JP2014228463A - Evaluation substrate, environmental test device, and evaluation method of sample - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an evaluation substrate that hardly causes variations in test temperature and is capable of precisely evaluating temperature characteristics of a sample even when a sample performing self-heating is evaluated.SOLUTION: An evaluation substrate evaluates a sample 10 by energizing the sample 10 to expose the sample 10 to a desired temperature. The evaluation substrate includes: a substrate body 2 having a planar area; a mount part 3 capable of mounting the sample 10; and a heater 8 for heating the substrate body 2. The evaluation substrate is configured such that the mount parts 3 are located at one main surface side of the substrate body 2, the heater 8 is distributed in a planar fashion at the other main surface side of the substrate body 2, being integrated.

Description

  The present invention relates to an evaluation board for evaluating temperature characteristics of a specimen. The present invention also relates to an environmental test apparatus that exposes an evaluation board to a predetermined environment. Furthermore, the present invention relates to a specimen evaluation method for evaluating temperature characteristics of a specimen using an environmental test apparatus.

One of the methods for evaluating the performance of products and the like is an environmental test. In the environmental test, a product or the like is placed in a specific environment and a change in performance or the like is observed.
The environmental test apparatus is an apparatus for performing an environmental test, and can maintain the test space in an environment such as a desired temperature (for example, Patent Document 1). The environmental test apparatus can form various environments such as a high temperature environment, a low temperature environment, a high humidity environment, a low humidity environment, and a vacuum environment. In other words, the environmental test apparatus can install a product in a test chamber and evaluate the performance of the product under various environments.

  By the way, conventionally, in the small device etc. which are mounted on a printed circuit board, the characteristic of a structural member is evaluated in order to ensure safety and reliability. For example, in a temperature characteristic evaluation test, a printed circuit board on which a specimen to be evaluated is soldered and mounted is installed in an air circulation type environmental test apparatus and energized with the specimen exposed to air at a predetermined temperature. Thus, the temperature characteristics of the specimen are evaluated.

JP 2011-209303 A

Usually, when evaluating the temperature characteristics of a specimen, many specimens are often evaluated at once. That is, in many cases, a plurality of specimens are mounted on one printed circuit board, and each specimen is evaluated. In evaluating these specimens, it is necessary to evaluate them under the same conditions and environment in order to obtain highly reliable temperature characteristic results.
However, in the case of a specimen that generates heat due to energization such as chip resistance (hereinafter also referred to as a heat generating specimen) as a specimen, the conventional environmental test apparatus uses the specimen depending on how the air (wind) in the test chamber is hit. Specimen changes between heat generation and heat dissipation. Therefore, the temperature distribution in the printed circuit board becomes large, and the test temperature may vary depending on the mounting position of the specimen. Therefore, the conventional evaluation method using the environmental test apparatus has a problem that the temperature characteristics may not be accurately evaluated.

Therefore, as one of the measures for solving such a problem, a method in which the wind does not hit the specimen can be considered by making the test chamber a non-wind space.
For example, in a windless space, a method of evaluating a temperature characteristic by directly heating a heat generating specimen by placing a printed circuit board having a heat generating specimen mounted on a surface on a heating device such as an electric hot plate. It is done.
However, even in this measure, the temperature in the printed circuit board varies depending on the contact condition between the printed circuit board and the heating device. In other words, the heat transfer area between the printed circuit board and the heating device varies due to the surface shape of the printed circuit board and the unevenness of the heating surface of the heating device, and the heat transfer to the heat generating specimen mounted on the printed circuit board is uneven. It will occur. Therefore, there has been a problem that the temperature characteristics of the exothermic specimen may not be accurately evaluated.

  Therefore, an object of the present invention is to provide an evaluation board that is less likely to cause variations in test temperature when evaluating a specimen and can accurately evaluate the temperature characteristics of the specimen. It is another object of the present invention to provide an environmental test apparatus that is less likely to cause variations in test temperature even for a self-heating specimen, and that can accurately evaluate the temperature characteristics of the specimen. Furthermore, it aims at providing the evaluation method which can evaluate the temperature characteristic of a test piece correctly.

  The invention described in claim 1 for solving the above-described problem has a planar spread in an evaluation substrate for evaluating a specimen by exposing the specimen to a desired temperature while energizing the specimen. A substrate body, an attachment portion to which the specimen can be attached, and a heater for heating the substrate body, wherein the attachment portion is located on one main surface side of the substrate body; The heater is distributed and integrated in a planar shape on the other main surface side of the evaluation board.

