CN217982844U - Test fixture - Google Patents

Abstract

The application provides a test fixture, test fixture includes: a bottom case; the upper cover and the bottom box are detachably assembled together and form an accommodating space together; one end of the test wire is arranged in the accommodating space, a test interface is arranged at the part of the test wire, which is positioned in the accommodating space, the test interface is used for electrically connecting a piece to be tested, and the other end of the test wire can extend out of the accommodating space; a control panel; and the heating element is arranged in the accommodating space and used for heating under the control of the control panel. The heating member is set up in the accommodating space that this application embodiment constitutes through end box and upper cover, can provide a high temperature test environment for the piece that awaits measuring can carry out functional test at accommodating space in-connection test line.

Description

Test fixture

Technical Field

The application relates to the field of hard disk testing, in particular to a testing jig.

Background

For a Solid State Drive (SSD), it is an essential part to perform high temperature test on all products at the time of factory shipment, that is, perform function test at high temperature. The test mode that uses in the market at present all is directly placing the product of being tested in the high temperature box and carrying out the high temperature test, and the heating temperature that provides through the high temperature box can screen out bad product. However, such a test needs to be performed at a designated position, cannot be moved and carried anytime and anywhere, and is poor in mobility.

SUMMERY OF THE UTILITY MODEL

In view of this, it is desirable to provide a testing fixture, which can improve the test flexibility and make the test more convenient.

The application provides a test fixture, test fixture includes:

a bottom case;

the upper cover and the bottom box are detachably assembled together, and together form an accommodating space;

one end of the test wire is arranged in the accommodating space, a test interface is arranged on the part of the test wire, which is positioned in the accommodating space, the test interface is used for electrically connecting a piece to be tested, and the other end of the test wire can extend out of the accommodating space;

a control panel; and

the heating member, the heating member set up in accommodating space is used for generating heat under the control of control panel.

According to an embodiment of the present application, the test fixture further includes: the heat dissipation piece is arranged in the accommodating space and is in contact with the heating piece.

According to an embodiment of the present application, the test fixture further includes: the temperature sensor is arranged in the accommodating space, is electrically connected with the control board and is used for measuring the temperature in the accommodating space; and the display unit is electrically connected with the control board and is used for displaying the temperature measured by the temperature sensor.

According to a specific embodiment of this application, the intercommunication groove has been seted up on the end box, the control panel sets up outside the accommodating space, and be located the end box is kept away from one side of heating member, the control panel with the heating member passes through the connector electricity and is connected, the connector passes the intercommunication groove sets up.

According to a specific embodiment of this application, test fixture still includes the switch, the switch with the control panel electricity is connected, the switch includes first state and second state, when the switch is in the first state, control panel control heating member heats, when the switch is in the second state, control panel control heating member stops heating.

According to an embodiment of the present application, the heating member includes: a heating ceramic plate; the heating plate is provided with a heating circuit; and the heating chip is electrically connected with the control panel, the heating circuit is used for electrically connecting the heating chip with the heating ceramic chip, and the heating chip is used for controlling the heating ceramic chip to heat under the action of the control panel.

According to a specific embodiment of this application, test fixture still includes the heat insulating part, the heat insulating part set up in the upper cover.

According to a specific embodiment of the present application, the bottom case is connected to the upper cover by a snap.

According to a specific embodiment of the present application, the upper cover is provided with a handle.

According to an embodiment of the present application, the testline is a pci express bus cable.

Compared with the prior art, the application has at least the following beneficial effects:

through set up the heating member in the accommodating space that end box and upper cover are constituteed, can provide a high temperature test environment for the piece that awaits measuring can carry out the functional test at accommodating space in-connection test line.

Drawings

Fig. 1 is a schematic structural diagram of a test fixture according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a bottom case and components in the bottom case of the test fixture shown in fig. 1.

Fig. 3 is another schematic structural diagram of the test fixture shown in fig. 1.

Fig. 4 is a schematic structural diagram of an upper cover of the test fixture shown in fig. 1.

