JP2014232759A - Wiring board unit, manufacturing method thereof, and manufacturing method of wiring board with lead - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board unit in which even a conductor part that is not electrically conducted with an external terminal of a wiring board disposed within an opening of a lead frame is covered with a plating film and curving of a lead connected with the external terminal is completely eliminated, a manufacturing method thereof and a manufacturing method of a wiring board with the lead.SOLUTION: The wiring board unit comprises: a lead frame 2 including a plurality of leads 5 of which one end is connected to an inner edge 3a of a frame 3 including an opening 4 for disposing a plurality of wiring boards 10 and the other end is connected to an external terminal 14 of the wiring board 10. The wiring board 10 includes a product insulation part 11 and a dummy insulation part 12. In the product insulation part 11, an external terminal 14 and conductor portions 18 and 19 which are not electrically connected with the terminal 14 are formed on a surface. In the dummy insulation part 12, a terminal 23 for plating that is electrically connected to the conductor portions 18 and 19 is formed on a surface. The dummy insulation part 12 is disposed at an outer edge of the product insulation part 11 which is not overlapped with the plurality of leads 5. The terminal 23 for plating and the inner edge 3a of the frame 3 are connected by a lead 7 for plating which extends into the opening 4 of the frame 3.

Description

  The present invention relates to a wiring board unit comprising a wiring board and a lead frame having the wiring board inside an opening, a manufacturing method of the wiring board unit, and a manufacturing method of a wiring board with leads obtained following the manufacturing method. .

  For example, a lead frame having a plurality of lead portions extending in parallel from one side of an opening having a rectangular shape in a plan view, and a terminal fixed by brazing to the distal end portions of the plurality of lead portions, and in the opening In a ceramic package composed of a ceramic substrate supported in a cantilever manner at a required position, the outer contour shape of the seal ring fixed to the main surface of the ceramic layer of the ceramic substrate is used as a reference for position recognition. There has been proposed an invention for obtaining a ceramic package excellent in mounting accuracy and productivity by mounting a semiconductor element on a substrate (see, for example, Patent Document 1).

  In the case where the ceramic substrate is supported in a cantilevered state by a plurality of leads in the opening portion of the lead frame as in the ceramic package, a plurality of terminals in the ceramic substrate brazed to the plurality of leads individually The conductor portion that is electrically connected to the terminal and exposed on the surface of the ceramic substrate can be coated with a plating film by electrolytic metal plating on the surface of the terminal or the like by connecting the lead frame to a plating power source. However, a portion of the ceramic substrate that is not electrically connected to the terminal, for example, a frame-shaped conductor portion surrounding the cavity provided in the ceramic substrate or a metal element provided on the bottom surface of the cavity There was a problem that the surface of the mounting portion could not be subjected to the electrolytic plating.

  Further, after the mounting step of mounting the ceramic substrate on a lead frame, the ceramic substrate is subjected to a flowing plating solution when plating is performed to coat the surface of the terminal or the plurality of leads of the ceramic substrate with a metal plating film. Since the substrate easily swings, the lead may be bent. In particular, the bending deformation is likely to occur as the plurality of leads are elongated and the width thereof is narrowed. As a result, there is a problem that the obtained wiring board unit, which is a lead frame with a wiring board, and a wiring board with leads are likely to be defective products.

JP 2001-156215 A (pages 1 to 8, FIGS. 1 to 4)

  The present invention solves the problems described in the background art, and is connected to a plurality of leads extending into the opening of the lead frame, and a plurality of external terminals in the wiring board disposed in the opening are used as the base. A wiring board unit in which the conductor portion of the wiring board that is not electrically connected to the terminal is also coated with a plating film and the lead is not bent at all, a method for manufacturing the wiring board unit, and the method It is an object of the present invention to provide a subsequent method for manufacturing a wiring substrate with leads.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention provides a lead for plating separately extending in the opening in addition to the plurality of leads extending in the opening of the lead frame, and the tip of the plating lead and the opening It is conceived to connect to a plating terminal provided in a dummy insulating part provided alongside a wiring board arranged in the part.
That is, the wiring board unit of the present invention (Claim 1) has a polygonal wiring board having three or more sides in a plan view and an opening for arranging at least one of the wiring boards on the inside in a plan view. A wiring board unit comprising: a frame; and a lead frame including a plurality of leads having one end coupled to an inner edge of the opening of the frame and the other end connected to a plurality of external terminals of the wiring board. The wiring board is formed on a product insulating part formed on the surface of the plurality of external terminals and a conductor part not electrically connected to the external terminals, and on an outer edge part including at least one side of the polygon. And a dummy insulating part formed on the surface with a plating terminal electrically connected to the conductor part, and the dummy insulating part is disposed at a position not overlapping with the plurality of leads in a plan view. Terminal , Between the inner edge of the opening of the frame are connected by the plating leads extending to the opening portion from the inner edge of the opening of the frame, characterized in that.

According to this, the wiring board disposed in the opening located inside the frame has a plurality of leads in which a plurality of external terminals formed on the surface of the product insulating portion extend from the inner edge of the frame into the opening. And a plating terminal formed on the surface of the dummy insulating portion of the wiring board is connected to a plating lead extending from a different position on the inner edge of the frame. Therefore, by connecting the frame to a plating power source in a plating process at the time of manufacture, a plating film formed by electrolytic metal plating on the surface of a plurality of external terminals formed on the product insulating portion of the wiring board via a plurality of leads The surface of the conductor portion that is not electrically connected to the external terminal can be covered with the plating film via the plating lead and the plating terminal.
In addition, since the wiring board is supported in the opening by a plurality of leads and plating terminals extending from different positions on the inner edge of the frame, the flow of the plating solution in the plating process, etc. In this manufacturing process, the plurality of leads are less likely to be inadvertently deformed such as bending.
Accordingly, a lead frame and a wiring board disposed in the opening thereof are provided, and the plurality of leads connecting the wiring board and the frame are not bent, and the surfaces of the plurality of external terminals and the external terminals on the wiring board are not bent. The wiring board unit is capable of reliably covering a desired plating film on the surface of a conductor portion that is not electrically connected.