According to the configuration of the present invention, the mounting portion is located on one main surface side of the substrate body, and the heater is distributed in a planar shape on the other main surface side of the substrate body. It has become. That is, the attachment portion and the heater are opposed to each other with the substrate body interposed therebetween, and the heat generated by the heater is transmitted to the specimen attached to the attachment portion via the substrate body.
In other words, the evaluation substrate of the present invention heats the substrate body in a planar shape by its own heater, and exposes the specimen to a predetermined temperature without using other heating means such as a heating device. Can do. Therefore, uneven heat transfer to the specimen attached on the opposite side of the substrate body is unlikely to occur, and the temperature characteristics of the specimen can be accurately evaluated.

  The invention according to claim 2 is characterized in that the heater is an energization path that is narrower than the entire length constituted by a conductive layer, and the energization path generates heat when energized to the energization path. The evaluation substrate according to claim 1.

  According to the configuration of the present invention, the energization path generates heat by energizing the energization path that is narrower than the entire length formed by the conductive layer. That is, heat is generated by the internal resistance of the conductive layer. Therefore, the substrate body can be easily heated.

  According to a third aspect of the present invention, the heater is an energization path of one system or a plurality of systems that is narrower than the entire length. The evaluation board according to claim 1, wherein the energization path generates heat.

  According to the configuration of the present invention, the energization path has a plurality of curved paths, and the energization path generates heat when energized to the energization path. Therefore, the energization paths are evenly spread over the main surface of the substrate body. The in-plane temperature distribution of the substrate body can be made more uniform.

  According to a fourth aspect of the present invention, the heater is a conductive path having a narrower width than a full length formed by etching a conductive layer widely provided on the substrate body. It is an evaluation board | substrate in any one of thru | or 3.

  According to the configuration of the present invention, since the heater is formed by etching a conductive layer widely provided on the substrate body, the conductive path can be easily patterned into a desired shape. Therefore, a conductive path having a narrow width compared to the entire length can be easily formed by the patterning.

  According to a fifth aspect of the present invention, the evaluation board is a printed board, and the heater is a current-carrying line that is narrower than the entire length formed by the printed wiring. It is an evaluation board | substrate in any one.

  According to the configuration of the present invention, the evaluation board is a printed board, and the heater is a current-carrying line that is narrower than the entire length formed by the printed wiring, so the heater can be easily formed in a desired shape. It can be easily mass-produced.

  According to a sixth aspect of the present invention, a heater power supply unit is provided at an end of the substrate body, the heater power supply unit is connected to the heater, and the heater power supply unit The evaluation board according to any one of claims 1 to 5, wherein the heater power supply unit is energized by being engaged with another member and being engaged with another member.

  According to the configuration of the present invention, by energizing the heater power supply unit connected to the heater with the other member, the heater is energized via the heater power supply unit. Therefore, it is possible to easily energize the heater from another member while supporting the substrate body with the other member.

  Moreover, it is desirable that a specimen energization path for energizing the specimen is integrated with the substrate body.

  According to this configuration, the specimen can be energized stably.

  In addition, a power supply part for a specimen is provided at an end of the substrate body, the power supply part for the specimen is connected to a specimen power supply path, and the power supply part for the specimen is engaged with another member. It is possible to energize the power supply unit for the specimen by engaging with another member.

  According to this configuration, the specimen power feeding section is energized by engaging the specimen power feeding section connected to the specimen power path with the other members. Therefore, it is possible to easily energize the specimen from another member while supporting the substrate body with the other member.

  Moreover, it is an evaluation board | substrate for evaluating a several test body, Comprising: It is preferable that it has a some attachment part and the said attachment part is distributed equally on the one main surface side of the said board | substrate body.

According to this structure, since the attaching part is uniformly distributed on the one main surface of the substrate body, it is possible to suppress the influence between the specimens attached to the attaching part.
For example, even when a specimen that self-heats when energized or the like is mounted, the influence on the adjacent specimen due to the heat generation can be suppressed.

By the way, when evaluating the temperature characteristics of a large number of mounted specimens, it is conceivable to perform evaluation by placing evaluation boards mounted with a plurality of specimens in parallel in the same test chamber from the viewpoint of matching the measurement conditions as much as possible.
However, when a test piece that self-heats is mounted on the evaluation board, convection occurs due to the heat generation of the test piece, which may affect the temperature conditions of other specimens and the in-plane temperature distribution of other evaluation boards. is there.
This point will be specifically described.
As shown in the relationship between the evaluation board 1A and the evaluation board 1C in FIG. Case). If a heat generating specimen is mounted on the lower evaluation board located on the lower side in the vertical direction, convection due to heat generation of the heat generating specimen may affect the temperature distribution of the upper evaluation board located above it. . Therefore, there is a fear that the specimen cannot be accurately evaluated.
Further, as shown in the relationship between the evaluation board 1A and the evaluation board 1B in FIG. 5, when two main boards of the evaluation board are arranged in parallel in the horizontal direction (the posture in which the main board of the evaluation board faces the horizontal direction) Will be described. In this case, the influence of the convection between the evaluation substrates described above can be suppressed. However, on the evaluation board, the convection due to the heat generation of the lower heating specimen located on the lower side in the vertical direction affects the upper heating specimen that is mounted on the same evaluation board and located in the upper side in the vertical direction. there is a possibility.
Thus, when the evaluation boards are installed side by side in one test chamber, there is a possibility that the features of the evaluation board of the present invention cannot be fully utilized.

