JPH0244271A - Desk-top type box for electronic part heating test - Google Patents

Desk-top type box for electronic part heating test

Info

Publication number
JPH0244271A
JPH0244271A JP63195412A JP19541288A JPH0244271A JP H0244271 A JPH0244271 A JP H0244271A JP 63195412 A JP63195412 A JP 63195412A JP 19541288 A JP19541288 A JP 19541288A JP H0244271 A JPH0244271 A JP H0244271A
Authority
JP
Japan
Prior art keywords
box
test
heating
electronic component
test board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63195412A
Other languages
Japanese (ja)
Other versions
JPH0627781B2 (en
Inventor
Kiyoshi Umemura
梅村 喜芳
Haruhiko Iwase
晴彦 岩瀬
Kenjiro Ogawa
小川 健次郎
Mitsuru Akimoto
秋元 満
Munemasa Jinbo
神保 宗正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Yamaichi Electronics Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Yamaichi Electronics Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP63195412A priority Critical patent/JPH0627781B2/en
Priority to MYPI89000314A priority patent/MY103847A/en
Priority to KR1019890003199A priority patent/KR890015025A/en
Priority to EP19890104587 priority patent/EP0333160A3/en
Publication of JPH0244271A publication Critical patent/JPH0244271A/en
Priority to US07/517,433 priority patent/US4978914A/en
Publication of JPH0627781B2 publication Critical patent/JPH0627781B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

PURPOSE:To obtain a portable box for an electronic part heating test by mounting a substrate support means, a substrate heating means, a signal connector and a power supply connector in a box having a lid, a standoff and a handle. CONSTITUTION:A standoff 25 and a handle 5 are provided to a box 1 and a substrate 30 to be tested is horizontally supported in the hermetically closed space closed by a lid 2 in a detachable manner through a guide track 6. The substrate to be tested loaded with electronic parts is heated from the under surface thereof by a heater plate 49. Power is supplied from a power supply through a connector 8 and a switch 14 to heat the substrate 30 to be tested and a signal is inputted/outputted to said substrate 30 through a connector 11. After the hermetically closed space is rapidly raised in temp., the lid is opened to measure the electronic parts in an opening part 50. By this constitution, a portable box for an electronic part heating test handy to carry is obtained.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はrc等の電子部品の加熱試験に用いる小型軽便
化された卓上型電子部品加熱試験用ボックスに関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a small and convenient tabletop electronic component heating test box used for heating tests of electronic components such as RC.

従来技術 ICの工場出荷前の性能試験の一つとしてrcを密閉さ
れた所定の熱雰囲気内に置き所定時間経通後信号を入出
力して性能を測定し製品の良否を判別するバーンイン試
験が行なわれている。
As one of the performance tests of conventional ICs before they are shipped from the factory, a burn-in test is carried out in which the RC is placed in a sealed heat atmosphere for a predetermined period of time, and then signals are input and output to measure the performance and determine whether the product is good or bad. It is being done.

このバーンイン試験は全量チエツクが原則とされており
、このためICメーカーでは一時に数千のICをバーン
イン試験できる大型で高重量の恒温槽を設備している。
As a general rule, this burn-in test is a complete check, and for this reason, IC manufacturers are equipped with large and heavy constant temperature chambers that can perform burn-in tests on thousands of ICs at once.

この恒温槽は電源や制御装置等の付属設備を含め可成り
大川りで非常に高価な装置であり、大容量であるため稼
動を停止すると立上りに時間がかかるため、常時稼動状
態に置いて槽内の温度を一定に保っている。
This thermostatic chamber is a very expensive device that requires a large amount of equipment, including the power supply, control device, and other attached equipment, and due to its large capacity, it takes time to start up when the operation is stopped, so it is necessary to leave the chamber in constant operation. It keeps the internal temperature constant.

他方、ICの供給動向からみると、従来は定格のICを
多量に生産しユーザはこれを組合せて使用する多品種多
量化傾向が主流となっていたが、近年は従来の多数の汎
用rcの機能を備えた特定ユーザ向けIC1例えばゲー
トアレー■C、カスタムIC等と呼称されるASICを
中心とした多品種少量化の傾向に移行しつつある。
On the other hand, looking at IC supply trends, the mainstream trend has traditionally been to produce a large number of rated ICs and to have users use them in combination. There is a trend toward high-mix, low-volume ICs with functions for specific users, such as ASICs called gate array ICs, custom ICs, and the like.

発明が解決しようとする問題点 而して前記ICメーカ設備の恒温槽では一時に数千のI
Cをバーンイン試験する場合には適当であったが、上記
の如arc供給動向の変化があり、一種類では限られた
数量となる、例えば数個から数拾個のICのバーンイン
試験のために上記数千のIC試験能力を有する大容量の
恒温槽を占有せねばならないのでは、又これを常時稼動
状態にぼくのではロスが大きく経済性に欠け、又数量か
らくる槽内温度管理が難しく安定な測定が行ない難い技
術上の問題点も生ずる。
The problem that the invention seeks to solve is that the temperature controlled ovens in the IC manufacturer's equipment handle thousands of ICs at once.
It was suitable for burn-in testing of ICs, but due to the changes in ARC supply trends as mentioned above, the quantity of one type is limited, for example, for burn-in testing of several to several tens of ICs. It would be necessary to occupy a large-capacity thermostatic chamber that can test thousands of ICs, and if it were to be kept in constant operation, there would be large losses and it would be uneconomical, and it would be difficult to control the temperature inside the chamber due to the quantity. There are also technical problems that make it difficult to perform stable measurements.

又特定ユーザ向けASICの開発に当ってはICの開発
部門においても生産ラインにのせる前の実験室段階での
試験を必1としている。又最近ではrcの信頼性確保の
目的からOA機器メーカーの殆どが購入後再度バーンイ
ン試験を随時持なっている実状にある。
Furthermore, when developing an ASIC for a specific user, the IC development department also requires testing at the laboratory stage before putting it on the production line. Furthermore, in order to ensure the reliability of RCs, most OA equipment manufacturers recently conduct burn-in tests again after purchase.

上記の背景から少量のrcを効率良く軽便に加熱試験し
たい要望があり、本発明はこれらの要望に応える小型軽
便なる機動性に富む卓上型電子部品加熱試験用ボックス
を提供するものである。尚現在ICのバーンイン試験用
としては前記恒温4Nのみであり、上記要望を満たす可
搬形加PA試験装置は皆無である。
From the above background, there is a desire to efficiently and easily heat test a small amount of RC, and the present invention provides a small, convenient, and highly mobile tabletop electronic component heating test box that meets these demands. Currently, only the constant temperature 4N is available for IC burn-in testing, and there is no portable PA testing device that meets the above requirements.

