coated with the thermoplastic resin to a glass transition temperature or higher. The thermoplastic resin is cured by being cooled by a cooling device or the like that is a resin curing device. The thermal imprint method has a feature that the selectivity of the material is wide, but it is difficult to increase the throughput because it is necessary to raise and lower the temperature of the mold when transferring the shape. On the other hand, since the UV imprint method using the UV curable resin 22 can complete the curing within several seconds to several tens of seconds, the throughput can be increased as compared with the case where the thermoplastic resin is used. .

  The operation or control of the above configuration is executed by a predetermined program. The predetermined program is stored in a computer-readable storage device or the like, and a control unit such as a computer reads and executes the program. A circuit board is mounted on the control unit, and a processor or a separate device is provided on the circuit board. A predetermined program may be stored in a memory or the like of these processors or devices, and a predetermined process is executed by the program.

  The various forms described above can be combined as appropriate. Pattern forming apparatuses that perform various pattern forming methods obtained as a result of various combinations are also included in the scope of the present disclosure. In addition, it is also possible to manufacture a substrate with a pattern by forming a pattern on the substrate using the various forms described above and combinations thereof. This patterned substrate is also included in the scope of the present disclosure.

  INDUSTRIAL APPLICABILITY The present invention can transfer a fine structure to a transfer object with high accuracy, and can be applied to a transfer method of a fine structure and a transfer device of a fine structure that transfer the fine structure to the transfer target.

DESCRIPTION OF SYMBOLS 11 Transfer object 12 Transfer material 13 Stage 14 Microstructure mold 140 Defect 151 Pressure roller 16 UV irradiator 17 Grasping tool 21 Substrate 22 UV curing resin 23 Stage 24 Microstructure mold 241 Patterning area 2411 Area 2412 Area 242 Pattern formation area 251 Pressure roller 2511 Central part 2512 Outer end 2513 Outer end 26 UV irradiator 27 Gripping tool 271 Gripping tool 31 Spray nozzle 32 Shielding mask 33 Screen plate 34 Squeegee 35 Dispensing nozzle 36 Squeegee 37 Rubber tool 38 Base 41 UV irradiator 42 Shielding mask 441 Precured resin

Claims (15)

A fine structure transfer method for forming a fine structure on a transfer object,
An application step of applying a resin to the concave portion of the concave / convex pattern of the mold having a concave / convex pattern corresponding to the fine structure formed thereon,
An arrangement step of arranging the transferred body such that the surface to which the resin is applied and a formation surface on which the microstructure of the transferred body is formed face each other;
A pressurizing step of relatively moving the mold and the transferred body so that the resin contacts the transferred body and pressurizing each other;
A curing step of curing the resin on the transfer object;
A fine structure transfer method comprising: a mold release step of transferring only the resin to the transfer body by relatively separating the mold and the transfer body.   2. The method for transferring a microstructure according to claim 1, wherein, in the pressurizing step, the outer peripheral portion of the transferred body is pressed after the central portion of the transferred body is first pressed.   In the pressurizing step, a pressure roller is pressed from the back surface side with respect to the front surface of the mold or the back surface side with respect to the formation surface of the transfer object to press the central portion of the transfer object, 3. The fine structure transfer method according to claim 2, wherein the pressure roller is moved toward the outer peripheral portion of the transfer body.   In the pressurizing step, a pressing tool having an elastic body that is thickest at the center and gradually becomes thinner toward the outer periphery is formed on the back surface side of the mold surface or the formation surface of the transfer object. 3. The method for transferring a fine structure according to claim 2, wherein the pressing is performed from the back side.   In the pressurizing step, the mold is deformed so that a part of the mold corresponding to the central part of the transferred body protrudes, and the central part of the transferred body is protruded by the protruding part of the mold. And then deforming the mold so that the protruding portion of the mold is restored, and pressing the outer peripheral portion of the transferred body around the protruding portion of the mold. The method for transferring a fine structure according to claim 2.   The method for transferring a microstructure according to any one of claims 2 to 5, wherein, in the arranging step, the transferred object is arranged on an upper part of the mold.   The method for transferring a microstructure according to any one of claims 2 to 6, wherein only the outer peripheral portion of the applied resin is cured after the applying step and before the arranging step.   The microstructure transfer according to claim 1, wherein the resin is a UV curable resin, and the UV curable resin is cured by irradiating ultraviolet rays in the curing step. Method.   The microstructure according to any one of claims 1 to 8, wherein a shape and a size of a region where the resin is applied to the mold are equal to a shape and a size of the transferred body. Transfer method.   The method for transferring a microstructure according to any one of claims 1 to 9, wherein the mold is in the form of a film.   The method for transferring a microstructure according to any one of claims 1 to 10, wherein the transfer object is a substrate. A fine structure transfer device for forming a fine structure on a transfer target,
A mold in which a concavo-convex pattern corresponding to the fine structure is formed on the surface and a concave portion of the concavo-convex pattern is filled with a resin,
A gripping tool for relatively moving the mold and the transfer object;
A pressing tool for pressing the mold against the transfer target;
A fine structure transfer device comprising a resin curing device for curing the resin. The pressure tool is a pressure roller;
A driving device for moving the pressure roller;
The drive device moves the pressure roller from a position corresponding to a central portion of the transfer target to a position corresponding to an outer peripheral portion while moving the pressure roller in a direction of pressing the mold. 13. The fine structure transfer apparatus according to claim 12.   13. The fine structure transfer device according to claim 12, wherein the pressing tool is an elastic body having a thickest central portion and a gradually decreasing thickness toward the outer peripheral portion.   The transfer device according to any one of claims 12 to 14, further comprising a control unit that controls the operation of the device so as to execute the transfer method according to any one of claims 1 to 11.