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Description of the main elements

Test fixture 1

Bottom case 10

First side 101

Second side 102

Accommodating space 11

Accommodating chamber 12

Buffer 13

Upper cover 20

Fastener 21

Handle 22

Bottom wall 23

Side wall 24

Accommodating chamber 25

First cavity 251

Second cavity 252

Partition 26

Control panel 30

Switch 31

Serial port 32

Test line 40

Test site 41

Test interface 42

Heating member 50

Temperature sensor 51

Display unit 52

Heat sink 60

Heat radiation unit 61

First thermal insulation member 71

Second thermal shield 72

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be made below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, but not all embodiments of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1, an embodiment of the present application provides a test fixture 1 for performing a functional test on a device under test (not shown) at a high temperature. The piece to be tested can be a solid state disk, for example.

Referring to fig. 2, the testing fixture 1 includes a bottom case 10, an upper cover 20, a control board 30, a testing line 40 and a heating element 50. The bottom case 10 is detachably assembled with the upper cover 20, and forms an accommodating space 11 (see fig. 2). The back box 10 includes a first surface 101 and a second surface 102 disposed opposite to each other. The control board 30 is disposed on the bottom case 10, for example, on a first surface 101 of the bottom case 10, i.e., a side away from the upper cover 20. The control board 30 is provided with a control circuit. The heating member 50 is disposed in the accommodating space 11 for generating heat under the control of the control board 30.

As shown in fig. 2, one end of the test wire 40 is disposed in the accommodating space 11, and the other end thereof can be disposed to extend out of the accommodating space 11. The portion of the test line 40 located in the accommodating space 11 is provided with a test site 41, and the test site 41 is provided with a test interface 42. The test interface 42 is electrically connected to the test line 40 for connecting the device under test. One end of the test wire 40 extending out of the accommodating space 11 is used for electrically connecting an electronic device (not shown), and the electronic device can send an operation instruction to the to-be-tested piece, so that the to-be-tested piece performs corresponding operation at the temperature provided by the heating element 50.

In one possible implementation, the electronic device is a computer. Testline 40 is a Peripheral Component Interconnect Express (PCIE) bus cable. After the test line 40 is connected with the electronic device, whether the test fixture 1 normally performs the function test can be displayed on the electronic device, and meanwhile, the progress and the result of the test can be displayed.

This application embodiment is through setting up the heating member 50 of being connected with control panel 30 electricity to can utilize control panel 30 to control heating member 50 and heat-retaining operation heaies up, lowers the temperature, and make and remain target temperature throughout in the accommodating space 11 that end box 10 and upper cover 20 constitute, the piece that awaits measuring can carry out functional test under corresponding target temperature. Therefore, the high-temperature test of the piece to be tested can be completed without placing the piece to be tested in a high-temperature box, so that the test process is more convenient.

It can be understood that the bottom case 10 and the top cover 20 need to be assembled together when the test fixture 1 performs the test of the dut. The bottom case 10 and the upper cover 20 can be assembled in various manners, and are not limited herein. In one possible implementation, the bottom case 10 and the upper cover 20 are connected by a snap 21.

Further, the upper cover 20 is provided with a handle 22 for facilitating access to the upper cover 20.

In one embodiment, the test fixture 1 further includes a heat sink 60. The heat sink 60 is disposed in the accommodating space 11 and adjacent to the heating member 50, for example, the heat sink 60 is disposed on the second surface 102 of the bottom case 10, i.e., on a side of the heating member 50 away from the control board 30, i.e., on a side of the heating member 50 facing the upper cover 20. The heat sink 60 is in direct or indirect contact with the heating member 50, and can transfer heat generated by the heating member 50 into the accommodating space 11 more quickly to provide a high-temperature test environment in the accommodating space 11.

In one possible implementation, the test site 41 is disposed along the length direction of the back box 10 (i.e., the Y-axis direction in the figure), and is located at the middle position of the back box 10 in the X-axis direction. The heat sink 60 includes two portions, which are respectively disposed at both sides of the test site 41. Therefore, the heat distribution on the two sides of the test position 41 is more uniform, and when the piece to be tested is placed in the test position 41 for testing, the piece to be tested is heated more uniformly.

In one possible implementation, the heating element 50 includes a heating chip (not shown), a heating plate (not shown), and a heating ceramic sheet (not shown). The heating chip is electrically connected with the control circuit on the control panel 30, the heating panel is provided with a heating circuit, the heating circuit electrically connects the heating chip with the heating ceramic piece, and the heating chip is used for controlling the heating ceramic piece to heat under the action of the control circuit. The heating chip is disposed on one side of the heating plate close to the control board 30, and the heating ceramic plate is disposed on one side of the heating plate far from the control board 30.