In addition to the form in which a plurality of the wiring boards are arranged in a straight line in a plan view in the opening of the lead frame, the wiring board is arranged in a grid-like position or a staggered position. It is also good.
The wiring board is made of a resin such as ceramic or epoxy.
Furthermore, the wiring board has an outer shape of a regular polygon (for example, a square) or more of a triangle or a deformed polygon (for example, a rectangle) in plan view.
Further, the dummy insulating portion of the wiring board is, for example, an insulating portion adjacent to the product insulating portion, and for example, a dividing groove may be provided along a boundary with the product insulating portion.
Furthermore, the plurality of external terminals in the wiring board may be formed on the surface of the thin portion in the product insulating portion, for example.
The lead frame is made of 42 alloy (Fe-42% Ni), copper alloy such as 194 alloy (Cu-2.3% Fe-0.03% P), Kovar (Fe-29% Ni-17% Co). ), Or a thin plate of stainless steel or the like is punched in a predetermined pattern.

Furthermore, when the opening of the frame is a regular polygon or a deformed polygon in plan view, the plurality of leads in the lead frame are parallel to each other from the same side among the inner edges forming the opening of the frame. It extends toward the same side of the product insulating part in the wiring board, or extends obliquely toward the same side of the product insulating part in the same wiring board while approaching each other from the same side of the inner edge of the frame, or It extends from different sides of the inner edge forming the opening of the frame in different directions and toward different sides of the product insulating part on the same wiring board.
Further, in the wiring board, on the surface exposed to the outside of the internal terminal conducting to the external terminal or the conductor conducting to the plating terminal, the same plating film (for example, Ni plating film and Au plating film) Plating layer).
In addition, the plating lead connected to the frame and the plating terminal of the wiring board are used only for coating the plating film on the surface of the conductor portion not electrically connected to the external terminal of the wiring board.

Further, in the present invention, the wiring board includes a plurality of internal terminals that conduct to the plurality of external terminals via a main internal wiring, and the conductor portion that conducts to the plating terminal via a sub internal wiring, A wiring board unit (claim 2) is also included.
According to this, in the plating process at the time of manufacture, the frame is connected to the plating power source, and formed on the product insulating portion of the wiring board via the plurality of leads, the plurality of external terminals, and the main internal wiring. The surface of the conductor part that is coated with a plating film by electrolytic metal plating on the surface of the plurality of internal terminals and is not electrically connected to the external terminal via the plating lead, the plating terminal, and the sub-internal wiring The wiring board unit is also coated with a plating film.
The conductor part formed in the product insulating part includes, for example, a plurality of internal terminals described below formed on the bottom surface of the cavity opened on the surface of the product insulating part. The main / sub internal wiring is composed of wiring formed between a plurality of insulating layers constituting the wiring board, and a pair of via conductors individually connected to both ends of the wiring and penetrating through the upper insulating layer, In the vertical cross section, a form that substantially exhibits a channel shape is illustrated.

Further, according to the present invention, the wiring board has a cavity opened on a surface of the product insulating portion, the plurality of internal terminals on the bottom surface of the cavity, and the sub-internal wiring on the plating terminal. A wiring board unit (Claim 3) having a flat conductor portion for mounting a conductive electronic component is also included.
According to this, the surface of the plurality of internal terminals formed on the bottom surface of the cavity opened on the surface of the product insulating portion is plated via the plurality of leads, the plurality of external terminals, and the main internal wiring, respectively. A wiring board unit coated with a film and coated with a plating film on the surface of a flat conductor formed on the bottom surface of the cavity via the plating lead, the plating terminal, and the sub-internal wiring; It has become.
The cavity opens in the center of the surface of the product insulating portion in the plan view or on any side of the surface, and opens in the flat surface of the product insulating portion, or stands from the surface. A form surrounded by a plurality of side walls is included.

In addition, according to the present invention, the wiring board further includes a frame-shaped conductor portion in a plan view that is electrically connected to the plating terminal via the sub-internal wiring on the surface of the product insulating portion surrounding the cavity. A wiring board unit (claim 4) is also included.
According to this, in the plating process at the time of manufacture, the frame is connected to a plating power source so that the surface of the product insulating portion surrounding the cavity is connected via the plating lead, the plating terminal, and the sub-internal wiring. A wiring board unit in which a plating film is also coated on the surface of the formed frame-shaped conductor portion.
The frame-shaped conductor is a metal frame for sealing for brazing a metal lid for sealing the cavity.

  On the other hand, a method of manufacturing a wiring board unit according to the present invention (Claim 5) includes a polygonal wiring board having three or more sides in a plan view and an opening in which at least one of the wiring boards is arranged in a plan view. And a lead frame including a plurality of leads having one end connected to an inner edge of the opening of the frame and the other end connected to a plurality of external terminals of the wiring substrate. And a position where the plating lead protrudes from the inner edge of the opening, the frame having an opening on the inner side in plan view, the plating lead extending from the inner edge of the opening into the opening. A step of preparing a lead frame having a plurality of leads extending into the opening from different positions, and a plurality of external terminals and a conductor portion not electrically connected to the external terminals A product insulating portion formed on the surface, and a dummy insulating portion formed on an outer edge portion including at least one side of the polygon and having a plating terminal electrically connected to the conductor portion formed on the surface. A step of preparing the wiring board; a plating terminal electrically connected to a conductor portion of the wiring board; and the frame are joined via the plating lead; and a plurality of external terminals formed in the product insulating portion; The wiring board mounting step of arranging the wiring board in the opening of the lead frame by individually bonding the plurality of leads so that the dummy insulating portion and the plurality of leads do not overlap in plan view; The lead frame having the wiring board disposed in the opening is electrically connected to a plating power source, the surface of the frame, the surfaces of the plurality of leads, the surfaces of the plating leads, and the internal terminals. And to the surface of the conductor portion includes a plating step of coating the plated film, and wherein the.

