CN104181095B - Evaluate the evaluation method of substrate, environment test device and sample - Google Patents
Evaluate the evaluation method of substrate, environment test device and sample Download PDFInfo
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- CN104181095B CN104181095B CN201410221848.7A CN201410221848A CN104181095B CN 104181095 B CN104181095 B CN 104181095B CN 201410221848 A CN201410221848 A CN 201410221848A CN 104181095 B CN104181095 B CN 104181095B
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- substrate
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- heater
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
Abstract
The present invention provides a kind of evaluation substrate, it is in the case of the sample of evaluation self-heating, it is also difficult to produces the inequality of test temperature, can correctly evaluate the temperature characterisitic of sample.The evaluation substrate is used to be powered to sample (10) and sample (10) is evaluated sample (10) at desirable temperature, which has：The base main body (2) to extend with planar；The mounting portion (3) of sample (10) can be installed；With the heater (8) for heating the substrate main body (2), mounting portion (3) is located at an interarea side of base main body (2), and heater (8) is distributed in planar in another interarea side of base main body (2) and is formed as one with base main body (2).
Description
Technical field
The present invention relates to the evaluation substrate of the evaluation for the temperature characterisitic for carrying out sample.In addition, the present invention relates to will evaluate base
Environment test device of the plate in the environment of regulation.Also, the invention further relates to use environment experimental rig to evaluate examination
The evaluation method of the temperature characterisitic of sample.
Background technology
As one of methods of performance such as evaluation product, such as there is environmental test.Environmental test is to be placed on product etc.
Under specific environment, the change of observation performance etc..
Environment test device is the device for carrying out environmental test, desired temperature can will be maintained in test space
Deng environment (such as patent document 1).Environment test device can for example form hot environment and low temperature environment, high humidity environment
With the various environment such as low-humidity environment, vacuum environment.That is, environment test device can set product in laboratory, and evaluation is each
Properties of product under kind environment.
In addition, in the past in miniature device being installed on printed base plate etc., commented in order to ensure safety and reliability
The characteristic of valency component parts.
For example, in temperature characterisitic evaluation test, prepare the printing base for the sample that solder is mounted with as evaluation object
Plate.Then, which is arranged in the environment test device of air circulating type, makes sample exposed to set point of temperature
It is powered in the state of in air, thus evaluates the temperature characterisitic of sample.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2011-209303 publications
The content of the invention
Technical problems to be solved by the inivention
In general, when evaluating the temperature characterisitic of sample, substantial amounts of sample is in most cases disposably evaluated.I.e., mostly
Multiple samples are installed on 1 printed base plate in the case of number, each sample is evaluated.It is terrible when evaluating these samples
To the high temperature characterisitic as a result, it is desirable to be evaluated under identical conditions, environment of reliability.
But because of energization and with sample (the hereinafter also referred to fever examination of fever as sample is chip resistor
Sample) in the case of, in existing environment test device, sample can be because test contact (wind-engaging) side of indoor air (wind)
Formula and change between febrile state, radiating state.Therefore, the Temperature Distribution increase in printed base plate, may be because of sample
Installation site and produce the inequality of test temperature.Therefore, in the evaluation method of existing environment test device, existing cannot
The problem of enough correct evaluation temperature characteristics.
Then, as one of such method is solved the problems, such as, consideration makes to become calm space in laboratory, not to sample
The method of blowing.
For example, in calm space, the printed base plate that fever sample is mounted with surface is loaded in as electric hot plate
On heating machine.Consider in this way to directly heat fever sample, the method for evaluation temperature characteristic.
But in the method, as the exposure level of printed base plate and heating machine, and in printed base plate
Produced in temperature uneven.That is, because the bumps of the heating surface of the surface configuration of printed base plate and heating machine, printed base plate with
Inequality is produced in heat-conducting area between heating machine, is produced not in the heat conduction for the fever sample installed on to printed base plate
.Therefore, in this method, there is also the problem of the temperature characterisitic that can not correctly evaluate fever sample.
Then, present invention aims at a kind of evaluation substrate is provided, it is difficult to produce test temperature when evaluating sample
Inequality, can correctly evaluate the temperature characterisitic of sample.In addition, and it is an object of the present invention to provide a kind of environment test device, even if it is right
Also it is difficult to the inequality of generation test temperature in the sample of self-heating, can correctly evaluates the temperature characterisitic of sample.Also, mesh
Also reside in a kind of evaluation method for the temperature characterisitic that can correctly evaluate sample be provided.
For solving the means of technical problem
One embodiment of the present invention for solving above-mentioned technical problem is：For being powered to sample and exposing sample
In the evaluation substrate that sample is evaluated at desirable temperature, have：The base main body to extend with planar；It can install
State the mounting portion of sample；With heating aforesaid substrate main body heater, wherein, above-mentioned installation position in aforesaid substrate main body one
A interarea side, above-mentioned heater another interarea side of aforesaid substrate main body in planar be distributed and with aforesaid substrate main body
It is formed as one.
According to the manner, above-mentioned installation position is in an interarea side of aforesaid substrate main body, and above-mentioned heater is above-mentioned
Another interarea side of base main body is distributed in planar and is formed as one with aforesaid substrate main body.That is, mounting portion and heating
Device is opposite to clip the mode of base main body, and the heat produced from heater is via base main body to the sample on mounting portion
Conduction.