問題点を解決するための手段 本発明は上記の如く在来の恒温槽では不適切な限られた
数量の、IC等の電子部品の加熱試験に通した卓上型電
子部品加熱試験用ボックスに係るもので、方形の可搬形
密閉ボックスを本体とする。該可搬形密閉ボックスには
該ボックスの密閉空間内に電子部品試験用基板を着脱可
に横架する基板支持手段と、同密閉空間内で該試験用基
板を加熱する加熱プレートの如き加熱手段とを具備させ
ると共に、上記電子部品試験用基板に搭載された電子部
品の測定を外部より行なえるように配したコネクタ手段
に加えて、上記加熱手段を外部から商用電源に接続する
ように配したコネクタ手段を夫々ボックス外壁に具備さ
せ、更に上記可搬形密閉ボックスの密閉空間を形成する
パネルにて該i!!l−閉空間内に設置された電子部品
試験用基板の電子部品搭載面を開放状態にする蓋体を形
成し、該蓋体の開蓋にて形成された測定作業用開口を介
し電子部品の測定が行なえるように構成し、更に上記蓋
体と対向するパネルにその外面より突出するスタンドオ
フを具備させ、該スタンドオフにて上記可搬形密閉ボッ
クスを床高に支え加熱及び測定作業時上記電子部品試験
用基板が水平に安定に静置され、且つその上面側におい
て上記蓋体の開閉が行なえるようにし、該可搬形密閉ボ
ックスの適所に把手を設けて試験作業場所へ随時持ち運
びし加熱試験が行なえるように構成したものである。
Means for Solving the Problems As mentioned above, the present invention relates to a table-top electronic component heating test box that is used for heating tests on a limited number of electronic components such as ICs, which are inappropriate for conventional constant temperature ovens. The main body is a rectangular portable sealed box. The portable sealed box includes board support means for removably horizontally suspending an electronic component testing board in the sealed space of the box, and heating means such as a heating plate for heating the testing board in the sealed space. In addition to a connector means arranged so that the electronic components mounted on the electronic component testing board can be measured from the outside, a connector arranged so as to connect the heating means from the outside to a commercial power source. The i! ! l- Forming a lid that opens the electronic component mounting surface of the electronic component test board installed in a closed space, and testing the electronic components through the opening for measurement work formed by opening the lid. The panel facing the lid is provided with standoffs protruding from its outer surface, and the standoffs support the portable sealed box at floor level during heating and measurement operations. The board for electronic component testing is placed horizontally and stably, and the lid can be opened and closed on the top side of the board, and a handle is provided at an appropriate location on the portable sealed box to carry it to the test work site at any time and heat it. It is configured to allow testing.

作用 上記卓上形電子部品加熱試験用ボックスは把手を以って
試験作業場所へ自由に移動し、例えば上記ボックスをス
タンドオフによって机上に設置し試験作業を行なう、机
上等に設置した時、試験用基板はスタンドオフによって
水平状態に静置され、加熱試験に通した状態に置かれ、
商用電源接続用コネクタ手段に商用電源を接続すること
によフて加熱手段に通電され限られた容積の密閉空間内
を速やかに昇温する。上記試験用基板がボックスの′I
ErA空間内に水平状態に置かれ加熱試験に供されてい
る時、試験用基板と対面する如く設けられた蓋体は同ボ
ックスの上面側に置かれ、上記加熱状態において直ちに
蓋体を開き試験用基板の電子部品搭載面を・開放し、電
子部品の測定、チエツクが行なわれる。即ち、蓋体を開
蓋することによってスタンドオフによって設置されたボ
ックスの上面側に測定作業用開口が形成され、該開口に
よって電子部品搭載面の上方空間を開放状態にし上方よ
り電子部品の測定を行なう。
Function The above-mentioned tabletop type electronic component heating test box can be moved freely to the test work place using the handle. The board is placed in a horizontal position with standoffs and placed through a heating test.
By connecting a commercial power supply to the commercial power supply connector means, the heating means is energized and the temperature within the limited volume of the closed space is rapidly raised. The above test board is the box'I
When the box is placed horizontally in the ErA space and subjected to a heating test, the lid, which is provided so as to face the test board, is placed on the top side of the box, and in the heating state, the lid is immediately opened to perform the test. The electronic component mounting surface of the board is opened and the electronic components are measured and checked. That is, by opening the lid, an opening for measurement is formed on the top side of the box installed by the standoff, and the opening allows the space above the electronic component mounting surface to be opened, allowing measurement of electronic components from above. Let's do it.

又上記測定作業用開口を介して上方より測定済電子部品
の着脱を行ない、同様にこれから測定せんとする電子部
品も上記測定作業用開口を通して試験用基板に搭載され
る。該試験用基板には電子部品用ソケットが設置されて
該基板表面に形成された試験用回路と接続しており、電
子部品は該ソケットを介して試験用回路に接続される。
Also, the measured electronic components are mounted and removed from above through the measurement operation opening, and electronic components to be measured from now on are similarly mounted on the test board through the measurement operation opening. An electronic component socket is installed on the test board and connected to a test circuit formed on the surface of the board, and the electronic component is connected to the test circuit via the socket.

本試験用ボックスは把手を持って作業場所へ自由に移動
し、ボックスに設けられたコネクタに身近にある商用電
源を接続することによって直ちに上記試験作業が行なえ
、商用電源を有する場所であれば実験室や開発室、事務
室等、場所に制約を受けることなく上記試験が行なえる
The test box can be moved freely to the work place by the handle, and the above test work can be performed immediately by connecting a nearby commercial power source to the connector provided on the box. The above tests can be conducted without being restricted by location, such as in a laboratory, development room, or office.

本試験用ボックスは限られた容積の密閉空間内で限られ
た数量の電子部品の測定試験を行なうものであるから、
上記コネクタを介して商用電源を接続することによって
短時間で上記密閉空間内を効率良く所要温度まで高める
ことができ、又不使用時には電源を切って1iIOロス
を防ぐことができる。
This test box is designed to measure and test a limited number of electronic components in a closed space with a limited volume.
By connecting a commercial power source through the connector, the inside of the sealed space can be efficiently raised to the required temperature in a short time, and when not in use, the power can be turned off to prevent 1iIO loss.

上記の通り木μ験用ボックスは前記したASrCの如き
限られた少量の電子部品の加熱試験に好適に用いられ、
身近に置いて必要な時には何時でも商用電源を使用して
直ちに上記加熱試験が行なえ、軽便且つ機動性に冨む試
験用ボックスを提供できる。
As mentioned above, the wooden μ test box is suitably used for heating tests of limited quantities of electronic components such as the ASrC mentioned above.
It is possible to provide a test box that is convenient and highly maneuverable because it can be placed nearby and the heating test can be performed immediately using a commercial power supply whenever necessary.

