JP6280519B2 - Electronic component temperature characteristic evaluation apparatus and temperature control unit used therefor - Google Patents

Description

  The present invention relates to the temperature of electronic components in a broad sense including circuit boards, wiring materials, etc. in addition to individual components (narrow sense electronic components) such as ICs on circuit boards on which LEDs, ICs, LSIs, resistors, etc. are mounted. The present invention relates to a temperature control unit used for characteristic evaluation, a temperature characteristic evaluation apparatus for an electronic component using the same, and a temperature characteristic evaluation method thereof.

  In recent years, with the miniaturization of portable devices such as smartphones and portable terminals, a large number of electronic components tend to be mounted on circuit boards. In addition, LSIs and ICs are becoming smaller and more sophisticated year by year according to Moore's Law, and the problem of heat generation is becoming more apparent. Especially when high-performance LSIs and ICs are mounted, these electronic components may become quite hot due to their operation, and are damaged by the temperature rise of the electronic components, surrounding electronic components, and the circuit board itself. Exposed to danger. In order to solve such a problem, a heat sink is attached to an electronic component that is particularly likely to generate heat to make it easy to dissipate heat, or a blower is provided nearby to perform air cooling.

  On the other hand, even in the same IC or LSI, the heat generation state changes depending on the use environment or use conditions, and the heat resistance of the IC or LSI also differs. Therefore, even when it is not necessary, a radiation fin may be provided, a blower may be installed, or a space between parts may be secured. Such excessive heat dissipation measures are contrary to the demand for downsizing of electronic devices, and also cause an increase in cost. Therefore, it is necessary to know the temperature characteristics of the electronic component in the mounted state.

  As a countermeasure for the temperature of such electronic components, for example, as shown in the summary of Patent Document 1, a cooling cycle apparatus having a cooling flow path for circulating a compressor, a condenser, an expander, and an evaporator (heat sink), and A temperature control device having a heat conduction block for connecting the heat sink and the electronic component, a heater for heating the heat conduction block, and the like is known. A temperature sensor is attached to the heat conduction block so that the temperature of the electronic component is controlled.

  Further, in Patent Document 2, a pusher body that can be in direct contact with an electronic component, a heat sink that is provided in the pusher body, and a pusher body that can be in direct or indirect contact with an electronic component to be tested. There is disclosed an electronic component handling device including a heater and a heat insulating material provided between the pusher body and the heater.

JP2012-208132A JP 2003-028923 A

  As described above, the electronic component handling apparatus capable of controlling the temperature of the electronic component cannot be used unless the electronic component is in a single state before being incorporated into a circuit board or the like. In other words, evaluation is performed by mounting electronic components on a handler, which is a large-scale device, and controlling the temperature thereof, and it is not possible to evaluate the temperature characteristics of individual electronic components when they are incorporated in an actual circuit board. There is a problem. However, in the mounted state, the characteristics also change depending on the environment and the like, and it is necessary to know the temperature characteristics in a state where the circuit board is actually mounted. In addition, it is necessary to investigate the effect on other electronic components placed near the LSI that generates heat on the circuit board. However, the evaluation of the electronic component alone also knows the effect on other electronic components. I can't.

  Further, in the devices described in the above-mentioned Patent Document 2, these devices are covered with a casing, and the temperature in the casing is adjusted by blowing with a temperature adjusting blower in the casing, and the temperature in the casing is measured. It is configured. In other words, the temperature of each electronic component is not detected and the temperature is not controlled.

  The present invention has been made in view of such a situation. Even when an electronic component or the like is mounted on a circuit board and operated, the temperature of the electronic component is increased or the temperature is increased. Even if the electrical characteristics are not adversely affected, or the temperature of the adjacent electronic components is affected and the characteristics are affected accurately, it contributes to the circuit board design. It is an object of the present invention to provide an electronic component temperature characteristic evaluation apparatus and a temperature control unit used therefor.

  Another object of the present invention is to contribute to the development of power-saving electronic equipment that is friendly to the earth without using wasted energy, in which appropriate design and electronic parts can be designed at the circuit design and prototyping stage of the electronic equipment. There is.

A temperature control unit for evaluating temperature characteristics of an electronic component according to the present invention includes an insulating substrate, a belt-like heating resistor that is formed in parallel in at least two rows on one surface of the insulating substrate, and heats the insulating substrate. At least one pair of electrodes capable of flowing a current in the longitudinal direction of the heating resistors formed in at least two rows, and at least one temperature measurement formed on the insulating substrate between the at least two rows of heating resistors. A resistor and at least a pair of measurement terminals for measuring an electrical resistance between a predetermined length of the temperature measurement resistor, the at least two rows of heating resistors, the pair of electrodes, The temperature measurement resistor and the set of measurement terminals are formed in parallel on the one surface of the insulating substrate so that there are at least two sets, and the temperature measurement is also performed between the two sets of heating resistors. Resistor for It has been made.

  Here, in addition to the individual electronic components in a narrow sense that form a circuit on the circuit board, the electronic component includes a circuit board on which the individual parts are mounted, a part thereof, or a wiring formed on the board. It may include a wide range of parts such as materials (broadly defined electronic parts).

Another embodiment of the temperature control unit for evaluating temperature characteristics of the electronic component of the present invention is an insulating substrate and a belt-like heating resistor that is formed in parallel in at least two rows on one surface of the insulating substrate and heats the insulating substrate. A body, at least a pair of electrodes capable of flowing current in the longitudinal direction of the heating resistors formed in at least two rows, and at least one formed on the insulating substrate between the at least two rows of heating resistors And a heating substrate having at least a pair of measurement terminals for measuring an electrical resistance between a predetermined length of the temperature measuring resistor and the heat generation of the heating substrate. By providing a cover substrate made of the same material as the insulating substrate on the resistor side, it is preferable that the heating substrate is not warped due to a difference in thermal expansion coefficient.