That is, the evaluation substrate of the manner heats base main body planar by the heater of itself, even if without using adding
Other heating units such as heat engine device, can also make sample exposure at an established temperature.Therefore, to the phase installed in base main body
The sample tossed about is difficult to produce heat transfer inequality, can correctly evaluate the temperature characterisitic of sample.
It is preferable that：Above-mentioned heater is by the narrow electrical path of the width compared with total length that conductive layer is formed, and is passed through
It is powered to above-mentioned electrical path to make above-mentioned electrical path generate heat.
According to the manner, it is powered by the narrow electrical path of the width compared with total length to being made of conductive layer above-mentioned to make
Electrical path generates heat.That is, according to the manner, generated heat by internal resistance of conductive layer etc., institute is so as to easily heat base
Plate main body.
It is preferable that：Above-mentioned heater is the circuit passband of the system that width is narrow compared with total length or multiple systems
Footpath, above-mentioned electrical path have multiple crooked routes, above-mentioned electrical path is generated heat by being powered to above-mentioned electrical path.
According to the manner, above-mentioned electrical path has multiple crooked routes, is made by being powered to above-mentioned electrical path
State electrical path fever.Therefore, it is possible to be paved with electrical path on the interarea of base main body, can make warm in the face of base main body
Degree is more evenly distributed.
It is preferable that：Above-mentioned heater is that the conductive layer being arranged in large area in aforesaid substrate main body is etched
And the narrow conductive path of the width compared with total length formed.
According to the manner, heater is that the conductive layer being arranged in large area in base main body is etched and is formed
's.Therefore, it is possible to easily make conductive path be formed as desirable shape.Therefore, being capable of easy landform by the patterning
The conductive path narrow into the width compared with total length.
It is preferable that：Evaluate substrate be printed base plate, above-mentioned heater be by printed wiring formed compared with total length
The narrow live wire of width.
According to the manner, evaluation substrate is printed base plate, and heater is the width compared with total length formed by printed wiring
Narrow live wire.Therefore, it is possible to which heater easily is formed as desirable shape, and easily a large amount of productions.
It is preferable that：In the end set heater power supply of aforesaid substrate main body, the heater power supply with
Above-mentioned heater connection, above-mentioned heater power supply can engage with miscellaneous part, by engaging with miscellaneous part come to upper
Heater is stated to be powered with power supply.
According to the manner, by the way that the heater being connected with heater power supply is engaged with miscellaneous part, via heating
Device power supply is powered heater.Accordingly, it is capable to enough miscellaneous part supporting substrates main bodys, and easily from miscellaneous part pair
Heater is powered.
Furthermore it is preferred that the sample electrical path being powered to sample is formed as one relative to aforesaid substrate main body.
According to the structure, can stably be powered to sample.
Furthermore it is preferred that in the end set sample power supply of aforesaid substrate main body, which leads to sample
Power path connects, and said sample power supply can engage with miscellaneous part, by engaging with miscellaneous part come to said sample
It is powered with power supply.
According to the structure, engaged by the sample power supply for making to be connected with sample electrical path with miscellaneous part, next pair
Sample is powered with power supply.Accordingly, it is capable to enough miscellaneous part supporting substrates main bodys, and easily sample is led to from miscellaneous part
Electricity.
Furthermore it is preferred that being the evaluation substrate for evaluating multiple samples, there are multiple mounting portions, the mounting portion is in above-mentioned base
One interarea side of plate main body is evenly distributed.
According to the structure, because mounting portion is evenly distributed configuration on an interarea of base main body, institute is so as to suppression
System is installed on the influence of sample to each other on mounting portion.
For example, even if be provided be powered when etc. self-heating sample in the case of, can also suppress the fever to phase
The influence of adjacent sample.
However, in the case of the temperature characterisitic of a large amount of samples of evaluation installation, make the consistent sight of determination condition for trying one's best
Point, considers that multiple evaluation substrates for being provided with sample are arranged in same laboratory to be evaluated.
But in the case of the sample of self-heating is installed on evaluation substrate, can because the fever of the sample produces convection current
Temperature Distribution in the face of the temperature conditionss of other samples and other evaluation substrates can be impacted.
This point is illustrated.
For the evaluation substrate 1A such as Figure 15 with shown in the relation of evaluation substrate 1C, evaluating the interarea of substrate in above-below direction
On be arranged in parallel 2 situation (evaluation substrate interarea be directed towards above-below direction posture situation) illustrate.
When being provided with fever sample on the downside of the downside of above-below direction evaluation substrate, the fever of the fever sample
The Temperature Distribution that caused convection current may align square upside evaluation substrate thereon impacts.Accordingly, it is possible to can not be just
Really evaluation sample.
In addition, for the evaluation substrate 1A such as Fig. 5 with shown in the relation of evaluation substrate 1B, evaluating the interarea of substrate in level
The situation (interarea of evaluation substrate is directed towards the situation of the posture of horizontal direction) of 2 is arranged in parallel on direction to be said
It is bright.In this case, the influence produced by the convection current between above-mentioned evaluation substrate can be suppressed.But evaluation substrate on, by positioned at
The downside of above-below direction downside fever sample fever caused by convection current may to installed in it is same evaluation substrate on and be located at
The upside fever sample of the top of above-below direction impacts.