実施例 以下本発明の実施例を第1図乃至第13図に示した実施
例に基き詳述する。
EXAMPLES Hereinafter, examples of the present invention will be described in detail based on the examples shown in FIGS. 1 to 13.

本卓上型電子部品加熱試験用ボックスは小型で移動可能
な少量の電子部品の加熱試験を目的とするもので、第1
図、第2図に示す如き方形の可搬形密閉ボックス1を本
体とする。
This tabletop electronic component heating test box is designed for the purpose of heating tests on small, movable, small quantities of electronic components.
The main body is a rectangular portable sealed box 1 as shown in FIGS.

該可搬形密閉ボックス1は該ボックス1の密閉空間内に
着脱可に横架支持される試験用基板30を備え、該試験
用基板30の電子部品搭載面と対向する巾広なパネル(
以下前面パネルと称する)にて形成された測定作業用開
口50を形成するための蓋体2を有し、該蓋体2と対向
する巾広な背面パネルに可搬形密閉ボックス1を床高に
支えるスタンドオフ25を備える。このスタンドオフ2
5は好ましくは電気絶縁材で且つ断熱材で形成する。
The portable sealed box 1 includes a test board 30 that is removably supported horizontally within the sealed space of the box 1, and has a wide panel (
It has a lid body 2 for forming a measurement work opening 50 formed in the front panel (hereinafter referred to as a front panel), and a portable sealed box 1 is mounted at floor height on a wide back panel facing the lid body 2. A supporting standoff 25 is provided. this standoff 2
5 is preferably made of an electrically insulating material and a heat insulating material.

上記蓋体2には開閉作業を至便に行なうためのつまみ又
は取手類の把持手段27を設ける。
The lid body 2 is provided with gripping means 27 such as a knob or handle for convenient opening and closing operations.

上記の如く試験用基板30は蓋体2と対面する如く設置
され、上記スタンドオフ25によってボックス1を机上
等に設置し加熱試験に供され、机上に設置した時、上記
試験用基板30及び蓋体2は水平状態に置かれ、該試験
用基板30の上面、即ち電子部品搭載面に対向して上記
蓋体2が配置され、この蓋体2の開蓋によって上記電子
部品搭載面の上部空間を開放状態とし、測定作業用開口
50を形成する。
As described above, the test board 30 is installed so as to face the lid 2, and the box 1 is placed on a desk or the like using the standoffs 25 and subjected to a heating test. The body 2 is placed in a horizontal state, and the lid 2 is placed opposite the upper surface of the test board 30, that is, the electronic component mounting surface, and when the lid 2 is opened, the space above the electronic component mounting surface is opened. is opened and an opening 50 for measurement work is formed.

上記ボックス1の適所、好ましくは上記前面パネルと隣
接する巾狭な側面パネルに取手やベルト等の把手5を具
備させ、該把手5を持ち上記ボックス1を随時試験場所
へ持ち運びできるようにし、又該把手5を設けたパネル
と対向する巾狭な側面パネルには別のスタンドオフ26
を設け、ボックス1を把手5によって持ち運びし上記ス
タンドオフ26にて試験時以外の設置を行なうようにす
る。
A handle 5 such as a handle or a belt is provided at a suitable location on the box 1, preferably on a narrow side panel adjacent to the front panel, so that the box 1 can be carried to the test site at any time by holding the handle 5; Another standoff 26 is provided on the narrow side panel facing the panel provided with the handle 5.
The box 1 is carried by the handle 5 and installed using the standoff 26 at times other than testing.

上記可搬形密閉ボックス1は蓋体2を形成する前面パネ
ル側において電子部品45を搭載する試験用基板30の
外形と略凹等の大きさを有し、側面パネル側において比
較的肉薄である。
The portable sealed box 1 has a size approximately concave to the outer shape of the test board 30 on which the electronic component 45 is mounted on the front panel side forming the lid body 2, and is relatively thin on the side panel side.

上記益体2によって閉塞されたボックス1内の密閉空間
内に、該試験用基板30を着脱可に横架する基板支持手
段及び該試験用基板30を加熱する加熱手段を備える。
In the sealed space in the box 1 closed by the above-mentioned benefit body 2, there are provided a substrate support means for removably horizontally suspending the test substrate 30, and a heating means for heating the test substrate 30.

上記基板支持手段は一例として第3図に示す如き一対の
案内軌道6によって形成される。該案内軌道6は密閉ボ
ックス1の試験用基板30の厚みと対向する一対の側面
パネルの内面に沿い平行に延在され、試験用基板30は
該軌道6の案内により該軌i!6の一端からボックス1
内へと挿入され、第4図に示すように該軌道6に試験用
基板30の縁部を係合させてボックスi内に横架状態に
支持する。
The substrate supporting means is formed, for example, by a pair of guide tracks 6 as shown in FIG. The guide track 6 extends in parallel along the inner surfaces of the pair of side panels facing the thickness of the test board 30 of the sealed box 1, and the test board 30 is guided by the track 6 to the track i! Box 1 from one end of 6
As shown in FIG. 4, the edge of the test board 30 is engaged with the track 6, and is supported horizontally within the box i.

上記試験用基板30をボックス1内に挿入する一手段と
して上記案内軌道6の一端側の側面パネルにてゲート板
3を形成する。該ゲート板3は上記蓋体2を形成する前
面パネル側へ抜き差し可にし、該抜き差しを行なうため
、上記案内軌道6が設けられた各側面パネルの一端に上
記案内軌道6の延在方向に対し直角方向に延在する案内
溝43を対向して配置する。該案内溝43の入口は上記
蓋体2によって閉ざされ、蓋体2を開くことによって開
口され試験用基板30の抜き差しを可能とする。上記案
内軌道6の一端には上記案内溝43の延在領域に位置し
て試験用基板30の挿入口4を形成し、第3図に示すよ
うに蓋体2を開き、上記ゲート板3を案内溝43より抜
去することにより上記基板挿入口4及びボックス1の一
側面を開放状態にして上記試験用基板30の案内軌道6
への抜き差しを可能とし、又第1図に示すようにゲート
板3を案内溝43に差し込むことにより上記基板挿入口
4を閉鎖状態とし、ボックス内気体の流出入を防止する
As a means of inserting the test board 30 into the box 1, a gate plate 3 is formed from a side panel on one end side of the guide track 6. The gate plate 3 can be inserted into and removed from the front panel side forming the lid body 2, and in order to perform the insertion and removal, a hole is provided at one end of each side panel on which the guide track 6 is provided in the direction in which the guide track 6 extends. Guide grooves 43 extending in a right angle direction are arranged to face each other. The entrance of the guide groove 43 is closed by the lid 2, and opened by opening the lid 2, allowing the test board 30 to be inserted and removed. An insertion opening 4 for the test board 30 is formed at one end of the guide track 6 in an area in which the guide groove 43 extends, and as shown in FIG. By removing it from the guide groove 43, the board insertion opening 4 and one side of the box 1 are opened, and the guide track 6 of the test board 30 is opened.
In addition, by inserting the gate plate 3 into the guide groove 43 as shown in FIG. 1, the board insertion opening 4 is closed, thereby preventing gas from flowing in and out of the box.