  Accordingly, the invention described in claim 7 provides an installation space in which the evaluation board according to any one of claims 1 to 6 is installed, a decompression unit that depressurizes the installation space, and a heater heater that supplies power to the heater. And an environmental test apparatus characterized in that the specimen can be exposed to a desired temperature while energizing the specimen under reduced pressure.

  According to the configuration of the present invention, it is possible to expose the specimen to a desired temperature while energizing the specimen under reduced pressure. That is, since each specimen is energized under a reduced pressure as compared with the atmospheric pressure, it is evaluated under a state where the amount of air as a heat medium is small, and heat is not easily transferred to other specimens. Therefore, the influence of the temperature between the specimens due to the heat generation of the specimen can be eliminated. Therefore, the characteristics of the specimen can be accurately evaluated.

  Desirably, the decompression means can decompress the installation space to 0 kPa or more and 50 kPa or less.

  According to this structure, since the decompression means can decompress the installation space to 0 kPa or more and 50 kPa or less, the interior of the installation space can be brought into a vacuum state lower than the atmospheric pressure, and the specimen can be thermally insulated by vacuum. . Therefore, it is difficult to be affected by convection and the like and can be evaluated accurately.

  It is further desirable that the decompression means can reduce the installation space to 10 kPa or less.

  According to this configuration, the pressure reducing means can reduce the pressure in the installation space to 10 kPa or less. This range is a degree of vacuum that does not cause discharge, and is an economical degree of vacuum and a degree of vacuum that takes a short time to reach the vacuum.

  It is particularly desirable that the installation space can be adjusted to a pressure within a certain range of 1.3 kPa to 10 kPa.

According to this configuration, the installation space can be adjusted to a pressure within a certain range of 1.3 kPa to 10 kPa. That is, a low vacuum state is always maintained.
Within this range, there will be a slight amount of gas (for example, air) in the test chamber, so that moderate heat dissipation from the evaluation board will be generated and the temperature controllability of the heater on the evaluation board will be improved. Can do. Further, when the degree of vacuum is higher than this, a discharge phenomenon may occur from the specimen, but discharge is unlikely to occur within this range.

  The invention described in claim 8 is a method for evaluating a specimen using the evaluation substrate according to any one of claims 1 to 6, wherein a plurality of specimens are desired while energizing the specimen under reduced pressure. This is a method for evaluating a specimen characterized by evaluating the temperature of a plurality of specimens by exposure to the temperature of the specimen.

  According to the method of the present invention, temperature unevenness is unlikely to occur between specimens, and accurate evaluation can be performed.

  Further, it is desirable to heat the sample by the heater and to expose the specimen to a desired temperature.

  According to this method, evaluation can be performed without temperature unevenness regardless of the installation position of the specimen on the substrate body.

  The desired temperature is preferably in the range of 50 degrees Celsius or more and 200 degrees Celsius or less.

  If it is said range, there will be little influence of the radiant heat to another specimen.

According to the evaluation board of the present invention, variation in test temperature is unlikely to occur, and the temperature characteristics of the specimen can be accurately evaluated.
According to the environmental test apparatus of the present invention, even when a specimen that self-heats is evaluated, variations in test temperature are unlikely to occur, and the temperature characteristics of the specimen can be accurately evaluated.
According to the method for evaluating a specimen of the present invention, accurate evaluation can be performed.

It is the perspective view which showed typically the evaluation board | substrate which concerns on 1st Embodiment of this invention. It is a disassembled perspective view of the evaluation board | substrate of FIG. It is a top view of the evaluation board | substrate of FIG. It is the top view which looked at the evaluation board | substrate of FIG. 3 from the back surface. It is the perspective view which showed notionally the environmental test apparatus which evaluates an evaluation board | substrate. It is a perspective view of the mother board | substrate attached to the environmental test apparatus of FIG. It is explanatory drawing showing the measurement condition of the evaluation board | substrate of FIG. It is a perspective view of the evaluation board | substrate of 2nd Embodiment. It is a disassembled perspective view of the evaluation board | substrate of 3rd Embodiment. It is sectional drawing of the evaluation board | substrate of 4th Embodiment. It is a disassembled perspective view of the evaluation board | substrate of 5th Embodiment. It is a disassembled perspective view of the evaluation board | substrate of 6th Embodiment. It is a top view of the evaluation board of a 7th embodiment. It is a top view of the evaluation board of an 8th embodiment. It is a perspective view of the environmental test apparatus of 9th Embodiment. It is a perspective view of the environmental test apparatus of 10th Embodiment.

