JP2014228793A - Photosensitive paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive paste which enables the formation of a fine and high-aspect-ratio wiring pattern.SOLUTION: A photosensitive paste comprises one or more photoreactive monomer and one or more alkali-soluble polymer. The number of curable functional groups of the photoreactive monomer is four or more. A side chain comprising an alkyl group with the number of carbon atoms of eight or more is introduced into the alkali-soluble polymer. The acid value of the alkali-soluble polymer is 20 KOHmg/g or more.

Description

  The present invention relates to a photosensitive paste.

  In recent years, with the demand for miniaturization of electronic components, there is a demand for technology for manufacturing electronic components that can be finely processed and have excellent accuracy. For example, as a laminated coil component manufacturing technique, a photosensitive glass paste and a photosensitive conductive paste are sequentially applied / exposed / developed by a photolithography technique suitable for microfabrication to obtain a laminated body, which is then sintered. A method of manufacturing a laminated coil component is known. Multilayer coil components tend to be further miniaturized, and it is desired that a photosensitive paste can be processed more finely, for example, a fine and high aspect ratio wiring pattern can be formed.

  Patent Document 1 discloses a photosensitive paste having an organic component containing inorganic fine particles and a photosensitive compound as essential components and having a total light transmittance of 50% or more per 40 μm thickness. Japanese Patent Application Laid-Open No. H10-228707 describes that high-aspect ratio and high-precision pattern processing can be performed by using such a photosensitive paste.

Japanese Patent Laid-Open No. 10-7432

で示されるＴＭＰＴＡ（トリメチロールプロパントリアクリレート）または式（ｂ）：

で示されるＢＭＥＸＳ−ＭＡ等が用いられている。しかしながら、これらの光反応性モノマーは硬化性官能基が少なく、硬化物の架橋密度が低くなり、現像の際に硬化物が現像液に流れ出してしまい、微細かつ高アスペクト比の配線パターンを形成するには十分ではないと考えられる。 However, according to the example of Patent Document 1, as the photoreactive monomer, the formula (a):

TMPTA (trimethylolpropane triacrylate) represented by the formula (b):

BMEX-MA etc. shown by these are used. However, these photoreactive monomers have few curable functional groups, the crosslink density of the cured product is low, and the cured product flows out into the developer during development, forming a fine and high aspect ratio wiring pattern. Is not considered sufficient.

  In order to solve the above problem, it is conceivable to increase the number of curable functional groups of the photoreactive monomer to increase the crosslinking density. When the curable functional group of the photoreactive monomer is increased in this way, the developer is less likely to penetrate into the cured product, and the outflow of the cured product due to development can be suppressed. However, if the number of curable functional groups in the photoreactive monomer is large, the monomer in the uncured portion is less likely to swell in the developer, resulting in a decrease in developability. As a result, it is difficult to form a fine wiring pattern. It turns out that a new problem arises. Thus, it is difficult to achieve both high crosslink density and high developability by adjusting the number of curable functional groups of the photoreactive monomer. With the technique disclosed in Patent Document 1, a fine and high aspect ratio is achieved. It is not sufficient to form a wiring pattern.

  As a result of intensive studies to solve the above problems, the present inventor has increased the crosslinking density by increasing the number of curable functional groups of the photoreactive monomer to 4 or more in the side chain of the alkali-soluble polymer. It has been found that a fine and high aspect ratio wiring pattern can be formed by introducing an alkyl group having 8 or more carbon atoms and improving developability with an acid value of 20 KOHmg / g or more. It came to be completed.

In accordance with the subject matter of the present invention, a photosensitive paste comprising one or more photoreactive monomers and one or more alkali-soluble polymers comprising:
The photoreactive monomer has four or more curable functional groups,
There is provided a photosensitive paste characterized in that the alkali-soluble polymer has a side chain containing an alkyl group having 8 or more carbon atoms and has an acid value of 20 KOHmg / g or more.

  According to the present invention, a photoreactive monomer having 4 or more curable functional groups, a side chain containing an alkyl group having 8 or more carbon atoms, and an alkali solubility having an acid value of 20 KOHmg / g or more. By using a polymer, a photosensitive paste capable of forming a fine and high aspect ratio wiring pattern is provided.