  By providing the cover substrate on the upper surface of the multiple heating substrate in which the heating substrates are stacked in two or more stages, the amount of heat for heating the electronic component can be increased. This lamination can be made in three or more stages. The control units provided with the cover substrate may be stacked in two or more stages. However, in order to eliminate waste of heat, it is preferable that the control units are stacked with the heating substrate from which the cover substrate is removed. The temperature measurement resistor may be provided.

  Two heating substrates may be formed as a multiple heating substrate by bonding the heating resistors facing each other. Waste of heat can be eliminated.

Still another embodiment of the temperature control unit for evaluating temperature characteristics of an electronic component according to the present invention is an insulating substrate and a belt-like heat generating member formed in parallel in at least two rows on one surface of the insulating substrate and heating the insulating substrate. A resistor, at least a pair of electrodes capable of flowing a current in a longitudinal direction of the heating resistors formed in at least two rows, and at least one formed on the insulating substrate between the at least two rows of heating resistors. A heating substrate comprising a plurality of temperature measuring resistors and at least a pair of measuring terminals for measuring an electrical resistance between a predetermined length of the temperature measuring resistors, the at least two rows one ends of the heating resistor to be formed, by being connected through the heating resistor formed at least in part, is formed in a U-shape, at least a portion of the corner portion of the U-shaped Is It is connected by the body layer. By providing the heating resistor at the bottom of the U shape, the heating area is increased and heating can be effectively performed. Further, in the corner portion, the current flowing through the heating resistor is concentrated at the shortest inner distance in the corner portion, and almost no current flows outside the corner portion, so that current concentration occurs. As a result, the heating resistor cannot be uniformly heated and the life is deteriorated. Therefore, it is preferable to use a conductor layer in the corner portion so that current flows uniformly in the straight portion.

  A heat conductive elastic member may be directly formed on the other surface opposite to the one surface of the insulating substrate. The heat conductive elastic member has an outer shape similar to the outer shape of the electronic component, so that the temperature of the electronic component can be accurately measured, and more reliably and quickly desired when the electronic component is heated. Easy to raise the temperature.

Still another embodiment of the temperature control unit for evaluating temperature characteristics of an electronic component according to the present invention is an insulating substrate and a belt-like heat generating member formed in parallel in at least two rows on one surface of the insulating substrate and heating the insulating substrate. A resistor, at least a pair of electrodes capable of flowing a current in a longitudinal direction of the heating resistors formed in at least two rows, and at least one formed on the insulating substrate between the at least two rows of heating resistors. A plurality of temperature measurement resistors, at least a pair of measurement terminals for measuring an electrical resistance between the predetermined lengths of the temperature measurement resistors, and a cover substrate formed on the surface side of the heating resistor The mounting board is fixed on the cover substrate, the heating substrate is pressed against an electronic component to be evaluated for temperature characteristics, and the electronic component is attached. The mounting plate is fixed on the cover substrate of the control unit, which is convenient when pressing the temperature control unit against the electronic component.

  A temperature characteristic evaluation apparatus for a circuit board or an electronic component mounted on a circuit board according to the present invention includes the temperature control unit according to any one of claims 1 to 9 and a temperature measurement unit formed in the temperature control unit. A temperature detecting means for detecting the temperature of the insulating substrate of the temperature control unit based on a resistance change of the resistor; and a current is passed through the heating resistor formed in the temperature control unit to set the temperature of the insulating substrate to a predetermined temperature. Temperature control means for controlling the temperature control unit, and a heat conductive elastic member formed on the other surface of the insulating substrate of the temperature control unit or a heat conductive elastic sheet prepared separately, and the insulation of the temperature control unit The other surface side of the substrate is in close contact with the electronic component mounted on the circuit board via the thermally conductive elastic member or the thermally conductive elastic sheet, and measures the temperature of the electronic component or a specific A device for evaluating the temperature characteristics of the electronic components when the temperature of the child component to a predetermined temperature.

  The method for evaluating temperature characteristics of a circuit board according to the present invention is a method for evaluating an electronic component incorporated in a circuit board or a temperature characteristic of the circuit board, wherein the electronic component mounted on the circuit board is operated, and the circuit The temperature control unit according to any one of claims 1 to 9 is pressed against an electronic component mounted on a substrate or the circuit board via a heat conductive elastic member or a heat conductive elastic sheet, and the electronic component or Utilizing the temperature control of the electronic component mounted on the circuit board or the circuit board by examining the relationship of the electrical characteristics with respect to the temperature of the electronic component or the circuit board while changing the temperature of the circuit board. It is characterized by.

  Utilizing the temperature control of the circuit board includes providing cooling means so that the ambient temperature of the circuit board is lower than a predetermined temperature, and the highest input at which the temperature of the electronic component can operate at a predetermined temperature or lower. Operating in a state, or investigating the cause of the deterioration of the heat dissipation characteristics of the electronic component.