Hereinafter, a first embodiment of the present invention will be described in detail.
In the following description, unless otherwise specified, the vertical positional relationship will be described based on the normal installation position (FIG. 1).

  The evaluation board 1 of the first embodiment is a board for evaluating the temperature characteristics of the specimen 10 by exposing the specimen 10 to a predetermined temperature while energizing the specimen 10 to be evaluated.

  The evaluation board 1 is a printed board in which the specimen 10 is mounted on the board body 2 having a planar shape as shown in FIG. The evaluation board 1 is formed of a mounting area 11 and a connector area 12 when viewed in plan as shown in FIG.

The mounting area 11 is an area for mounting the specimen 10 and the like as shown in FIG. 3 and is a part that forms an evaluation environment for the specimen 10.
The connector region 12 is a region that can be connected to other members, and is a so-called edge connector. The connector region 12 is a part that functions as a power supply unit for supplying power to the specimen 10 or the like mounted in the mounting region 11. The connector region 12 can be engaged with other members.

  And the evaluation board | substrate 1 of 1st Embodiment mounts the heater 8 which can heat the board | substrate body 2 and can expose the test body 10 to desired temperature, and is one of the characteristics.

  Based on this, the configuration of the evaluation board 1 will be described below.

As shown in FIGS. 1 and 2, the evaluation substrate 1 has a plurality of attachment portions 3 on one main surface side (upper surface side) of the substrate body 2, and a specimen energization path 5 that passes through each attachment portion 3 ( A specimen energization path) and temperature measuring means 4 are provided, and an insulating layer 6 is further coated thereon.
In addition, as can be seen from FIGS. 1 and 2, the evaluation substrate 1 is provided with a heater 8 which is a feature of the present invention on the other main surface side (lower surface side) of the substrate body 2 and further on the lower surface. An insulating layer 9 is coated from the side.

The substrate body 2 is a plate-like substrate having a planar shape and has a rigidity that does not bend when supported in a cantilever manner.
The material of the substrate body 2 is not particularly limited as long as it has the above-described rigidity and heat resistance, but is preferably made of glass / epoxy (made of FR4) from the viewpoint of easy etching treatment.
The thickness of the substrate body 2 is preferably in a range where heat conduction to the evaluation substrate 1 by the heater 8 can be efficiently performed.

  As can be seen from FIG. 1 and FIG. 2, the attachment portion 3 is a portion that is continuous with the specimen energization path 5, and is a portion to which the specimen 10 is attached via a conductive adhesive 13 such as solder. The attachment portion 3 can supply power to the attached specimen 10.

The specimen energization path 5 is formed by a conductive layer 7 laminated on the substrate body 2.
Specifically, the test-unit current path 5 is formed by etching a conductive layer 7 provided on the substrate body 2 so as to be spread, and then patterning the conductive layer 7 into a desired shape.
For example, the current path 5 for the specimen is formed by forming a desired resist pattern on the conductive layer 7 on the substrate body 2 and removing the resist pattern after removing portions other than the resist pattern of the conductive layer 7. ing.
The specimen energization path 5 is formed across the mounting area 11 and the connector area 12, and can be energized by connecting the connector area 12 to another member.

  The conductive layer 7 is not particularly limited as long as it has conductivity, but is preferably a copper foil from the viewpoint of being inexpensive and easily etched.

  The temperature measuring means 4 is a known temperature sensor, and can measure the temperature of the evaluation board 1 and transmit the measured temperature to an external microcomputer or the like.

  The insulating layer 6 is a resin layer having insulation properties and is a known solder resist.

The heater 8 is formed by a heating current path 15 distributed so that the in-plane temperature distribution of the substrate body 2 in the mounting region 11 is uniform.
The heating heater 8 is preferably formed with a heating energization path 15 so that the in-plane temperature distribution of the substrate body 2 in the mounting region 11 during energization falls within the range of −1 degree Celsius to 1 degree Celsius. From the viewpoint of further reducing the temperature distribution, it is more preferable that the heating current path 15 is formed so as to be −0.5 degrees Celsius or more and 0.5 degrees Celsius or less.

  The heating energization path 15 is an energization line that is elongated and is a conductive path that is narrower than the entire length. The heating current path 15 is formed so as to crawl all over the substrate body 2 in the mounting region 11.

Specifically, as shown in FIG. 4, the heating energization path 15 meanders in a wave shape in the mounting region 11, and an end thereof extends to the connector region 12. The heating energization path 15 is formed by a plurality of straight paths 17 extending linearly and a plurality of curved paths 18 folded back in an arc shape.
The straight paths 17 are arranged in parallel on the lower surface of the substrate body 2 in the width direction, and the curved paths 18 are connected so as to connect the ends of the adjacent straight paths 17 and 17. That is, the curved path 18 can be said to be a direction changing means for changing the extending direction of the heating current path 15.