FIG. 1 is a cross-sectional view schematically showing a wiring pattern formed in the embodiment.

  The photosensitive paste of the present invention has a photoreactive monomer having 4 or more curable functional groups, a side chain containing an alkyl group having 8 or more carbon atoms, and an acid value of 20 KOHmg / g or more. An alkali-soluble polymer.

  The photoreactive monomer used in the photosensitive paste of the present invention has 4 or more, preferably 5 or more, and more preferably 6 or more curable functional groups. By having four or more curable functional groups, a higher crosslinking density can be obtained when the photosensitive paste is cured by light irradiation. You may use the said photoreactive monomer in combination of 2 or more types.

  The curable functional group means a functional group that can cause a polymerization reaction and / or a crosslinking reaction by light irradiation. Examples of the curable functional group include, but are not limited to, a functional group containing an ethylenic double bond such as an acryloyl group, a methacryloyl group, a vinyl group, and an allyl group, and an epoxy group.

  Examples of the photoreactive monomer used in the photosensitive paste of the present invention include, but are not limited to, ester compounds of pentaerythritol or dipentaerythritol and acrylic acid or methacrylic acid (for example, pentaerythritol tetraacrylate, dipentaerythritol). Tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol tetramethacrylate, dipentaerythritol tetramethacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexamethacrylate, etc.), ethoxylated pentaerythritol tetraacrylate, ethoxylated penta Erythritol tetramethacrylate, ditrimethylolpropane tetra Acrylate, and ditrimethylolpropane tetra methacrylate. You may use these in combination of 2 or more types.

  The alkali-soluble polymer used in the photosensitive paste of the present invention has a side chain containing an alkyl group having 8 or more carbon atoms, preferably 13 or more carbon atoms, more preferably 18 or more carbon atoms. By introducing an alkyl group having 8 or more carbon atoms into the side chain of the alkali-soluble polymer, the glass transition temperature of the alkali-soluble polymer is lowered, the developer can easily penetrate into the photosensitive paste, and the developability is improved. In addition, the alkyl group preferably has 30 or less carbon atoms, and more preferably 24 or less, from the viewpoint of solubility of the alkali-soluble polymer in a solvent, dispersibility, or glass transition point. The alkyl group may be linear, branched or cyclic.

  The alkali-soluble polymer has an acid value of 20 KOH mg / g or more, preferably 70 KOH mg / g or more, more preferably 120 KOH mg / g or more. By setting the acid value of the alkali-soluble polymer to 20 KOH mg / g or more, the solubility of the alkali-soluble polymer in the alkali developer is increased, and the developability is improved. In addition, an acid value means the milligram number of potassium hydroxide required in order to neutralize the acid (for example, carboxyl group which exists in a molecule terminal) contained in 1g of alkali-soluble polymer samples. The acid value is measured according to JIS K 0070.

  Thus, by using an alkali-soluble polymer having a side chain containing an alkyl group having 8 or more carbon atoms and an acid value of 20 KOHmg / g or more, the cured product has a high crosslinking density. Even in such a case, high developability can be ensured. Two or more alkali-soluble polymers may be used in combination.

  The alkali-soluble polymer is not limited, but for example, a polymer having a main chain structure of an acrylic copolymer having a carboxyl group is preferable. The main chain structure of such an acrylic copolymer having a carboxyl group can be formed, for example, by copolymerizing an unsaturated carboxylic acid and an ethylenically unsaturated compound.

  Examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, maleic acid, fumaric acid, vinyl acetic acid, and anhydrides thereof. Examples of the ethylenically unsaturated compound include acrylic esters such as methyl acrylate and ethyl acrylate, methacrylic esters such as methyl methacrylate and ethyl methacrylate, fumaric esters such as monoethyl fumarate, and styrene. .

  A side chain containing an alkyl group having 8 or more carbon atoms can be introduced into a polymer having a main chain structure by using a chemical reaction known per se, such as an addition reaction or a condensation reaction. For example, when the main chain structure of an alkali-soluble polymer has a carboxyl group, use a ring-opening addition reaction of an epoxy group or a condensation reaction with a functional group that can react with a carboxyl group, such as a hydroxyl group, a thiol group, or an amino group. can do.

