JP2014513434A5 - - Google Patents
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- Publication number
- JP2014513434A5 JP2014513434A5 JP2014508469A JP2014508469A JP2014513434A5 JP 2014513434 A5 JP2014513434 A5 JP 2014513434A5 JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014513434 A5 JP2014513434 A5 JP 2014513434A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- removal
- controllable
- removal profile
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 34
- 238000004590 computer program Methods 0.000 claims 14
- 239000011159 matrix material Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- 238000005498 polishing Methods 0.000 claims 7
- 239000000126 substance Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 238000004364 calculation method Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/098,257 | 2011-04-29 | ||
| US13/098,257 US8774958B2 (en) | 2011-04-29 | 2011-04-29 | Selection of polishing parameters to generate removal profile |
| PCT/US2012/034702 WO2012148859A2 (en) | 2011-04-29 | 2012-04-23 | Selection of polishing parameters to generate removal profile |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014513434A JP2014513434A (ja) | 2014-05-29 |
| JP2014513434A5 true JP2014513434A5 (OSRAM) | 2015-09-17 |
Family
ID=47068573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014508469A Pending JP2014513434A (ja) | 2011-04-29 | 2012-04-23 | 除去プロファイルを生成するための研磨パラメータの選択 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US8774958B2 (OSRAM) |
| JP (1) | JP2014513434A (OSRAM) |
| KR (2) | KR101831309B1 (OSRAM) |
| TW (2) | TWI668078B (OSRAM) |
| WO (1) | WO2012148859A2 (OSRAM) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8774958B2 (en) * | 2011-04-29 | 2014-07-08 | Applied Materials, Inc. | Selection of polishing parameters to generate removal profile |
| JP5900196B2 (ja) * | 2012-07-05 | 2016-04-06 | 株式会社Sumco | ウェーハの片面研磨方法およびウェーハの片面研磨装置 |
| MX354430B (es) * | 2012-07-10 | 2018-03-05 | Statoil Petroleum As | Estimacion de parametro de anisotropia. |
| US9248544B2 (en) * | 2012-07-18 | 2016-02-02 | Applied Materials, Inc. | Endpoint detection during polishing using integrated differential intensity |
| JP6158637B2 (ja) * | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | 弾性膜及び基板保持装置 |
| JP6266493B2 (ja) * | 2014-03-20 | 2018-01-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| KR102323430B1 (ko) * | 2014-03-31 | 2021-11-09 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
| US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
| KR102276869B1 (ko) * | 2016-06-30 | 2021-07-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 연마 자동화된 레시피 생성 |
| TWI816620B (zh) | 2017-04-21 | 2023-09-21 | 美商應用材料股份有限公司 | 使用神經網路來監測的拋光裝置 |
| TWI794293B (zh) * | 2017-09-25 | 2023-03-01 | 美商應用材料股份有限公司 | 使用製程控制參數矩陣的半導體製造 |
| TWI783037B (zh) * | 2017-09-25 | 2022-11-11 | 美商應用材料股份有限公司 | 使用機器學習方式以產生製程控制參數的半導體製造 |
| JP7068831B2 (ja) * | 2018-01-18 | 2022-05-17 | 株式会社荏原製作所 | 研磨装置 |
| WO2019176522A1 (ja) * | 2018-03-12 | 2019-09-19 | 東京エレクトロン株式会社 | 基板の反り修正方法、コンピュータ記憶媒体及び基板反り修正装置 |
| TWI845444B (zh) | 2018-04-03 | 2024-06-11 | 美商應用材料股份有限公司 | 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體 |
| US12017322B2 (en) * | 2018-08-14 | 2024-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
| WO2020067914A1 (en) | 2018-09-26 | 2020-04-02 | Applied Materials, Inc. | Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring |
| EP3640972A1 (en) * | 2018-10-18 | 2020-04-22 | ASML Netherlands B.V. | System and method for facilitating chemical mechanical polishing |
| US11989492B2 (en) | 2018-12-26 | 2024-05-21 | Applied Materials, Inc. | Preston matrix generator |