The heating current path 15 is formed by printed wiring, and is formed by a foil-like conductive layer 16 laminated on the substrate body 2. Specifically, the conductive layer 16 provided on the substrate main body 2 so as to spread is patterned by etching into the above-described shape.
The etching method is not particularly limited, but wet etching is mainly used.
The conductive layer 16 is not particularly limited as long as it has conductivity, but is preferably a copper foil from the viewpoint of being inexpensive and easily etched. From the viewpoint of relatively high electrical resistance and high heat generation efficiency, iron foil is preferred.

The heating energization path 15 is formed across the mounting area 11 and the connector area 12, and can be energized with other members from the connector area 12.
The heating energization path 15 is heated by the internal resistance of the conductive layer 16 by being supplied with power from another member, so that the substrate body 2 can be heated to a desired temperature.

The cross-sectional area of the heating current path 15 is appropriately designed according to the measurement temperature of the specimen 10 or the like. What is necessary is just to be able to heat by the heat_generation | fever by internal resistance. In heating the substrate body 2, it is preferable that the temperature rises at an appropriate rate.
The width of the heating current path 15 in the present embodiment is substantially the same in the mounting region 11, and the thickness of the heating current path 15 is also substantially the same in the mounting region 11. That is, the heating current path 15 has substantially the same resistance value over the entire length.

  The insulating layer 9 is an insulating resin layer and is a known solder resist.

  The specimen 10 is a known specimen such as an element or a resistor. In the present embodiment, the specimen 10 is a resistor and is a heating element that self-heats when energized.

Then, the positional relationship of each site | part of the evaluation board | substrate 1 which mounted the test body 10 is demonstrated.
On one side main surface (upper surface) of the substrate body 2, a plurality of mounting portions 3 are arranged in the mounting region 11 as shown in FIG. 3. Each mounting portion 3 is spaced a predetermined distance in the width direction x (one direction orthogonal to the thickness direction) and the length direction y (direction orthogonal to the thickness direction and orthogonal to the width direction). Are lined up.
It is preferable that the mounting portions 3 are evenly distributed in the mounting region 11 so that the distances between the mounting portions 3 adjacent on the board body 2 are equal.

  The specimen energization path 5 is connected to each mounting portion 3 in the mounting region 11 as shown in FIG. 3, and the exposed portion 20 for the specimen exposed from the insulating layer 6 in the connector region 12 (feeding portion for specimen). have. That is, it is possible to energize each attachment portion 3 via the specimen energization path 5 by connecting another member to the specimen exposure section 20.

  As shown in FIG. 4, the heating current path 15 has a heating exposed portion 21 (heater power feeding portion) exposed from the insulating layer 9 in the connector region 12. It is possible to energize the heating energization path 15 by connecting another member to the heating exposed portion 21. That is, the heating energization path 15 is connected to the other heating exposure part 21B (21) from the one heating exposure part 21A (21) via the straight path 17 and the curved path 18 in the mounting region 11. A conductive path is formed.

The temperature measuring means 4 is arranged on the upper side of the insulating layer 6 so as to avoid the projection surface in the member thickness direction of the heating current path 15.
The specimen 10 is bonded to each mounting portion 3 with a conductive adhesive 13 such as solder, and is integrated with the evaluation substrate 1. That is, the specimen 10 is electrically connected to the specimen energization path 5 via the attachment portion 3.
The insulating layer 6 covers the outer side of the energization path 5 for the specimen in the vertical direction (perpendicular to the main surface) with the substrate body 2 as a reference. The insulating layer 9 covers the outside of the heating current path 15 with the substrate body 2 as a reference.

  Next, an environment test apparatus 100 suitable for using the evaluation board 1 on which the specimen 10 described above is mounted will be described.

  As can be read from FIGS. 5 and 7, the environmental test apparatus 100 includes a test chamber 101, a stage 102, a vacuum pump 103 (decompression unit), a characteristic evaluation apparatus 104, and a microcomputer (not shown).

  The test chamber 101 is a housing having an installation space 110 in which a mother board 105 to which a plurality of evaluation boards 1 are connected is installed.

The stage 102 is formed of a mother board 105 to which the evaluation board 1 can be connected as shown in FIG. 6 and a mother power supply slot 106 connected to an external power source.
The mother board 105 is a known mother board, and as shown in FIG. 6, has one or a plurality of evaluation board slots 107 for connecting the evaluation board 1 and an edge connector 108 for supplying power to each of the evaluation board slots 107. Yes.
The mother substrate 105 is mounted with a known rectifier circuit (not shown). The mother board 105 has at least two systems of circuits, and can supply DC power and AC power (for example, commercial power) independently from the evaluation board slot 107.
The evaluation board slot 107 is a part for fixing the evaluation board 1 and can be engaged with the connector region 12 of the evaluation board 1.
Further, the evaluation board slot 107 is capable of supplying DC power to the specimen exposure part 20 by being engaged with the evaluation board 1, and can supply AC power to the heating exposure part 21. Yes. That is, the evaluation board slot 107 is not only a specimen power supply means but also a heater power supply means.
The edge connector 108 can be engaged with the mother power supply slot 106, and can be electrically connected to the mother power supply slot 106 by being engaged.