According to this, in the mounting step, the prepared wiring board is disposed in the opening located inside the prepared lead frame, and a plurality of external parts formed on the surface of the product insulating part of the wiring board The terminal and a plurality of leads extending from the inner edge of the frame are joined, and the plating terminal formed on the surface of the dummy insulating portion of the wiring board and the plurality of leads on the inner edge of the frame extend from different positions. The lead for plating is joined. Therefore, in the next plating step, the surface of the plurality of external terminals formed on the product insulating portion of the wiring board can be coated with a plating film by electrolytic metal plating via the plurality of leads, and the plating lead and the plating lead The plating film can also be coated on the surface of the conductor portion that is not electrically connected to the external terminal via the terminal.
Accordingly, a lead frame and a wiring board disposed in the opening thereof are provided, the plurality of leads connecting the wiring board and the frame are not bent, and together with the surfaces of the plurality of external terminals on the wiring board, the external terminals It is possible to reliably provide a wiring board unit in which a desired plating film is also coated on the surface of a conductor portion that is not electrically connected to the conductor.

Furthermore, in the method for manufacturing a wiring board with leads according to the present invention (Claim 6), after the plating step in the manufacturing method of the wiring board unit, at least a part of the frame is cut and the plurality of leads are removed. In addition to separating from the frame, the dummy insulating portion is separated from the wiring substrate, and a cutting step of cutting out the wiring substrate consisting only of the product insulating portion from the lead frame is performed.
According to this, the required number of leads comprising the wiring substrate composed of only the product insulating portion and a plurality of leads each having one end portion (tip portion) individually joined to a plurality of external terminals formed on the surface thereof. An attached wiring board can be provided reliably.
Note that the cross-section of the sub-internal wiring that has been electrically connected to the plating terminal and the conductor portion is exposed on the cut surface of the wiring board after the cutting step, but the fine cross-section hardly causes adverse effects. . However, you may cover the said cross section with the coating film of an insulating agent.
Moreover, it is good also as a wiring board with a lead of the form which also has a part of said frame adjacent to the vicinity of the base end part of a some lead | read | reed. Furthermore, in the wiring board with leads in such a form, it is also possible to provide a wiring board with leads having a lead having a desired length by cutting a plurality of leads at positions on the base end side.

The top view which shows the wiring board unit of one form by this invention. 1A is a vertical cross-sectional view taken along the line XX in FIG. 1, FIG. 1B is a partially enlarged view of a one-dot chain line portion B in FIG. 1A, and FIGS. The top view which shows the wiring board with a lead obtained by a board | substrate unit. The partial top view which shows the wiring board unit of a different form. FIG. 4A is a vertical sectional view taken along the line YY in FIG. 3, and FIGS. 4B and 4C are plan views showing a leaded wiring board obtained by the wiring board unit. (A) is a top view which shows the wiring board unit of another form further, (B) is a vertical sectional view of the wiring board along the arrow of the HH line in (A), (C) is in (A). The vertical sectional view of the wiring board along the arrow of the VV line. (A), (B) is a top view which shows the wiring board with a lead obtained by the said wiring board unit. Schematic which shows one preparatory process in the manufacturing method of the wiring board unit of FIG. Schematic which shows the different preparatory process in the manufacturing method of the said wiring board unit. Schematic which shows the preparatory process following FIG. (A) is the schematic which shows the mounting process in the said manufacturing method, (B) is the schematic which shows the plating process in this manufacturing method. (A) is a plan view of a wiring board with leads obtained by a cutting process following the above manufacturing method, and (B) and (C) are with a lead obtained by a cutting process following the manufacturing method of a wiring board unit of a different form. The top view of a wiring board.

Hereinafter, modes for carrying out the present invention will be described.
1 is a plan view showing a wiring board unit 1 according to one embodiment, FIG. 2A is a vertical sectional view taken along the line XX in FIG. 1, and FIG. It is the elements on larger scale of the dashed-dotted line part B in FIG.
As shown in FIG. 1, the wiring board unit 1 includes three (plural) wiring boards 10 that have a rectangular (quadrangle) outer shape in a plan view, and the three wiring boards 10 that are straight in the opening 4. The lead frame 2 is arranged in a shape.
The lead frame 2 is composed of, for example, a 42 alloy having a thickness of about 0.1 to 0.2 mm, a frame 3 having a rectangular frame-like outer shape in plan view and a substantially similar opening 4 on the inside, Three sets of three (a plurality of) adjacent to each other from the inner edge 3a on the lower side of the frame 3 vertically extend into the opening 4, and the upper side of the frame 3 is perpendicular to the inner edge 3a on the upper side of the frame 3 and Three plating leads 7 extending into the opening 4 are provided so as to face the central lead 5 of each group.

On the other hand, as shown in FIGS. 1, 2A and 2B, the wiring board 10 has a vertically long rectangular shape having four sides in plan view, and is compared with a relatively large product insulating portion 11. And a small dummy insulating portion 12. These insulating portions 11 and 12 are formed by laminating ceramic layers s1 to s4 mainly composed of alumina, for example, and are divided by a virtual broken line in FIG. 2B, and along the boundary between the two, A split groove 13 having an inverted V-shaped cross section is formed on the back surface of the wiring board 10. In addition, you may comprise the said insulating parts 11 and 12 with the insulating material which consists of high temperature baking ceramics, such as mullite, low temperature baking ceramics, such as glass-ceramics, or resin of an epoxy type.
The product insulating portion 11 is formed by laminating ceramic layers s3 and s4 having a square frame shape in plan view above a flat plate portion made of ceramic layers s1 and s2, and FIGS. 3), three (plural) external terminals 14 are linearly formed on the surface of the thin portion of the product insulating portion 11. The three external terminals 14 are individually brazed (bonded) to the tip of each of the three leads of the set 5 via, for example, a brazing material 9 made of Ag.

Further, inside the ceramic layers s3 and s4, a cavity 16 is formed that is surrounded by the side walls 15 in a plan view and has a part of the surface of the ceramic layer s2 as a bottom surface. Are formed with three internal terminals 17 along the left and right sides and one conductor portion 18 having a rectangular shape in plan view and a flat plate shape.
As shown in FIG. 2B, the three external terminals 14 and the three internal terminals 17 are formed from via conductors that penetrate the ceramic layer s2 and wiring formed between the ceramic layers s1 and s2. Thus, the electrical connection can be made individually through the three sets of main internal wirings 21 whose vertical cross section has a substantially channel shape. Further, an electronic component 20 such as a semiconductor element such as an IC chip or a light emitting element is mounted on the surface of the conductor portion 18 later, and three electrodes (not shown) positioned on the upper surface of the electronic component 20 The three internal terminals 17 are individually connected through wires 22 later.

