JP2014513195A - 高い熱安定性とじん性を示すエポキシ樹脂 - Google Patents
高い熱安定性とじん性を示すエポキシ樹脂 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
Abstract
Description
(a)ポリエポキシド樹脂、
(b)一般式(III)または(V):
OH−A−OH (III)
R2O−A−OR2 (V)
[式中、
Aは、式(IV)
R2は、炭素原子数が1から6のエポキシ官能アルキル基である]
で表される少なくとも1種の化合物を含有して成る鎖延長剤、
(c)強化剤、
(d)硬化剤、および場合により
(e)ビスフェノール化合物、
を含有して成る。
質的に成る”が本明細書に現れる場合、それは実現可能性に必須ではないもの以外は引き続くいずれかの記述の範囲から他の如何なる成分も段階も手順も排除するものであり、そして用語“から成る”を用いる場合、それは具体的に詳しく説明することも挙げることもなかった如何なる成分も段階も手順も排除するものである。用語“または”は、特に明記しない限り、個々に挙げた員ばかりでなく任意組み合わせの員を指すものである。
応性エポキシ基の約5%−90%、好適には約9%−70%がベンゾフランジオール成分によってもたらされる活性ヒドロキシ基と反応するような量にする一方で、他の態様では、ベンゾフランジエポキシド成分の使用量を結果としてもたらされる樹脂の約2%−78%(重量)、好適には約4%−60%(重量)がベンゾフラン単位を含有するような量にする。硬化剤の使用量はそれが有する官能基の濃度および分子量に依存する。いくつかの態様では、硬化剤の使用量をエポキシ樹脂組成物内に存在する実質的な量の残存反応性エポキシ基と反応するに充分な量にする。本明細書では用語“実質的な量”を結果として所望のガラス転移温度とじん性を示す硬化エポキシ樹脂がもたらされるに充分な架橋を生じさせるに充分な量を指す目的で用いる。
で表されるエポキシ樹脂である。本明細書で用いる如き“ヒドロカルビル”は炭化水素基を指し、それには、これらに限定するものでないが、アリール、アルキル、シクロアルキ
ル、アルケニル、シクロアルケニル、シクロアルカジエニル、アルキニル、アラルキル、アラルケニル、アラルキニルなどが含まれ、それらにはそれらのあらゆる置換、非置換、分枝、直鎖、ヘテロ原子置換誘導体が含まれる。同様に、用語“ヒドロカルビルオキシ”は、ヒドロカルビル基とこれが結合している物との間に酸素結合を有するヒドロカルビル基を指す。
OH−A−OH (III)
で表される化合物が含まれ、ここで、Aは式(IV)
R2O−A−OR2 (V)
で表される化合物であり、ここで、Aはこの上で定義した通りであり、そしてR2は炭素原子数が1から6のエポキシ官能アルキル基である。好適な態様として、各R2は2,3−エポキシプロピル基である。この態様では、ジヒドロキシ化合物の反応によってではなくジエポキシ化合物の反応によってベンゾフラン単位がポリエポキシド樹脂の中に組み込まれる。
ン、ジクロロスチレンおよびエチルクロロスチレンであり得る。
て強化される本開示の特徴である。
で表される。
度より低い温度で実施する。強化後に温度を上昇させて硬化を起こさせる。積層後の部品にしばしば独立後硬化を更により高い温度のオーブン内で受けさせる。
a)(i)ポリエポキシド樹脂、(ii)上述した如きベンゾフランジオール成分、ベンゾフランジエポキシド成分またはこれらの混合物、(iii)強化剤および(iv)硬化剤を含有して成るエポキシ樹脂組成物を準備し、
b)前記エポキシ樹脂組成物を1つ以上の前記基質の少なくとも1つの表面に塗布し、そして
c)一緒に結合させるべき前記基質の前記表面を一致するように噛み合わせて前記組成物を硬化させることでそれらの間に結合を生じさせる、
ことを包含する。
ーラーコーティングなどで硬化剤を塗布する前、塗布した後または同時に所望の厚みになるように塗布してもよい。塗布後の組成物を周囲条件および/または熱をかけて硬化させる。それらの表面および間に位置する本エポキシ樹脂組成物を本組成物が前記表面を結合させるに充分なほど硬化するまで噛み合わせ状態に維持する。本組成物を塗布することが可能な基質の例には、これらに限定するものでないが、鋼、亜鉛メッキ鋼、アルミニウム、銅、真鍮、木、ガラス、紙、複合材料、セラミック、プラスチックおよび高分子材料、例えばポリエステル、ポリアミド、ポリウレタン、ポリ塩化ビニル、ポリカーボネート、ABSプラスチックなどおよびプレキシガラスが含まれる。
Claims (10)
- 前記ポリエポキシド樹脂がエポキシ基を約2個有する1種以上の脂肪族、脂環式または芳香族が基になったエポキシ化合物を含有して成る請求項1記載のエポキシ樹脂組成物。
- 前記エポキシ化合物が構造式(IA)または(IB)または(IC):
で表されるエポキシ樹脂である請求項2記載のエポキシ樹脂組成物。 - A1がフェニル、ジフェニルメタン、ビフェニル、メタン基が1または2個のC1-C4アルキル基で置換されているジフェニルメタン、ジフェニルケトンまたはジフェニルスルホンである請求項1記載のエポキシ樹脂組成物。
- 前記強化剤がカルボキシル化もしくはアミン末端アクリロニトリル/ブタジエンエラストマーである請求項1記載のエポキシ樹脂組成物。
- 前記鎖延長剤が一般式(V):
R2O−A−OR2 (V)
[式中、AおよびR2は請求項1で定義した通りである]
