CN215383237U

CN215383237U - Flow-through heater apparatus

Info

Publication number: CN215383237U
Application number: CN202120602377.XU
Authority: CN
Inventors: 罗布·马特坎普; 阿尔扬·威廉姆斯·玛丽亚·科斯特; 马里奥·贾尼丝·珀尔斯特拉; 威廉·安东·伯纳德·耐曼; 亨德里克·约翰·阿尔努·尼乌文赫伊斯; 瑞纳杜斯·赫曼努斯·伯纳杜斯·迪嫩; 亚历克斯·赖尼尔·尼霍夫; 格雷德斯·约翰尼斯·克罗普斯
Original assignee: Otter Controls Ltd
Current assignee: Otter Controls Ltd
Priority date: 2020-03-24
Filing date: 2021-03-23
Publication date: 2022-01-04
Anticipated expiration: 2031-03-23
Also published as: CN215372923U; GB202004273D0; GB2595630A; EP3886534A1; CN215412491U; GB2595630B

Abstract

A flow-through heater comprising a thick film heating element and a channel plate attached to the thick film heating element to form a fluid channel therebetween. The fluid channel may have a rectangular or square planar spiral form. The PCB may be connected to the heating element by one or more connectors, each connector having a first end directly connected to the PCB and a second end comprising a spring making electrical contact with the thick film heating element. Electronic means or components for switching or controlling the supply of current to the heating element may be mounted adjacent the inlet of the fluid channel for cooling. Electronic devices or components may be mounted directly on the thick film heating element. The terminal adapted for ground connection may be integrally formed with the channel plate and may be bent out of the plane of the channel plate or may be integrally formed with the thick film heating element.

Description

Flow-through heater apparatus

Technical Field

The present invention relates to flow-through heaters and, in particular, to thick film flow-through heaters.

Background

Flow-through heaters heat a fluid as it flows through the heater. These may be used for example for continuously or near instantaneously dispensing hot or boiling water for example for a hot water dispenser or a coffee machine.

The flow-through heater described in patent publication GB-a-2481265 comprises a channel plate brazed to a planar thick film heating element. The thick film heating element comprises a substrate of a material (e.g. metal) having good thermal conductivity properties, an electrically insulating layer (e.g. enamel) and at least one resistor track applied by thick film technology. The channels formed between the channel plate and the planar heating element direct the fluid to be heated in a path corresponding to the layout of the heating traces on the thick film heater. The low thermal mass of this type of flow-through heater (FTH) provides a fast response and very controllable heater.

The channel plate of the heater disclosed in GB-a-2481265 is circular and the channels have a circular spiral form to maximise the radius of curvature in the channels and reduce the pressure drop along the channels. The heater trace aligned with the channel also has a circular spiral form, which reduces the problems associated with tight bends in the heater trace.

The flow-through heater may include associated electronic components, for example to provide temperature sensing and/or control. The electronic components may control an E-fast (TM) sensor as disclosed in EP-A-1828068. In conventional arrangements, the electrical connection between the electronic component and the thick film heating element is achieved using a spring which may comprise a silver contact pressed against a contact pad on the heating element. The spring has terminals that can be connected to a Printed Circuit Board (PCB) using wires fitted with sockets for receiving the terminals.

Flow-through heaters are relatively high power devices, and many applications of such heaters require that the temperature of the heater be controlled within certain limits. This is typically accomplished by using an NTC thermistor to measure the temperature of the output fluid and switching (e.g., using a Triac, thyristor, or similar electronic device) the current supply to the heating traces in response to the measured temperature. These devices should be maintained below a critical temperature and are typically mounted on a heat sink to facilitate cooling. The heat sink adds weight and cost to the heater.

High power flow-through heaters typically require a ground connection in order to meet safety standards. In a conventional FTH provided by fisher technologies (Ferro Techniek BV), the ground is connected to the conductive base plate of the heater by an eyelet connector, screws and locking washers.

SUMMERY OF THE UTILITY MODEL

In one aspect of the utility model, a flow-through heater comprises: a thick film heating element; and a channel plate attached to the thick film heating element to form a fluid channel having a planar square or rectangular spiral shape. Advantageously, this allows the size of the heating element to be reduced for a given heating zone, thus also reducing the material required. In heater applications (e.g., espresso machines), any pressure drop caused by a right angle bend in the spiral may be insignificant.

In another aspect of the present invention, there is provided a flow-through heater comprising: a thick film heating element having a PCB connected thereto by one or more connectors, each connector having a first end connected directly to the PCB and a second end comprising a spring making electrical contact with the thick film heating element.

In another aspect of the present invention, there is provided a flow-through heater comprising: a thick film heating element and a fluid channel, wherein an electrical switching or control component is mounted adjacent to the inlet of the fluid channel in order to cool the component. Advantageously, this may eliminate the need for a heat sink and may provide more efficient cooling.

In another aspect of the utility model, a flow-through heater is provided comprising a thick film heating element and a fluid channel, wherein electronic components are mounted directly on the thick film heating element, for example by printing or surface mounting.