In this way, in a laboratory in the case of spread configuration evaluation substrate, it may be impossible to fully play this hair
The speciality of bright evaluation substrate.
Then, one embodiment of the present invention is a kind of environment test device, it has：For setting above-mentioned evaluation substrate
Installation space；The decompressing unit depressurized to above-mentioned installation space；With the heater power unit to above-mentioned heating installation power supply,
Above-mentioned environment test device under a reduced pressure can be powered sample and sample is exposed at desirable temperature.
According to the manner, it can be powered under a reduced pressure to sample and sample is exposed at desirable temperature.That is,
Each sample compared with atmospheric pressure depressurize in the state of be energized, so in the state of less as the amount of the air of heating agent into
Row evaluation, it is difficult to other sample heat conduction.Influenced therefore, it is possible to exclude the temperature of sample caused by the fever of sample to each other.
Therefore, it is possible to correctly evaluate the characteristic of sample.
It is preferred that it is more than 0kPa below 50kPa that decompressing unit, which can depressurize installation space,.
According to the structure, it is more than 0kPa below 50kPa that decompressing unit, which can depressurize installation space, and institute is so as to make to set
Become subatmospheric vacuum state in emptying, can be by sample vacuum heat-insulation.Accordingly, it is difficult to it is subject to the shadow of convection current etc.
Ring, can correctly be evaluated.
It is preferred that it is below 10kPa that decompressing unit, which can depressurize installation space,.
According to the structure, it is below 10kPa that decompressing unit, which can depressurize installation space,.The scope is to discharge
Degree vacuum, and be economy and reach the time of vacuum shorter vacuum.
Installation space can be particularly preferably adjusted to a certain range of pressure of more than 1.3kPa below 10kPa.
According to the structure, installation space can be adjusted to a certain range of pressure of more than 1.3kPa below 10kPa.
That is, low vacuum state is always maintained.
In this range, because there are micro gas (such as air) in laboratory, institute is so as to from evaluation substrate
The heat dissipation of appropriateness is produced, improves the temperature control of the heater of evaluation substrate.In addition, if vacuum then may be used than this higher
Electric discharge phenomena can occur from sample, but if the scope, then be difficult to happen electric discharge.
One embodiment of the present invention is using the evaluation method of the sample of above-mentioned evaluation substrate, it is under a reduced pressure to examination
Sample is powered, and multiple samples are exposed at desirable temperature, evaluates the temperature of multiple samples.
According to the manner, it is difficult to temperature inequality occurs to each other in sample, can correctly be evaluated.
Furthermore it is preferred that being heated by above-mentioned heater, sample is set to be exposed at desirable temperature.
According to this method, can and no temperature unrelated with setting position of the sample in base main body unevenly commented
Valency.
Furthermore it is preferred that above-mentioned desirable temperature is more than 50 degree Celsius less than 200 degree of scopes Celsius.
In the above range, the influence to the radiant heat of other samples is lacked.
The effect of invention
Evaluation substrate according to the present invention, it is difficult to the inequality of test temperature occurs, can correctly evaluate the temperature of sample
Characteristic.
Environment test device according to the present invention, in the case of the sample of evaluation self-heating, it is also difficult to occur
The inequality of test temperature, can correctly evaluate the temperature characterisitic of sample.
The evaluation method of sample according to the present invention, can correctly be evaluated.
Brief description of the drawings
Fig. 1 is the stereogram for the evaluation substrate for schematically showing the first embodiment of the present invention.
Fig. 2 is the exploded perspective view of the evaluation substrate of Fig. 1.
Fig. 3 is the plan of the evaluation substrate of Fig. 1.
Fig. 4 is the plan from the evaluation substrate of overleaf observing Fig. 3.
Fig. 5 is the stereogram of environment test device for conceptually representing to evaluate evaluation substrate.
Fig. 6 is the stereogram for the motherboard installed on the environment test device of Fig. 5.
Fig. 7 is the explanatory drawin of the measure situation for the evaluation substrate for representing Fig. 1.
Fig. 8 is the stereogram of the evaluation substrate of second embodiment.
Fig. 9 is the exploded perspective view of the evaluation substrate of the 3rd embodiment.
Figure 10 is the sectional view of the evaluation substrate of the 4th embodiment.
Figure 11 is the exploded perspective view of the evaluation substrate of the 5th embodiment.
Figure 12 is the exploded perspective view of the evaluation substrate of sixth embodiment.
Figure 13 is the plan of the evaluation substrate of the 7th embodiment.
Figure 14 is the plan of the evaluation substrate of the 8th embodiment.
Figure 15 is the stereogram of the environment test device of the 9th embodiment.
Figure 16 is the stereogram of the environment test device of the tenth embodiment.
The explanation of reference numeral
1 evaluation substrate
2 base main bodies
3 mounting portions
5 samples are with electrical path (sample electrical path)
7 conductive layers
8 heaters
10 samples
Electrical path (electrical path) is used in 15 heating
16 conductive layers
18 crooked routes
20 samples are with exposed division (sample power supply)
Exposed division (heater power supply) is used in 21 heating
100 environment test devices
103 vacuum pumps (decompressing unit)
107 evaluation substrate slots
110 installation spaces
Embodiment
First embodiment of the invention described further below.
Wherein, in the following description, if without special suggestion, overlying relation is with common setting position (figure
1) illustrated on the basis of.