  In the control unit for evaluating the temperature characteristics of the electronic component of the present invention, at least two heating resistors are provided in parallel on an insulating substrate, and a temperature measuring resistor is formed between the two heating resistors. Has been. This insulating substrate is formed, for example, approximately in accordance with the size of the electronic component whose temperature characteristics are to be evaluated. Accordingly, the temperature measuring resistor is provided not at least on the end side of the electronic component but on the central portion. Therefore, it is possible to measure the temperature of electronic parts and the like very accurately. That is, the temperature of the end portion of the insulating substrate of the control unit tends to be measured low because heat easily escapes to the outside. However, in the present invention, since the temperature measuring resistor is formed between the parallel heating resistors, when the temperature is increased, the substrate temperature is more accurate without receiving heat dissipation at the end. Is measured. In other words, when used as a heating head for recording or transfer, the temperature is considerably raised to, for example, about 400 ° C. or more, and there is a slight temperature difference between the center and the end of the substrate. However, since the temperature is raised to the required temperature based on the temperature of the measurement unit, an absolute temperature is not required, but as in the present invention, the temperature of the electronic component or the like is not increased so much, and If you want to know exactly, you need to measure the temperature accurately in the center without being affected by the temperature escape. From this point of view, it is very effective to provide a temperature measuring resistor between at least two heating resistors. That is, an accurate temperature can be measured, and the amount of heat to be heated can be minimized, which contributes to power saving without reducing the function. When heating an electronic component and the temperature cannot be raised to a desired temperature, two such control units can be used one above the other or a multiple heating substrate can be used. .

  Since the control unit of the present invention includes a heating resistor and a temperature measuring resistor, only the temperature measuring resistor is used without operating the heating resistor when it is desired to know the temperature of the electronic component. By operating it, the temperature of the electronic component or the like can be known. In addition, if you want to know how many times the electronic component rises, the characteristics of the electronic component will be affected, apply the temperature control unit to the electronic component and measure the temperature while operating the heating resistor. The temperature of the electronic component can be gradually increased. Further, it is possible to check how long the electronic component can be operated without being affected by maintaining the electronic component at a predetermined temperature. Furthermore, by operating the circuit board, it is possible to investigate the influence on the electronic component adjacent to the electronic component whose temperature rises and the temperature rise of the circuit board itself.

  In addition, according to the circuit board of the present invention or the temperature characteristic evaluation apparatus for electronic components mounted on the circuit board, the control unit itself can be formed in a very small size or a large size. By using the control unit in which the insulating substrate is used, even the electronic component arranged in a narrow place can directly press the part of the control unit against the electronic component. As a result, accurate temperature control can be performed even with an electronic component placed in a place where the electronic component is complicated.

  Furthermore, according to the temperature characteristic evaluation method for a circuit board or an electronic component mounted on the circuit board of the present invention, it is detected that the temperature of a certain electronic component rises so as to be unable to maintain a predetermined characteristic, for example, in a prototype at the design stage. In this case, the cooling means can be provided so that the temperature of the electronic component is equal to or lower than a predetermined temperature. Moreover, it can also be designed to operate in the highest input state in which the temperature of the electronic component can operate at a specified temperature or lower. That is, it is possible to design so that the function of the electronic component can be utilized to the maximum extent. Furthermore, it can be changed to an electronic component having excellent heat dissipation characteristics in place of the electronic component at the design stage. In this way, while making a prototype at the design stage, it is possible to change the design parameters and design optimally.

It is a plane explanatory view showing one embodiment of a temperature control unit for temperature characteristic evaluation of electronic parts of the present invention, and its BB sectional view. It is a figure which shows the example of formation of the pattern of the heating resistor of FIG. It is a figure which shows the other example of a pattern of the heating resistor of FIG. It is an example of a pattern in case the insulating substrate of the control unit of FIG. 1 is large. It is a figure which shows the example which overlapped the heating substrate shown by FIG. 1, and was set as the multiple heating substrate. It is the side view, rear view, and top view of one embodiment of the temperature control unit of the present invention. FIG. 4 is a schematic diagram for controlling the temperature of an electronic component mounted on a circuit board, where (a) is a diagram showing an example of the circuit board, and (b) is a state in which the electronic component is mounted and the control unit is in close contact therewith. FIG. It is a figure which shows the example of a circuit which drives the heating resistor of FIG. It is a circuit diagram which shows an example of substrate temperature control.

  Next, a temperature control unit for evaluating temperature characteristics of an electronic component and an apparatus for evaluating temperature characteristics of an electronic component using the same according to the present invention will be described with reference to the drawings. FIG. 1 is an explanatory plan view showing an embodiment of a temperature characteristic evaluation control unit according to an embodiment of the present invention, and an explanatory view of the B-B cross section thereof. As shown in FIG. 1, strip-shaped heating resistors 2 for heating the insulating substrate 1 are formed in parallel on at least two rows on one surface of the insulating substrate 1, and the length of the heating resistors 2 formed in the two rows is formed. At least a pair of electrodes 3 capable of flowing a current in the direction are connected. Then, at least one temperature measuring resistor 4 is formed on the insulating substrate 1 between at least two rows of the heating resistors 2, and the electric resistance between the temperature measuring resistors 4 for a predetermined length is measured. At least a pair of measurement terminals 5 are connected. Thus, the heating substrate 10a is formed. Further, the temperature control unit 10 is formed by bonding the cover substrate 6 to the surface side of the heating resistor 2 by the glass adhesive layer 9.

  FIG. 1 shows only the configuration of the main part such as the arrangement of the heating resistor and the temperature measuring resistor. However, as shown in FIG. 6, lead wires 31 and 51 are also connected as the control unit 10, and the temperature of the insulating substrate 1 of the temperature control unit 10 is detected based on the resistance change of the temperature measuring resistor 4. Temperature detection means, and temperature control means for controlling the temperature of the insulating substrate 1 to a predetermined temperature by passing a current through the heating resistor 2. The electronic component temperature characteristic evaluation apparatus includes these temperature detection means and temperature control means, and has a specific circuit for causing a heating resistor to generate heat by flowing a current and measuring the temperature. And a circuit for calculating the temperature of the insulating substrate from the change in the resistance value of the temperature measuring resistor. The operation of these control units will be described later. As this temperature control means, the same one as a heating control unit of a general heating head used for printing or erasing cards can be used.