  The vacuum pump 103 is a known vacuum pump. The vacuum pump 103 can depressurize the installation space 110 in the test chamber 101, and can be adjusted to a pressure within a predetermined range by microcomputer control.

  The characteristic evaluation device 104 is a device that measures and evaluates the temperature characteristic of the specimen 10. Specifically, the connection portion between the mounting portion 3 and the specimen 10 shown in FIG. 7, that is, the conductive adhesive 13 is measured and evaluated as the measurement point 111.

Then, the positional relationship of each member of the environmental test apparatus 100 will be described.
A plurality of mother power supply slots 106 are provided on the side surface of the test chamber 101 as shown in FIG. The edge connector 108 of the mother board 105 is attached to the mother power supply slot 106, and the mother board 105 faces the direction intersecting the side surface of the test chamber 101. In the present embodiment, the mother substrate 105 is oriented in the vertical direction with respect to the side surface of the test chamber 101, and is in a vertical posture (posture extending upside down).
The connector region 12 of the evaluation board 1 is attached to the evaluation board slot 107, and the evaluation board 1 faces the direction intersecting the main surface of the mother board 105. In the present embodiment, the evaluation substrate 1 is oriented in the vertical direction with respect to the main surface of the mother substrate 105 and has a vertical posture (a posture extending vertically). That is, in this embodiment, the evaluation substrate 1 is attached so as to face the side surface of the test chamber 101.
For example, the evaluation board 1A (1) shown in FIG. 5 is parallel to the evaluation board 1B (1) adjacent in the horizontal direction on one mother board 105. Further, the evaluation board 1A (1) is arranged on the same straight line as the evaluation board 1D (1) adjacent in the vertical direction.
It should be noted that the relationship between one evaluation board 1 and the other evaluation board 1 adjacent to the one evaluation board 1 in the vertical direction does not necessarily have to be aligned on the same straight line.

Next, a method for evaluating the specimen 10 using the environmental test apparatus 100 will be described.
First, a plurality of specimens 10 are bonded to each mounting portion 3 using a conductive adhesive 13, and the specimens 10 are mounted on the evaluation board 1. In the present embodiment, a plurality of specimens 10 are soldered and bonded to the mounting portions 3.
At this time, a plurality of specimens 10 are mounted on one evaluation board 1. In the present embodiment, as shown in FIG. 1, four specimens 10 are mounted on one evaluation board 1.

Thereafter, as shown in FIG. 6, the connector region 12 of the evaluation board 1 on which the specimen 10 is mounted is inserted into the evaluation board slot 107 of the mother board 105.
At this time, the evaluation substrate 1 is in a posture intersecting with the main surface of the mother substrate 105. That is, the evaluation board 1 is supported in a cantilever manner with respect to the mother board 105 by the connector region 12 engaging with the evaluation board slot 107.

  Then, the edge connector 108 of the mother board 105 is inserted into the mother power supply slot 106 in the test chamber 101, and the characteristic evaluation device 104 is connected to the connection portion of each mounting portion 3 and the specimen 10 as shown in FIG.

Thereafter, the test chamber 101 is set as a sealed space, and the inside of the test chamber 101 is evacuated by the vacuum pump 103 to reduce the pressure until the installation space 110 becomes a predetermined pressure or less.
At this time, the installation space 110 is decompressed to 0 kPa or more and 50 kPa or less. The installation space 110 is preferably decompressed to 10 kPa or less from the viewpoint of achieving a vacuum degree that is economical and requires a short time to reach a vacuum. In the present embodiment, the pressure reduction is controlled so as to be in the range of 1.3 kPa or more and 10 kPa or less from the viewpoint of achieving a pressure at which discharge does not occur.
That is, the installation space 110 is in a low vacuum state.

Then, the installation space 110 is depressurized until the degree of vacuum becomes equal to or lower than a predetermined degree of vacuum, and when the degree of vacuum is stabilized, the heater 8 is energized to heat the substrate body 2.
At this time, the temperature measured by the temperature measuring means 4 provided on the insulating layer 6 is received by the microcomputer, and the power output from the microcomputer to the heater 8 is controlled to turn on and off so that the temperature is controlled to a desired temperature. ing.
The temperature of the substrate body 2 can be controlled to be an arbitrary value in the range of 50 degrees Celsius or more and 200 degrees Celsius or less. In this embodiment, the temperature is controlled to be about 100 degrees Celsius.
The power output control to the heater 8 may be proportional control or PID control.