又第2図、第3図に示すように、上記ゲート板3と対向
する側面パネルには上記案内軌1Ji6の基板挿入口4
と反対側の端部に位置してコネクタ手段11を設け、該
コネクタ手段11を介して上記試験用基板30の表面に
密着形成された信号回路パターン34に信号を入出力す
る。該コネクタ手段11はボックス1の内面に開口する
該試験用基板30の挿入スロット12を有し、ボックス
1の外面側に露出して信号を人出力するコンタクト13
を有する。上記試験用基板30を上記の如く案内軌11
i6に挿入すると、その挿入終端において基板の端部に
延設した接続板部42が上記基板挿入スロット12内に
差込まれ、接続板部42表面に密着して配列した回路端
子41が上記コンタクト13と上記スロット12内にお
いて接続する。
Further, as shown in FIGS. 2 and 3, a board insertion opening 4 for the guide track 1Ji6 is provided on the side panel facing the gate plate 3.
Connector means 11 is provided at the opposite end of the test board 30, and signals are input and output through the connector means 11 to the signal circuit pattern 34 formed in close contact with the surface of the test board 30. The connector means 11 has an insertion slot 12 for the test board 30 that opens on the inner surface of the box 1, and contacts 13 that are exposed on the outer surface of the box 1 and output signals.
has. The test board 30 is placed on the guide track 11 as described above.
i6, the connection plate portion 42 extending from the end of the board is inserted into the board insertion slot 12 at the insertion end, and the circuit terminals 41 arranged in close contact with the surface of the connection plate portion 42 are connected to the contacts. 13 in the slot 12.

40は該試験用基板30の上面に搭載されたソケットで
あり、該ソケット40はハンダ等を介して上記回路パタ
ーン34と接続されており、IC等の電子部品45を上
記ソケット40に接続し、該ソケット40を介し回路パ
ターン34及び上記信号入出力用コネクタ11と接続す
る。上記支持手段に横架された試験用基板30の電子部
品tミ載面は上記着体2と対面し、該蓋体2を開くこと
により同搭載面全面を上方に開放状態にし測定作業用開
口50を形成する。
40 is a socket mounted on the upper surface of the test board 30, the socket 40 is connected to the circuit pattern 34 through solder or the like, and an electronic component 45 such as an IC is connected to the socket 40; It is connected to the circuit pattern 34 and the signal input/output connector 11 through the socket 40. The electronic component mounting surface of the test board 30 suspended horizontally on the support means faces the mounted body 2, and by opening the lid 2, the entire surface of the mounting surface is opened upward and opened for measurement work. form 50.

又前記加熱手段は上記蓋体2によって閉塞されたボック
ス1内の密閉空間及び該密閉空間内の試験用基板30.
該基板30にソケット40を介して搭載されたrc等の
電子部品45を加熱する。
Further, the heating means is applied to the sealed space inside the box 1 closed by the lid 2 and the test substrate 30 within the sealed space.
An electronic component 45 such as an RC mounted on the board 30 via a socket 40 is heated.

第3図、第4図及び第6図は上記加熱手段の一例として
上記試験用基板30自身が加熱プレートとしても機能す
るようにした場合を示している。
FIGS. 3, 4, and 6 show an example of the heating means in which the test substrate 30 itself also functions as a heating plate.

該加熱プレートを兼ねる試験用基板30は第11図に示
すように、熱伝導性の良好なアルミニウム等の金属板3
1の表面に絶縁層37を介して表裏に信号回路パターン
34を有する配線基板32を層着し、金属板31の裏面
に絶縁F133を介してヒータ回路パターン35を有す
る。該ヒータ回路パターン35を保護層38で覆い、該
保護層38を前記接続板部42において除去し、上記ヒ
ータ回路パターン35の端子36を露出状態に配置し、
該端子36に商用電源を接続する構成とする。
As shown in FIG. 11, the test substrate 30 which also serves as the heating plate is a metal plate 3 made of aluminum or the like having good thermal conductivity.
A wiring board 32 having a signal circuit pattern 34 on both sides is layered on the front surface of the metal plate 31 via an insulating layer 37, and a heater circuit pattern 35 is provided on the back surface of the metal plate 31 via an insulating layer F133. covering the heater circuit pattern 35 with a protective layer 38, removing the protective layer 38 at the connection plate portion 42, and arranging the terminals 36 of the heater circuit pattern 35 in an exposed state;
The terminal 36 is configured to be connected to a commercial power source.

第12図は上記ヒータプレートを兼ねる試験用基板30
の他側を示している。該試験用基板30はセラミック等
で代表される良好な熱伝導性を有する絶縁板39の表面
に信号用回路パターン34を層着し、同裏面にヒータ回
路パターン35を層着している。
FIG. 12 shows a test board 30 that also serves as the heater plate.
shows the other side. The test board 30 has a signal circuit pattern 34 layered on the front surface of an insulating plate 39 having good thermal conductivity, typically made of ceramic or the like, and a heater circuit pattern 35 layered on the back surface thereof.

第11図、第12図の試験用基板30は何れも一面に信
号用回路パターン34を、他面にヒータ回路パターン3
5を夫々有し、ヒータ回路パターン35によって高熱伝
導性金属板31又は高熱伝導性絶縁板39を加熱し、該
金属板31又は絶縁板39によって均一に拡散され、そ
の表面に層着された信号用回路パターン34を均一に加
熱すると共に、該回路パターン34に接続されたソケッ
1−40及び電子部品45を均一に加熱する。
Each of the test boards 30 in FIGS. 11 and 12 has a signal circuit pattern 34 on one side and a heater circuit pattern 3 on the other side.
5, the high thermal conductive metal plate 31 or the high thermal conductive insulating plate 39 is heated by the heater circuit pattern 35, and the signal is uniformly diffused by the metal plate 31 or the insulating plate 39 and layered on the surface thereof. The circuit pattern 34 is uniformly heated, and the sockets 1-40 and electronic components 45 connected to the circuit pattern 34 are uniformly heated.