In another aspect of the present invention, there is provided a flow-through heater comprising: a thick film heating element; and a channel plate attached to the heating element to form a channel for fluid heated by the heating element, wherein the channel plate comprises integral terminals that can be bent away from the plane of the channel plate for forming a ground connection.

Drawings

Preferred embodiments of the present invention will now be described in detail, by way of example only, with reference to the accompanying drawings identified below.

FIG. 1 is a perspective view of a thick film flow-through heater in an embodiment of the utility model, as viewed from above the channel plate.

Fig. 2 is an exploded view of the embodiment as seen from below the channel plate.

Fig. 3 shows a PCB connected to a bracket of the heater in an embodiment.

Fig. 4 shows a bracket with terminals for connection to a PCB.

Fig. 5 shows a portion of a bracket with a push-fit pin for connection to a PCB in an alternative embodiment.

Fig. 6a shows a channel plate including terminals for use in a heater in an embodiment of the utility model.

Fig. 6b shows details of the terminal at a later stage of the manufacturing process.

Detailed Description

FTH with square spiral channel

Fig. 1 shows a thick film heater in an embodiment of the utility model comprising a channel plate 10 attached (e.g. by brazing or welding) to a thick film heating element 11 to form a fluid channel 12 therebetween. The tubes 6 are attached to corresponding apertures in the channel plate 10, which serve as inlets and outlets for the fluid channels 12. Preferably, either tube 6 can be used as an inlet, while the other tube is used as an outlet.

The thick film heating element 11 comprises a substrate which may be substantially planar and one or more electrically heated (e.g. resistor) traces deposited on the substrate using a thick film printing or deposition process. The substrate may be a thermally conductive material, for example, a metal. In the case of a substrate that is electrically conductive, an electrically insulating layer may be applied to the surface of the substrate to electrically insulate the trace from the substrate before the electrically heated trace(s) are deposited. The electrically insulating layer should have reasonable or good thermal conductivity properties and may for example comprise enamel. Alternatively, the substrate may be an electrically insulating material, e.g. a ceramic. Preferably, a further electrically insulating layer is applied over the heating tracks to electrically insulate and protect the tracks.

The channel plate 10 is preferably attached to the side of the substrate opposite to the side on which the heating trace(s) are deposited. Thus, the heating trace(s) and electrically insulating layer may be deposited before or after the channel plate 10 is attached to the substrate. The face of the substrate to which the channel plate 10 is attached may be referred to as the wet side of the substrate and the face on which the heating trace(s) are deposited may be referred to as the dry side.

The fluid channel 12 has a planar spiral form extending in one direction (e.g., clockwise) from one aperture towards the center C of the channel plate 10 and thereby in the opposite direction (e.g., counterclockwise) from the center C to the other aperture. In this embodiment, the helix is square or rectangular, comprising linear segments, each connected at right angles to the next by a bend extending through the right angle in the direction of the helix (i.e., clockwise or counterclockwise). Preferably, the channel plate 10 is also square or rectangular corresponding to the shape of the fluid channel 12. Preferably, the thick film heating element 11 is also square or rectangular corresponding to the shape of the channel plate 10.

The inventors have found that in certain applications, the pressure drop across the fluid channel 12 is relatively insignificant. For example, in an espresso-type coffee machine, there is a large pressure drop across the coffee grounds, so that a relatively small increase in the pressure drop across the flow-through heater has little effect. On the other hand, the use of a square or rectangular shape significantly reduces the space and material requirements of the flow-through heater. For example, for a given heating area of the thick film heating element 11, the entire square shaped side will be reduced by more than 10% compared to the diameter of the circular shape, and the area of material used will be reduced by the square of this reduction, for example 21.5%.

Connection of components to thick film heating elements

In at least some embodiments of the utility model, the flow-through heater may include associated electronic components, for example, to provide temperature sensing and/or control. In one example, the electronic components may work with E-fast (TM) sensors as disclosed in EP-A-1828068. The electronic components may be mounted on a Printed Circuit Board (PCB)7, the PCB 7 being mounted on one side of the support 8 and a thick film heating element 11 being mounted on the other side of the support 8. The bracket 8 may be made of molded plastic or other suitable material. The bracket 8 may be used to mount the flow-through heater in an appliance.

The electrical connection between the PCB 7 and the thick film heating element 11 may be achieved by connector springs 3, each connector spring 3 having a terminal end 3a which is directly connected to the PCB 7, for example by soldering into a hole in the PCB 7, and a spring end 3b which makes electrical contact with a surface pad on the thick film heating element 11. As shown in fig. 4, each of the connector springs 3 may be mounted in a respective spacer 13 in the bracket 8 with the terminal ends 3a passing through corresponding slots in the bracket 8 to make contact with the PCB 7. The connector springs 3 may be secured within their respective dividers 13, for example by pins extending into apertures in the connector springs 3.