  When the substrate body 2 is heated and the temperature of the specimen 10 is exposed to a predetermined temperature, the specimen 10 is energized, and the temperature of the connection portion between the mounting portion 3 and the specimen 10 is set by the characteristic evaluation device 104. Measure and evaluate the temperature characteristics of the specimen 10.

According to the environmental test apparatus 100 of the present embodiment, the interior of the installation space 110 is maintained at a low vacuum at the time of evaluation, and each specimen 10 is vacuum insulated. That is, since measurement is performed under reduced pressure rather than atmospheric pressure, it is possible to prevent other specimens 10 from being affected by temperature due to the heat generated by the specimen 10 itself.
Further, since the test temperature of the specimen 10 is as low as about 100 degrees Celsius, the influence of the radiant heat of the specimen 10 on the temperature of other specimens 10 is small.

  In the above-described embodiment, the specimens 10 are arranged in a vertical and horizontal grid pattern, but the present invention is not limited to this, and the arrangement of the specimens 10 is not particularly limited. For example, the specimens 10 may be arranged in a staggered manner on the substrate body 2 as shown in FIG. 8 (second embodiment).

In the above-described embodiment, the heating current path 15 is formed by etching the conductive layer 16 integrated with the substrate body 2, but the present invention is not limited to this, and separate heating is performed. A heater may be attached to the substrate body 2.
In addition, the attachment method and kind of heater are not specifically limited. For example, as shown in FIG. 9, a heater 30 having a planar heating section or a linear or foil heater may be attached to the substrate body 2 by an adhesive or the like (third embodiment), or FIG. Thus, the heater 31 and the substrate body 2 may be brought into contact with each other by sandwiching the linear, plate-like or foil-like heater 31 between the substrate body 2 and the plate-like member 32 (fourth embodiment).
Moreover, it is good also as a laminated structure which pinched | interposed the linear, plate-shaped, or foil-shaped heater 33 by the two board | substrate main bodies 2 like FIG. 11 (5th Embodiment). In this case, the specimen 10 can be attached to both surfaces of the laminated structure. Therefore, the space for installing the evaluation board can be reduced.
For example, in the case of a linear heater, a nichrome wire can be used, and in the case of a foil or plate heater, punching of an iron foil or an iron plate can be used.
Further, when the heater is attached to the substrate body 2, at least one of the substrate body 2 or the heater may be fused and integrated.

  In the above-described embodiment, the substrate main body 2 is heated using one heating energization path 15. However, the present invention is not limited to this, and a plurality of heating energization paths 15 are used. The substrate body 2 may be heated. In this case, it is preferable that a plurality of systems (two systems in the figure) of heating current paths 15 are arranged in parallel in a plurality of rows on the lower surface of the substrate body 2 as shown in FIG. 12 (sixth embodiment).

In the embodiment described above, the distribution of the heating current path 15 on the substrate body 2 in the mounting region 11 is uniform. However, the present invention is not limited to this, and the distribution of the heating current path 15 is not limited thereto. May not be uniform.
For example, when the evaluation substrate 1 is evaluated in the air, the heating energization path 15 is cooled from the outside in the surface direction of the substrate body 2 (the edge side of the substrate body 2) by the existing air, and the temperature decreases. When used in such a case, the heat generation amount may be increased by reducing the cross-sectional area of the outer portion of the heating energization path 15 as shown in FIG. 13 (seventh embodiment).

  In the above-described embodiment, the heating energization path 15 is formed so that the back surface of the substrate body 2 is wavy, but the present invention is not limited to this, and the entire substrate body 2 is heated. I just need it. For example, the heating current path 15 may be formed in a spiral shape as shown in FIG. 14 (eighth embodiment).

  In the above-described embodiment, each evaluation substrate 1 is fixed in the test chamber 101 so as to be parallel to the horizontal direction. However, the present invention is not limited to this, and each evaluation substrate 1 in the test chamber 101 is fixed. There is no particular limitation on the installation position and posture of the. For example, as shown in FIG. 15, the evaluation board 1 may be fixed in a horizontal posture (9th embodiment). At this time, the evaluation board 1A (1) is arranged on the same straight line as the evaluation board 1B (1) adjacent in the horizontal direction on one mother board 105. Further, the evaluation board 1A (1) is parallel to the evaluation board 1C (1) adjacent in the vertical direction. Note that the relationship between one evaluation substrate 1 and another evaluation substrate 1 that is adjacent to the one evaluation substrate 1 in the horizontal direction on the mother substrate 105 is not necessarily aligned on the same straight line.