The evaluation substrate 1 of first embodiment, is for by being powered to the sample 10 for being used as evaluation object and by sample
10 exposures evaluate the substrate of the temperature characterisitic of sample 10 at an established temperature.
It is the printing base that sample 10 is provided with the base main body 2 to extend with planar as shown in Figure 1 to evaluate substrate 1
Plate.Substrate 1 is evaluated as shown in Figure 3 when plane apparent time is formed by installation region 11 and connector area 12.
Installation region 11 is the region for installing the grade of sample 10 as shown in Figure 3, is the position for the evaluation environment to form sample 10.
Connector area 12 is the region that can be connected with miscellaneous part, is the position of referred to as edge connector.Connector
Region 12 is for the position played function as power supply to the grade power supply of sample 10 on installation region 11.Connection
Device region 12 can engage with miscellaneous part.
Then, one of feature of evaluation substrate 1 of first embodiment is：It is mounted with that main body 2 can be heated the substrate
The heater 8 for making sample 10 be exposed at desirable temperature.
On this basis, the structure of evaluation substrate 1 is illustrated below.
Evaluate substrate 1 as shown in Figure 1 and Figure 2, be provided with an interarea side (upper surface side) for base main body 2 more
A mounting portion 3, sample electrical path 5 (sample electrical path), temperature measurement unit 4 by each mounting portion 3, and at it
On covered with insulating layer 6.
In addition, as seen from Figure 1, Figure 2, evaluation substrate 1 is set in another interarea side (lower surface side) of base main body 2
The heater 8 as feature of present invention is equipped with, and covered with insulating layer 9 on the downside of it.
Base main body 2 is the substrate for the tabular that there is planar to extend, and is had in unbending when being supported by cantilever manner
Rigidity.
The material of base main body 2 is just not particularly limited as long as there is above-mentioned rigidity and heat resistance, but for easily being lost
Carve the material of the viewpoint of processing, preferably glass epoxy resin manufacture (FR4 manufactures).
The thickness preferred heater 8 of base main body 2 efficiently can carry out evaluation substrate 1 scope of heat conduction.
As seen from Figure 1, Figure 2, mounting portion 3 is the position being connected with sample electrical path 5, is by electric conductivity such as scolding tin
Cement 13 installs the position of sample 10.Mounting portion 3 can power the sample 10 of installation.
Sample is formed with electrical path 5 by the conductive layer 7 being laminated in base main body 2.
Specifically, sample with electrical path 5 by being etched to the conductive layer 7 that setting is extended in base main body 2,
Patterned desirable shape and formed.
For example, for sample electrical path 5, the conductive layer 7 in base main body 2 forms desirable resist figure
Case.Then, sample is against corrosion by being removed after the position beyond the Resist patterns of conductive layer 7 is removed with electrical path 5
Agent pattern and formed.
Sample is formed with electrical path 5 across installation region 11 and 12 ground of connector area, can be by from connector area
12 connect miscellaneous parts and are powered.
Conductive layer 7 is just not particularly limited as long as there is electric conductivity, but is preferably copper for viewpoint that is cheap and easily etching
Paper tinsel.
Temperature measurement unit 4 is known temperature sensor, is capable of the temperature of evaluation of measuring substrate 1, to exterior microcomputer
Deng transmission measuring temperature.
Insulating layer 6 is the resin bed for having insulating properties, is known solder mask.
The heating that heater 8 makes the temperature in the face of the base main body 2 of installation region 11 be evenly distributed by being scattered in is powered
Path 15 is formed.
The temperature in the face distribution of the base main body 2 of installation region 11 when heater 8 is preferably to be powered is limited in ﹣ 1 Celsius
It is more than degree that less than 1 degree Celsius of mode forms heating electrical path 15.For the further viewpoint for reducing Temperature Distribution, preferably
Heating electrical path 15 is formed in a manner of being limited in more than 0.5 degree less than 0.5 degree Celsius of ﹣ Celsius.
Heating electrical path 15 is elongate live wire, is the conductive path that width is narrow compared with total length.Heating
With electrical path 15 in installation region 11 to be formed in a manner of each corner for advancing to base main body 2.
Specifically, heating electrical path 15 as shown in figure 4, in installation region 11 in hummock bending advance, its
End extends to connector area 12.Heating electrical path 15 is by multiple straight line paths 17 for linearly extending and in circular arc
Multiple crooked routes 18 of shape bending are formed.
Straight line path 17 is arranged in parallel with width respectively in the lower surface of base main body 2, crooked route 18 so that
The mode being connected between the end of adjacent straight line path 17,17 connects.That is, crooked route 18 is change heating electrical path
The direction converting unit of 15 extending direction.
Heating is formed with electrical path 15 by printed wiring, by the conductive layer 16 for the foil-like being layered in base main body 2
Formed.Specifically, by being etched to the conductive layer 16 that setting is extended in base main body 2, patterned above-mentioned shape
And formed.
The method of etching is not particularly limited, but mainly uses Wet-type etching.
Conductive layer 16 is just not particularly limited as long as there is electric conductivity, but for viewpoint that is cheap and easily etching, is preferably
Copper foil.In addition, for resistance is higher and viewpoint that heating efficiency is higher, preferably iron foil.
Heating electrical path 15 is formed across installation region 11 and connector area 12, can be from connector area 12 and its
He is powered at component.