As shown in FIGS. 1 and 2B, the dummy insulating portion 12 is formed at a position that does not overlap the plurality of leads 5 in plan view. A horizontally long plating terminal 23 is formed on the surface of the ceramic layer s2 constituting the dummy insulating portion 12, and the plating lead 23 is connected to the plating lead via the Ag brazing material 9 similar to the above. 7 is brazed (connected). The conductor part 18 and the plating terminal 23 on the product insulating part 11 side are connected via a sub-internal wiring 24 comprising a via conductor that penetrates the ceramic layer s2 and a wiring formed between the ceramic layers s1 and s2. , Conduction is possible. Further, a frame-like conductor portion 19 is formed on the surface of the side wall 15 forming the cavity 16 in plan view, and the conductor portion 19 is interposed via a via conductor 25 penetrating the side wall 15 in the thickness direction. It is connected to the sub internal wiring 24.
The external terminal 14, the internal terminal 17, the conductor portions 18 and 19, the plating terminal 23, and the main / sub internal wirings 21 and 24 are made of, for example, W, Mo, or Cu.

FIG. 2C shows a wiring board 10p having only the product insulating part 11 as an insulating part by cutting and removing the dummy insulating part 12 along the dividing groove 13 from the wiring board unit 1, and three wiring boards 10p. 2 is a plan view showing a lead-attached wiring board 26 comprising a lead 5 and a partial frame 3b left by cutting the lower side of the frame 3 adjacent to the three leads 5 at two places. FIG. Three wiring boards 26 with leads are obtained from the wiring board unit 1. The cut surface of the sub-internal wiring 24 is exposed on the cut side surface of the wiring board 10p.
Further, by cutting and removing the partial frame 3b and the base end side of the three leads 5 adjacent to the partial frame 3b from the lead-attached wiring board 26, as shown in FIG. The leaded wiring board 28 including the three leads 5 having a length of 1 mm is obtained. The wiring substrate 28 with leads mounts the electronic component 20 on the surface of the frame-shaped conductor portion 18 for mounting elements, and wire each electrode of the electronic component 20 and the three internal terminals 17 to each other. By being individually conducted by 22, it is possible to dispose at a predetermined portion in various electronic devices.

FIG. 3 is a plan view showing a part of a different type of wiring board unit 1a, and FIG. 4A is a partial vertical sectional view taken along the line YY in FIG.
As shown in FIG. 3, the wiring board unit 1 a includes a lead frame 2 a similar to the above and a plurality of wiring boards 30 arranged in the opening 4 of the frame 3. The lead frame 2a includes the same frame 3, leads 5 extending perpendicularly from the inner edge 3a of the opening 4 on the lower side of the frame 3, and both sides of the lead 5 and symmetrically from the inner edge 3a. A pair of left and right leads 6 extending in an inclined manner and a plurality of plating leads 7 extending vertically from the inner edge 3a of the upper side of the frame 3 substantially opposite to the leads 5 are provided. The lead 5 and the pair of left and right leads 6 sandwiching the lead 5 are “a plurality of leads” corresponding to each wiring board 30.

On the other hand, as shown in FIGS. 3 and 4A, the wiring board 30 is formed by laminating a plurality of ceramic layers s1 to s4 similar to the above, and has a deformed octagonal shape having eight sides in plan view. 3, a deformed hexagonal product insulating part 31 having five sides located under the boundary indicated by the phantom dashed line in FIG. 3, and a plane having three sides located above the boundary The dummy insulating portion 32 has a trapezoidal shape.
As shown in FIGS. 3 and 4 (A), the product insulating portion 31 includes a rectangular frame-shaped side wall 40 and a cavity 36 inside thereof in a plan view above the surface, and in the vicinity of the lower side in FIG. And a pair of left and right external terminals 35 individually formed vertically on the surface in the vicinity of the left and right sides in FIG. The bottom surface of the cavity 38 has three internal terminals 37 that are individually connected to the three external terminals 34 and 35 through the main internal wiring 41 similar to the above, and has a rectangular shape in plan view and a flat plate shape as a whole. The one conductor part 38 which is is formed. Further, a frame-shaped conductor portion 39 is formed on the surface of the side wall 40 surrounding the cavity 36 in plan view. The external terminals 34 and 35 are brazed at the leading ends of the leads 5 and 6 individually via the brazing material 9 via the same brazing material of Ag.

Further, as shown in FIG. 3, the dummy insulating portion 32 is disposed at a position that does not overlap with the plurality of leads 5 and 6. In the dummy insulating portion 32, a horizontally long plating terminal 43 is formed on the surface in the vicinity of the upper side in FIG. 3, and the tip end portion of the plating lead 7 is brazed to the plating terminal 43 in the same manner as described above (see FIG. It is connected. Further, as shown in FIG. 4A, the conductor portion 38 and the plating terminal 43 on the product insulating portion 31 side are electrically connected via the same sub-internal wiring 44 and the sub-internal wiring. A via conductor 45 extending from the conductor portion 39 is connected to 44. In addition, as shown in FIG. 4A, the same divided groove 33 is formed on the back surface of the wiring board 30 along the boundary between the product insulating portion 31 and the dummy insulating portion 32.
As in the case of the wiring board unit 1, as shown in FIG. 3, the tip of the lead 5 extending from the inner edge 3 a on the lower side of the frame 3 into the opening 4 is connected to the outside of the product insulating part 31 for each wiring board 30. The terminals 34 and the distal ends of the pair of left and right leads 6 are individually joined to the pair of external terminals 35 in the product insulating portion 31, and the plating leads 7 extending from the inner edge 3 a on the upper side of the frame 3 into the opening 4. The wiring board unit 1 a is configured by joining the leading end of each of the wiring board 30 to the plating terminal 43 of the dummy insulating part 42 in each wiring board 30.

