KR102605203B1 - Heating element using pcb type, and manufacturing method thereof - Google Patents

Abstract

A heating element structure using a printed circuit board (PCB) method is disclosed.
The heating element structure according to the present invention includes an insulating layer partially cut so that a preset area in the central area is opened in a predefined longitudinal direction; A conductive layer split and patterned on both sides on the insulating layer; A heating layer connected to the upper surface of one conductive layer and the other conductive layer of the conductive layer split and patterned on both sides; and power terminals respectively soldered to the one conductive layer and the other conductive layer so that an external power source is applied to the one conductive layer and the other conductive layer so that the heating layer emits heat energy, but on both sides. The split-patterned conductive layer may be patterned on both sides of the upper and lower sides of the insulating layer, and the heating layer may be soldered on both sides to the upper and lower sides of the split-patterned conductive layer.

Description

Heating element structure and manufacturing method using the printed circuit board method {HEATING ELEMENT USING PCB TYPE, AND MANUFACTURING METHOD THEREOF}

The present invention relates to a heating element structure, and particularly to a heating element structure and a heating element manufacturing method using a printed circuit board (PCB) method.

The heating element is mainly structured to increase the temperature by applying power to the heating wire built inside, and is used as a heating element for electric heaters, a heating element for detonation, etc. These heating elements are structurally large in size and have some limitations in heating efficiency.

Figure 5 shows the structure of a PCB-type heating element, which has been proposed to overcome the structural and functional limitations of existing heating elements.

The PCB type heating element is structured by forming a copper foil (12) as a conductive layer on the top of an insulating board (not shown) and then soldering a heating wire (14) for heat generation on top of the copper foil. . A power terminal 16 for supplying power from the outside is soldered to this copper thin film 12, and thus the heating wire 14 can generate a certain level of heat.

In FIG. 5 , the hot wire exposed to the opening of the hot wire 14 corresponds to the area actually touched by the detonator.

This PCB-type heating element can obtain heat energy by driving a heating element with limited power, but due to the nature of the heating element operating within a very short time (for example, several milliseconds), it is difficult to supply the desired heat energy to various types of heating elements. There is a limit.

In particular, in the case of a detonating heating element, the incidence of malfunction of the heating element may increase in a low-temperature environment that requires relatively large amounts of heat energy.

Republic of Korea Patent No. 10-1623337 (registration date May 17, 2016) Republic of Korea Patent No. 10-0577406 (registration date April 28, 2006)

In an embodiment of the present invention, it is intended to provide a heating element structure and a heating element manufacturing method using the PCB method that can increase thermal energy generation efficiency while maintaining the resistance component of the existing heating element.

In addition, in an embodiment of the present invention, it is intended to provide a heating element structure and a heating element manufacturing method using the PCB method that can increase the combustion and operation success rate of the detonating heating element by increasing the area touched by the detonator.

The problems to be solved by the present invention are not limited to those mentioned above, and other problems to be solved that are not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

According to an embodiment of the present invention, an insulating layer is partially cut so that a preset area in the central area is opened in a predefined longitudinal direction; A conductive layer split and patterned on both sides on the insulating layer; A heating layer connected to the upper surface of the conductive layer on one side and the other conductive layer of the conductive layer split and patterned on both sides - the conductive layer on one side and the conductive layer on the other side are arranged in parallel in the preset length direction while being spaced apart from each other by a preset distance. - ; and each power terminal soldered to one conductive layer and the other conductive layer to allow external power to be applied to one conductive layer and the other conductive layer, thereby allowing the heating layer to emit heat energy. A heating element structure using the PCB method is provided. can do.

Here, the heating layer may be soldered so as to be perpendicular to a preset longitudinal direction across the open area of the insulating layer on the upper surface of one conductive layer and the other conductive layer.

Additionally, the conductive layer split and patterned on both sides may be patterned on both sides on the top and bottom of the insulating layer, and the heating layer may be soldered on both sides to the top and bottom of the conductive layer split and patterned on both sides.

Additionally, each power terminal may allow power to be applied to the conductive layer patterned on both sides of the upper and lower sides of the insulating layer through a through hole.