| TWI850338B (zh) * | 2019-02-28 | 2024-08-01 | 美商應用材料股份有限公司 | 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法 |
| US11282755B2 (en) | 2019-08-27 | 2022-03-22 | Applied Materials, Inc. | Asymmetry correction via oriented wafer loading |
| JP2022551429A (ja) * | 2019-09-27 | 2022-12-09 | コーニング インコーポレイテッド | 平坦さ機能要件を満たすフォトマスクブランクを仕上げるための目標トポグラフィマップの生成提供装置、システムおよび方法 |
| US12440942B2 (en) | 2021-03-03 | 2025-10-14 | Applied Materials, Inc. | Pressure signals with different frequencies during friction monitoring to provide spatial resolution |
| EP4301549A4 (en) | 2021-03-05 | 2025-02-26 | Applied Materials, Inc. | CONTROLLING PROCESSING PARAMETERS DURING POLISHING OF A SUBSTRATE USING A COST FUNCTION OR EXPECTED FUTURE PARAMETER CHANGES |
| JP7651001B2 (ja) | 2021-03-05 | 2025-03-25 | アプライド マテリアルズ インコーポレイテッド | 基板歳差運動を伴う基板研磨のための処理パラメータの制御 |
| CN113159121B (zh) * | 2021-03-16 | 2022-07-19 | 华中科技大学 | 基于先验知识模型的机器人磨抛去除量预测方法及设备 |
| US20220362903A1 (en) * | 2021-05-12 | 2022-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multiple polishing heads with cross-zone pressure element distributions for cmp |
| US20250114896A1 (en) * | 2023-10-05 | 2025-04-10 | Applied Materials, Inc. | Individually rotatable platens and control of carrier head sweep |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6439964B1 (en) * | 1999-10-12 | 2002-08-27 | Applied Materials, Inc. | Method of controlling a polishing machine |
| US6544103B1 (en) * | 2000-11-28 | 2003-04-08 | Speedfam-Ipec Corporation | Method to determine optimum geometry of a multizone carrier |
| US6540591B1 (en) * | 2001-04-18 | 2003-04-01 | Alexander J. Pasadyn | Method and apparatus for post-polish thickness and uniformity control |
| US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US6857947B2 (en) | 2002-01-17 | 2005-02-22 | Asm Nutool, Inc | Advanced chemical mechanical polishing system with smart endpoint detection |
| US20050070205A1 (en) | 2003-09-30 | 2005-03-31 | Speedfam-Ipec Corporation | Integrated pressure control system for workpiece carrier |
| US6932671B1 (en) * | 2004-05-05 | 2005-08-23 | Novellus Systems, Inc. | Method for controlling a chemical mechanical polishing (CMP) operation |
| EP1758711B1 (en) * | 2004-06-21 | 2013-08-07 | Ebara Corporation | Polishing apparatus and polishing method |
| US7150673B2 (en) * | 2004-07-09 | 2006-12-19 | Ebara Corporation | Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
| JP4689367B2 (ja) * | 2004-07-09 | 2011-05-25 | 株式会社荏原製作所 | 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置 |
| US7115017B1 (en) | 2006-03-31 | 2006-10-03 | Novellus Systems, Inc. | Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization |
| WO2008032753A1 (fr) * | 2006-09-12 | 2008-03-20 | Ebara Corporation | Appareil de polissage et procédé de polissage |
| US7699688B2 (en) | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| US8774958B2 (en) * | 2011-04-29 | 2014-07-08 | Applied Materials, Inc. | Selection of polishing parameters to generate removal profile |
-
2011
- 2011-04-29 US US13/098,257 patent/US8774958B2/en active Active
-
2012
- 2012-04-23 KR KR1020137031787A patent/KR101831309B1/ko active Active
- 2012-04-23 JP JP2014508469A patent/JP2014513434A/ja active Pending
- 2012-04-23 WO PCT/US2012/034702 patent/WO2012148859A2/en not_active Ceased
- 2012-04-23 KR KR1020177015865A patent/KR101834711B1/ko active Active
- 2012-04-24 TW TW106120666A patent/TWI668078B/zh active
- 2012-04-24 TW TW101114548A patent/TWI637813B/zh active
-
2014
- 2014-06-02 US US14/293,776 patent/US9213340B2/en active Active
-
2015
- 2015-12-14 US US14/968,546 patent/US10493590B2/en active Active
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