FIG. 4B shows a wiring board 30p having only the product insulating part 31 by cutting and removing the dummy insulating part 32 along the dividing groove 33 from the wiring board unit 1a, and three leads. 5 is a plan view showing a leaded wiring board 46 composed of 5, 6 and a partial frame 3c left by cutting the lower side of the frame 3 adjacent to the leads 5, 6 in two places.
Further, by cutting and removing the partial frame 3c and the proximal end sides of the three leads 5 and 6 adjacent to the partial frame 3c from the lead wiring board 46, as shown in FIG. Thus, the leaded wiring board 48 including the three leads 5 and 6 having a desired length is obtained. In the lead-attached wiring board 48, the electronic component 20 is mounted on the surface of the element mounting conductor portion 38, and each electrode of the electronic component 20 and the three internal terminals 37 are individually connected by the wires 22. By conducting, it is possible to dispose in a predetermined part of various electronic devices.

FIG. 5A is a plan view showing a further different form of the wiring board unit 1b, and FIG. 5B is a vertical sectional view of the wiring board 50 taken along the line HH in FIG. FIG. 5C is a vertical cross-sectional view of the wiring board 50 taken along the line VV in FIG.
As shown in FIG. 5A, the wiring board unit 1b includes a lead frame 2b similar to the above, and two (plural) wiring boards 50 arranged in the opening 4 of the frame 3. . The lead frame 2b includes the same frame 3, a pair of left and right (two) and two sets of leads 5 extending perpendicularly from the inner edge 3a on the opening 4 side on the lower side of the frame 3, and the frame 3 A pair of plating leads 8 that extend perpendicularly and symmetrically from the inner edge 3a of the left and right sides into the opening 4 are provided.

On the other hand, the wiring board 50 is formed by laminating the same ceramic layers s1 to s4 as described above, as shown in FIGS. 5A to 5C, and has a substantially square outer shape in plan view. And a relatively small and elongated rectangular dummy insulating part 52 adjacent to one long side of the product insulating part 51. On the back surface of the wiring substrate 50, the same dividing groove 53 is formed along the boundary between the product insulating portion 51 and the dummy insulating portion 52 indicated by a broken line in FIG.
The product insulating portion 51 has a rectangular frame-shaped side wall 55 and a cavity 56 inside thereof in a plan view above the surface, and a pair of left and right external terminals formed on the surface near the lower side of FIG. 54. The pair of external terminals 54 are individually brazed with the tip portions of the pair of leads 5 via the brazing material 9. On the bottom surface of the cavity 56, there are two internal terminals 57 individually connected to a pair of external terminals 54 via the same main internal wiring 61, and one conductor portion 58 in the same flat plate shape. Is formed. A frame-shaped conductor portion 59 is formed on the surface of the side wall 55 surrounding the cavity 56 in plan view.

The dummy insulating portion 52 is formed with a plating terminal 63 on the surface on the upper side in FIG. 5A, and the tip of the plating lead 8 is brazed to the plating terminal 63 in the same manner as described above. (It is connected. Further, as shown in FIG. 5B, the conductor 58 on the product insulating portion 51 side and the plating terminal 63 are electrically connected through the sub-internal wiring 64 similar to the above, and the sub-internal wiring 64 includes A via conductor 65 extending from the conductor portion 59 and conducting to the sub internal wiring 64 is connected.
As in the case of the wiring board unit 1, as shown in FIG. 5A, the leading end portion of the lead 5 extending from the inner edge 3 a on the lower side of the frame 3 into the opening 4 is connected to the product insulating portion of the wiring board 50. In addition to individually joining to the external terminal 54 of the frame 51, the tip end portion of the plating lead 8 extending into the opening 4 from the inner edge 3 a on the left or right side of the frame 3 is a dummy insulating portion for each wiring board 50. The wiring board unit 1b is configured by bonding to the plating terminals 63 of 52.

FIG. 6A shows a wiring board 50p in which the dummy insulating part 52 is cut and removed from the wiring board unit 1b along the dividing groove 53 to make only the product insulating part 51, each lead 5, FIG. 6 is a plan view showing a lead-attached wiring board 66 composed of a partial frame 3b left by cutting the lower side of the frame 3 adjacent to the lead 5 at two places.
Further, by cutting and removing the partial frame 3b and the base end side of the pair of leads 5 adjacent to the partial frame 3b from the wiring board 66 with leads, as shown in FIG. A leaded wiring board 58 including two leads 5 having a length is obtained. In the lead-attached wiring board 58, the electronic component 20 is mounted on the surface of the element mounting conductor 58, and each electrode of the electronic component 20 and the two internal terminals 57 are individually connected by wires 22. By conducting, it is possible to dispose in a predetermined part of various electronic devices.

  According to the wiring board units 1, 1 a, 1 b as described above, the wiring boards 10, 30, 50 arranged in the opening 4 located inside the frame 3 are connected to the product insulating parts 11, 31, A plurality of external terminals 14, 34, 35, 54 formed on the surface of 51 are individually connected to a plurality of leads 5, 6 extending from the inner edge of the frame 3, and dummy insulation of the wiring boards 10, 30, 50 is performed. Plating leads 7, 8 in which plating terminals 23, 43, 63 formed on the surfaces of the portions 12, 32, 52 extend from a side different from the side where the plurality of leads 5, 6 extend on the inner edge of the frame 3. Connected with. Therefore, by connecting the frame 3 to the plating power source in the plating process at the time of manufacture, the plurality of leads 5 and 6, the plurality of external terminals 14, 34, 35 and 54, and the main internal wiring 21, 41 and 61 are connected. In addition, the surfaces of the internal terminals 17, 37, 57 formed in the product insulating portions 11, 31, 51 are coated with a plating film by electrolytic metal plating, and the plating leads 7, 8, the plating terminals 23, 43, 63, and flat conductor portions 18, 38, 58 and frame-like conductors that are not electrically connected to the external terminals 14, 34, 35, 54 via the sub-internal wirings 24, 44, 64. The plating film is also coated on the surfaces of the portions 19, 39 and 59.