According to an embodiment of the present invention, forming a first conductive layer and a second conductive layer on the top and bottom of the insulating layer, respectively; Split patterning of the first conductive layer and the second conductive layer, respectively - During the split patterning process of the first conductive layer and the second conductive layer, the preset area in the central area of the insulating layer is insulated so that it is opened in the preset length direction. Involves partial incision of the layer - ; Soldering a heating layer on the upper surfaces of one conductive layer and the other conductive layer of the split-patterned first conductive layer and the lower surfaces of the one conductive layer and the other conductive layer of the split-patterned second conductive layer, respectively; and soldering power terminals to one conductive layer and the other conductive layer of the first conductive layer, wherein the heating layer is formed on the upper surface of one conductive layer and the other conductive layer of the first conductive layer, and the second conductive layer. It is possible to provide a method of manufacturing a heating element using a PCB method in which soldering is performed perpendicular to a preset longitudinal direction across the open area of the insulating layer from the lower surface of one conductive layer and the other conductive layer.

Here, after the step of dividing patterning, the step of forming a through hole so that the power supplied through the power terminal is connected to the second conductive layer through the first conductive layer may be included.

According to an embodiment of the present invention, the resistance component of the existing heating element can be maintained while the efficiency of generating heat energy can be increased, and the degree of freedom regarding the direction of heat generation can be increased. In addition, according to an embodiment of the present invention, the success rate of combustion and operation of the detonating heating element can be increased by increasing the area touched by the detonator.

Figure 1 is a plan view of a heating element structure using the PCB method according to an embodiment of the present invention.
Figure 2 is a cross-sectional view taken along line AA' of the heating element structure using the PCB method of Figure 1.
Figure 3 is a cross-sectional view taken along line BB' of the heating element structure using the PCB method of Figure 1.
Figure 4 is a circuit conceptual diagram of a heating element structure using the PCB method according to an embodiment of the present invention.
Figure 5 is a plan view of a heating element structure using a typical PCB method.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various forms. The present embodiments are merely provided to ensure that the disclosure of the present invention is complete and to those skilled in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention, and the scope of the invention is only defined by the claims.

In describing the embodiments of the present invention, detailed descriptions of well-known functions or configurations will be omitted except when actually necessary. The terms described below are terms defined in consideration of functions in the embodiments of the present invention, and may vary depending on the intention or custom of the user or operator. Therefore, the definition should be made based on the contents throughout this specification.

In an embodiment of the present invention, conductive layers are patterned on the upper and lower surfaces of the PCB board so that the central area of the PCB board is opened in the longitudinal direction, and a heating layer (heat wire) is used to connect one side and the other side of the patterned conductive layer. By forming each on both sides of the PCB board, the resistance component of the existing heating element is maintained while increasing the efficiency of thermal energy generation, and the area touched by the detonator is increased to increase the success rate of combustion and operation of the detonating heating element.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a plan view of a heating element structure using the PCB method according to an embodiment of the present invention.

As shown in Figure 1, the heating element structure using the PCB method according to an embodiment of the present invention includes an insulating layer 100 that is partially cut so that a preset area in the central area is opened in a predefined longitudinal direction; A conductive layer (102a) split and patterned on both sides on the insulating layer (100); A heating layer (104a) connecting the upper surface of one conductive layer and the other conductive layer of the conductive layer split and patterned on both sides to each other; And each power terminal (106a, 106b) is soldered to one conductive layer and the other conductive layer to apply external power to one conductive layer and the other conductive layer to cause the heating layer (104a) to emit heat energy. You can.

The insulating layer 100 may be made of an insulating material such as epoxy resin or phenolic resin to form the core layer of the PCB board.

The conductive layer 102a may be formed on the insulating layer 100, and the conductive layer 102a may be made of, for example, a copper thin film.

This conductive layer 102a may be patterned to be divided into two sides on the insulating layer 100 through an etching process or the like. For example, as shown in FIG. 1, during the patterning process of the conductive layer 102a, the insulating layer 100 is partially cut so that a preset area in the central area of the insulating layer 100 is opened in a preset longitudinal direction. It can be accompanied by

As shown, one conductive side and the other conductive layer of the conductive layer 102a are arranged in parallel in the longitudinal direction while being spaced apart from each other at a predetermined distance.

The heating layer 104a may be connected to the upper surface of one conductive layer and the other conductive layer of the conductive layer 102a that is split and patterned on both sides. For example, the heating layer 104a may be soldered to the upper surfaces of the conductive layer patterned at the bottom and the conductive layer patterned at the top of FIG. 1 .

This heating layer 104a may include a heat ray that emits a certain level of heat energy, for example, in the case of a detonation heating element. The heating wire is driven with limited power for a very short period of time, and the amount of heat energy emitted may vary depending on the standard and type of the heating wire. The heating wire that can be applied to the embodiment of the present invention may be, for example, a heating wire with a wire diameter of 30㎛ and a length of 1.3 to 1.7mm.