  The weight average molecular weight of the alkali-soluble polymer is not particularly limited, but is about 10,000 to about 60,000, preferably about 10,000 to about 50,000, more preferably about 20,000 to About 30,000. By making the weight-average molecular weight of the alkali-soluble polymer about 10,000 or more, it is possible to promote the progress of the photocuring reaction in the exposed area and prevent pattern peeling or chipping during development due to insufficient photocuring reaction. it can. Further, when the weight average molecular weight of the alkali-soluble polymer is about 60,000 or less, the development time can be shortened.

で示されるポリマーである。 Preferably, the alkali-soluble polymer has the following formula (I):

It is a polymer shown by.

In said formula (I), R < ¹ >, R < ² > and R < ³ > are respectively independently a hydrogen atom or a C1-C4 alkyl group. The alkyl group having 1 to 4 carbon atoms may be linear or branched, and specifically includes a methyl group, ethyl group, n-propyl group, iso-propyl group, n- A butyl group, a sec-butyl group, an iso-butyl group or a tert-butyl group. ^Preferably, one or more of R 1, ^{R 2} and ^{R 3} are methyl groups, more ^preferably, R 1, ^{R 2} and ^{R 3} are all methyl groups.

In the above formula (I), ^{R 4} is an alkyl group having 1 to 4 carbon atoms. Examples of the alkyl group having 1 to 4 carbon atoms include the same ones as described above, preferably a methyl group.

In the above formula (I), R ⁵ is a linker group. As the linker group, but are not particularly limited, for example, -C (O) -, - NR- ( wherein, R is _{C 1-6} alkyl), - O -, - S- , -C (S)-, -C (O) O-, -C (O) NH-, -NHC (O) NH-, -NHC (S) NH-, etc. are mentioned, preferably -C (O). -.

In the above formula (I), R ⁶ has 8 or more carbon atoms, preferably 13 or more carbon atoms, more preferably 18 carbon atoms, which may be substituted by one or more substituents. These are the above alkyl groups. The alkyl group may be linear, branched or cyclic, and one or more carbon-carbon single bonds of the alkyl chain may be carbon-carbon double bonds (ie An alkenyl group or the like. In addition, the alkyl group may contain one or more —O—, —S—, —NR— (wherein R is C _1-6 alkyl), amide, sulfonyl, in the molecular chain or at the terminal. Etc. may be included.

Examples of the substituent of the alkyl group of ^{R 6,} but are not limited to, oxygen atom, halogen atom, hydroxyl _{group, C 1-6} alkenyl _{groups, C 3-16} cycloalkyl _{groups, C 3-16} cycloalkenyl groups, C _6-16 heterocycloalkyl group, C _6-16 heterocycloalkenyl group, C _6-16 aryl group, C _6-16 heteroaryl group, C _1-6 alkoxy group, C _6-6 aryloxy group, C _{1- 6} alkylthio group etc. are mentioned. Among them, a group having an ethylenically unsaturated bond, for example, a C _1-6 alkenyl group is preferable because a higher crosslinking density can be obtained.

  In the above formula (I), l, m and n are each independently an integer of 1 to 3,000, preferably an integer of 10 to 1000. Further, 0.01 ≦ (l // l + m + n) <0.8 is preferable, and 0.01 ≦ (l // l + m + n) <0.6 is more preferable. The order of presence of each repeating unit with the subscript l, m or n enclosed in parentheses is arbitrary.

で示されるポリマーである。 More preferably, the alkali-soluble polymer has the following formula (Ia):

It is a polymer shown by.

In the above formula (Ia), R ⁷ has 6 or more carbon atoms, preferably 11 or more carbon atoms, more preferably 16 carbon atoms, which may be substituted with one or more substituents. These are the above alkyl groups.

Examples of the substituent of the alkyl group of R ⁷ include the same substituents as the substituent of the alkyl group of R ⁶ of the above formula (I).

  In the above formula (Ia), l, m and n are as defined in the above formula (I).