Moreover, the wiring boards 1, 1 a and 1 b are supported by a plurality of leads 5 and 6 and plating terminals 7 and 8 extending into the opening 4 from different positions on the inner edge 3 a of the opening 4 in the frame 3. Therefore, in the flow of the plating solution in the plating process and other manufacturing processes, the plurality of leads 5 and 6 are hardly deformed such as bending.
Accordingly, the lead frames 2, 2 a, 2 b and the plurality of wiring boards 10, 30, 50 arranged in the openings 4 are provided, and the plurality of wiring boards 10, 30, 50 and the frame 3 are connected to each other. The leads 5 and 6 are not bent, and are electrically connected to the surfaces of the plurality of external terminals 14, 34, 35, 54 on the wiring boards 10, 30, 50 and the external terminals 14, 34, 35, 54. The wiring board units 1, 1 a, 1 b are surely coated with desired plating films on the surfaces of the flat plate-like conductor portions 18, 38, 58 and the frame-shaped conductor portions 19, 39, 59.

Hereinafter, a method for manufacturing the wiring board unit 1 and the wiring boards 26 and 28 with leads will be described.
A step of preparing a lead frame 2 as shown in FIG. 7 was performed in advance. In order to obtain the lead frame 2, for example, a belt-like metal thin plate (not shown) that is continuous in the left-right direction in FIG. 7 is prepared, and a predetermined cross section is provided with respect to the metal thin plate. Punching with a punch having a shape (pattern) and a die was performed a plurality of times along the longitudinal direction of the thin metal sheet.
Next, the thin metal plate was cut for each punched region. As a result, as shown in FIG. 7, a rectangular frame-shaped frame 3 having an opening 4 substantially similar to the outer shape on the inside in plan view, and three adjacent three from the inner edge 3 a on the lower side of the frame 3. A set of leads 5 extending vertically into the opening 4 and an inner edge 3a on the upper side of the frame 3 extending into the opening 4 perpendicularly to the central lead 5 in each set. A lead frame 2 provided with three plating leads 7 was obtained.
The step of preparing the lead frames 2a and 2b can be formed in the same manner as described above by using punches and dies each having a dedicated sectional shape.

In parallel with the preparation of the lead frame 2, a process of preparing the wiring board 10 was performed.
Four green sheets mainly composed of alumina are prepared in advance, and among these, the two green sheets g1 and g2 that will be the ceramic layers s1 and s2 are left as they are, and the ceramic layers s3 and s4 are subsequently formed. The two green sheets g3 and g4 are punched using a die having a rectangular punched hole in plan view and a punch having a rectangular cross section smaller than the punched hole. As shown in the figure, two frame-shaped green sheets g3 and g4 having a square frame shape in plan view and having a through-hole 16h for the cavity 16 on the inside are formed. Next, via holes were punched along the thickness direction for each of the sheets g3 and g4, and each via hole was filled with a conductive paste containing W or Mo powder to form an unfired via conductor 25v. Further, the same conductive paste as described above was screen-printed on the surface of the uppermost frame-shaped green sheet g4 to form an unfired conductor portion 19 having a frame shape in plan view.

On the other hand, the flat green sheet g2 that will be the ceramic layer s2 later is punched with a small diameter punch to form a plurality of via holes, and each via hole is filled with the same conductive paste as described above. As shown in FIG. 8, a plurality of unfired via conductors 21v and 24v, which will be part of the main / sub internal wirings 21 and 24, are formed later. Next, a conductive paste similar to the above is printed in a predetermined pattern by screen printing at a predetermined position on the surface of the green sheet g2 on which the via conductors 21v and 24v are formed, and the unfired external terminals 14 and internal terminals 17, the required number of flat conductor portions 18 and plating terminals 23 were formed.
Further, the same conductive paste as described above is screen-printed on the surface of the flat green sheet g1 to be the ceramic layer s1 later, so that the unfired wiring that becomes a part of the main / sub-internal wirings 21, 24 21f and 24f were formed. In addition, a knife was inserted to a predetermined depth at a predetermined position on the back surface of the green sheet g1 to form the divided groove 13 having an inverted V-shaped cross section.

Further, as indicated by the arrows in FIG. 8, after the green sheets g1 to g4 were laminated and pressure-bonded, the obtained green sheet laminate was degreased and fired.
As a result, as shown in FIG. 9, ceramic layers s <b> 1 to s <b> 4 are laminated, and are composed of a product insulating portion 11 and a dummy insulating portion 12 that are adjacent to each other with the dividing groove 13 on the back surface interposed therebetween. Three external terminals 14 positioned, three internal terminals 17 positioned on the bottom surface of the cavity 16 and a flat conductor portion 18, and a frame-shaped conductor portion 19 positioned on the surface of the side wall 15 forming the cavity 16. Three sets of main internal wirings 21 that conduct between the external terminal 14 and the internal terminal 17, a plating terminal 23 located on the surface of the dummy insulating portion 12, the terminal 23, and the conductor portions 18, 19 Thus, the wiring board 10 including the sub-internal wiring 24 that conducts between them can be formed.
The wiring boards 30 and 50 can also be prepared by the same process as above. Moreover, you may perform the said process of preparing the said wiring boards 10, 30, and 50 by the form of many pieces, respectively.

Next, a step of mounting the three wiring boards 10 on the lead frame 2 was performed. That is, as indicated by an arrow in FIG. 10A, the wiring board 10 is connected to the leading ends of the three leads 5 extending from the lower side of the frame 3 in the lead frame 2 into the opening 4, and the wiring board. Three external terminals 14 in every ten product insulation parts 11 were individually brazed via the brazing material 9 and connected. Further, the tip portion of each plating lead 7 extending from the upper side of the frame 3 into the opening 4 and the plating terminal 23 in the dummy insulating portion 12 of each wiring board 10 are brazed in the same manner as described above. Connected.
As a result, as shown in FIG. 10B, the leading ends of the three leads 5 and the plating leads 7 extending into the opening 4 of the frame 3 in the lead frame 2 and the external parts of the product insulating portion 11 The terminal 14 and the plating terminal 23 of the dummy insulating portion 12 are individually joined to each other, thereby comprising the lead frame 2 and the three wiring boards 10 mounted in the opening 4 of the lead frame 2. An unplated wiring board unit (1) was obtained.
The required number of the wiring boards 30 and 50 are arranged in each of the openings 4 of the lead frames 2a and 2b, and the same mounting process is performed, so that the unplated wiring board units (1a and 1b) are provided. ) Can be obtained.