The heating layer 104a according to an embodiment of the present invention may be formed on the upper surface of one conductive layer and the other conductive layer, across the open central area of the insulating layer 100, in a direction perpendicular to the preset longitudinal direction. there is. Substantially, the heat-generating portion of the heat-generating layer 104a that comes into contact with the initiator may be an open area of the insulating layer 100.

The power terminals 106a and 106b may be soldered to the upper surfaces of one conductive layer and the other conductive layer of the conductive layer 102a, respectively. Therefore, when external power is supplied through the power terminals 106a and 106b, the external power is applied to one conductive layer and the other conductive layer, respectively, so that the heating layer 104a can emit heat energy.

Figure 2 is a cross-sectional view taken along line A-A' of the heating element structure using the PCB method of Figure 1.

As shown in FIG. 2, the heating element structure using the PCB method according to an embodiment of the present invention has the upper surface of the insulating layer 100 partially cut so that a preset area in the central area is opened in a predefined longitudinal direction. A first conductive layer (102a) patterned to be split on both sides; a second conductive layer (102b) patterned in segments on both sides of the lower surface of the insulating layer (100); A first heating layer (104a) soldered so as to be perpendicular to the open central area of the insulating layer (100) on the upper surface of the first conductive layer (102a); And it may include a second heating layer (104b) soldered so as to be perpendicular to the open central area of the insulating layer (100) on the lower surface of the second conductive layer (102b).

Substantially, the heat-generating part of the heat-generating layer 104a and the heat-generating part of the heat-generating layer 104b that come into contact with the initiator are the opening areas of the insulating layer 1 of a predetermined length. That is, as shown in FIG. 2, the heat wire exposed to the opening area in the heating layers 104a and 104b, referred to as the heat wire, substantially radiates heat and corresponds to the area in contact with the detonator.

Figure 3 is a B-B' cross-sectional view of the heating element structure using the PCB method of Figure 1.

As shown in FIG. 3, the heating element structure using the PCB method according to an embodiment of the present invention has the upper surface of the insulating layer 100 partially cut so that a preset area in the central area is opened in a predefined longitudinal direction. A first conductive layer (102a) patterned on; a second conductive layer (102b) patterned on the lower surface of the insulating layer (100); A first heating layer (104a) soldered so as to be perpendicular to the open central area of the insulating layer (100) on the upper surface of the first conductive layer (102a); a second heating layer (104b) soldered so as to be perpendicular to the open central area of the insulating layer (100) on the lower surface of the second conductive layer (102b); And it may include power terminals 106a and 106b soldered to the first conductive layer 102a so that an external power source is applied to the first conductive layer 102a so that the first heating layer 104a emits heat energy. there is.

At this time, in the embodiment of the present invention, after patterning the first conductive layer 102a and the second conductive layer 102b, the second conductive layer ( It may further include a through hole (not shown) formed up to 102b). External power supplied from the power terminals 106a and 106b is applied to the second conductive layer 102b through these through holes, thereby enabling the second heating layer 104b to emit heat energy.

Meanwhile, the method of manufacturing a heating element using the PCB method according to an embodiment of the present invention includes forming a first conductive layer (102a) and a second conductive layer (102b) on the upper and lower parts of the insulating layer 100, respectively; Split patterning of the first conductive layer 102a and the second conductive layer 102b - During the split patterning process of the first conductive layer 102a and the second conductive layer 102b, the insulating layer 100 - Involves partial cutting of the insulating layer 100 so that a preset area in the central area is opened in a preset length direction; Soldering the first heating layer (104a) on the upper surface of one conductive layer and the other conductive layer of the split patterned first conductive layer (102a); Soldering a second heating layer (104b) on the lower surfaces of one conductive layer and the other conductive layer of the split patterned second conductive layer (102b); And soldering each power terminal (106a, 106b) to each of one conductive layer and the other conductive layer of the first conductive layer (102a), wherein the first heat generating layer (104a) is connected to the first conductive layer (102a). ) may be soldered so as to be perpendicular to the open central area of the insulating layer 100 on the upper surfaces of one conductive layer and the other conductive layer, and the second heating layer 104b may be conductive on one side of the second conductive layer 102b. The top surface of the layer and the other conductive layer is soldered so as to be perpendicular to the open central area of the insulating layer 100.

At this time, after the step of dividing patterning, it may include forming a through hole so that the power supplied through the power terminals 106a and 106b is connected to the second conductive layer 102b through the first conductive layer 102a. You can.

