JP2014502221A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014502221A5 JP2014502221A5 JP2013536689A JP2013536689A JP2014502221A5 JP 2014502221 A5 JP2014502221 A5 JP 2014502221A5 JP 2013536689 A JP2013536689 A JP 2013536689A JP 2013536689 A JP2013536689 A JP 2013536689A JP 2014502221 A5 JP2014502221 A5 JP 2014502221A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- composite film
- film according
- lower layer
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40670510P | 2010-10-26 | 2010-10-26 | |
| US61/406,705 | 2010-10-26 | ||
| PCT/US2011/057418 WO2012058131A2 (en) | 2010-10-26 | 2011-10-24 | Composite film for board level emi shielding |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016035811A Division JP2016122859A (ja) | 2010-10-26 | 2016-02-26 | 基板レベルのｅｍｉ遮蔽のための複合フィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014502221A JP2014502221A (ja) | 2014-01-30 |
| JP2014502221A5 true JP2014502221A5 (https=) | 2015-03-26 |
| JP6082696B2 JP6082696B2 (ja) | 2017-02-15 |
Family
ID=45994675
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013536689A Expired - Fee Related JP6082696B2 (ja) | 2010-10-26 | 2011-10-24 | 基板レベルのｅｍｉ遮蔽のための複合フィルム |
| JP2016035811A Withdrawn JP2016122859A (ja) | 2010-10-26 | 2016-02-26 | 基板レベルのｅｍｉ遮蔽のための複合フィルム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016035811A Withdrawn JP2016122859A (ja) | 2010-10-26 | 2016-02-26 | 基板レベルのｅｍｉ遮蔽のための複合フィルム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8847184B2 (https=) |
| EP (1) | EP2633746B1 (https=) |
| JP (2) | JP6082696B2 (https=) |
| KR (1) | KR101584872B1 (https=) |
| CN (1) | CN103190209B (https=) |
| FI (1) | FI2633746T3 (https=) |
| TW (1) | TWI507120B (https=) |
| WO (1) | WO2012058131A2 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9678499B2 (en) | 2012-06-27 | 2017-06-13 | Mitsubishi Electric Research Laboratories, Inc. | Method for controlling redundantly actuated machines for cutting a pattern of disconnected contours |
| TWI573523B (zh) * | 2014-04-10 | 2017-03-01 | Joinsoon Electronic Manufacturing Co Ltd | Prevention and control of electrical signals are disturbed by the method and its circuit structure |
| WO2015186624A1 (ja) | 2014-06-02 | 2015-12-10 | タツタ電線株式会社 | 導電性接着フィルム、プリント回路基板、及び、電子機器 |
| KR102314774B1 (ko) | 2014-11-26 | 2021-10-21 | 삼성전자주식회사 | 반도체 패키지 |
| US9635789B2 (en) | 2015-01-30 | 2017-04-25 | Laird Technologies, Inc. | Board level electromagnetic interference (EMI) shields with increased under-shield space |
| KR101862121B1 (ko) * | 2015-02-02 | 2018-05-29 | 토요잉크Sc홀딩스주식회사 | 전자파 차폐 시트, 프린트 배선판 및 전자 기기 |
| EP3075798A1 (en) * | 2015-04-01 | 2016-10-05 | Ronald R. Savin | Coating compositions |
| EP3307815B1 (en) | 2015-06-12 | 2026-02-18 | NeoGraf Solutions, LLC | Graphite composites and thermal management systems |