Alternatively, the terminal end 3a may comprise a push-fit pin 9, for example as shown in fig. 5, the push-fit pin 9 forming a press-fit connection into a corresponding connector aperture in the PCB 7. Examples of such push-fit techniques are available under the Elopin (TM) and Isofit (TM) brands.

Instead of using the bracket 8, the PCB 7 may be mounted directly to the thick film heating element 11, preferably spaced from the thick film heating element 11 using spacers or lugs which may form part of the thick film heating element 11.

Mounting electronic devices

In at least some embodiments of the utility model, the thick film heater includes one or more electronic devices 2, e.g., triacs, thyristors, or similar devices, for switching or controlling the current supplied to the thick film heating trace(s). The electronic device(s) 2 may be controlled in response to a temperature sensor (e.g., a thermistor). The electronic device(s) 2 may be mounted directly on the dry side of the substrate of the thick film heating element 11, preferably in a position opposite the fluid channels 12, such that the passage of fluid through the substrate cools the electronic device, and most preferably in a position opposite a portion of the fluid channels where the fluid is cool (e.g. the inlet of the fluid channels 12). The electronic device(s) 2 may then be directly connected to the heater trace(s), for example by soldering. Alternatively, the electronic device(s) may be mounted on the channel plate 10 in a position adjacent to the inlet so that the fluid cools the device through the channel plate 10.

Other types of electronic devices or components (e.g., NTC thermistors) may additionally or alternatively be mounted directly on the dry side of the substrate. The electronic device or component may have a surface mount configuration that allows direct connection to the trace(s) on the substrate. Alternatively or additionally, electronic devices or components (e.g. NTC resistors, thermal fuses or thermal protectors such as disclosed in WO-A-2008/150171) may be printed onto the dry side of the substrate. As described above, the traces may additionally be connected to the PCB 7.

Terminal for ground connection

In at least some embodiments of the present invention, the channel plate 10 may include a terminal 14 for forming a ground connection. In one embodiment shown in fig. 6a and 6b, the terminals 14 are formed as part of the sheet material of the channel plate 10, said part having a partial cut-out, so that the terminals can be bent away from the plane of the channel plate 10, for example in the form of tabs, in order to allow connection to a ground connector. As shown in fig. 6a, the terminals 14 may be bent substantially perpendicular to the channel plate 10, and optionally bent back to be substantially parallel to the channel plate 10, but raised above the channel plate 10, as shown in fig. 6 b.

The terminal 14 may be bent after the channel plate 10 has been attached to the element substrate by brazing, for example, to avoid interference with a machine used to perform the attachment.

Alternatively, the terminals 14 may be integrally formed as part of the thick film heating element, although this may be less advantageous as it may not be possible to bend the terminals away from the plane of the substrate after the heater is manufactured. Rather, the terminals 14 may be formed as projections or tabs extending in the plane of the substrate to which the edge connector may be connected.

Alternative embodiments

In some embodiments, individual features as described above may be combined or omitted. Upon reading the above description, one skilled in the art may contemplate alternative embodiments that still fall within the scope of the appended claims.

Claims

1. A flow-through heater apparatus, comprising:

a thick film heating element;

a channel plate attached to the thick film heating element to form a fluid channel between the channel plate and the thick film heating element; and

at least one electronic device or component for switching or controlling the supply of electrical current to the thick film heating element, the at least one electronic device or component being mounted adjacent the fluid channel.

2. The flow-through heater apparatus of claim 1, wherein the at least one electronic device or component is mounted adjacent to an inlet of the fluid channel.

3. The flow-through heater apparatus of claim 1 or 2, wherein the at least one electronic device or component is mounted on the thick film heating element.

4. The flow-through heater apparatus of claim 1 or 2, wherein the at least one electronic device or component is mounted on the channel plate.

5. The flow-through heater apparatus of claim 1 or 2, wherein the at least one electronic device or component comprises a triac or thyristor.

6. A flow-through heater apparatus comprising:

a thick film heating element;

at least one electronic device or component mounted on the thick film heating element.

7. The flow-through heater apparatus of claim 6, wherein the at least one electronic device or component is mounted on a side of the thick film heating element opposite the channel plate.

8. The flow-through heater apparatus of claim 6, wherein the at least one electronic device or component is printed on the thick film heating element.

9. The flow-through heater apparatus of claim 8, wherein the at least one electronic device or component comprises an NTC resistor.

10. The flow-through heater apparatus of claim 8, wherein the at least one electronic device or component comprises a thermal fuse.

11. The flow-through heater apparatus of claim 6 or 7, wherein the at least one electronic device or component is surface mounted on the thick film heating element.

12. A flow-through heater apparatus, comprising:

a thick film heating element;

a terminal integrally formed with the channel plate.

13. The flow-through heater apparatus of claim 12, wherein the terminal is bent away from a plane of the channel plate.

14. A flow-through heater apparatus, comprising:

a thick film heating element;

a terminal integrally formed with the thick film heating element.

15. The flow-through heater apparatus of claim 14, wherein the terminals protrude from the thick film heating element in the plane of the substrate of the thick film heating element.