The heating ceramic plate is a safe and reliable electric heating flat plate with a plate surface heating after being electrified and without electricity and open fire. The heating ceramic plate is mainly based on heat conduction when in use, so the heat efficiency is high. Moreover, the heating ceramic wafer has the advantages of rapid heating, rapid temperature compensation, high heating temperature, acid and alkali resistance and other corrosive substances, the heating ceramic wafer is adopted as a heating element 50 in the application, the detection efficiency can be improved, the electric power cost can be saved, and the test process can not generate large noise.

Further, in the present embodiment, the heat sink 60 is in contact with the heating ceramic plate so as to transfer the heat of the heating ceramic plate into the accommodating space 11. The heat sink 60 may be in direct contact or indirect contact with the heat generating ceramic sheet. In one possible implementation, the indirect contact may be that the heat sink 60 is spaced opposite the heat generating ceramic sheet for heat conduction using air. In another implementation, the heat sink 60 is in indirect contact with the heating ceramic sheet through other heat conducting elements for heat transfer using the heat conducting elements.

In other embodiments, the heating ceramic plates are also distributed on both sides of the test site 41, and the heat sink 60 is disposed corresponding to the positions of the heating ceramic plates. Specifically, the heat sink 60 includes a plurality of heat dissipation units 61, and each heat dissipation unit 61 is disposed at a position corresponding to one heating ceramic plate. Thus, the heat dissipation efficiency of the heat sink 60 can be improved.

In a possible implementation, the bottom case 10 is provided with a communication groove (not shown). The communicating groove is formed at one end of the bottom case 10 near the side from which the test line 40 extends. The control board 30 located on the side of the base case 10 remote from the heating member 50 is electrically connected to the heating member 50 through a connector (not shown) provided through the communication groove. A cushion member 13 is provided in the housing space 11. The buffer 13 may be a silicone pad, for example. The buffer member 13 is provided on the heating member 50 in the width direction (i.e., the X-axis direction) of the base case 10.

Referring to fig. 3, the testing fixture 1 further includes a switch 31, and the switch 31 is electrically connected to the control circuit on the control board 30. The switch 31 includes a first state and a second state. When the switch 31 is in the first state, the control board 30 controls the heating member 50 to perform heating, and when the switch 31 is in the second state, the control board 30 controls the heating member 50 to stop heating. In one possible implementation, the switches 31 include two, and the control board 30 controls the heating element 50 to heat when both switches 31 are in the first state.

Further, the control board 30 is provided with a storage unit (not shown) and a serial port 32. The storage unit stores data of a preset temperature, and when the switch 31 is in the first state, the control board 30 controls the heating element 50 to heat to the preset temperature stored in the storage unit. The serial port 32 is capable of changing the preset temperature in the storage unit by connecting an electronic device.

Further, the testing fixture 1 further includes a temperature sensor 51 (see fig. 2) and a display unit 52, and both the temperature sensor 51 and the display unit 52 are electrically connected to the control board 30. The temperature sensor 51 is disposed in the accommodating space 11 and measures the temperature in the accommodating space 11. The control board 30 can receive the temperature measured by the temperature sensor 51 and display the temperature data through the display unit 52.

The temperature sensor 51 may be provided in several numbers. In this way, the temperature at different positions within the housing space 11 can be monitored simultaneously.

It is to be understood that the specific location where the display unit 52 is disposed is not limited herein. In one possible implementation, the display unit 52 is disposed outside the bottom case 10, and specifically, the display unit 52 is disposed on a side wall of an end of the bottom case 10 away from the test line 40.

Referring to fig. 2, in a possible implementation manner, an accommodating cavity 12 is further formed on a side of the bottom case 10 close to the upper cover 20, and the accommodating cavity 12 is disposed close to the display unit 52. The first heat insulator 71 is provided in the accommodation chamber 12. The first thermal insulation member 71 may be, for example, thermal insulation cotton. It can be understood that the display unit 52 can be effectively protected from being damaged by high temperature by disposing the first heat insulating member 71 in the back case 10 at a position close to the display unit 52.

Referring to fig. 4, the top lid 20 includes a bottom wall 23 and a sidewall 24 disposed around the bottom wall 23. The bottom wall 23 and the side wall 24 cooperate to form a receiving cavity 25. It will be understood that the bottom wall 23, the side wall 24 and the bottom case 10 together form the receiving space 11 when the upper cover 20 is assembled with the bottom case 10.