［式中、Ｒ^７は、式（Ｉａ）の記載と同意義である。］
で示されるエポキシ誘導体と反応させることにより得ることができる。 The compound represented by the above formula (Ia) is obtained by copolymerizing methacrylic acid and methyl methacrylate to obtain a methacrylic acid-methyl methacrylate copolymer, which is represented by the formula (II):

[Wherein, R ⁷ is as defined in the formula (Ia). ]
It can obtain by making it react with the epoxy derivative shown by these.

  The amount of methacrylic acid, methyl methacrylate and the epoxy derivative represented by the formula (II) to be used can be appropriately determined according to the desired acid value, the number of alkyl side chains and the like.

  The total content of the alkali-soluble polymer and the photoreactive monomer is 85 with respect to the alkali-soluble polymer, the photoreactive monomer, and the photopolymerization initiator described below (hereinafter collectively referred to as the photosensitive resin component). ˜97.5 mass%, preferably 90 to 95 mass%. Furthermore, the mass ratio of the photoreactive monomer to the total of the alkali-soluble polymer and the photoreactive monomer (photoreactive monomer / (photoreactive monomer + alkali-soluble polymer)) is 0.3 to 0.7, preferably 0. .4 to 0.6. By setting the mass ratio of the photoreactive monomer to 0.3 or more, sufficient photocurability can be obtained. Moreover, by setting the monomer ratio to 0.7 or less, the adhesiveness (stickiness) of the dried coating film can be suppressed, and film defects due to contamination of the photomask can be suppressed.

  The photosensitive paste of the present invention may further contain a photopolymerization initiator in addition to the alkali-soluble polymer and the photoreactive monomer. The photopolymerization initiator is not particularly limited as long as it is a photopolymerization initiator known in the art, but benzyl, benzoin ethyl ether, benzoin isobutyl ether, benzoin isopropyl ether, benzophenone, benzoylbenzoic acid, Methyl benzoylbenzoate, 4-benzoyl-4′-methyldiphenyl sulfide, benzyldimethyl ketal, 2-n-butoxy-4-dimethylaminobenzoate, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone , Isopropylthioxanthone, 2-dimethylaminoethylbenzoate, ethyl p-dimethylaminobenzoate, isoamyl p-dimethylaminobenzoate, 3,3′-dimethyl-4-methoxybenzophenone, , 4-dimethylthioxanthone, 1- (4-dodecylphenyl) -2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methylpropan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one, hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane-1- ON, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2- Morpholinopropan-1-one, methylbenzoylformate, 1-phenyl-1,2-propanedione-2- ( -Ethoxycarbonyl) oxime, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide And bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide. You may use these in combination of 2 or more type.

  Content of the said photoinitiator is 2.5-15 mass% with respect to the whole photosensitive resin component, Preferably, it is 5-10 mass%. By setting the content of the photopolymerization initiator to 2.5% by mass or more, light is sufficiently absorbed and the curing reaction can be sufficiently advanced. Moreover, sufficient photocurability is acquired by making content of a photoinitiator 15 mass% or less. If it exceeds 15% by mass, light absorption on the surface of the coating film is excessively increased, curability at the inside and in the deep portion is lowered, and there is a concern that the photopolymerization initiator may not be completely dissolved and precipitate.

  The photosensitive paste of the present invention may further contain a photosensitizer in addition to the photosensitive resin component. The photosensitizer is not particularly limited. For example, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, p-phenylbenzophenone, benzyldimethyl ketal, isopropylthioxanthone, benzoin ethyl ether, benzoin isopropyl Examples include ether, benzoin isobutyl ether, 4,4′-diethylaminobenzophenone, and p-dimethylaminobenzoic acid ethyl ester. These can be used for the purpose of adjusting the curing wavelength range of the photosensitive insulating paste, and two or more of them may be used in combination.

  The content of the photosensitizer may be a catalytic amount, that is, an amount capable of exhibiting a photosensitizing action. The content of the photosensitizer is preferably 0.1 to 1.0% by mass, more preferably 0.1 to 0.5% by mass with respect to the entire photosensitive paste.