Then, heating is generated heat with electrical path 15 by powering from miscellaneous part by the internal resistance of conductive layer 16, energy
It is enough that base main body 2 is heated to be desirable temperature.
The sectional area of heating electrical path 15 can be appropriately designed according to the measuring temperature of sample 10 etc..As long as it can lead to
The fever for crossing internal resistance generation is heated.When being heated to base main body 2, preferably in temperature with the speed of appropriateness
In the range of rising.
The heating of present embodiment roughly the same, heating circuit passband in installation region 11 with the width of electrical path 15
The thickness in footpath 15 is also roughly the same in installation region 11.That is, heating with electrical path 15 in total length have it is roughly the same
Resistance value.
Insulating layer 9 is the resin bed for having insulating properties, is known solder mask.
Sample 10 is, for example, sample known to element or resistance etc..In present embodiment, sample 10 is resistance, is because being powered
And the heater of self-heating.
Then, the position relationship at each position for the evaluation substrate 1 for being provided with sample 10 is illustrated.
In the unilateral interarea (upper surface) of base main body 2, multiple mounting portions are configured with installation region 11 as shown in Figure 3
3.Each mounting portion 3 width x (1 direction orthogonal with thickness direction) and length direction y (it is orthogonal with thickness direction and with
The orthogonal direction of width) on arrange with separating predetermined distance.
Distance of each mounting portion 3 preferably in installation region 11 between adjacent mounting portion 3 in base main body 2 be
The mode at interval is evenly distributed.
Sample electrical path 5 is connected in installation region 11 with each mounting portion 3 as shown in Figure 3, is had in connector area
From the sample that insulating layer 6 exposes with exposed division 20 (sample power supply) in domain 12.That is, by the sample with exposed division 20
Miscellaneous part is connected, can be powered by sample electrical path 5 to each mounting portion 3.
Heating electrical path 15 has the heating dew exposed in connector area 12 from insulating layer 9 as shown in Figure 4
Go out portion 21 (heater power supply)., can be to heating circuit passband by connecting miscellaneous part with exposed division 21 in heating
Footpath 15 is powered.That is, heating electrical path 15 is formed from the heating of a side with exposed division 21A (21) via the straight of installation region 11
The heating of thread path 17 and crooked route 18 and the opposing party are with the conductive path of exposed division 21B (21) system being connected.
Temperature measurement unit 4 is as shown in Figure 2 in the upside of insulating layer 6 to avoid the component thickness of heating electrical path 15
The mode on the perspective plane in direction configures.
Sample 10 is engaged with each mounting portion 3 by the electric conductivity such as scolding tin cement 13, is formed as one with evaluation substrate 1.
That is, sample 10 is electrically connected via mounting portion 3 with sample electrical path 5.
Insulating layer 6 covers sample energization on the basis of base main body 2 on above-below direction (direction vertical with interarea)
The outside in path 5.In addition, insulating layer 9 covers the outside of heating electrical path 15 on the basis of base main body 2.
Then, preferable environment test device 100 during the evaluation substrate 1 for being mounted with sample 10 using above-mentioned is illustrated.
From Fig. 5, Fig. 7, environment test device 100 has laboratory 101, platform 102, vacuum pump 103, and (decompression is single
Member), apparatus for evaluating characteristics 104, microcomputer (not shown).
Laboratory 101 is the housing for having installation space 110, and installation space 110 is connected with multiple evaluation bases for setting
The main substrate 105 of plate 1.
Platform 102 is as shown in Figure 6 by that can connect the main base evaluated the main substrate 105 of substrate 1 and be connected with external power supply
Plate is formed with for electrical slot 106.
Main substrate 105 is known motherboard, is had as shown in Figure 6：One or more evaluation substrates of connection evaluation substrate 1
With slot 107；With the edge connector 108 powered to each evaluation substrate with slot 107.
Main substrate 105 is provided with known rectification circuit (not shown).Main substrate 105 has the circuit of at least two system,
Direct current power and alternating electromotive force (such as commercial power) can be independently supplied to evaluation substrate 1 from evaluation substrate slot 107.
Evaluation substrate slot 107 is the position of fixed evaluation substrate 1, can be with the connector area 12 of evaluation substrate 1
Engaging.
In addition, evaluation substrate slot 107 can supply sample exposed division 20 directly by engaging with evaluation substrate 1
Galvanic electricity power, can supply alternating electromotive force to heating exposed division 21.That is, it is sample power supply unit to evaluate substrate slot 107,
It is heater power unit.
Edge connector 108 can be engaged with main substrate with for electrical slot 106, can be powered by engaging with main substrate
Slot 106 is electrically connected.
Vacuum pump 103 is known vacuum pump.Vacuum pump 103 can depressurize the installation space 110 in laboratory 101,
The pressure of prescribed limit can be adjusted to by microcomputer control.
Apparatus for evaluating characteristics 104 is measure, evaluates the device of the temperature characterisitic of sample 10.Specifically, shown in Fig. 7
Connecting portion, that is, electric conductivity cement 13 of mounting portion 3 and sample 10 is measured as measuring point 111, evaluates.
Then, the position relationship at each position of environment test device 100 is illustrated.
Main substrate is multiple with being provided with as shown in Figure 5 in the inner side of laboratory 101 for electrical slot 106.Main substrate 105
Edge connector 108 be installed on main substrate and use in electrical slot 106, main substrate 105 is towards the inner side with laboratory 101
The direction of intersection.In present embodiment, main substrate 105 becomes longitudinal direction towards the direction vertical with the inner side of laboratory 101
Posture (posture extended up and down).