  That is, the temperature control unit for evaluating the temperature characteristics of the electronic component of the present embodiment has the same structure as a conventional heating head used for recording or erasing on a card or the like. A heating resistor 2 and a temperature measuring resistor 4 are provided. However, the present invention is characterized in that the heating resistors 2 are provided in parallel in at least two rows, and the temperature measuring resistors 4 are provided between the two rows of heating resistors 2. The meaning of “at least two rows” means that it is only necessary to have a portion in parallel. As shown in FIG. 1A, one end of each of the two heating resistors 2 is a connection conductor 7. The connected ones may be arranged side by side, and as shown in FIG. 2A, one heating resistor 2 may be bent in a U shape to form a parallel portion. As shown in FIGS. 3A to 3B, they may be connected via some of the heating resistors 2a and 2b. In the structure shown in FIG. 1 (a), one end of each of the two heating resistors 2 is connected by a connecting conductor 7, and the electrodes 3 provided at the other ends are a pair of electrodes. However, separate or common electrodes 3 are provided in place of the connection conductors 7 so that different voltages or the same voltages are applied to the electrodes 3 at the other ends of the two heating resistors 2. You can also. Furthermore, the resistance value or width can be partially changed, or the electrode terminal can be taken out from the intermediate portion so that the temperature can be partially changed. In particular, non-uniform heating is facilitated by using a U-shape. Further, the present invention is characterized in that the temperature measuring resistors 4 are provided between the heating resistors 2 provided in two rows in parallel. By providing the temperature measuring resistor 4 in this way, the temperature of the insulating substrate 1 and thus the temperature of the electronic component to be evaluated can be accurately controlled.

  As the insulating substrate 1, an insulating substrate made of alumina or the like and having excellent thermal conductivity is used. The shape and dimensions are preferably the shape of the electronic component to be evaluated and are formed in a slightly smaller size. However, when the shape of the electronic component is circular or complex, as will be described later, the heat conductive elastic member 11 (see FIG. 6) is matched to the shape of the electronic component even if the insulating substrate 1 is rectangular. Can do. In order to avoid dissipating the heat of the electronic component through the insulating substrate 1, it is preferable to make the shape slightly smaller than the electronic component in accordance with the shape of the electronic component.

The heating resistor 2 is formed, for example, by selecting a powder such as Ag + Pd + RuO ₂ + Pt + metal oxide + glass, applying it in a paste form, and baking it. The sheet resistance of the resistance film formed by firing is changed depending on the amount of the solid insulating powder. The resistance value and the temperature coefficient can be changed according to the ratio of the two. In addition, as a material used as the conductor (electrodes 3 and 5, connection conductors 7 and 8, and connection conductors 7a and 7b), the same paste-like material in which the ratio of Ag is increased and Pd is decreased is used. By doing so, it can be formed by printing in the same manner as the heating resistor. The operating temperature can be changed by connecting the terminals. The more Ag, the lower the resistance. It is preferable that the resistance temperature coefficient of the heat generating resistor 2 is exactly high, and it is particularly preferable to use a material of 1000 to 3500 ppm / ° C. Although not shown, by providing electrodes at appropriate positions along the longitudinal direction of the heating resistor 2, a voltage can be applied partially, and the temperature can be changed depending on the location, It can also be heated to a uniform temperature within the insulating substrate.

  The fact that the temperature coefficient of resistance is positively large means that the resistance value increases greatly when the temperature rises. Therefore, it is easy to detect the actual heat generation temperature due to deviation from the reference resistance value by measuring the resistance value in the heated state. It is easy to correct the deviation from the desired heat generation temperature by adjusting the applied voltage or adjusting the duty of the applied pulse. Also, since the temperature coefficient of resistance is positive, if the temperature rises too much, the resistance value increases, the current value decreases, and the amount of heat generated by the resistance decreases, so the temperature becomes saturated sooner, This is because it is excellent in temperature stability and can prevent overheating due to thermal runaway. In addition, the width of the heating resistor 2 is not limited to the above-described example, and may be set according to the application and may be arranged in parallel.

  In addition, electrodes 3 and connection conductors 7 made of a good conductor such as a silver / palladium alloy or an Ag—Pt alloy with a reduced palladium ratio are printed on both ends of the heating resistor 2. As shown in FIG. 6 which will be described later, the electrode 3 has a structure in which a lead 31 is connected and a power source is connected to energize the heating resistor 2. This power source may be a direct current, an alternating current, or a pulse voltage. If it is a pulse voltage, the applied power can be controlled by changing its duty.

  In the example shown in FIGS. 1 and 2, the electrode 3 and the connection conductor 7 are formed on the lower side of the heating resistor. However, in this vertical relationship, as shown in FIG. 3, the heating resistor 2 may be formed on the lower side, and the electrodes 3 and the connecting conductors 7a and 7b may be formed on the upper side. FIG. 3 shows an example in which the vertical relationship between the heating resistor 2 and the electrode 3 in FIGS. 2B to 2C is reversed.

  In the example shown in FIG. 1, two linear heating resistors 2 are formed in parallel, the electrodes 3 at the other end portions are formed, and one end portions are connected by the connection conductor 7. As shown in FIG. 2A, even if one heating resistor 2 is bent and formed in a U-shape, the portions other than the corner portion are formed in a straight line in parallel. Thus, even when the heating resistor 2 is bent in a U shape, it is preferable that the connecting conductors 7a and 7b are provided at least in the corner as shown in FIGS. 2 (b) to 2 (c). . This is because, at the corner portion, the current is concentrated on the inner portion where the path is short and the resistance is small, the current on the outer peripheral side is reduced, and uniform heat generation is difficult. As shown in FIG. 2B, the connection conductor 7a is provided in the entire corner portion, so that the current flowing in parallel through the heating resistor 2 having a certain width is uniformly distributed throughout the connection conductor 7a. Therefore, the current flows even in the heat generating resistor 2a at the bottom, and the other heat generating resistor 2 in the parallel relationship also flows through the whole and can be heated uniformly. As a result, only the bottom heating resistor 2a is connected to the two parallel heating resistors in the same manner as the heating resistor 2 shown in FIG. It is done.