  The photosensitive paste of the present invention may further contain a solvent. The solvent is not particularly limited, but glycols such as pentamethylene glycol, alcohols such as dipropylene glycol monomethyl ether, and alcohol acetates such as ethyl carbitol acetate are preferable.

  The photosensitive paste of the present invention may further contain additives such as a storage stabilizer, an antioxidant, a dye, an antifoaming agent, and a surfactant as necessary.

  The photosensitive paste of the present invention may be either a photosensitive insulating paste or a photosensitive conductor paste.

When the photosensitive paste of the present invention is a photosensitive insulating paste, the photosensitive insulating paste includes an inorganic component. The inorganic component is not particularly limited, for _{example, SiO 2, B 2 O 3} , K 2 O, Li 2 O, CaO, ZnO, Bi 2 O 3, and / or _Al 2 _{O 3} or _the like Glass containing, for example, SiO ₂ —B ₂ O ₃ —K ₂ O glass, SiO ₂ —B ₂ O ₃ —Li ₂ O—CaO glass, SiO ₂ —B ₂ O ₃ —Li ₂ O—CaO—ZnO And glass based on Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ . These inorganic components may be used in combination of two or more.

The photosensitive insulating paste may further contain a filler (aggregate). In this specification, a filler means the inorganic particle which does not soften in the baking temperature range after image development and exists as particles. As the filler, various ceramic materials can be used, but are not limited to, for example, SiO ₂ —B ₂ O ₃ glass, quartz, alumina, magnesia, spinel, silica, forsteride, steatite and Examples include zirconia. You may use the said filler in combination of 2 or more types. By using the filler, the thermal expansion coefficient of the insulating layer can be lowered, and defects such as disconnection and destruction during firing can be avoided. Moreover, the bending strength of the produced laminated coil component can be increased.

  When the photosensitive paste of the present invention is a photosensitive conductor paste, the photosensitive conductor paste contains a conductive metal. The conductive metal is not particularly limited, and examples thereof include Ag, Au, AuPd, AgPd, Cu, and Ni.

  The photosensitive paste of this invention can be prepared by the method similar to the manufacturing method of the general photosensitive paste in the said field | area.

-Preparation of photosensitive glass paste The following (a)-(k) was prepared as a material of the photosensitive glass paste.

  (J) Examples of the photoreactive monomer include dipentaerythritol hexaacrylate having 6 curable functional groups, dipentaerythritol pentaacrylate having 5 curable functional groups, pentaerythritol tetraacrylate having 4 curable functional groups, and curability. A trimethylolpropane triacrylate having 3 functional groups and a phenol EO (ethylene oxide) -modified acrylate having 1 curable functional group were prepared. The photoreactive monomers used in each example are shown in Table 2.

  (K) The alkali-soluble polymer was prepared by copolymerizing methacrylic acid and methyl methacrylate, and then adding an alkyl epoxide to the obtained copolymer (weight average molecular weight: about 25000). Table 2 shows the alkyl epoxides used for the preparation of the alkali-soluble polymers used in each example.

  The materials shown in Table 1 and Table 2 above were weighed so as to have the blending ratio shown in Table 3, stirred for 30 minutes with a planetary mixer, and kneaded by passing them through a three-roll mill four times. A photosensitive glass paste was prepared for each of Examples 1-18. Examples 1 to 12 are examples of the present invention, and examples 13 to 18 are comparative examples.

-Preparation of wiring pattern About each example, the photosensitive glass paste obtained above was printed on the alumina substrate by screen printing, and was dried at 60 degreeC for 40 minutes, and the coating film with a thickness of 16-20 micrometers was formed.

Next, exposure is performed at an exposure amount of 2000 mJ / cm ² through a photomask (patterns each having a width of 2 to 100 μm in the range of 2 to 100 μm) in which patterns of various widths and intervals are formed. Then, the unexposed portion was removed with a developer triethanolamine aqueous solution to produce a wiring pattern as shown in FIG. The width of the formed groove is “S”, and the width of the photosensitive glass paste is “L”.