同時に該試験用基板30が占有する可搬形密閉ボックス
1の密閉空間内を均一に加熱する。該密閉空間内の温度
を検知するため、ボックス1の適所に温度センサー10
用のコネクタ9を設け、温度センサー10をボックス内
に置く。
At the same time, the inside of the sealed space of the portable sealed box 1 occupied by the test board 30 is heated uniformly. A temperature sensor 10 is installed at a suitable location in the box 1 to detect the temperature inside the closed space.
The temperature sensor 10 is placed inside the box.

父上記加熱手段の他側として、第10図に示すように、
試験用基板30とは別に、加熱専用のヒータ回路パター
ン35を有するヒータプレート49を形成し、該ヒータ
プレート49を上記ボックスl内に内装し、上記試験用
基板3oに該基板30と平行となるように配置する。上
記ヒータ回路パターン35は第13図に示すように両端
において密で中間部で疎となるように蛇行配線する。
On the other side of the heating means, as shown in FIG.
Separately from the test board 30, a heater plate 49 having a heater circuit pattern 35 dedicated to heating is formed, and the heater plate 49 is placed inside the box l so as to be parallel to the board 30 on the test board 3o. Place it like this. As shown in FIG. 13, the heater circuit pattern 35 is arranged in a meandering manner so that the wiring is dense at both ends and sparse in the middle.

上記ヒータプレート49及び上記ヒータブレトを兼ねる
試験用基板3oに通電する手段として、上記可搬形a!
−開−閉クス1の適所に商用NyA接続用のコネクタ手
段8を設ける0例えば該コネクタ手段8は蓋体2を形成
する前面パネル以外の側面パネルに設けられ、外部より
プラグによって商用電源に接続される。該コネクタ手段
8とヒータ回路35とは第10図に示すように導線によ
って直接接続するか、又はスイッチ手段を介して接続と
接続解除が行なえるようにする0例えば試験用基板30
がヒータプレートを兼ねる場合には、該試験用基板30
をボックスl内から取外しできるように上記スイッチ手
段を介してコネクタ手段8と接続し、第10図に示すヒ
ータプレート49の如く試験用基板30と別体にする場
合にはコネクタ手段8と導線によって直接接続すること
もできる。
The portable type a!
- Connector means 8 for commercial NyA connection is provided at an appropriate location of the opening-closing box 1. For example, the connector means 8 is provided on a side panel other than the front panel forming the lid body 2, and is connected to a commercial power source by a plug from the outside. be done. The connector means 8 and the heater circuit 35 may be connected directly by conductive wires as shown in FIG. 10, or may be connected and disconnected via switch means.
When the test board 30 also serves as a heater plate, the test board 30
is connected to the connector means 8 through the switch means so that it can be removed from inside the box l, and when it is made separate from the test board 30 like the heater plate 49 shown in FIG. You can also connect directly.

上記スイッチ手段を上記ボックスの適所、例えばコネク
タ手段8の近辺に設ける。′!J3図及び第6図は上記
スイッチ手段の一例を示している。図示のように、取付
片24にスイッチレバー14を@22を支点として回り
操作できるように設け、他方ボックス1内に、表面に接
片16を有する絶縁材から成る可動ブロック15を配し
、該可動ブロック15を上記試験用基板3oの接続板部
42の下位に配置して上記接片16をヒータ回路パター
ン35の端子36に対向させ、該可動ブロック15の接
片16の端子17.20と上記ヒータ回路パターン35
の端子36とを導線21にて接続し、該可動ブロック1
5をバネ19にて弾持して接片16をヒータ回Wr@子
36に接触する方向に付勢すると共に、上記可動ブロッ
ク15と上記スイッチレバー14の自由端を連結部材1
8にて連結し、第6図Aに示すようにレバー14を一方
向に回動操作することにより上記連結部材18を介し可
動ブロック15をバネ19に抗し下降させて接片16と
ヒータ回路端子36を離間(接触解除)し、逆に¥S6
図Bに示すようにスイッチレバー14をバネ19に従い
他方向に回動操作することにより上記バネ19の弾力で
可動ブロック15を押上げ接片16とヒータ回路端子3
6との接触状態を形成する。上記スイッチレバー14を
上記各操作位置に保持する手段として、例えばバネに弾
持されたボール23を二つの孔内に選択的に係合させる
手段等を用いる。
The switch means is provided at a suitable location in the box, for example in the vicinity of the connector means 8. ′! FIG. J3 and FIG. 6 show an example of the above-mentioned switch means. As shown in the figure, a switch lever 14 is provided on a mounting piece 24 so that it can be rotated around @22 as a fulcrum, and a movable block 15 made of an insulating material having a contact piece 16 on its surface is disposed inside the box 1. The movable block 15 is disposed below the connection plate portion 42 of the test board 3o, and the contact piece 16 is opposed to the terminal 36 of the heater circuit pattern 35, and the contact piece 16 of the movable block 15 is connected to the terminal 17.20 of the contact piece 16 of the movable block 15. Above heater circuit pattern 35
The terminal 36 of the movable block 1 is connected with the conducting wire 21.
5 is resiliently supported by a spring 19 to bias the contact piece 16 in the direction of contacting the heater rotation Wr@ child 36, and the movable block 15 and the free end of the switch lever 14 are connected to the connecting member 1.
8, and by rotating the lever 14 in one direction as shown in FIG. Separate the terminal 36 (release contact) and conversely ¥S6
As shown in FIG. B, by rotating the switch lever 14 in the other direction according to the spring 19, the elasticity of the spring 19 pushes up the movable block 15 and the contact piece 16 and the heater circuit terminal 3.
Forms contact with 6. As means for holding the switch lever 14 at each of the operating positions, for example, means for selectively engaging a ball 23 supported by a spring in two holes is used.

上記の如きスイッチ手段を具備することにより、商用電
源接続用のコネクタ手段8にプラグを差し込んだまま、
ヒータ回路パターン35への商用電源からの通電及び通
電解除を図ることができ、又試験用基板30をボックス
1から取外して別の基板と交換することができる。該試
験用基板30を取外す場合は第3図に示すように蓋体2
を開け、ゲート板3を案内溝43から抜き取った後、案
内軌i!6を滑らせながら挿入口4より引出せば良い。
By providing the switch means as described above, the plug can be inserted into the connector means 8 for connecting to the commercial power supply,
The heater circuit pattern 35 can be energized and de-energized from the commercial power supply, and the test board 30 can be removed from the box 1 and replaced with another board. When removing the test board 30, remove the lid 2 as shown in FIG.
After opening the gate plate 3 and removing it from the guide groove 43, the guide track i! 6 and pull it out from the insertion slot 4 while sliding it.