Furthermore, as shown in FIG. 10B, the upper side of the frame 3 of the lead frame 2 constituting the wiring board unit (1) is connected to a plating electrode (power source) 70, and the wiring board unit (1) is connected. Then, electrolytic Ni plating and electrolytic Au plating (plating step), which were immersed in an electrolytic Ni plating solution (not shown) and an electrolytic Au plating solution and energized, were sequentially performed.
As a result, the Ni plating film and the Au plating film are applied to all exposed surfaces of the lead frame 2 and the surfaces of the external terminals 14, the internal terminals 17, the conductor portions 18 and 19, and the plating terminals 23 for each wiring board 10. By covering a plated layer (not shown), the wiring board unit 1 shown in FIG. 1 could be obtained.
Note that the wiring board unit (1a, 1b), which is composed of the lead frames 2a, 2b and the required number of wiring boards 30, 50, is also subjected to the same plating process as described above, thereby providing the wiring board. Units 1a and 1b can be obtained.

In the plating step, the internal terminals 17 can be energized from the lower side of the frame 3 via the leads 5, the external terminals 14, and the main internal wiring 21, and the plating leads 7 can be supplied from the upper side of the frame 3. Since the conductor portions 18 and 19 are energized through the plating terminals 23 and the sub-internal wiring 24, the surface for each internal terminal 17 and the surface for each conductor portion 18 and 19 are simultaneously applied to the conductor portions 18 and 19 respectively. It could be covered with a plating layer.
Moreover, even when these plating solutions flow during immersion in the electrolytic Ni plating solution and the electrolytic Au plating solution, each wiring board 10 is connected to the lower side of the frame 3 via the three leads 5. In addition, since the lead 5 and the plating lead 7 are substantially opposed to each other in the opening 4 while being connected to the upper side of the frame 3 via the plating lead 7, No deformation such as bending occurred.
In addition, the leads 5 and 7 are inadvertent at the time of transport from the mounting process to the plating process, when connected to the plated electrode 70 (racking), and when removed from the plated electrode 52 (unracking). No deformation such as bending occurred.

According to the manufacturing method of the wiring board unit 1 as described above, the lead frame 2 and the wiring board 10 prepared in each of the preparation steps are formed on the surface of the product insulating portion 11 of the wiring board 10 in the mounting step. The three external terminals 14 thus formed and the tips of the three leads 5 extending from the frame 3 into the opening 4 are individually joined and formed on the surface of the dummy insulating portion 12 of the wiring board 10. The plating terminal 23 and the tip of the plating lead 7 extending from the frame 3 into the opening 4 were joined. As a result, in the plating process, the surface of the internal terminal 17 and the conductor portions 18 and 19 for each wiring board 10 could be reliably coated with the plating film. In addition, even if the plating solution flows in the plating process, the wiring board 10 and the leads 5 and 7 connected to the wiring substrate 10 do not oscillate in the plating solution, or the oscillating situation can be remarkably suppressed. It was. Further, even when the lead frame 2 on which the wiring board 10 is mounted is connected to the plating electrode 70 or removed from the plating electrode 70, the leads 5 and 7 are not bent at all. Further, the leads 5 and 7 connected to the wiring board 10 were not deformed such as being bent carelessly after the mounting process or during conveyance between the processes.
Accordingly, the product insulating portion 11 is connected to the lead frame 2 and the three leads 5 extending into the opening 4 inside the frame 3, and the dummy insulating portion 12 is connected to the frame 3 via the plating lead 7. The wiring board unit 1 connected to the wiring board 10 and the wiring board unit 1 excellent in shape stability and dimensional accuracy could be reliably manufactured.
It should be noted that the same effects as described above can also be achieved for the respective manufacturing methods of the wiring board units 1a and 1b.

FIG. 11A shows that the dummy insulating portion 12 is cut and removed from the wiring board 10 along the dividing groove 13 from the wiring board unit 1, and the lower side of the frame 3 adjacent to the three leads 5 is 2. A wiring board with leads obtained by a cutting process of cutting at a part (part) and comprising only the product insulating part 11, the three leads 5 connected to the external terminals 14, and the partial frame 3 b 26 is a plan view. Three lead boards 26 were obtained from the wiring board unit 1.
Further, a cutting step of cutting and removing the partial frame 3b and the base end side of the pair of leads 5 adjacent to the partial frame 3b at the position indicated by the broken line in FIG. By performing the above, it was possible to obtain the three wiring substrates 28 with leads.

FIG. 11B is obtained by subjecting the wiring board unit 1a to the same cutting process as described above, and is connected to the wiring board 30p including only the product insulating portion 31 and three external terminals 34 connected thereto. The top view of the wiring board 46 with a lead which consists of the lead | read | reeds 5 and 6 and the partial frame 3c is shown. A cutting step of cutting and removing the partial frame 3c and the base end side of the leads 5 and 6 adjacent to the partial frame 3c at the position indicated by the broken line in FIG. As a result, a plurality of the leaded wiring boards 48 could be obtained.
Further, FIG. 11C is obtained by subjecting the wiring board unit 1b to the same cutting process as described above, and the wiring board 50p consisting of only the product insulating portion 51 and the three connected to the external terminal 54 are shown. The top view of the wiring board 66 with a lead which consists of the lead | read | reed 5 and the partial frame 3b is shown. A cutting step of cutting and removing the partial frame 3b and the base end side of each lead 5 adjacent to the partial frame 3b at the position indicated by the broken line in FIG. As a result, two leaded wiring boards 68 could be obtained.

