JP2014529847A5 - - Google Patents
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- Publication number
- JP2014529847A5 JP2014529847A5 JP2014526191A JP2014526191A JP2014529847A5 JP 2014529847 A5 JP2014529847 A5 JP 2014529847A5 JP 2014526191 A JP2014526191 A JP 2014526191A JP 2014526191 A JP2014526191 A JP 2014526191A JP 2014529847 A5 JP2014529847 A5 JP 2014529847A5
- Authority
- JP
- Japan
- Prior art keywords
- heater zone
- planar heater
- temperature
- current
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 16
- 238000009529 body temperature measurement Methods 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 14
- 238000005259 measurement Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000001020 plasma etching Methods 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims description 3
- 238000012937 correction Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161524546P | 2011-08-17 | 2011-08-17 | |
| US61/524,546 | 2011-08-17 | ||
| PCT/US2012/051029 WO2013025852A1 (en) | 2011-08-17 | 2012-08-16 | A system and method for monitoring temperatures of and controlling multiplexed heater array |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014529847A JP2014529847A (ja) | 2014-11-13 |
| JP2014529847A5 true JP2014529847A5 (enrdf_load_stackoverflow) | 2015-10-08 |
| JP6067705B2 JP6067705B2 (ja) | 2017-01-25 |
Family
ID=47715468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014526191A Active JP6067705B2 (ja) | 2011-08-17 | 2012-08-16 | 多重ヒータ配列の温度監視及び制御のためのシステムと方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6067705B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102006508B1 (enrdf_load_stackoverflow) |
| CN (1) | CN103828031B (enrdf_load_stackoverflow) |
| TW (2) | TWI534941B (enrdf_load_stackoverflow) |
| WO (1) | WO2013025852A1 (enrdf_load_stackoverflow) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8791392B2 (en) * | 2010-10-22 | 2014-07-29 | Lam Research Corporation | Methods of fault detection for multiplexed heater array |
| US9324589B2 (en) * | 2012-02-28 | 2016-04-26 | Lam Research Corporation | Multiplexed heater array using AC drive for semiconductor processing |
| US8809747B2 (en) * | 2012-04-13 | 2014-08-19 | Lam Research Corporation | Current peak spreading schemes for multiplexed heated array |
| KR102429619B1 (ko) | 2015-11-18 | 2022-08-04 | 삼성전자주식회사 | 본딩 스테이지와 이를 포함하는 본딩 장치 |
| US9812342B2 (en) * | 2015-12-08 | 2017-11-07 | Watlow Electric Manufacturing Company | Reduced wire count heater array block |
| CN106920768A (zh) * | 2015-12-24 | 2017-07-04 | 中微半导体设备(上海)有限公司 | 多区主动矩阵温控系统和温控方法及其适用的静电吸盘和等离子处理装置 |
| US10366867B2 (en) * | 2016-08-19 | 2019-07-30 | Applied Materials, Inc. | Temperature measurement for substrate carrier using a heater element array |
| WO2019140200A1 (en) | 2018-01-15 | 2019-07-18 | Applied Materials, Inc. | Advanced temperature monitoring system and methods for semiconductor manufacture productivity |
| JP6971199B2 (ja) * | 2018-05-31 | 2021-11-24 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| JP7456951B2 (ja) * | 2018-07-05 | 2024-03-27 | ラム リサーチ コーポレーション | 基板処理システムにおける基板支持体の動的温度制御 |
| US11183400B2 (en) | 2018-08-08 | 2021-11-23 | Lam Research Corporation | Progressive heating of components of substrate processing systems using TCR element-based heaters |
| CN111383891B (zh) * | 2018-12-29 | 2023-03-10 | 中微半导体设备(上海)股份有限公司 | 用于半导体处理设备的温度控制装置及其温度控制方法 |
| KR102722106B1 (ko) | 2019-04-10 | 2024-10-28 | 엘에스일렉트릭(주) | 파워 디바이스 모니터링 시스템 및 모니터링 방법 |
| US12013291B2 (en) | 2020-10-14 | 2024-06-18 | Applied Materials, Inc. | Advanced temperature monitoring system with expandable modular layout design |
| KR20220095612A (ko) * | 2020-12-30 | 2022-07-07 | 세메스 주식회사 | 히터 어레이 및 히터 어레이를 포함하는 기판 처리 장치 |
| CN112614771A (zh) * | 2021-01-08 | 2021-04-06 | 上海谙邦半导体设备有限公司 | 一种反应腔装置及其工作方法 |
| KR20230031569A (ko) * | 2021-08-27 | 2023-03-07 | 세메스 주식회사 | 지지 유닛 및 기판 처리 장치 |
| CN114499654B (zh) * | 2022-04-01 | 2022-07-15 | 国开启科量子技术(北京)有限公司 | 用于校准不等臂干涉仪的电路装置和量子通信设备 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3440883A (en) * | 1966-12-01 | 1969-04-29 | Monsanto Co | Electronic semiconductor thermometer |
| JP2001045655A (ja) * | 1999-07-28 | 2001-02-16 | Fujitsu Ltd | 温度スイッチ回路 |
| KR20050053464A (ko) * | 2003-12-01 | 2005-06-08 | 정준호 | 직렬 연결된 2개의 다이오드를 이용한 반도체 기억소자 |
| US7141763B2 (en) * | 2004-03-26 | 2006-11-28 | Tokyo Electron Limited | Method and apparatus for rapid temperature change and control |
| US7768286B2 (en) * | 2005-08-25 | 2010-08-03 | Advantest Corporation | Electronic device testing apparatus and temperature control method in an electronic device testing apparatus |
| KR100849069B1 (ko) * | 2007-04-20 | 2008-07-30 | 주식회사 하이닉스반도체 | 정전기 방전 보호 장치 |
| US8092637B2 (en) * | 2008-02-28 | 2012-01-10 | Hitachi High-Technologies Corporation | Manufacturing method in plasma processing apparatus |
| US8168923B2 (en) * | 2008-10-14 | 2012-05-01 | Chon Meng Wong | System for heated food delivery and serving |
| JP2010153730A (ja) * | 2008-12-26 | 2010-07-08 | Omron Corp | 配線構造、ヒータ駆動装置、計測装置および制御システム |
| US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
| CN201608925U (zh) * | 2010-01-13 | 2010-10-13 | 张红中 | 一种用于感应加热电源的多区控制电路 |
-
2012
- 2012-08-16 CN CN201280040080.2A patent/CN103828031B/zh active Active
- 2012-08-16 JP JP2014526191A patent/JP6067705B2/ja active Active
- 2012-08-16 WO PCT/US2012/051029 patent/WO2013025852A1/en active Application Filing
- 2012-08-16 KR KR1020147007098A patent/KR102006508B1/ko active Active
- 2012-08-17 TW TW101129983A patent/TWI534941B/zh active
- 2012-08-17 TW TW105104698A patent/TWI591756B/zh active
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