In a possible realization, the bottom wall 23 is provided with a second thermal insulation element 72, the second thermal insulation element 72 being for example thermal insulation cotton. It can be understood that, because the interior of the accommodating space 11 is always kept at a high temperature, the second heat insulation piece 72 is added on the bottom wall 23, so that on one hand, the high temperature can be prevented from being transmitted to the upper cover 20 and the handle 22, and then the operation of the test fixture 1 by an operator is facilitated, and on the other hand, the heat preservation in the accommodating space 11 is facilitated.

In a possible implementation, a partition 26 is also provided in the housing chamber 25. The bottom of the partition 26 is connected to the bottom wall 23, and both ends of the partition 26 are connected to the side walls 24. The partition 26 separates the accommodating cavity 25 to form a first cavity 251 and a second cavity 252. And the partition 26 is provided corresponding to the buffer member 13 (see fig. 2) in the back case 10. When the upper cover 20 is assembled with the bottom case 10, the partition 26 can abut against the buffer 13, so that the second cavity 252 is completely isolated from the first cavity 251. Thus, the high-temperature gas in the accommodating space 11 on one side of the first cavity 251 cannot enter the accommodating space 11 on one side of the second cavity 252, and then cannot overflow the test fixture 1 through the communicating groove, so that the heat preservation effect of the test fixture 1 is better.

It should be noted that, in the embodiment of the present application, the control board 30 and the function realized by the control circuit on the control board 30 are both designed conventionally. That is, the control board 30 controls the heating member 50 to heat or stop heating, the temperature data collected by the temperature sensor 51 is displayed on the display unit 52, the storage unit on the control board 30 sets the preset temperature and controls the heating member 50 to heat to the preset temperature, and the like, which are common functions of the control board 30.

This application sets up heating member 50 through setting up in accommodating space 11 that end box 10 and upper cover 20 are constituteed, can provide a high temperature test environment for the piece that awaits measuring can be in accommodating space 11 in-connection test line 40 carry out the functional test under the high temperature. Compare in using large-scale high temperature box equipment, the test fixture 1 mobility of this application is better for it is more convenient to test.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present application and are not used as limitations of the present application, and that suitable modifications and changes of the above embodiments are within the scope of the claims of the present application as long as they are within the spirit and scope of the present application.

Claims (10)

1. A test fixture, comprising:

a bottom case;

the upper cover and the bottom box are detachably assembled together and form an accommodating space together;

one end of the test wire is arranged in the accommodating space, a test interface is arranged on the part of the test wire, which is positioned in the accommodating space, the test interface is used for electrically connecting a piece to be tested, and the other end of the test wire can extend out of the accommodating space;

a control panel; and

the heating member, the heating member set up in accommodating space is used for generating heat under the control of control panel.

2. The test fixture of claim 1, further comprising:

the heat dissipation piece is arranged in the accommodating space and is in contact with the heating piece.

3. The test fixture of claim 1, further comprising:

the temperature sensor is arranged in the accommodating space, is electrically connected with the control board and is used for measuring the temperature in the accommodating space; and

and the display unit is electrically connected with the control board and is used for displaying the temperature measured by the temperature sensor.

4. The testing fixture of claim 1, wherein the bottom case has a communication slot, the control board is disposed outside the accommodating space and on a side of the bottom case away from the heating element, the control board is electrically connected to the heating element through a connector, and the connector is disposed through the communication slot.

5. The test fixture of claim 1, further comprising a switch electrically connected to the control board, wherein the switch includes a first state and a second state, the control board controls the heating element to heat when the switch is in the first state, and the control board controls the heating element to stop heating when the switch is in the second state.

6. The test fixture of claim 1, wherein the heating element comprises:

a heating ceramic plate;

the heating plate is provided with a heating circuit; and

the heating chip is electrically connected with the control panel, the heating circuit is used for electrically connecting the heating chip with the heating ceramic piece, and the heating chip is used for controlling the heating ceramic piece to heat under the action of the control panel.

7. The test fixture of claim 1, further comprising a heat shield disposed within the upper cover.

8. The testing fixture of claim 1, wherein the bottom case is connected to the top cover by a snap fit.

9. The test fixture of claim 1, wherein the upper cover is provided with a handle.

10. The test fixture of claim 1, wherein the test line is a PCI express bus cable.

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