Figure 4 is a circuit conceptual diagram of a heating element structure using the PCB method according to an embodiment of the present invention.

When a hot wire (heating layer) is connected to a copper thin film (conductive layer) made of a PCB substrate, the resistance R of the hot wire can be exemplified as follows [Equation 1].

Here, ρ is the specific resistance value of the heating wire, L represents the length of the heating wire, and A represents the cross-sectional area of the heating wire.

In the case of a heating element structure using the PCB method manufactured according to an embodiment of the present invention, each heating wire is connected to a copper thin film made of a double-sided PCB board, so the length of the heating wire may be 2 L and the resistance may be 2 R.

At this time, since the two hot wires are respectively soldered to the copper thin film on the upper and lower surfaces of the double-sided PCB board, in terms of circuit concept, the two hot wires can have the same effect as the parallel connection structure. Therefore, the heating element structure and manufacturing method according to an embodiment of the present invention can secure more than twice the heating area while maintaining the same resistance component as that of the existing PCB-type heating element.

According to an embodiment of the present invention, the first heating layer 104a is connected in a vertical direction to the upper surface of the first conductive layer 102a split and patterned on both sides, and the second conductive layer 102b is split patterned on both sides. ) By connecting the second heating layer (104b) in a direction perpendicular to the lower surface of the heating element, the area in contact with the heating part of the heating element and the actual detonator can be expanded and the degree of freedom regarding the direction of heat generation can be increased. Conventionally, as shown in FIG. 5, the hot wire 14 is soldered to the upper conductive layer and the lower conductive layer copper thin film 12 to form a single hot wire 14, so the hot wire exposed from the terminal insulating layer of the PCB board The area in contact with the detonator was limited or the direction in which heat energy was emitted was limited to one direction. Therefore, according to an embodiment of the present invention, it is possible to implement a heating element structure that can increase the combustion and operation success rate of the detonating heating element by increasing the area of the heating area that the detonator touches.

100: insulation layer
102a, 102b: conductive layer
104a, 104b: Heating layer (heating wire)
106a, 106b: power terminal

Claims (5)

an insulating layer that is partially cut so that a preset area in the central area is opened in a predefined longitudinal direction;
A conductive layer split and patterned on both sides on the insulating layer;
A heating layer connected to the upper surface of one conductive layer and the other conductive layer of the conductive layer split and patterned on both sides - the one conductive layer and the other conductive layer are spaced apart from each other by a preset distance and parallel in the preset length direction. arranged - ; and
Each power terminal is soldered to the one conductive layer and the other conductive layer to allow external power to be applied to the one conductive layer and the other conductive layer so that the heating layer emits heat energy,
The conductive layer, which is split and patterned on both sides, is patterned on both sides, respectively, on the upper and lower sides of the insulating layer,
The heating layer is soldered on both sides to the upper and lower parts of the conductive layer that is patterned on both sides, respectively.
The heating layer is soldered so as to be perpendicular to the preset longitudinal direction across the open central area of the insulating layer from the upper surfaces of the one conductive layer and the other conductive layer.
Heating element structure for detonator using printed circuit board method.
delete According to claim 1,
Each of the power terminals allows power to be applied to the conductive layer patterned on both sides of the upper and lower sides of the insulating layer through a through hole.
Heating element structure for detonator using printed circuit board method.
Forming a first conductive layer and a second conductive layer on the top and bottom of the insulating layer, respectively;
Split patterning of the first conductive layer and the second conductive layer, respectively - Split patterning of the first conductive layer and the second conductive layer insulates the insulating layer so that a preset area in the central area is opened in a preset length direction. Involves partial incision of the layer - ;
soldering a heating layer to the upper surfaces of the split-patterned conductive layer on one side and the other conductive layer of the first conductive layer and the lower surfaces of the conductive layer on one side and the other conductive layer of the split-patterned second conductive layer, respectively; and
A step of soldering power terminals to one conductive layer and the other conductive layer of the first conductive layer, respectively,
The heating layer extends over the open area of the insulating layer on the upper surface of one conductive layer and the other conductive layer of the first conductive layer and the lower surface of the one conductive layer and the other conductive layer of the second conductive layer. Soldered perpendicular to the preset length direction
Method of manufacturing a heating element for a detonator using a printed circuit board method.
According to claim 4,
After the division patterning step,
Comprising the step of forming a through hole so that the power supplied through the power terminal is connected to the second conductive layer through the first conductive layer.
Method of manufacturing a heating element for a detonator using a printed circuit board method.

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