  In the above-described embodiment, each mother substrate 105 is fixed in the test chamber 101 so as to be parallel to the horizontal direction. However, the present invention is not limited to this, and each mother substrate 105 in the test chamber 101 is fixed. There is no particular limitation on the installation position and posture of the. For example, as shown in FIG. 16, the mother substrate 105 may be fixed in a horizontal position (9th embodiment). At this time, the mother substrate 105A (105) is parallel to the mother substrate 105B (105) adjacent in the vertical direction.

  In the above-described embodiment, the copper foil is used as the conductive layer 16, but the present invention is not limited to this, and uses a material whose internal resistance increases and the current density decreases as the temperature rises. May be.

  In the above-described embodiment, the pressure reduction control is performed so that the installation space 110 is in the range of 1.3 kPa to 10 kPa, but the present invention is not limited to this, and may be 50 kPa or less. That is, the pressure may be constantly reduced by the vacuum pump 103.

  In the above-described embodiment, the temperature measuring means 4 is provided on the upper surface of the insulating layer 6, but the present invention is not limited to this, as long as the temperature of the substrate body 2 can be measured. That is, it may be located anywhere on the substrate body 2, and the temperature measuring means 4 may be provided on the lower surface of the insulating layer 9. Further, the temperature measuring means 4 may be provided on the substrate body 2.

  In the above-described embodiment, the specimen energization path 5 and the heating energization path 15 are formed by etching. However, the present invention is not limited to this, and a conductive paste is applied to the substrate body 2 by a printing method. The energization path 5 for the specimen and / or the energization path 15 for heating may be formed.

  In the above-described embodiment, after the installation space 110 is depressurized to a predetermined vacuum level or less and the vacuum level is stabilized, the heater body 8 is energized to heat the substrate body 2, but the present invention is limited to this. Instead, the substrate body 2 may be heated by energizing the heater 8 simultaneously with the pressure reduction.

  In the above-described embodiment, the specimen 10 mounted on the evaluation board 1 is evaluated in the environmental test apparatus 100. However, the present invention is not limited to this, and the test specimen 10 is performed in the atmosphere without decompression. Also good.

  In the above-described embodiment, a plurality of evaluation substrates 1 are installed in the test chamber 101 of the environmental test apparatus 100 and the specimen 10 is evaluated. However, the present invention is not limited to this, and a single sheet is used. You may evaluate only with the evaluation board | substrate 1. FIG.

  In the embodiment described above, a plurality of mother boards 105 mounted with the evaluation board 1 are installed in the test chamber 101 of the environmental test apparatus 100 and the specimen 10 is evaluated. However, the present invention is not limited to this. Alternatively, the evaluation may be performed using only one mother substrate 105.

DESCRIPTION OF SYMBOLS 1 Evaluation board | substrate 2 Board | substrate body 3 Attaching part 5 Specimen energization path (Specimen energization path)
8 Heating heater 10 Specimen 16 Conductive layer 18 Curve 20 Exposed part for specimen (feeding part for specimen)
21 Exposed part for heating (power supply part for heater)
100 Environmental test equipment 103 Vacuum pump (pressure reduction means)
107 Evaluation Board Slot 110 Installation Space

Claims (8)

In the evaluation board for evaluating the specimen by exposing the specimen to a desired temperature while energizing the specimen,
A substrate body having a spread in a planar shape, a mounting portion to which the specimen can be attached, and a heater for heating the substrate body,
The mounting portion is located on one main surface side of the substrate body,
An evaluation board, wherein the heater is distributed and integrated in a planar shape on the other main surface side of the board body. The heater is a narrow energization path compared to the entire length constituted by the conductive layer,
The evaluation board according to claim 1, wherein the energization path generates heat when the energization path is energized. The heater is a single-system or multiple-system energization path that is narrow compared to the overall length,
The energizing path has a plurality of curved paths,
The evaluation board according to claim 1, wherein the energization path generates heat when the energization path is energized.   The evaluation according to any one of claims 1 to 3, wherein the heater is a conductive path that is narrower than a total length formed by etching a conductive layer widely provided on the substrate body. substrate. The evaluation board is a printed board,
The evaluation board according to claim 1, wherein the heater is an energization line that is narrower than a full length formed of printed wiring. A heater power supply is provided at the end of the substrate body,
The heater power supply unit is connected to the heater,
The heater power supply unit is engageable with another member,
The evaluation substrate according to claim 1, wherein the heater power supply unit is energized by being engaged with another member. An installation space in which the evaluation board according to any one of claims 1 to 6 is installed, a decompression unit that depressurizes the installation space, and a heater power supply unit that supplies power to the heater.
An environmental test apparatus characterized in that a specimen can be exposed to a desired temperature while energizing the specimen under reduced pressure. A method for evaluating a specimen using the evaluation substrate according to any one of claims 1 to 6,
A method for evaluating a specimen, comprising: exposing a plurality of specimens to a desired temperature while energizing the specimen under reduced pressure, and evaluating the temperatures of the plurality of specimens.

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