| US9968004B2 (en) | 2015-09-25 | 2018-05-08 | Laird Technologies, Inc. | Thermal interface materials including electrically-conductive material |
| US11189420B2 (en) | 2016-03-31 | 2021-11-30 | Neograf Solutions, Llc | Noise suppressing assemblies |
| JP6528733B2 (ja) | 2016-06-21 | 2019-06-12 | 株式会社デンソー | エジェクタ式冷凍サイクル |
| US10080317B2 (en) | 2016-06-29 | 2018-09-18 | Microsoft Technology Licensing, Llc | Polymeric electromagnetic shield for electronic components |
| TWI619561B (zh) * | 2016-07-28 | 2018-04-01 | Rotating target | |
| US10477738B2 (en) | 2017-03-06 | 2019-11-12 | Laird Technologies, Inc. | Board level shields and systems and methods of applying board level shielding |
| KR20190076250A (ko) | 2017-12-22 | 2019-07-02 | 삼성전자주식회사 | 반도체 패키지 및 반도체 모듈 |
| KR102616814B1 (ko) * | 2018-03-09 | 2023-12-21 | 삼성전자주식회사 | 반도체 패키지 및 반도체 모듈 |
| WO2019174748A1 (en) | 2018-03-16 | 2019-09-19 | Huawei Technologies Co., Ltd. | Assembly for electro-magnetic interference shielding and method |
| KR102075669B1 (ko) * | 2018-10-26 | 2020-02-10 | 오재숙 | 신호 전송 커넥터 및 그 제조방법 |
| KR102869375B1 (ko) * | 2020-07-28 | 2025-10-14 | 삼성전자주식회사 | Fpcb 조립체 및 이를 포함하는 전자 기기 |
| CA3199923A1 (en) * | 2020-11-25 | 2022-06-02 | Maher F. El-Kady | Metallic based electromagnetic interference shielding materials, devices, and methods of manufacture thereof |
| KR102521564B1 (ko) * | 2021-01-14 | 2023-04-12 | 성균관대학교산학협력단 | 방열 및 전자파 차폐 복합재료, 이를 구비하는 전자 소자 패키지 및 이의 제조방법 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3157344B2 (ja) * | 1993-04-27 | 2001-04-16 | 三洋電機株式会社 | 導電シート及び表示器の製造方法 |
| US5639989A (en) | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
| JPH087658A (ja) * | 1994-06-22 | 1996-01-12 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
| JP2002223094A (ja) | 2001-01-25 | 2002-08-09 | Yokohama Rubber Co Ltd:The | 電波吸収体の構造 |
| US6900383B2 (en) * | 2001-03-19 | 2005-05-31 | Hewlett-Packard Development Company, L.P. | Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
| US6674652B2 (en) * | 2002-01-29 | 2004-01-06 | 3Com Corporation | Integrated shield wrap |
| US20060225874A1 (en) * | 2005-04-11 | 2006-10-12 | Shives Gary D | Sandwiched thermal article |
| US20060247352A1 (en) * | 2005-04-29 | 2006-11-02 | Ariel - University Research And Development Ltd. | EMI shielding material |
| KR100608533B1 (ko) * | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| JP4319167B2 (ja) | 2005-05-13 | 2009-08-26 | タツタ システム・エレクトロニクス株式会社 | シールドフィルム、シールドプリント配線板、シールドフレキシブルプリント配線板、シールドフィルムの製造方法及びシールドプリント配線板の製造方法 |
| JP2007073547A (ja) * | 2005-09-02 | 2007-03-22 | Yuji Suda | 電子部品の加圧装置 |
| WO2007123645A2 (en) * | 2006-03-28 | 2007-11-01 | Parker-Hannifin Corporation | Dispensable cured resin |
| JP4914262B2 (ja) * | 2006-03-29 | 2012-04-11 | タツタ電線株式会社 | シールドフィルム及びシールドプリント配線板 |
| JP2007324161A (ja) * | 2006-05-30 | 2007-12-13 | Yuji Suda | ビルドアップ多層配線板の製造方法 |
