JP2015008148A5 - - Google Patents

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Publication number
JP2015008148A5
JP2015008148A5 JP2014171154A JP2014171154A JP2015008148A5 JP 2015008148 A5 JP2015008148 A5 JP 2015008148A5 JP 2014171154 A JP2014171154 A JP 2014171154A JP 2014171154 A JP2014171154 A JP 2014171154A JP 2015008148 A5 JP2015008148 A5 JP 2015008148A5
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Japan
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sample
detection
calibration factor
information corresponding
electrons emitted
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JP2014171154A
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Japanese (ja)
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JP2015008148A (ja
JP6152077B2 (ja
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Priority claimed from US13/365,238 external-priority patent/US8604427B2/en
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Publication of JP2015008148A5 publication Critical patent/JP2015008148A5/ja
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JP2014171154A 2012-02-02 2014-08-26 走査電子顕微鏡画像を用いた３次元マッピング Active JP6152077B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/365,238 2012-02-02
US13/365,238 US8604427B2 (en) 2012-02-02 2012-02-02 Three-dimensional mapping using scanning electron microscope images

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013031500A Division JP5793155B2 (ja) 2012-02-02 2013-02-01 走査電子顕微鏡画像を用いた３次元マッピング

Publications (3)

Publication Number Publication Date
JP2015008148A JP2015008148A (ja) 2015-01-15
JP2015008148A5 true JP2015008148A5 (https=) 2016-08-18
JP6152077B2 JP6152077B2 (ja) 2017-06-21

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JP2013031500A Active JP5793155B2 (ja) 2012-02-02 2013-02-01 走査電子顕微鏡画像を用いた３次元マッピング
JP2014171154A Active JP6152077B2 (ja) 2012-02-02 2014-08-26 走査電子顕微鏡画像を用いた３次元マッピング

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JP2013031500A Active JP5793155B2 (ja) 2012-02-02 2013-02-01 走査電子顕微鏡画像を用いた３次元マッピング

Country Status (4)

Country Link
US (3) US8604427B2 (https=)
JP (2) JP5793155B2 (https=)
KR (2) KR101477014B1 (https=)
TW (2) TWI493180B (https=)

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US8901492B1 (en) * 2013-07-16 2014-12-02 Taiwan Semiconductor Manufacturing Company, Ltd. Three-dimensional semiconductor image reconstruction apparatus and method
US9588066B2 (en) * 2014-01-23 2017-03-07 Revera, Incorporated Methods and systems for measuring periodic structures using multi-angle X-ray reflectance scatterometry (XRS)
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KR102149947B1 (ko) * 2017-04-27 2020-09-02 킹 압둘라 유니버시티 오브 사이언스 앤드 테크놀로지 투과 전자 현미경 샘플 정렬 시스템 및 방법
US10748272B2 (en) * 2017-05-18 2020-08-18 Applied Materials Israel Ltd. Measuring height difference in patterns on semiconductor wafers
JP6851345B2 (ja) * 2018-05-24 2021-03-31 日本電子株式会社 荷電粒子線装置および画像取得方法
LU100806B1 (en) * 2018-05-30 2019-12-02 Luxembourg Inst Science & Tech List Joint nanoscale three-dimensional imaging and chemical analysis
US11139142B2 (en) * 2019-05-23 2021-10-05 Applied Materials, Inc. High-resolution three-dimensional profiling of features in advanced semiconductor devices in a non-destructive manner using electron beam scanning electron microscopy
CN112449722B (zh) * 2019-07-04 2024-04-09 株式会社日立高新技术 尺寸测量装置、尺寸测量程序及半导体制造系统
JP7173937B2 (ja) 2019-08-08 2022-11-16 株式会社日立ハイテク 荷電粒子線装置
JP7159128B2 (ja) 2019-08-08 2022-10-24 株式会社日立ハイテク 荷電粒子線装置
KR102771899B1 (ko) 2019-09-03 2025-02-25 삼성전자주식회사 주사 전자 현미경 장치 및 그의 동작 방법
JP2023535192A (ja) * 2020-07-29 2023-08-16 エーエスエムエル ネザーランズ ビー．ブイ． 検査装置における信号電子検出のためのシステム及び方法
JP7364540B2 (ja) * 2020-08-05 2023-10-18 株式会社日立ハイテク 画像処理システム
US12057336B2 (en) 2020-12-16 2024-08-06 Samsung Electronics Co., Ltd. Estimating heights of defects in a wafer by scaling a 3D model using an artificial neural network
US11626267B2 (en) * 2021-04-28 2023-04-11 Applied Materials Israel Ltd. Back-scatter electrons (BSE) imaging with a SEM in tilted mode using cap bias voltage
JP7323574B2 (ja) * 2021-06-03 2023-08-08 日本電子株式会社 荷電粒子線装置および画像取得方法
CN120121657B (zh) * 2025-03-11 2025-11-25 浙江大学 一种基于扫描电镜的原位三维表面重建方法

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