JP2014232097A - 基板検査装置および基板検査方法 - Google Patents

基板検査装置および基板検査方法 Download PDF

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Publication number
JP2014232097A
JP2014232097A JP2013172725A JP2013172725A JP2014232097A JP 2014232097 A JP2014232097 A JP 2014232097A JP 2013172725 A JP2013172725 A JP 2013172725A JP 2013172725 A JP2013172725 A JP 2013172725A JP 2014232097 A JP2014232097 A JP 2014232097A
Authority
JP
Japan
Prior art keywords
contact pin
substrate
contact
pads
substrate inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013172725A
Other languages
English (en)
Japanese (ja)
Inventor
ラック ソン，ヨン
Yeong Rak Song
ラック ソン，ヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2014232097A publication Critical patent/JP2014232097A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2013172725A 2013-05-28 2013-08-22 基板検査装置および基板検査方法 Pending JP2014232097A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130060561A KR20140139885A (ko) 2013-05-28 2013-05-28 기판 검사 장치 및 기판 검사 방법
KR10-2013-0060561 2013-05-28

Publications (1)

Publication Number Publication Date
JP2014232097A true JP2014232097A (ja) 2014-12-11

Family

ID=52125559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013172725A Pending JP2014232097A (ja) 2013-05-28 2013-08-22 基板検査装置および基板検査方法

Country Status (3)

Country Link
JP (1) JP2014232097A (ko)
KR (1) KR20140139885A (ko)
TW (1) TW201445155A (ko)

Also Published As

Publication number Publication date
KR20140139885A (ko) 2014-12-08
TW201445155A (zh) 2014-12-01

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