第8図、′fS9図は上記試験用基板30をボックス1
内に着脱可に装着する手段として、蓋体2を開くことに
よって形成される測定作業用開口50を利用する場合を
示している。
Figure 8 and Figure 'fS9 show the above test board 30 in box 1.
A case is shown in which a measuring operation opening 50 formed by opening the lid body 2 is used as a means for removably attaching the device.

図に示すように、一対の対向する側面パネルに沿い、一
対の基板支持座47を設け、試験用基板30を測定作業
用間口50から収容して上記支持座47に載せ横架状態
とすると共に、支持座470通所適所験用基板30の縁
部に係合する手段として、例えば図示の如き弾性を有す
る係止片46を設ける。該係止片46は試験用基板30
を該係止片46の内側へ押し込む時、後方へ弾性変位し
基板30が支持座47に載った時前方へ復元し基板縁部
に係合する。又試験用基板30を係止片46の弾性に抗
し引き上げることにより、該係止片46による係合が外
れ、測定作業用開口50より取り出すことができる。
As shown in the figure, a pair of board support seats 47 are provided along a pair of opposing side panels, and the test board 30 is received from the measurement work opening 50 and placed on the support seats 47 to be in a horizontally suspended state. As a means for engaging the edge of the test board 30 in place through the support seat 470, for example, an elastic locking piece 46 as shown in the figure is provided. The locking piece 46 is attached to the test board 30.
When pushed into the locking piece 46, it is elastically displaced backward, and when the substrate 30 is placed on the support seat 47, it is restored forward and engaged with the edge of the substrate. Further, by pulling up the test board 30 against the elasticity of the locking piece 46, the engagement by the locking piece 46 is released and the test board 30 can be taken out from the measurement operation opening 50.

この場合、測定作業用開口50は電子部品45を測定す
るためと、試験用基板30を着脱するための開口として
機能する。又同開口50よりIC等の電子部品45をソ
ケット40に着脱することができる。
In this case, the measurement operation opening 50 functions as an opening for measuring the electronic component 45 and for attaching and detaching the test board 30. Further, an electronic component 45 such as an IC can be attached to and removed from the socket 40 through the opening 50.

上記測定作業用間口50から試験用基板30を装着する
構造を取る場合、試験用基板30の接続板部42の下面
にコネクタ48を取り付け、他方ボックス1の蓋体2と
対向する背面パネルに上記コネクタ48と対向して前記
信号人出内用コネクタ11を取付ける0両コネクタ48
.11は試験用基板30を測定作業用開口50から嵌装
し支持座4フ上に支持させる時互いに結合される。
When a structure is adopted in which the test board 30 is installed from the measurement work opening 50, the connector 48 is attached to the lower surface of the connection plate part 42 of the test board 30, and the connector 48 is attached to the rear panel facing the lid 2 of the box 1. A 0-way connector 48 to which the signal person exit/exit connector 11 is attached opposite to the connector 48.
.. 11 are connected to each other when the test board 30 is inserted through the measurement operation opening 50 and supported on the support seat 4.

又上記蓋体2は第3図に示すように、ボックス本体から
分離できるようにし、蓋体2とボックス1の開口縁部に
バラチン錠等の益施錠手段7を具備させて上記測定作業
用開口50を塞ぎ、密閉状態を保持する。
Further, as shown in FIG. 3, the lid 2 is made separable from the box body, and a locking means 7 such as a locking lock is provided at the opening edges of the lid 2 and the box 1 to secure the opening for the measurement operation. 50 and maintain a sealed state.

又他側として第7図、第8図に示すように上記蓋体2の
一端を蝶番等のヒンジ44を介してボックス本体にrW
I閉可に取付け、蓋体2自由端を上記バラチン錠等の施
錠手段7を介してロックし密閉できるようにする。
On the other side, as shown in FIGS. 7 and 8, one end of the lid 2 is attached to the box body via a hinge 44 such as a hinge.
The free end of the lid body 2 can be locked and sealed via a locking means 7 such as the above-mentioned baratin lock.

尚上記試験用基板30はボックス1内に一枚内装した場
合を例示したが、二枚以上並置し内装することができ、
又本発明は同基板30を蓋体2の内腔部に前記と同様の
方法にて横架支持させ、内蓋体2を開いた時、同基板3
0を蓋体2に付随させて開放するようにした実施例を包
含する。
Although the above-mentioned test board 30 is exemplified as a single board installed inside the box 1, two or more boards can be placed side by side and installed inside the box 1.
Further, in the present invention, the substrate 30 is horizontally supported in the inner cavity of the lid body 2 in the same manner as described above, and when the inner lid body 2 is opened, the substrate 3
This includes an embodiment in which the cover 2 is attached to the lid 2 and opened.

例えばボックス本体内に前記の方法で試験用基板30を
内装すると同時に、蓋体2にも同基板30を保持させ、
蓋体2を閉じた時、同基板がボックス1の密閉空間内で
上下に間隔を1いて平行に配置されるようにする。
For example, at the same time that the test board 30 is placed inside the box body in the above-described manner, the same board 30 is also held in the lid body 2,
When the lid body 2 is closed, the substrates are arranged in parallel in the closed space of the box 1 with an interval of 1 vertically.

而して、上記可搬形密閉ボックス1をスタンドオフ25
によって机上等に床高に設置すると、上記ボックス1内
に横架支持された試験用基板30は水平状態に保持され
、コネクタ手段8に商用を源を接続し、スイッチ手段を
没入すると、加熱手段、即ちヒータ回路パターン35に
通電されボックス1の密閉空間内及び試験用基板3o及
び同基板30に搭載された電子部品45を加熱するに至
る。所定加熱温度に達した後、信号入出力用コネクタ手
段11のコンタクト13により信号を入出力して電子部
品45の各種チエツク並びに測定試験を行なう。
Then, the portable sealed box 1 is attached to the standoff 25.
When installed at floor level on a desk or the like, the test board 30 horizontally supported in the box 1 is held in a horizontal state, and when a commercial power source is connected to the connector means 8 and the switch means is inserted, the heating means That is, the heater circuit pattern 35 is energized to heat the inside of the closed space of the box 1, the test board 3o, and the electronic components 45 mounted on the board 30. After reaching a predetermined heating temperature, various checks and measurement tests on the electronic component 45 are performed by inputting and outputting signals through the contacts 13 of the signal input/output connector means 11.