  In the example shown in FIG. 2C, the heating resistor 2 is formed only inside the corner portion, and the outer peripheral side of the corner portion is formed by the connecting conductor 7b. By forming the connecting conductor 7b on the outer periphery of the corner portion where the resistance is increased, similarly to the example of FIG. 2B, the current at the corner portion is made uniform, and the heating resistor of the connecting portion is formed. It becomes easy to obtain a uniform current in 2b. The examples shown in FIGS. 3A to 3B are the same as those shown in FIGS. 2B to 2C. As described above, the electrode 3 and the connecting conductors 7a and 7b are made of the heating resistor 2. It is an example formed in the upper side. Since the heating resistor 2, the electrode 3, and the like are formed by screen printing, different materials are formed in different printing processes, either of which may be formed first.

  The temperature measuring resistor 3 is formed between two heating resistors 2 as shown in FIG. In the example shown in FIG. 1A, similarly to the heating resistor 2, two temperature measuring resistors 4 are provided in parallel, and one end of each is connected to the measuring terminal 5, The other end is connected by a connection conductor 8. As a result, the temperature of the insulating substrate 1 can be known from the change in resistance by applying a voltage between the measuring terminals 5 connected to one end of each of the two temperature measuring resistors 4. it can. A method for measuring this temperature will be described later.

  The temperature measuring resistor 4 may be formed of the same material as that of the heat generating resistor 2, but a material having as large an absolute value (%) of a temperature coefficient as possible is preferable. This temperature measuring resistor 4 does not generate heat, but detects the temperature of the insulating substrate 1 to estimate the temperature of the electronic component to be evaluated. For example, it has a width of 0.5 mm and is slightly larger than the heating resistor 2. It is formed with a short length. Further, the applied voltage is kept low so that the temperature measuring resistor 4 itself does not generate heat, and, for example, about 5 V is applied. That is, since the temperature measuring resistor 4 is directly provided on the insulating substrate 1, both temperatures are almost the same. By measuring the temperature of the temperature measuring resistor 4, the temperature of the surface of the insulating substrate 1 is measured. As a result, the temperature of the evaluation electronic component that is in close contact with the insulating substrate 1 can be estimated. Although the temperature detecting means will be described later, the temperature of the temperature measuring resistor 4 is detected by detecting the voltage change at both ends of the temperature measuring resistor 4, so that the larger the temperature coefficient, the smaller the measurement error. be able to. In this case, the temperature coefficient may be positive or negative.

  The temperature measuring resistor 4 is not limited to the same material as the heating resistor 2 and is formed by printing or the like depending on the application. That is, when a very small temperature difference is required, it is possible to change the mixing ratio of Ag and Pd or use a completely different material having a large temperature coefficient. The measurement terminal 5 and the connection conductor 8 of the temperature measuring resistor 4 are also formed of a highly conductive material in which Ag is increased and Pd is decreased, as in the case of the heating resistor 2. The formation of the temperature measuring terminal 5 is not necessarily provided at the end of the temperature measuring resistor 4. For example, as shown in FIGS. 2 (a) to 2 (c), the temperature measuring resistor 4 is formed in a single U-shape, and the temperature measuring terminal is interposed from the middle through the measuring lead 5e. 5c and 5d are formed, and the measurement terminals 5a and 5b connected to both ends are formed, thereby enabling local temperature measurement. That is, by using the measurement terminal 5a and the measurement terminal 5c, the temperature of about 1/3 of the U-shaped temperature measurement resistor 4 on the measurement terminal 5a side can be measured. By measuring using 5c and the measurement terminal 5d, the temperature in the vicinity of the U-shaped corner can be measured. Furthermore, by measuring using the measurement terminal 5d and the measurement terminal 5b, it is possible to measure the temperature of the remaining one third of the temperature measurement resistor 4. Furthermore, by measuring with the measurement terminal 5a and the measurement terminal 5b, the average temperature of the insulating substrate 1 as a whole can be measured. The number of the measurement terminals is not limited to a position of about 1/3, and can be provided more finely or roughly. In particular, when the insulating substrate 1 is large, the temperature may vary depending on the position of the insulating substrate 1, so it is preferable to provide measurement points in detail. This measurement position is preferably performed in the vicinity of the heating resistor 2.

  The temperature measuring resistor 4 is formed in accordance with the size of the insulating substrate 1 (control unit 10), a uniform temperature, a temperature gradient, or partial heating. And the position of the measurement terminal 5 are set. Further, the heat generating resistor 2 and the temperature measuring resistor 4 are not directly provided on the insulating substrate 1, and there are cases in which about two to three thermal insulating layers (grace layers) 6 are provided by screen printing or the like. However, when the other surface side of the insulating substrate 1 is applied to the electronic component, it is preferable that there is no glaze layer so that heat is easily transmitted to the other surface side.

  In the example described above, two heating resistors 2 are provided in parallel, and two temperature measuring resistors 4 are provided between them. However, as shown in FIG. A structure in which the heating resistors 2 are provided in parallel and the temperature measuring resistor 4 is provided between the heating resistors 2 may be employed. The number of heating resistors 2 is adjusted or the width of each heating resistor 2 is adjusted according to the size of the electronic component evaluated by the insulating substrate 1. At this time, as described above, by changing the width of each heating resistor 2 in parallel, the heating resistor 2 to be energized can be selected to obtain a desired amount of heat generation as a whole. Easy to adjust to temperature. Of course, the temperature adjustment can be changed according to the voltage to be applied or the duty cycle in the case of pulse driving without being adjusted by the heating resistor 2.

