JP2014504810A - 本体領域のバンドギャップより低いバンドギャップを持つ接続領域を有するメモリ装置 - Google Patents
本体領域のバンドギャップより低いバンドギャップを持つ接続領域を有するメモリ装置 Download PDFInfo
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- 210000000746 body region Anatomy 0.000 title claims abstract description 76
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 18
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 229910000673 Indium arsenide Inorganic materials 0.000 claims description 2
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 claims description 2
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 2
- 229940056932 lead sulfide Drugs 0.000 claims description 2
- 229910052981 lead sulfide Inorganic materials 0.000 claims description 2
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical compound [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 claims description 2
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 claims description 2
- 230000010365 information processing Effects 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
【選択図】図1
Description
1つまたは複数のハードドライブ612、および/またはコンパクトディスク(CD)、フラッシュドライブ、デジタルビデオディスク(DVD)、などのような着脱可能な媒体613を処理する1つまたは複数のドライブのような、特定のアプリケーションに適切な1つまたは複数のメモリ構成要素を含むことが可能である。前述の例で記載のように構成された半導体メモリダイが、情報処理システム600に含まれる。
Claims (27)
- 第1のバンドギャップを持つ半導体を有する本体領域と、
前記本体領域の第1の端部に接続されたソース領域、および、前記本体領域の第1の端部に接続されたドレイン領域と、
複数のゲートのそれぞれが、少なくともそれぞれの電荷記憶構造により前記本体領域から分離される、前記本体領域の長さに沿った複数のゲートと、
第2のバンドギャップを持つ半導体を有し、前記第2のバンドギャップは前記第1のバンドギャップより低く、接続領域が前記ソース領域を前記本体領域に接続する接続領域と、
前記本体領域および前記接続領域に近接したソース選択ゲートと、を備える、
メモリ装置。 - 前記本体領域が垂直方向に方向付けられる、請求項1に記載のメモリ装置。
- 前記本体領域が水平方向に方向付けられる、請求項1に記載のメモリ装置。
- 前記本体領域が、上方に向いた端部とともに“U”字型を形成する、請求項1に記載のメモリ装置。
- 前記本体領域がドープされたシリコンを含む、請求項1に記載のメモリ装置。
- 前記本体領域がp型のシリコンを含む、請求項5に記載のメモリ装置。
- 前記接続領域が、
ゲルマニウム、アンチモン化ガリウム、インジウム窒化物、砒化インジウム、硫化鉛、セレン化鉛、テルル化鉛およびシリコンゲルマニウムからなる群から選択される半導体を含む、請求項1に記載のメモリ装置。 - 前記接続領域が前記ソース領域に直接接続され、かつ前記接続領域が前記本体領域に直接接続される、請求項1に記載のメモリ装置。
- 前記本体領域がシリコンを含み、前記接続領域がシリコンゲルマニウムを含む、請求項1に記載のメモリ装置。
- 前記シリコンゲルマニウム領域がエピタキシャルシリコンゲルマニウムを含む、請求項9に記載のメモリ装置。
- 前記エピタキシャルシリコンゲルマニウムがSixGe1−xであり、xがおよそ0.5である、請求項10に記載のメモリ装置。
- 前記接続領域がソース接続領域を備え、
前記第1のバンドギャップより低いバンドギャップを持つ半導体を有し、前記ドレイン領域を前記本体領域に接続するドレイン接続領域と、
前記本体領域および前記ドレイン接続領域に近接したドレイン選択ゲートと、をさらに備える、
請求項1に記載のメモリ装置。 - 前記ソース接続領域および前記ドレイン接続領域の両方が、同一の材質で形成される、請求項12に記載のメモリ装置。
- 前記ドレイン接続領域がシリコンゲルマニウムを含む、請求項12に記載のメモリ装置。
- 前記本体領域を含むストリングのブースト動作中の前記本体領域内のゲートが引き起こすドレインリーク電流が、前記本体領域を含む前記ストリングの消去動作中の前記本体領域内のゲートが引き起こすドレインリーク電流と比較して低い、請求項1に記載のメモリ装置。
- 前記接続領域が、前記ソース領域と前記本体領域の間に位置付けられる、請求項1に記載のメモリ装置。
- 第1のバンドギャップを持つ半導体を有し、第1の上方に向いた端部および第2の上方に向いた端部を有する本体領域と、
前記第1の上方に向いた端部に接続されたドレイン領域と、
前記第2の上方に向いた端部に接続されたソース領域と、
前記本体領域の長さに沿った複数のゲートと、
第2のバンドギャップを持つ半導体を有し、前記第2のバンドギャップは前記第1のバンドギャップより低く、接続領域が前記ソース領域を前記本体領域に接続する接続領域と、
前記本体領域および前記接続領域に近接したソース選択ゲートと、を含む、
メモリセルストリングと、
前記ドレイン領域に接続されたデータラインと、
前記ソース領域に接続されたソースラインと、を備える、
メモリ装置。 - 前記接続領域がシリコンゲルマニウムを含む、請求項17に記載のメモリ装置。
- 前記接続領域がSixGe1−xを含み、xがおよそ0.5である、請求項17に記載のメモリ装置。
- 前記接続領域がエピタキシャルSixGe1−xを含む、請求項17に記載のメモリ装置。
- 前記本体領域がp型ドープされたシリコンを含む、請求項17に記載のメモリ装置。
- 前記ソース領域が、近接したメモリセルストリングと共用される、請求項17に記載のメモリ装置。
- 前記メモリセルストリングが、実質的にU字型を形成する、請求項17に記載のメモリ装置。
- 前記ゲートのそれぞれが、近接したメモリセルストリングと共用される、請求項17に記載のメモリ装置。
- 前記ゲートのそれぞれが、前記本体領域のそれぞれの断面を実質的に取り囲む、請求項17に記載のメモリ装置。
- 前記本体領域が細長形本体領域を有する、請求項17に記載のメモリ装置。
- 前記ゲートの第1の部分が、第1の近接したメモリセルストリングと共用され、前記ゲートの第2の部分が、第2の近接したメモリセルストリングと共用される、請求項17に記載のメモリ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/020,337 | 2011-02-03 | ||
US13/020,337 US8431961B2 (en) | 2011-02-03 | 2011-02-03 | Memory devices with a connecting region having a band gap lower than a band gap of a body region |
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