The connector area 12 for evaluating substrate 1 is installed on evaluation substrate with slot 107, evaluation substrate 1 towards with main base
The direction that the interarea of plate 105 intersects.In present embodiment, evaluation substrate 1 towards the direction vertical with the interarea of main substrate 105,
As longitudinal posture (vertically extending posture).That is, in present embodiment, evaluation substrate 1 is with face of the private side of laboratory 101
The mode in face is installed.
For example, evaluation substrate 1A (1) and evaluation adjacent in the horizontal direction on a piece of main substrate 105 shown in Fig. 5
Substrate 1B (1) is parallel.In addition, evaluation substrate 1A (1) and evaluation substrate 1D (1) adjacent in the up-down direction are on the same line
Arrangement.
Wherein, an evaluation substrate 1 and the pass with the evaluation substrate 1 other adjacent evaluation substrates 1 in the up-down direction
System may not be the relation arranged on the same line.
Then, the evaluation method of the sample 10 of use environment experimental rig 100 is illustrated.
First, multiple samples 10 are engaged in each mounting portion 3 using electric conductivity cement 13, sample 10 is installed on evaluation
On substrate 1.In present embodiment, multiple 10 solders of sample are engaged in each mounting portion 3.
At this time, multiple samples 10 are installed on 1 evaluation substrate 1.In present embodiment, as shown in Figure 1, in 1 evaluation
4 samples 10 are installed on substrate 1.
Afterwards, as shown in fig. 6, the connector area 12 for the evaluation substrate 1 for being provided with sample 10 is inserted into main substrate 105
Evaluate substrate slot 107.
At this time, evaluating substrate 1 becomes the posture intersected with the interarea of main substrate 105.That is, substrate 1 is evaluated by evaluating
Substrate is with 107 snap-together connector region 12 of slot and relative to main substrate 105 by supporting in cantilever manner.
Then, the edge connector for supplying in electrical slot 106 to be inserted into main substrate 105 of the main substrate in laboratory 101
108, as shown in fig. 7, in each mounting portion 3 and the connecting portion connection performance evaluating apparatus 104 of sample 10.
Afterwards, the laboratory 101 shown in Fig. 5 is set to confined space, it is true to being taken out in laboratory 101 using vacuum pump 103
Sky, installation space 110 are decompressed to below defined pressure.
At this time, installation space 110 is depressurized as more than 0kPa below 50kPa.For as more economical and reach vacuum
The viewpoint of time short vacuum, it is below 10kPa to be preferably provided with the decompression of space 110.In present embodiment, for as not sending out
The viewpoint of the pressure of the degree of raw electric discharge, carries out Decompression Controlling in a manner of the scope as more than 1.3kPa below 10kPa.
That is, installation space 110 becomes low vacuum state.
Then, installation space 110 is depressurized to below defined vacuum, after vacustat, is powered to heater 8,
Heat the substrate main body 2.
At this time, microcomputer receives the measuring temperature for the temperature measurement unit 4 being arranged on insulating layer 6, by microcomputer to heater 8
Electric power output carry out break-make control, thus control be desirable temperature.
The temperature of base main body 2 can be controlled as the arbitrary value in more than 50 degree Celsius less than 200 degree of scopes Celsius, sheet
In embodiment, control as 100° centigrade or so.
Wherein, the electric power output control to heater 8 can be ratio control or PID control.
Base main body 2 is heated, logical to sample 10 when the temperature of sample 10 becomes the state of exposure at an established temperature
Electricity, the temperature of mounting portion 3 and the connecting portion of sample 10 is measured using apparatus for evaluating characteristics 104, and the temperature for evaluating sample 10 is special
Property.
Environment test device 100 according to the present embodiment, in evaluation, makes to maintain low vacuum in installation space 110, respectively
Sample 10 is by vacuum heat-insulation.That is, it is measured in the state of being depressurized compared with atmospheric pressure, institute is so as to prevent because of sample 10 certainly
The fever of body causes temperature to influence on other samples 10.
In addition, in present embodiment, the test temperature of sample 10 is 100° centigrade or so, relatively low, so the spoke of sample 10
It is less on temperature influence caused by other samples 10 to penetrate heat.
In the above embodiment, with checkerboard arrangement sample 10 in length and breadth, however, the present invention is not limited thereto, the arrangement side of sample 10
Formula is not particularly limited.For example, it is also possible to arrange (the second embodiment party of sample 10 in base main body 2 as shown in Figure 8 oblique trellis
Formula).
In the above embodiment, by being etched the conductive layer 16 being formed as one relative to base main body 2 and shape
Into heating electrical path 15, however, the present invention is not limited thereto, can also install other heater in base main body 2.
In addition, the installation method and species of heater are not particularly limited.
For example, it is also possible to the heating of the heating part with planar is installed with cement etc. in base main body 2 as shown in Figure 9
Device 30, or the heater of wire or foil-like (the 3rd embodiment).In addition it is also possible to as shown in Figure 10 by using base main body
2 and plate-shaped member 32 clamp the heater 31 of tabular or foil-like and heater 31 is contacted with base main body 2, so as to be installed
(the 4th embodiment).