  Thus, the heating substrate 10a is formed by forming the heating resistor 2, the temperature measuring resistor 4, the electrode 3, and the measuring terminal 5 on one surface of the insulating substrate 1. The control substrate 10 of the present invention is formed by attaching the cover substrate 6 to the surface side of the heating substrate 10a via the glass adhesive layer 9 (see FIG. 1). The cover substrate 6 is a ceramic substrate similar to the insulating substrate 1 and having a thickness of about 0.6 mm, making it difficult to dissipate heat and preventing warping of the insulating substrate 1 based on the difference in thermal expansion coefficient. I am trying. Therefore, although the thermal conductivity may be smaller than that of the insulating substrate 1, it is preferable that the insulating substrate 1 has the same material and the same thickness. On the other hand, when a sufficient calorific value cannot be obtained with this control unit, a multiple heating substrate 10b may be used as shown in FIG. The amount of heat can be increased simply by stacking control units. In such a case, it is preferable that the cover substrate 6 also has a thermal conductivity comparable to that of the insulating substrate 1.

  In the example shown in FIG. 5A, two heating substrates 10a each having a heating resistor 2, a temperature measuring resistor 4 and an electrode 3, a measuring terminal 5 and the like formed on an insulating substrate 1 are stacked. This is an example of a multiple heating substrate 10b bonded by an adhesive layer 9 and having a cover substrate 6 bonded to the surface thereof. Thus, by laminating | stacking the heating board | substrate 10a in two or more steps, heat capacity becomes large and the temperature of an electronic component can be made into desired temperature.

  The example shown in FIG. 5B is an example in which the heating substrate 10a described above is joined with the heating resistor 2 facing each other, and in this way, the heat generation amount of the two heating substrates 10a can be used without waste. Can be used. In this case, the insulating substrate 1 on the opposite side to the insulating substrate 1 to be in close contact with the electronic component is used instead of the cover substrate 6 described above. Therefore, a material having a low thermal conductivity can be used for the insulating substrate 1. In the structure shown in FIG. 5B, another heating substrate 10a can be bonded.

  In order to make an electronic component temperature characteristic evaluation apparatus that applies the control unit 10 to an electronic component mounted on a circuit board or the like and evaluates the temperature characteristic of the electronic component, for example, as shown in FIG. A heat conductive elastic member 11 is formed on the other surface of the insulating substrate 1 of the unit 10 (the surface opposite to the surface on which the heating resistor 2 and the like are provided), and is in close contact with the exposed surface of the electronic component so that the heat conduction is performed quickly. It has come to be. For this reason, the heat conductive elastic member 11 is preferably a silicone rubber having excellent heat conduction characteristics, elasticity, and good adhesion. Such a sheet such as silicone rubber may be attached, or may be formed directly on the other surface side of the insulating substrate 1 by printing or the like. Moreover, even if this heat conductive elastic member 11 is not affixed, when a control unit is pressed as another component, it may be pressed on both sides of a heat conductive elastic sheet. As such a heat conductive elastic sheet, a commercially available one can be used.

  In the example shown in FIG. 6, the mounting plate 12 is attached to the surface of the cover substrate 6. The mounting plate 12 is for pressing and fixing the control unit 10 so as to be in close contact with the electronic component. The mounting plate 12 has a mounting hole 12a. However, the mounting plate 12 is unnecessary when there is no space for fixing the mounting plate 12 in relation to the space of the circuit board or the like on which the electronic part cost to be evaluated is mounted. It is preferable because the temperature of the electronic component can be accurately measured by firmly attaching the control unit 10 to the electronic component by the mounting plate 12. However, when there is no space to be fixed by the mounting plate 12, the thermal evaluation is performed by pressing the heat conductive elastic member 11 provided on the back surface of the insulating substrate 1 of the control unit 10 to the electronic component.

  FIG. 7 shows an example in which the temperature characteristics are evaluated by bringing the temperature control unit 10 into close contact with the IC 16 or the like mounted on the circuit board 15. That is, FIG. 7A shows an example of a simplified plan view of the circuit board 15 before the IC 16 is mounted, and FIG. 7B shows the IC 16 mounted on which the temperature control unit 10 is applied. A conceptual diagram of the attached state is shown. In this example, the mounting plate 12 is not attached to the temperature control unit 10, and the temperature control unit 10 is pressed against the IC 16 by pressing means (not shown). Note that reference numeral 18 of the circuit board 15 indicates wiring. In the circuit board 15 in FIG. 7A, for the sake of clarity, only the IC 16 is mounted, but in reality, various electronic components such as other ICs, LEDs, capacitors, resistors are mounted. When other various electronic components are operated, temperature characteristics different from the case of the operation of only one IC 16 are evaluated. The temperature characteristics of each electronic component including the circuit board 15 under such a comprehensive situation can be individually evaluated.

  As described above, electronic components are not limited to discrete components such as ICs and LEDs, but also include, for example, a circuit board 15 on which electronic components are mounted, a printed wiring board, and the like. It may also be necessary to control the temperature at a particular location on the circuit board. Others include batteries, power supply circuits, displays, connectors, and the like. Recently, accidents such as smartphone heat generation have occurred, and it is necessary to know in advance which part of the device will rise to what temperature. By grasping the place where the temperature of the circuit board easily rises and taking measures against the temperature rise, it is possible to prevent a heat generation accident of a portable device such as a smartphone.