The present invention is not limited to the embodiments described above.
For example, the lead frame may be obtained by punching a thin plate such as a copper alloy such as 194 alloy, Kovar, or stainless steel in a predetermined pattern.
In addition, the outer shape of the frame and the shape of the opening located on the inside thereof are substantially similar to each other in a plan view, a triangular shape, a pentagon or more regular polygon, or a deformed polygon shape. It may be circular, oval, elliptical or the like.
Further, a plurality of openings may be provided in one lead frame, and one or a plurality of wiring boards may be arranged in each opening.
Further, the plurality of leads may be four or more, and these extend from the different sides of the inner edge of the frame into the opening at an arbitrary angle, and the leading ends of the leads are the same in the product insulating portion of the same wiring board. It may extend in the vicinity of the external terminal.

Further, the plurality of leads and the plating leads are not limited to positions facing each other or positions where their extension lines are orthogonal to each other in the opening surrounded by the frame, as in the above embodiments. The extension line may extend from each side of the inner edge of the frame so that the extension lines intersect at an obtuse angle of more than 90 degrees and less than 180 degrees.
In addition, the wiring board may have a shape having an outer shape exhibiting a triangular or pentagonal regular polygon or a deformed polygon in plan view, or a flat plate without the cavity.
Furthermore, the wiring board may be formed of, for example, a product insulating portion made of an epoxy resin or the like and a dummy insulating portion. In such a form, the conductor portions such as the external terminal and the conductor are formed by various photolithography techniques.
In addition, the connection between the leads 5 and 6 and the plating leads 7 and 8 is not limited to the brazing, but various types of welding (laser welding, electron beam welding, etc.) or various conductive adhesives including metal powder. You may join by an agent.

  According to the present invention, the plurality of leads connected to the plurality of leads extending into the opening portion of the lead frame and not electrically connected to the external terminals as well as the plurality of external terminals in the wiring board disposed in the opening portion. A wiring board unit coated with a plating film on the conductor portion of the wiring board and having no bending of the leads, a method of manufacturing the wiring board unit, and a method of manufacturing a wiring board with leads following the method It becomes possible to provide reliably.

1,1a, 1b …………………………………… Wiring board unit 2,2a, 2b …………………………………… Lead frame 3 ……………… …………………………………… Frame 3a ………………………………………………… Inner edge 4 ………………………………… ………………… Opening 5,6 ……………………………………………… Lead 7,8 ………………………………………… …… Lead for plating 10, 10p, 30, 30p, 50, 50p… Wiring board 11, 31, 51 ………………………………… Product insulation part 12, 32, 52 …………… …………………… Dummy insulation parts 14, 34, 35, 54 ………………………… External terminals 17, 37, 57 ………………………………… Internal terminals 18, 38, 58 ……………………………… Flat conductor portion 19, 39, 59 ............................................................ Frame-shaped conductor portion 21, 41, 61... , 43, 63 ......... ………………………………………………………………………………………………………………………… Sub-internal wiring 26, 28, 46, 48, 66 , 68 ………… Leaded wiring board 70 …………………………………………………… Plating electrode (plating power source)

Claims (6)

A polygonal wiring board having three or more sides in plan view;
A frame having an opening for disposing at least one wiring board on the inside in a plan view, and one end connected to the inner edge of the opening of the frame, and the other end connected to a plurality of external terminals of the wiring board A wiring board unit comprising a lead frame including a plurality of leads,
The wiring board is formed on a product insulating portion formed on a surface of the plurality of external terminals and a conductor portion that is not electrically connected to the external terminals, and an outer edge portion including at least one side of the polygon and the conductor. A dummy insulating part formed on the surface with a terminal for plating electrically connected to the part,
The dummy insulating portion is arranged at a position not overlapping with the plurality of leads in a plan view,
The plating terminal and the inner edge of the opening of the frame are connected by a plating lead extending from the inner edge of the opening of the frame into the opening.
A wiring board unit characterized by that. The wiring board includes a plurality of internal terminals that conduct to the plurality of external terminals via a main internal wiring, and the conductor portion that conducts to the plating terminal via a sub internal wiring.
The wiring board unit according to claim 1. The wiring board has a cavity opened on a surface of the product insulating portion, and the plurality of internal terminals are mounted on a bottom surface of the cavity, and an electronic component that conducts to the plating terminal via the sub-internal wiring is mounted. A plate-shaped conductor portion for,
The wiring board unit according to claim 2. The wiring board further includes a frame-like conductor portion in a plan view that is electrically connected to the plating terminal via the sub-internal wiring on the surface of the product insulating portion surrounding the cavity.
The wiring board unit according to claim 3. One end is connected to a polygonal wiring board having three or more sides in a plan view, a frame having an opening in which at least one of the wiring boards is disposed in a plan view, and an inner edge of the opening of the frame. And a lead frame including a plurality of leads whose other ends are connected to a plurality of external terminals of the wiring board, and a method of manufacturing a wiring board unit comprising:
A frame having an opening on the inside in a plan view, a plating lead extending from the inner edge of the opening into the opening, and the opening from a position different from the position where the plating lead protrudes on the inner edge of the opening Preparing a lead frame having a plurality of leads extending into the section;
A plurality of external terminals and a product insulating part formed on the surface of a conductor part not electrically connected to the external terminal, and an outer edge part including at least one side of the polygon and electrically connected to the conductor part A step of preparing the wiring board having a dummy insulating portion on the surface of which the plating terminal is formed;
The plating terminal and the frame, which are electrically connected to the conductor portion of the wiring board, are joined via the plating lead, and the plurality of external terminals and the plurality of leads formed in the product insulating portion are connected to the dummy. The wiring board mounting step of arranging the wiring board in the opening of the lead frame by individually joining the insulating part and the plurality of leads so as not to overlap in plan view;
The lead frame having the wiring board disposed in the opening is electrically connected to a plating power source, and is placed on the surface of the frame, the surfaces of the leads, the surfaces of the plating leads, the internal terminals, and the surfaces of the conductors. And a plating process for coating the plating film,
A method of manufacturing a leaded wiring board. After the plating step of claim 5,
A cutting step of cutting at least a part of the frame, cutting the plurality of leads from the frame, cutting a dummy insulating part from the wiring board, and cutting a wiring board made of only the product insulating part from the lead frame. Apply
A method of manufacturing a leaded wiring board.

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