併せて所定の加熱温度に達した時、蓋体2を開いて試験
用基板30の電子部品搭載面を開放状態にし、蓋体2を
開くことによフて形成された測定作業用開口50から試
験用検出子を差し入れてソケット40の端子側々に接触
させ電子部品の各種チエツク並びに測定試験を行なう。
At the same time, when a predetermined heating temperature is reached, the lid 2 is opened to open the electronic component mounting surface of the test board 30, and the measurement work opening 50 formed by opening the lid 2 is opened. Test detectors are inserted and brought into contact with the terminal sides of the socket 40 to perform various checks and measurement tests on the electronic components.

蓋体2を開くと加熱温度が低下するので、所定時間経過
後再び蓋体2を閉じ、温度上昇後再度蓋体2を開き、上
記と同様の測定試験を継続する。
When the lid 2 is opened, the heating temperature decreases, so the lid 2 is closed again after a predetermined period of time has elapsed, and after the temperature rises, the lid 2 is opened again, and the same measurement test as described above is continued.

測定が終了した後、別の電子部品を測定作業用開口50
からソケット40に搭載し上記と同様の試験を繰り返す
After the measurement is completed, another electronic component is inserted into the measurement work opening 50.
Then, it is mounted on the socket 40 and the same test as above is repeated.

発明の詳細 な説明したように、本試験用ボックスは把手を以って試
験作業場所へ自由に移動し、ボックスに設けられたコネ
クタに身近にある商用電源を接続することによって直ち
に試験作業を行なうことができ、商用電源を有する場所
であれば実験室や開発室、事務室等、場所に制約を受け
ることなく試験を行なうことができる。
As described in the detailed description of the invention, the test box can be moved freely to the test work site using the handle, and the test work can be performed immediately by connecting a nearby commercial power source to the connector provided on the box. As long as there is a commercial power source, testing can be carried out in a laboratory, development room, office, etc. without being restricted by location.

例えば上記ボックスをスタンドオフによって机上に設置
し試験作業を行なうことができ、机上等に設置した時、
試験用基板はスタンドオフによって水平状態に静置され
、加熱試験に適した状態に置くことができる。
For example, the above box can be installed on a desk using standoffs to perform test work, and when installed on a desk, etc.
The test board can be placed in a horizontal position by standoffs, making it suitable for heating tests.

又上記の如く試験用基板がボックスの密閉空間内に水平
状態に置かれ加熱試験に供されている時、試験用基板と
対面する如く設けられた蓋体は同ボックスの上面側に置
かれ、上記加熱状態のまま直ちに蓋体を開き試験用基板
の電子部品搭載面を開放し、電子部品の測定、チエツク
を簡便に行なうことができる。即ち、蓋体を開蓋するこ
とによってスタンドオフによって設置されたボックスの
上面側に測定用開口が形成され、該開口によって電子部
品搭載面の上方空間を開放状態にし上方より電子部品の
測定が容易に行なえる。
Furthermore, when the test board is placed horizontally in the sealed space of the box and subjected to the heating test as described above, the lid body provided to face the test board is placed on the top side of the box, While in the heated state, the lid is immediately opened to expose the electronic component mounting surface of the test board, and electronic components can be easily measured and checked. That is, by opening the lid, a measurement opening is formed on the top side of the box installed by the standoff, and this opening opens the space above the electronic component mounting surface, making it easy to measure the electronic components from above. can be done.

父上記劇定作業用開口を介して上方より測定済電子部品
の着脱を行ない、同様にこれから測定せんとする電子部
品も上記測定作業用開口を通して試験用基板に搭載でと
る。
The electronic components that have already been measured are mounted and removed from above through the above-mentioned dramatic operation opening, and the electronic components to be measured are also mounted on the test board through the above-mentioned measurement operation opening.

本試験用ボックスは限られた容積の密閉空間内で限られ
た数量の電子部品の測定試験を行なうものであるから、
上記コネクタを介して商用電源を接続することによって
短時間で上記密閉空間内を効率良く所要温度まで高める
ことができ、又不使用時には電源を切って稼動ロスを防
ぐことができる。
This test box is designed to measure and test a limited number of electronic components in a closed space with a limited volume.
By connecting a commercial power source through the connector, the inside of the sealed space can be efficiently raised to a required temperature in a short time, and the power can be turned off when not in use to prevent operational loss.

上記の通り本試験用ボックスは前記したASICの如き
限られた少量の電子部品の加熱試験に好適に用いられ、
身近に置いて必要な時には何時でも商用電源を使用して
直ちに上記加熱試験が行なえ、軽便且つ機動性に富む試
験用ボックスを提供できる。
As mentioned above, this test box is suitably used for heating tests of limited small quantities of electronic components such as the ASICs mentioned above.
It is possible to provide a test box that is convenient and highly maneuverable and can be placed nearby and the heating test can be performed immediately using a commercial power supply whenever necessary.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の実施例を示し、第1図は卓上型電子部品
加熱試験用ボックスの外観構造を前面パネルより観た斜
視図、第2図は同ボックスの外観構造を背面パネルより
見た斜視図、第3図は前面パネルより成る蓋体を開いて
内部構造を示す同ボックス斜視図、第4図は蓋体を開ぎ
試験用基板を内装した状態を示す同ボックス斜視図、第
5図は同ボックス平面図、第6図Aはスイッチ手段の構
造を同スイッチの閉状態を持って示す断面図、同図Bは
同スイッチの開状態を以って示す断面図、第7図は蓋体
の開閉構造に関する他側を示すボックス断面図、第8図
は試験用基板の支持手段に関する他側を示すボックス横
断面図、第9図は同縦断面図、第10図は加熱手段に関
する他側を示すボックス断面図、il1図はヒータプレ
ートを兼ねる試験用基板の要部拡大断面図であり断面表
示を省略して示す図、第12図はヒータプレートの他側
を示す要部拡大断面図であり断面表示を省略して示す図
、第13図はヒータ回路パターンを例示する要部拡大平
面図である。 l・・・可搬形密閉ボックス、2・・・蓋体、5・・・
把手、6・・・基板案内軌道、8・・・商用電源接続用
コネクタ手段、11・・・信号入出力用コネクタ手段、
14・・・スイッチ手段を形成するスイッチレバー25
・・・スタンドオフ、30・・・試験用基板、34・・
・信号回路パターン、35・・・ヒータ回路パターン、
40・・・ソケット、45・・・電子部品、47・・・
基板支持座、49・・・ヒータプレート、50・・・測
定作業用開口。 特許出願人 山−電機工業株式会社 勿 第1図 第り図 第11図
The drawings show an embodiment of the present invention, and FIG. 1 is a perspective view of the external structure of a tabletop electronic component heating test box viewed from the front panel, and FIG. 2 is a perspective view of the external structure of the box viewed from the back panel. Figure 3 is a perspective view of the box with the front panel lid opened to show the internal structure, Figure 4 is a perspective view of the box with the lid opened and the test board installed, and Figure 5. 6A is a sectional view showing the structure of the switch means in the closed state, FIG. 6B is a sectional view showing the switch in the open state, and FIG. 7 is a sectional view of the switch means in the open state. 8 is a cross-sectional view of the box showing the other side related to the opening/closing structure of the body, FIG. 9 is a longitudinal sectional view of the same, and FIG. 10 is the other side related to the heating means. Figure 12 is an enlarged cross-sectional view of the main part of the test board that also serves as a heater plate, with cross-sectional representation omitted, and Figure 12 is an enlarged cross-sectional view of the main part showing the other side of the heater plate. FIG. 13 is an enlarged plan view of a main part illustrating a heater circuit pattern. l...Portable airtight box, 2...Lid, 5...
Handle, 6... Board guide track, 8... Connector means for connecting commercial power supply, 11... Connector means for signal input/output,
14...Switch lever 25 forming switch means
...Standoff, 30...Test board, 34...
・Signal circuit pattern, 35... Heater circuit pattern,
40...Socket, 45...Electronic component, 47...
Substrate support seat, 49... Heater plate, 50... Opening for measurement work. Patent applicant Yama-Denki Kogyo Co., Ltd. Figure 1 Figure 11