  Returning to FIG. 6, in the temperature control unit 10 of the present invention, the heating resistor lead 31 is connected to the electrode 3 (not shown in FIG. 6) of the heating resistor 2, and the temperature measuring resistor 4 Temperature measurement leads 51 are connected to measurement terminals (not shown in FIG. 6) by soldering or the like. Since the leads 31 and 51 are easily broken at the connecting portion, they are fixed by the fixing member 13. The heating resistor and temperature measuring leads 31 and 51 are connected to a control unit (not shown) to measure the temperature of the insulating substrate 1 and to generate heat when a voltage is applied to the heating resistor 2. The application of voltage to the heating resistor 2 is controlled by the temperature detected by temperature measurement, as will be described later.

  The temperature control means (drive circuit) of the temperature control unit 10 shown in FIG. 1 is shown in FIG. That is, this drive circuit is driven by a direct current or alternating current power supply 29. As the power supply 29, a battery, a commercial power supply, or a commercial power supply 29 is adjusted by a transformer or the like to adjust the voltage and application time to adjust the applied power. The driving power is supplied to the electrode 3 (see FIG. 1) connected to the heating resistor 2 via the heater 27. As a result, the AC power supply can be used as it is, and the voltage supplied from the commercial AC power supply 29 is adjusted by the power adjustment unit 27 and adjusted to a desired temperature. As a result, no DC power supply is required, and no power supply cooling fan is required. However, a direct current power source using a battery can also be used. Although not shown, heating can also be performed by pulse driving in which a pulse is applied. In that case, the applied power can be adjusted by changing the duty cycle in addition to changing the voltage. The temperature is measured by measuring the current supplied from the constant current source 25 and the voltage V across the temperature measuring resistor 4 by using the temperature measuring resistor 4. The temperature of the temperature measurement resistor 4, that is, the temperature of the insulating substrate 1 is measured based on the change in the resistance value, and the voltage and the like can be adjusted by the power adjustment unit 27 according to the temperature. The adjusting unit 27 is effective for making the temperature of each heating resistor 2 uniform, particularly when heating a plurality of heating resistors 2 side by side. Therefore, when a plurality of temperature measuring resistors 4 are provided, it is preferable that the temperature in the vicinity thereof is separately measured and the applied voltage or the like is adjusted by each heating resistor 2.

  The principle of this temperature measurement will be described with reference to FIG. 9 which is a little more detailed. For example, a constant current device CCR (current controlled regulator) 25 is connected in series with the temperature measuring resistor 4 at both ends of a measuring power source 21 composed of a DC power source, and the voltage V across the temperature measuring resistor 3 is measured. Then, by dividing the voltage by the constant current by the temperature detecting means 23, the resistance value of the temperature measuring resistor 4 at that time can be known, and the temperature measuring resistor 4 that is known in advance can be obtained. The temperature can be calculated from the temperature coefficient (determined by the material). According to the detected temperature, the temperature of the insulating substrate 1 can be maintained at a predetermined temperature by controlling the power applied from the control means 26 to the both ends of the heating resistor 2 by the adjusting unit 27. As described above, the temperature control of the heating resistor 2 by the control means 26 may be performed by changing the duty cycle of the pulse by changing the applied voltage to a pulse or the voltage itself. In the example shown in FIG. 9, the constant current circuit 25 is provided. Instead, a reference resistor is provided in a place where the temperature does not change, and the voltage of the reference resistor is measured to obtain the current. The voltage at both ends of the temperature measuring resistor 2 may be measured. Further, the temperature measurement power source 21 is not necessarily a DC power source. A constant current can be obtained in a pulsed manner even with an alternating current.

  As described above, the temperature measurement resistor is preferably as large as possible in absolute value (%) of the temperature coefficient (which may be positive or negative). When used only for temperature measurement, for example, it is preferably about 0.3 to 0.5 mm wide and attached to an appropriate position of the insulating substrate 1 (in the vicinity of the heating resistor 2). The temperature measuring resistor 4 It is preferable to apply a DC voltage of about 5V because the applied voltage is kept low so as not to generate heat. Thereby, the temperature of the back surface of the insulating substrate 1 and by extension, the electronic component can be estimated.

  According to the present invention, since the temperature measuring means and the heat generating means are provided, and it is possible to prepare from small to large according to the electronic component to be evaluated, so the temperature in the mounted state of the electronic component to be evaluated is measured. It is also possible to increase the temperature of the electronic component to a specific temperature and investigate the influence on the electrical characteristics in that state. As a result, it can contribute to a design that can prevent an electronic device such as a smartphone from abnormally generating heat or deteriorating characteristics due to environmental temperature. As described above, as an example used for temperature control of the circuit board, a cooling means is provided so that the ambient temperature of the circuit board becomes a predetermined temperature or less, and the maximum temperature at which the temperature of the electronic component can operate at a specified temperature or less. For example, to investigate the cause of the deterioration of the heat dissipation characteristics of the electronic component.

DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Heating resistor 2a, 2b Connecting heating resistor 3 Electrode 31 Heating resistor lead 4 Temperature measuring resistor 5 Measuring terminal 5a to 5d Measuring terminal 5e Temperature measuring lead 51 Temperature measuring lead 6 Cover substrate 7 Connection conductor 7a, 7b Connection conductor 8 Connection conductor 9 Glass adhesive layer 10 Temperature control unit 10a Heating substrate 10b Multiple heating substrate 11 Thermally conductive elastic member 12 Mounting plate 13 Fixing member 15 Circuit substrate 16 IC
17 Connection terminal 18 Wiring

Claims (11)

An insulating substrate; a belt-like heating resistor formed in parallel in at least two rows on one surface of the insulating substrate for heating the insulating substrate; and a current in a longitudinal direction of the heating resistor formed in the at least two rows. At least one pair of electrodes that can flow, at least one temperature measurement resistor formed on the insulating substrate between the at least two rows of heating resistors, and a predetermined length of the temperature measurement resistor At least a pair of measurement terminals for measuring the electrical resistance between the at least two rows of heating resistors, the pair of electrodes, the temperature measurement resistor, and the measurement terminals. wherein said insulating substrate so as to set formed in parallel on one side, and the electronic component having a heating substrate ing is formed the temperature measuring resistor in between the two pairs of heating resistors For temperature characteristic evaluation Temperature control unit. An insulating substrate; a belt-like heating resistor formed in parallel in at least two rows on one surface of the insulating substrate for heating the insulating substrate; and a current in a longitudinal direction of the heating resistor formed in the at least two rows. At least one pair of electrodes that can flow, at least one temperature measurement resistor formed on the insulating substrate between the at least two rows of heating resistors, and a predetermined length of the temperature measurement resistor A heating substrate having at least a pair of measurement terminals for measuring an electrical resistance between them, and a cover substrate made of the same material as the insulating substrate is provided on the heating resistor side of the heating substrate. Temperature control unit for evaluating temperature characteristics of electronic components . An insulating substrate; a belt-like heating resistor formed in parallel in at least two rows on one surface of the insulating substrate for heating the insulating substrate; and a current in a longitudinal direction of the heating resistor formed in the at least two rows. At least one pair of electrodes that can flow, at least one temperature measurement resistor formed on the insulating substrate between the at least two rows of heating resistors, and a predetermined length of the temperature measurement resistor a heating substrate and at least a pair of measurement terminals for measuring the electrical resistance between two said heating substrate, electrons having multiple heating substrate bonded side of the heating resistor orientation combined with Temperature control unit for evaluating temperature characteristics of parts . An insulating substrate; a belt-like heating resistor formed in parallel in at least two rows on one surface of the insulating substrate for heating the insulating substrate; and a current in a longitudinal direction of the heating resistor formed in the at least two rows. At least one pair of electrodes that can flow, at least one temperature measurement resistor formed on the insulating substrate between the at least two rows of heating resistors, and a predetermined length of the temperature measurement resistor A heating substrate having at least a pair of measurement terminals for measuring an electrical resistance between them, and each heating element formed in at least two rows has one end formed at least in part. A temperature control unit for an electronic component which is formed in a U shape by being connected through a resistor, and at least a part of the U-shaped corner portion is connected by a conductor layer . Temperature control unit of the electronic components of the heating substrate cover substrate is provided on the upper surface of the multi-heated substrates superposed in two or more stages according to claim 1 or 4, wherein. One end of each of the heating resistors formed in at least two rows of the heating resistors is connected via a heating resistor formed in at least a part, thereby forming a U-shape. The temperature control unit for an electronic component according to any one of claims 1 to 3 and 5 , wherein at least a part of the letter-shaped corner portion is connected by a conductor layer . Mounting plate is fixed on the cover substrate of the temperature control unit, pressing the heated substrate to the electronic component temperature characteristics are evaluated, according to claim 2 or 5 is fixed to the substrate on which the electronic component is mounted Electronic component temperature control unit. An insulating substrate; a belt-like heating resistor formed in parallel in at least two rows on one surface of the insulating substrate for heating the insulating substrate; and a current in a longitudinal direction of the heating resistor formed in the at least two rows. At least one pair of electrodes that can flow, at least one temperature measurement resistor formed on the insulating substrate between the at least two rows of heating resistors, and a predetermined length of the temperature measurement resistor And a heating substrate having a cover substrate formed on the surface side of the heating resistor , a mounting plate is fixed on the cover substrate, and a temperature is measured. An electronic component temperature control unit that presses the heating substrate against an electronic component to be evaluated and fixes the electronic substrate to the substrate on which the electronic component is mounted . The temperature which detects the temperature of the insulating substrate of the said temperature control unit based on the resistance change of the temperature control unit of any one of Claims 1-8 , and the temperature measurement resistor formed in the said temperature control unit Formed on the other surface of the insulating substrate of the temperature control unit, detection means, temperature control means for controlling the temperature of the insulating substrate to a predetermined temperature by passing a current through a heating resistor formed in the temperature control unit A thermally conductive elastic member or a separately prepared thermally conductive elastic sheet, and the other surface side of the insulating substrate of the temperature control unit is interposed via the thermally conductive elastic member or the thermally conductive elastic sheet. The electronic component is closely attached to the electronic component mounted on the circuit board, and the temperature of the electronic component is measured, or the temperature characteristic of the electronic component when the temperature of the specific electronic component is set to a predetermined temperature is evaluated. Equipment for evaluating temperature characteristics of electronic components mounted on road boards. An electronic component incorporated in a circuit board or a method for evaluating temperature characteristics of the circuit board, the electronic component mounted on the circuit board being operated, and the electronic component or circuit board mounted on the circuit board The temperature control unit according to any one of claims 1 to 8 is pressed through a heat conductive elastic member or a heat conductive elastic sheet to change the temperature of the electronic component or the circuit board while changing the temperature of the electronic component or the circuit board. A method of evaluating temperature characteristics of an electronic component, which is used for temperature control of an electronic component mounted on the circuit board or the circuit board by examining a relationship of electrical characteristics with respect to the temperature of the component or the circuit board. Utilizing the temperature control of the circuit board includes providing cooling means so that the ambient temperature of the circuit board is lower than a predetermined temperature, and the highest input at which the temperature of the electronic component can operate at a predetermined temperature or lower. The method for evaluating temperature characteristics of an electronic component according to claim 10, wherein the method is any one of operating in a state and investigating a cause of a decrease in heat dissipation characteristics of the electronic component.

Images