In addition it is also possible to it is the heater 33 with 2 plate base main bodys 2 clamping wire, tabular or foil-like as shown in figure 11
Stepped construction (the 5th embodiment).In this case, sample 10 can be installed on the two sides of the stepped construction, institute is so as to reduce
The space of evaluation substrate is set.
For example, in the case of the heater of wire, nichrome wire can be used, the situation of the heater of foil-like or tabular
Under, the iron foil perforated or iron plate can be used.
In addition, when installing heater in base main body 2, at least one party of base main body 2 or heater can also merge
And it is formed as one.
In the above embodiment, base main body 2 is heated using the heating electrical path 15 of 1 system, but the present invention
Not limited to this, can also heat the substrate main body 2 using the heating of multiple systems with electrical path 15.In this case, it is preferred that such as
The heating electrical path 15 of multiple systems (being 2 systems in figure) is arranged in parallel in the lower surface of base main body 2 shown in Figure 12
Multiple row (sixth embodiment).
In the above embodiment, heating in installation region 11 in base main body 2 is uniform with the distribution of electrical path 15
, however, the present invention is not limited thereto, heating may not be uniformly with the distribution of electrical path 15.
For example, in the case of evaluating in atmosphere evaluation substrate 1, heating electrical path 15 is because existing sky
Gas and it is cooled from the outside in the face direction of base main body 2 (edge side of base main body 2) and temperature reduces.For such feelings
During condition, heating can also be reduced as shown in figure 13 with the sectional area of the outside left of electrical path 15 to increase caloric value the (the 7th
Embodiment).
In the above embodiment, heating energization is formd in a manner of the back side wave wire in base main body 2 is advanced
Path 15, however, the present invention is not limited thereto, as long as the shape integrally heated to base main body 2.For example, it is also possible to such as Figure 14
It is shown helically to form heating with electrical path 15 (the 8th embodiment).
In the above embodiment, respectively evaluation substrate 1 fixed respectively with horizontal direction parallel in laboratory 101, but this
Invention not limited to this, the setting position of each evaluation substrate 1 in laboratory 101 and posture are not particularly limited.For example, it is also possible to such as
Evaluation substrate 1 is set to be fixed as horizontal posture (the 9th embodiment) shown in Figure 15.At this time, evaluate substrate 1A (1) with a piece of
Evaluation substrate 1B (1) adjacent in the horizontal direction is arranged on the same line on main substrate 105.In addition, evaluation substrate 1A (1)
It is parallel with adjacent evaluation substrate 1C (1) in the up-down direction.In addition, an evaluation substrate 1, with main substrate 105 with one
The relation of another adjacent in the horizontal direction evaluation substrate 1 of a evaluation substrate 1, may not be and arrange on the same line
Relation.
In the above embodiment, each main substrate 105 fixed respectively with horizontal direction parallel in laboratory 101, but this
Invention not limited to this, the setting position of each main substrate 105 in laboratory 101 and posture are not particularly limited.For example, it is also possible to such as
Main substrate 105 is set to be fixed as horizontal posture (the 9th embodiment) shown in Figure 16.At this time, main substrate 105A (105) with upper and lower
Adjacent main substrate 105B (105) is parallel on direction.
In the above embodiment, using copper foil as conductive layer 16, however, the present invention is not limited thereto, can also use with temperature
Degree rises internal resistance increase, the conductive layer for the material that current density reduces.
In the above embodiment, Decompression Controlling is the scope of more than 1.3kPa below 10kPa in installation space 110, but this
Invention not limited to this, as long as below 50kPa.Such as can also always it be depressurized using vacuum pump 103.
In the above embodiment, temperature measurement unit 4 is arranged on the upper surface of insulating layer 6, however, the present invention is not limited thereto, only
The temperature of base main body 2 can be measured.I.e., it is possible to positioned at the arbitrary site of base main body 2, can also be in insulating layer 9
Lower surface set temperature determination unit 4.In addition, temperature measurement unit 4 can also be arranged at base main body 2.
In the above embodiment, sample electrical path 5 and heating electrical path 15, but the present invention are formed by etching
Not limited to this, can also by print process in base main body 2 applying conductive slurry, formed sample with electrical path 5 and/or
Electrical path 15 is used in heating.
In the above embodiment, it is depressurized in installation space 110 as below defined vacuum, after vacustat,
It is powered to heater 8 to heat the substrate main body 2, however, the present invention is not limited thereto, can also be powered heater 8 while decompression
To heat the substrate main body 2.
In the above embodiment, commenting for the sample 10 on evaluation substrate 1 is carried out in environment test device 100
Valency, however, the present invention is not limited thereto, can not also depressurize but carry out in an atmosphere.
In the above embodiment, multiple evaluation substrates 1 are set in the laboratory 101 of environment test device 100, are tried
The evaluation of sample 10, however, the present invention is not limited thereto, can also only be evaluated with 1 evaluation substrate 1.
In the above embodiment, multiple be provided with is set to evaluate substrate 1 in the laboratory 101 of environment test device 100
Main substrate 105, carry out sample 10 evaluation, however, the present invention is not limited thereto, can also only be evaluated with 1 main substrate 105.