-Evaluation For each example, the wiring pattern formed as described above was observed with an optical microscope, and the finest wiring pattern was selected from among the grooves formed, and the photosensitive glass paste shown in FIG. The width (L), the width (S) and the thickness (t) of the groove were measured with a microscope (VHX-900, manufactured by Keyence Corporation) and evaluated according to the following criteria. The results are shown in Table 4.
○: L + S <50
Δ: 50 ≦ L + S ≦ 70
X: L + S> 70

The lower side and the upper side of the groove formed with a pattern of L = 30 μm and S = 70 μm were measured, and the rectangular ratio (= lower side / upper side × 100) was determined from the measurement results, and evaluated according to the following criteria. The results are also shown in Table 4.
○: Rectangular ratio ≧ 70
Δ: Rectangular ratio ≧ 50
X: Rectangular ratio <50

  As shown in Table 4, the number of curable functional groups of the photoreactive monomer is 4 or more, the alkali-soluble polymer has a side chain containing an alkyl group having 8 or more carbon atoms, and the acid value is It was confirmed that a fine and high aspect ratio wiring pattern can be formed by using the photosensitive glass paste of Examples 1 to 12 of 20 KOHmg / g or more.

  On the other hand, the photosensitive glass pastes of Example 13 (3) and Example 14 (1), in which the number of curable functional groups of the photoreactive monomer is 3 or less, form a fine and high aspect ratio wiring pattern. I could not. This is because, since the number of curable functional groups of these photoreactive monomers is 3 or less, the crosslink density of the cured product becomes low, and the cured product flows out into the developer during development, resulting in a fine and high aspect ratio. It is thought that the ratio wiring could not be formed.

  Further, Example 15 (7) and Example 16 (3) in which the alkyl group in the side chain of the alkali-soluble polymer has 7 or less carbon atoms cannot form a fine and high aspect ratio wiring pattern. It was. This is thought to be because the glass transition temperature of the alkali-soluble polymer was high and the developer was difficult to penetrate, so that fine and high aspect ratio wiring could not be formed.

  Further, Example 17 (15 KOHmg / g) and Example 18 (10 KOHmg / g) having an acid value of 20 KOHmg / g or less could not form a fine and high aspect ratio wiring pattern. This is thought to be because fine and high aspect ratio wiring could not be formed because the alkali-soluble polymer was difficult to dissolve in the alkali developer.

  Since the photosensitive paste of the present invention can form a fine and high aspect ratio pattern, it can be used in a wide variety of applications such as the production of laminated coil components.

Claims (5)

A photosensitive paste comprising one or more photoreactive monomers and one or more alkali-soluble polymers,
The photoreactive monomer has four or more curable functional groups;
The photosensitive paste, wherein the alkali-soluble polymer has a side chain containing an alkyl group having 8 or more carbon atoms, and has an acid value of 20 KOHmg / g or more. The alkali-soluble polymer is represented by the following formula (I):

[Where:
R ¹ , R ² and R ³ are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms;
R ⁴ is an alkyl group having 1 to 4 carbon atoms;
R ⁵ is a linker group;
R ⁶ is an alkyl group having 8 or more carbon atoms which may be substituted with one or more substituents;
l, m and n are each independently an integer of 1 to 3000;
The order of presence of each repeating unit with the subscript l, m or n enclosed in parentheses is arbitrary in the formula. ]
The photosensitive paste of Claim 1 which is a polymer shown by these. The alkali-soluble polymer has the following formula (Ia):

[Where:
R ⁷ is an alkyl group having 6 or more carbon atoms which may be substituted with one or more substituents;
l, m and n are each independently an integer of 1 to 3000;
The order of presence of each repeating unit with the subscript l, m or n enclosed in parentheses is arbitrary in the formula. ]
The photosensitive paste of Claim 1 or 2 which is a polymer shown by these.   The photosensitive paste in any one of Claims 1-3 in which an alkali-soluble polymer contains an ethylenically unsaturated group.   The photoreactive monomer is composed of an ester compound of pentaerythritol or dipentaerythritol and acrylic acid or methacrylic acid, ethoxylated pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetramethacrylate, ditrimethylolpropane tetraacrylate and ditrimethylolpropane tetramethacrylate. The photosensitive paste in any one of Claims 1-4 which is a compound selected from a group.

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