で表される化合物である請求項1記載のエポキシ樹脂組成物。 - 更にビスフェノールA、ビスフェノールF、ビスフェノールR、ビスフェノールSおよびこれらの混合物から選択されるビスフェノール化合物も含有して成る請求項7記載のエポキシ樹脂組成物。
- エポキシ樹脂組成物であって、ベンゾフランジオールおよび/またはベンゾフランジエポキシド成分および強化剤の存在下で式(VI)
で表されるポリエポキシド樹脂を含有して成るエポキシ樹脂組成物。 - 少なくとも2つの基質を一緒に結合させる方法であって、
a)(i)ポリエポキシド樹脂、(ii)一般式(III)または(V):
OH−A−OH (III)
R2O−A−OR2 (V)
[式中、Aは、式(IV)
R2は、炭素原子数が1から6のエポキシ官能アルキル基である]
で表される少なくとも1種の化合物を含有して成る鎖延長剤、(iii)強化剤および(iv)硬化剤、
を含有して成るエポキシ樹脂組成物を準備し、
b)前記エポキシ樹脂組成物を1つ以上の前記基質の少なくとも1つの表面に塗布し、そして
c)一緒に結合させるべき前記基質の前記表面を一致するように噛み合わせて前記組成物を硬化させることでそれらの間に結合を生じさせる、
ことを含んで成る方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161485902P | 2011-05-13 | 2011-05-13 | |
US61/485,902 | 2011-05-13 | ||
PCT/US2012/036421 WO2012158363A1 (en) | 2011-05-13 | 2012-05-04 | Epoxy resins with high thermal stability and toughness |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014513195A true JP2014513195A (ja) | 2014-05-29 |
Family
ID=47177258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014510370A Pending JP2014513195A (ja) | 2011-05-13 | 2012-05-04 | 高い熱安定性とじん性を示すエポキシ樹脂 |
Country Status (11)
Country | Link |
---|---|
US (1) | US9051498B2 (ja) |
EP (1) | EP2751160B1 (ja) |
JP (1) | JP2014513195A (ja) |
KR (1) | KR20140043752A (ja) |
CN (1) | CN103534289B (ja) |
AU (1) | AU2012256282B2 (ja) |
BR (1) | BR112013028011A2 (ja) |
CA (1) | CA2835204A1 (ja) |
ES (1) | ES2612236T3 (ja) |
TW (1) | TW201302832A (ja) |
WO (1) | WO2012158363A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5679248B1 (ja) * | 2013-06-26 | 2015-03-04 | Dic株式会社 | エポキシ化合物、エポキシ樹脂、硬化性組成物、その硬化物、半導体封止材料、及びプリント配線基板 |
EP3298060A1 (en) * | 2015-05-20 | 2018-03-28 | 3M Innovative Properties Company | High temperature stable, one-part, curable thermoset compositions |
WO2017106596A1 (en) | 2015-12-18 | 2017-06-22 | 3M Innovative Properties Company | Curable epoxy compositions and methods for accelerating the curing of epoxy compositions |
CN107502261B (zh) * | 2017-09-14 | 2020-07-14 | 广州欣凯化工科技有限公司 | 一种用于木制品的耐高温抗冻树脂胶 |
FR3073223B1 (fr) * | 2017-11-07 | 2019-11-15 | Arianegroup Sas | Composes biphenyles pluriepoxydes, preparation et utilisations |
KR102566321B1 (ko) * | 2021-07-26 | 2023-08-14 | 한국화학연구원 | 산 무수물기반 에폭시 화합물, 이를 포함하는 에폭시 수지 이액형 조성물 및 이로부터 제조된 경화물 |
CN116410714A (zh) * | 2021-12-30 | 2023-07-11 | 天津中油渤星工程科技有限公司 | 一种树脂胶凝材料及其制备方法 |
CN116144165B (zh) * | 2022-12-27 | 2024-04-02 | 四川大学 | 可回收、可修复的热固性聚氨酯改性沥青材料及其制法 |