Claims (8)
- It is 1. a kind of using for being powered to sample and sample being evaluated the evaluation substrate of sample at desirable temperature The experimental rig tested, it is characterised in that have：For setting the installation space of the evaluation substrate；Laboratory with the installation space；The decompressing unit depressurized to the installation space；Main substrate；WithThe main substrate being connected with external power supply is used and supplies electrical slot,The main substrate is arranged on the inner side in the laboratory with for electrical slot,The main substrate has edge connector and can connect multiple evaluation substrate slots of the evaluation substrate,The edge connector can engage with main substrate power supply slot, can be supplied by engaging with the main substrate Electrical slot is electrically connected, and the evaluation substrate is the substrate being connected with the evaluation substrate of the main substrate with slot, is had：Tool There is the base main body that planar extends；The mounting portion of the sample can be installed；It is described with the heater for heating the base main body Evaluate in substrate,The installation position in an interarea side of the base main body,The heater is distributed in planar in another interarea side of the base main body and is formed as with the base main body One,Install to the direction that the interarea of the evaluation substrate intersects towards the interarea with the main substrate,Using the decompressing unit by the installation space decompression be below 50kPa, evaluate the sample.
- 2. experimental rig as claimed in claim 1, it is characterised in that：The heater be by the narrow electrical path of the width compared with total length that conductive layer is formed,The electrical path is set to generate heat by being powered to the electrical path.
- 3. experimental rig as claimed in claim 1, it is characterised in that：The heater is the electrical path of the system that width is narrow compared with total length or multiple systems,The electrical path has multiple crooked routes,The electrical path is set to generate heat by being powered to the electrical path.
- 4. experimental rig as claimed in claim 1, it is characterised in that：The heater be the conductive layer being arranged in large area in the base main body is etched and is formed and total length The conductive path narrow compared to width.
- 5. experimental rig as claimed in claim 1, it is characterised in that：The evaluation substrate is printed base plate,The heater is the narrow live wire of the width compared with total length formed by printed wiring.
- 6. experimental rig as claimed in claim 1, it is characterised in that：With the heater power unit to the heating installation power supply,The experimental rig under a reduced pressure can be powered sample and sample is exposed at desirable temperature.
- 7. such as experimental rig according to any one of claims 1 to 6, it is characterised in that：In the end set heater power supply of the base main body,The heater power supply is connected with the heater,The heater power supply can engage with miscellaneous part,It is powered by engaging with miscellaneous part to the heater with power supply.
- A kind of 8. evaluation method of sample, it is characterised in that：The evaluation method of the sample is using following evaluation substrate and experimental rig, so that the interarea of multiple evaluation substrates The evaluation substrate is connected with the main substrate towards the mode in the direction intersected with the interarea of main substrate and carries out sample The method of evaluation, wherein,The evaluation substrate has：The base main body to extend with planar；The mounting portion of the sample can be installed；With heating institute The heater of base main body is stated, described to evaluate in substrate, the installation position is in an interarea side of the base main body, institute Heater is stated to be distributed in planar in another interarea side of the base main body and be formed as one with the base main body,The experimental rig has：For setting the installation space of the evaluation substrate；Laboratory with the installation space；The decompressing unit depressurized to the installation space；The main substrate；WithThe main substrate being connected with external power supply is used and supplies electrical slot,The main substrate is arranged on the inner side in the laboratory with for electrical slot,The main substrate changes with edge connector and can connect multiple evaluation substrate slots of the evaluation substrate,The edge connector can engage with main substrate power supply slot, can be supplied by engaging with the main substrate Electrical slot is electrically connected,In the evaluation method of the sample, it is powered under the decompression state of below 50kPa to sample and exposes multiple samples At desirable temperature, the temperature of multiple samples is evaluated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-109866 | 2013-05-24 | ||
| JP2013109866A JP5882944B2 (en) | 2013-05-24 | 2013-05-24 | Environmental test equipment, test specimen evaluation method, and test equipment |
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| Publication Number | Publication Date |
|---|---|
| CN104181095A CN104181095A (en) | 2014-12-03 |
| CN104181095B true CN104181095B (en) | 2018-05-15 |
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| CN201410221848.7A Active CN104181095B (en) | 2013-05-24 | 2014-05-23 | Evaluate the evaluation method of substrate, environment test device and sample |
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| Country | Link |
|---|---|
| JP (1) | JP5882944B2 (en) |
| KR (1) | KR101639588B1 (en) |
| CN (1) | CN104181095B (en) |
| TW (1) | TWI598576B (en) |
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| CN111771120B (en) * | 2018-02-22 | 2023-09-05 | 国立大学法人大阪大学 | Chip for evaluating substrate and substrate evaluating device |
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| JPH01316675A (en) * | 1988-03-15 | 1989-12-21 | Furukawa Electric Co Ltd:The | Laminate for testing electronic parts |
| US4978914A (en) * | 1988-03-15 | 1990-12-18 | Furukawa Denki Kogyo Kabushiki Kaisha | Laminated board for testing electronic components |
| JPH0244271A (en) * | 1988-08-04 | 1990-02-14 | Yamaichi Electric Mfg Co Ltd | Desk-top type box for electronic part heating test |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2014228463A (en) | 2014-12-08 |
| TWI598576B (en) | 2017-09-11 |
| TW201447264A (en) | 2014-12-16 |
| CN104181095A (en) | 2014-12-03 |
| KR101639588B1 (en) | 2016-07-14 |
| JP5882944B2 (en) | 2016-03-09 |
| KR20140138024A (en) | 2014-12-03 |
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