Claims (3)

【特許請求の範囲】[Claims] (1)方形の可搬形密閉ボックスと、該可搬形密閉ボッ
クスに内装される試験用基板とから成り、上記可搬形密
閉ボックスには同ボックスの密閉空間内に試験用基板を
着脱可に横架する基板支持手段と、該試験用基板を加熱
する加熱手段とを具備させると共に、上記内装された試
験用基板と接続して信号の入出力を行なうコネクタ手段
と、上記加熱手段を商用電源に接続するコネクタ手段と
を具備させ、又上記可搬形密閉ボックスの上記試験用基
板の電子部品搭載面と対向するパネルにて蓋体を形成し
、該蓋体を開蓋することにより上記電子部品搭載面を開
放状態にする測定作業用開口が形成され、上記蓋体と対
向するパネルに可搬形密閉ボックスを床高に支持するス
タンドオフを具備させ、可搬形密閉ボックスの適所に該
ボックスを持ち運びするための把手を備えることを特徴
とする卓上型電子部品加熱試験用ボックス。
(1) Consists of a rectangular portable sealed box and a test board placed inside the portable sealed box, and the test board is removably mounted horizontally in the sealed space of the portable box. and a heating means for heating the test board, a connector means for connecting with the installed test board for signal input/output, and connecting the heating means to a commercial power source. A lid body is formed of a panel facing the electronic component mounting surface of the test board of the portable sealed box, and when the lid body is opened, the electronic component mounting surface is connected to the electronic component mounting surface. A measuring operation opening is formed to open the box, and a panel facing the lid body is provided with a standoff for supporting the portable sealed box at floor level, so that the box can be carried to an appropriate location in the portable sealed box. A tabletop electronic component heating test box characterized by having a handle.
(2)上記可搬形密閉ボックスの適所に上記加熱手段へ
供給する商用電源のスイッチ手段を有することを特徴と
する請求項1記載の卓上型電子部品加熱試験用ボックス
(2) The tabletop electronic component heating test box according to claim 1, further comprising switch means for supplying commercial power to the heating means at a suitable location in the portable sealed box.
(3)上記試験用基板が加熱プレートを形成することを
特徴とする請求項1記載の卓上型電子部品加熱試験用ボ
ックス。
(3) The tabletop electronic component heating test box according to claim 1, wherein the test substrate forms a heating plate.
JP63195412A 1988-03-15 1988-08-04 Desktop type electronic parts heating test box Expired - Lifetime JPH0627781B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63195412A JPH0627781B2 (en) 1988-08-04 1988-08-04 Desktop type electronic parts heating test box
MYPI89000314A MY103847A (en) 1988-03-15 1989-03-14 Laminated board for testing electronic components
KR1019890003199A KR890015025A (en) 1988-03-15 1989-03-15 Laminates for Electronic Component Testing
EP19890104587 EP0333160A3 (en) 1988-03-15 1989-03-15 Laminated board for testing electronic components
US07/517,433 US4978914A (en) 1988-03-15 1990-04-24 Laminated board for testing electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63195412A JPH0627781B2 (en) 1988-08-04 1988-08-04 Desktop type electronic parts heating test box

Publications (2)

Publication Number Publication Date
JPH0244271A true JPH0244271A (en) 1990-02-14
JPH0627781B2 JPH0627781B2 (en) 1994-04-13

Family

ID=16340665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63195412A Expired - Lifetime JPH0627781B2 (en) 1988-03-15 1988-08-04 Desktop type electronic parts heating test box

Country Status (1)

Country Link
JP (1) JPH0627781B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208809B1 (en) 1998-07-17 2001-03-27 Fuji Photo Film Co., Ltd. Camera with motor-driven lens barrel
US6349173B1 (en) 1998-07-17 2002-02-19 Fuji Photo Film Co., Ltd. Camera with motor-driven lens barrel
KR20140138024A (en) * 2013-05-24 2014-12-03 에스펙 가부시키가이샤 Evaluating substrate, environmental test device, and evaluating method of test specimen
CN109405872A (en) * 2018-11-20 2019-03-01 深圳市匠信智能科技有限公司 A kind of portable inspectiont platform

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208809B1 (en) 1998-07-17 2001-03-27 Fuji Photo Film Co., Ltd. Camera with motor-driven lens barrel
US6349173B1 (en) 1998-07-17 2002-02-19 Fuji Photo Film Co., Ltd. Camera with motor-driven lens barrel
KR20140138024A (en) * 2013-05-24 2014-12-03 에스펙 가부시키가이샤 Evaluating substrate, environmental test device, and evaluating method of test specimen
JP2014228463A (en) * 2013-05-24 2014-12-08 エスペック株式会社 Evaluation substrate, environmental test device, and evaluation method of sample
CN104181095B (en) * 2013-05-24 2018-05-15 爱斯佩克株式会社 Evaluate the evaluation method of substrate, environment test device and sample
CN109405872A (en) * 2018-11-20 2019-03-01 深圳市匠信智能科技有限公司 A kind of portable inspectiont platform
CN109405872B (en) * 2018-11-20 2024-05-17 深圳市匠信智能科技有限公司 Portable detection platform

Also Published As

Publication number Publication date
JPH0627781B2 (en) 1994-04-13

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