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JP2004263021A (ja) * | 2003-02-28 | 2004-09-24 | Sumitomo Chem Co Ltd | ポリエーテル樹脂および絶縁膜形成用塗布液 |
JP2014517104A (ja) * | 2011-05-12 | 2014-07-17 | ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー | 高い熱安定性とじん性を示すエポキシ樹脂 |
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US5151485A (en) * | 1990-11-21 | 1992-09-29 | The Dow Chemical Company | Advanced epoxy compositions, curable compositions and cured products |
US6486256B1 (en) | 1998-10-13 | 2002-11-26 | 3M Innovative Properties Company | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
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-
2012
- 2012-05-04 KR KR1020137032978A patent/KR20140043752A/ko not_active Application Discontinuation
- 2012-05-04 CA CA2835204A patent/CA2835204A1/en not_active Abandoned
- 2012-05-04 US US14/110,300 patent/US9051498B2/en active Active
- 2012-05-04 BR BR112013028011A patent/BR112013028011A2/pt not_active IP Right Cessation
- 2012-05-04 WO PCT/US2012/036421 patent/WO2012158363A1/en active Application Filing
- 2012-05-04 EP EP12785700.1A patent/EP2751160B1/en active Active
- 2012-05-04 ES ES12785700.1T patent/ES2612236T3/es active Active
- 2012-05-04 CN CN201280023141.4A patent/CN103534289B/zh active Active
- 2012-05-04 JP JP2014510370A patent/JP2014513195A/ja active Pending
- 2012-05-04 AU AU2012256282A patent/AU2012256282B2/en not_active Ceased
- 2012-05-10 TW TW101116720A patent/TW201302832A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51149263A (en) * | 1975-06-02 | 1976-12-22 | Eastman Kodak Co | Production of dihydrobenzofrandiols from quinones and carbonyl compound |
JPH06199863A (ja) * | 1992-10-29 | 1994-07-19 | Ciba Geigy Ag | 多環式フェノールから誘導されたエポキシ樹脂 |
JP2004263021A (ja) * | 2003-02-28 | 2004-09-24 | Sumitomo Chem Co Ltd | ポリエーテル樹脂および絶縁膜形成用塗布液 |
JP2014517104A (ja) * | 2011-05-12 | 2014-07-17 | ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー | 高い熱安定性とじん性を示すエポキシ樹脂 |
Also Published As
Publication number | Publication date |
---|---|
BR112013028011A2 (pt) | 2019-09-24 |
KR20140043752A (ko) | 2014-04-10 |
EP2751160A1 (en) | 2014-07-09 |
US9051498B2 (en) | 2015-06-09 |
TW201302832A (zh) | 2013-01-16 |
WO2012158363A1 (en) | 2012-11-22 |
CA2835204A1 (en) | 2012-11-22 |
EP2751160A4 (en) | 2015-04-22 |
AU2012256282B2 (en) | 2015-12-17 |
CN103534289B (zh) | 2016-08-17 |
US20140069583A1 (en) | 2014-03-13 |
EP2751160B1 (en) | 2016-09-28 |
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