| JP5129935B2 (ja) * | 2006-06-13 | 2013-01-30 | 日東電工株式会社 | シート状複合材料及びその製造方法 |
| EP2131642A1 (en) * | 2007-03-29 | 2009-12-09 | Kabushiki Kaisha Asahi Rubber | Electromagnetic shield sheet and rfid plate |
| GB0710425D0 (en) * | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
| JP5487419B2 (ja) * | 2008-02-12 | 2014-05-07 | タツタ電線株式会社 | 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法 |
| JP5139156B2 (ja) | 2008-05-30 | 2013-02-06 | タツタ電線株式会社 | 電磁波シールド材及びプリント配線板 |
| CN102803406B (zh) * | 2009-06-12 | 2015-10-14 | 洛德公司 | 防止基底被雷击的方法 |
| KR101332362B1 (ko) | 2012-09-21 | 2013-12-02 | 재단법인 철원플라즈마 산업기술연구원 | 나노금속―그래핀을 이용한 열 확산기 및 이의 제조방법 |
-
2011
- 2011-10-24 WO PCT/US2011/057418 patent/WO2012058131A2/en not_active Ceased
- 2011-10-24 CN CN201180051609.6A patent/CN103190209B/zh not_active Expired - Fee Related
- 2011-10-24 KR KR1020137013255A patent/KR101584872B1/ko not_active Expired - Fee Related
- 2011-10-24 EP EP11836909.9A patent/EP2633746B1/en active Active
- 2011-10-24 FI FIEP11836909.9T patent/FI2633746T3/fi active
- 2011-10-24 JP JP2013536689A patent/JP6082696B2/ja not_active Expired - Fee Related
- 2011-10-25 TW TW100138733A patent/TWI507120B/zh not_active IP Right Cessation
-
2013
- 2013-03-13 US US13/798,895 patent/US8847184B2/en active Active
-
2016
- 2016-02-26 JP JP2016035811A patent/JP2016122859A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014502221A5 (https=) | ||
| FI2633746T3 (fi) | Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo | |
| CN105015094B (zh) | 石墨烯散热结构 | |
| Zhao et al. | Highly conductive multifunctional rGO/CNT hybrid sponge for electromagnetic wave shielding and strain sensor | |
| WO2008048705A3 (en) | Low density lightning strike protection for use in airplanes | |
| CN103552296B (zh) | 一种防雷击用导电层及其制备方法 | |
| CN105007704B (zh) | 复合散热吸波膜 | |
| JP2012072364A5 (https=) | ||
| JP2011003544A5 (https=) | ||
| CN109328135A (zh) | 导热薄膜片及包含其的制品 | |
| CN107325421A (zh) | 一种聚合物/石墨烯/碳纳米管复合材料的制备方法 | |
| WO2015180221A1 (zh) | 一种纳米银线透明导电膜的生产方法 | |
| CN103408993A (zh) | 导电油墨、透明导电体及其制备方法 | |
| KR20200101885A (ko) | 복합재 | |
| CN106009530A (zh) | 氮化硼-银杂化粒子/环氧树脂复合材料及其制备方法 | |
| CN110607167A (zh) | 一种含液态金属的三维复合散热浆料及由其制备的散热膜 | |
| JP2013118180A5 (https=) | ||
| CN107148207A (zh) | 一种复合微球颗粒电磁吸波填料以及具有该电磁吸波填料的电磁屏蔽材料 | |
| Lee et al. | Vertically-aligned boron nitride composite as a highly thermally conductive material using magnetic field-assisted three-dimensional printing | |
| WO2024130938A1 (zh) | 一种高回弹低热阻界面材料及其制备方法 | |
| KR102565178B1 (ko) | 연성-강성-연성 다층 구조 열 계면 소재, 이의 제조 방법 및 이를 포함하는 방열 장치 또는 시스템 | |
| CN202941076U (zh) | 电子产品用石墨散热片 | |
| Li et al. | Thermal conductivity enhancement for multi-functional phase change materials: From random fillers to oriented networks in viscous systems | |
| CN203151931U (zh) | 具有散热效果的复合材料纤维布 | |
| CN204801156U (zh) | 一种高匀热低导热的散热膜 |